X9261
DUCT
E PRO PRODUCT
T
E
L
O
OBS
ITUTE
SUBST 424 Data Sheet
E
L
IB
POSS
ISL22
Single Supply/Low Power/256-Tap/SPI Bus
October 12, 2006
Dual Digitally-Controlled (XDCP™)
Potentiometers
FN8171.4
DESCRIPTION
The X9261 integrates 2 digitally controlled
potentiometer (XDCP) on a monolithic CMOS
integrated circuit.
FEATURES
• Dual–Two Separate Potentiometers
• 256 Resistor Taps/pot–0.4% Resolution
• SPI Serial Interface for Write, Read, and Transfer
Operations of the Potentiometer Single Supply
Device
• Wiper Resistance, 100 typical @ VCC = 5V
• 4 Nonvolatile Data Registers for Each
Potentiometer
• Nonvolatile Storage of Multiple Wiper Positions
• Power-on Recall Loads Saved Wiper Position on
Power-up.
• Standby Current < 5µA Max
• 50k, 100k Versions of End to End Resistance
• 100 yr. Data Retention
• Endurance: 100,000 Data Changes per Bit per
Register
• 24 Ld SOIC, 24 Ld TSSOP
• Low Power CMOS
• Power Supply VCC = 5V ±10%
• Pb-Free Plus Anneal Available (RoHS Compliant)
The digital controlled potentiometer is implemented
using 255 resistive elements in a series array.
Between each element are tap points connected to the
wiper terminal through switches. The position of the
wiper on the array is controlled by the user through the
SPI bus interface. Each potentiometer has associated
with it a volatile Wiper Counter Register (WCR) and
four non-volatile Data Registers that can be directly
written to and read by the user. The contents of the
WCR controls the position of the wiper on the resistor
array though the switches. Powerup recalls the
contents of the default Data Register (DR0) to the
WCR.
The XDCP can be used as a three-terminal
potentiometer or as a two terminal variable resistor in
a wide variety of applications including control,
parameter adjustments, and signal processing.
FUNCTIONAL DIAGRAM
VCC
SPI
Bus
Interface
Address
Data
Status
Write
Read
Transfer
Inc/Dec
Bus
Interface
and Control
Power-on Recall
Wiper Counter
Register (WCR)
Control
VSS
RH1
RH0
Data Registers
(DR0-DR3)
RW0
RL0
RW1
RL1
50k or 100k versions
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X9261
Ordering Information
PART NUMBER
PART
MARKING
X9261US24
X9261US
X9261US24Z (Note)
VCC LIMITS
(V)
RTOTAL (k) TEMP RANGE (°C)
5 ±10%
50
PACKAGE
PKG.
DWG. #
0 to 70
24 Ld SOIC (300 mil)
M24.3
X9261US Z
0 to 70
24 Ld SOIC (300 mil) (Pb-free)
M24.3
X9261UV24
X9261UV
0 to 70
24 Ld TSSOP (4.4mm)
MDP0044
X9261UV24Z (Note)
X9261UV Z
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
DETAILED FUNCTIONAL DIAGRAM
RH0 RL0 RW0
VCC
Power-on
Recall
R0 R1
HOLD
CS
SCK
SO
SI
A0
A1
INTERFACE
AND
CONTROL
CIRCUITRY
R2 R3
Wiper
Counter
Register
(WCR)
50k and 100k
256-taps
8
Data
WP
Power-on
Recall
R0 R1
R2 R3
VSS
Pot 0
Wiper
Counter
Register
(WCR)
Resistor
Array
Pot 1
RL1 RH1 RW1
CIRCUIT LEVEL APPLICATIONS
• Vary the frequency and duty cycle of timer ICs
• Vary the gain of a voltage amplifier
• Vary the dc biasing of a pin diode attenuator in RF
circuits
• Provide programmable dc reference voltages for
comparators and detectors
• Control the volume in audio circuits
• Provide a control variable (I, V, or R) in feedback
circuits
• Trim out the offset voltage error in a voltage amplifier
circuit
• Set the output voltage of a voltage regulator
• Trim the resistance in Wheatstone bridge circuits
• Control the gain, characteristic frequency and
Q-factor in filter circuits
• Set the scale factor and zero point in sensor signal
conditioning circuits
2
FN8171.4
October 12, 2006
X9261
PIN ASSIGNMENTS
SYSTEM LEVEL APPLICATIONS
• Adjust the contrast in LCD displays
• Control the power level of LED transmitters in
communication systems
Pin
(SOIC/
TSSOP)
Symbol
1
SO
Function
Serial Data Output for SPI bus
• Set and regulate the DC biasing point in an RF
power amplifier in wireless systems
2
A0
Device Address for SPI bus.
3
NC
No Connect.
• Control the gain in audio and home entertainment
systems
4
NC
No Connect.
5
NC
No Connect.
• Provide the variable DC bias for tuners in RF wireless systems
6
NC
No Connect.
• Set the operating points in temperature control
systems
7
VCC
System Supply Voltage
8
RL0
Low Terminal for Potentiometer 0.
• Control the operating point for sensors in industrial
systems
9
RH0
High Terminal for Potentiometer 0.
10
RW0
Wiper Terminal for Potentiometer 0.
• Trim offset and gain errors in artificial intelligent
systems
11
CS
Device Address for SPI bus.
12
WP
Hardware Write Protect
13
SI
Serial Data Input for SPI bus
PIN CONFIGURATION
14
A1
Device Address for SPI bus.
15
RL1
Low Terminal for Potentiometer 1.
16
RH1
High Terminal for Potentiometer 1.
HOLD
17
RW1
Wiper Terminal for Potentiometer 1.
VSS
System Ground
SOIC/TSSOP
SO
A0
NC
1
24
2
23
SCK
18
3
22
NC
19
NC
No Connect
NC
No Connect
NC
4
21
NC
20
NC
5
20
NC
21
NC
No Connect
19
NC
22
NC
No Connect
NC
6
X9261
VCC
7
18
VSS
23
SCK
RL0
8
17
RW1
24
HOLD
RH0
9
16
RH1
RW0
10
15
RL1
CS
11
14
A1
WP
12
13
SI
Serial Clock for SPI bus
Device select. Pause the SPI serial bus.
PIN DESCRIPTIONS
Bus Interface Pins
SERIAL OUTPUT (SO)
SO is a serial data output pin. During a read cycle,
data is shifted out on this pin. Data is clocked out by
the falling edge of the serial clock.
SERIAL INPUT
SI is the serial data input pin. All opcodes, byte
addresses and data to be written to the pots and pot
registers are input on this pin. Data is latched by the
rising edge of the serial clock.
SERIAL CLOCK (SCK)
The SCK input is used to clock data into and out of the
X9261.
3
FN8171.4
October 12, 2006
X9261
HOLD (HOLD)
Other Pins
HOLD is used in conjunction with the CS pin to select
the device. Once the part is selected and a serial
sequence is underway, HOLD may be used to pause
the serial communication with the controller without
resetting the serial sequence. To pause, HOLD must
be brought LOW while SCK is LOW. To resume
communication, HOLD is brought HIGH, again while
SCK is LOW. If the pause feature is not used, HOLD
should be held HIGH at all times.
DEVICE ADDRESS (A1 - A0)
The address inputs are used to set the 4-bit slave
address. A match in the slave address serial data
stream must be made with the address input in order
to initiate communication with the X9261.
CHIP SELECT (CS)
When CS is HIGH, the X9261 is deselected and the
SO pin is at high impedance, and (unless an internal
write cycle is underway) the device will be in the
standby state. CS LOW enables the X9261, placing it
in the active power mode. It should be noted that after
a power-up, a HIGH to LOW transition on CS is
required prior to the start of any operation.
Potentiometer Pins
RH, RL
The RH and RL pins are equivalent to the terminal
connections on a mechanical potentiometer. Since
there are 2 potentiometers, there are 2 sets of RH and
RL such that RH0 and RL0 are the terminals of POT 0
and so on.
RW
The wiper pin are equivalent to the wiper terminal of a
mechanical potentiometer. Since there are 2
potentiometers, there are 2 sets of RW such that RW0
is the terminals of POT 0 and so on.
Supply Pins
SYSTEM SUPPLY VOLTAGE (VCC) AND SUPPLY
GROUND (VSS)
The VCC pin is the system supply voltage. The VSS
pin is the system ground.
4
NO CONNECT
No connect pins should be left floating. This pins are
used for Intersil manufacturing and testing purposes.
HARDWARE WRITE PROTECT INPUT (WP)
The WP pin when LOW prevents nonvolatile writes to
the Data Registers.
PRINCIPLES OF OPERATION
Serial Interface
The X9261 supports the SPI interface hardware
conventions. The device is accessed via the SI input
with data clocked in on the rising SCK. CS must be
LOW and the HOLD and WP pins must be HIGH
during the entire operation.
The SO and SI pins can be connected together, since
they have three state outputs. This can help to reduce
system pin count.
Array Description
The X9261 is comprised of a resistor array (See
Figure 1). The array contains the equivalent of 255
discrete resistive segments that are connected in
series. The physical ends of each array are equivalent
to the fixed terminals of a mechanical potentiometer
(RH and RL inputs).
At both ends of each array and between each resistor
segment is a CMOS switch connected to the wiper
(RW) output. Within each individual array only one
switch may be turned on at a time.
These switches are controlled by a Wiper Counter
Register (WCR). The 8-bits of the WCR (WCR[7:0])
are decoded to select, and enable, one of 256
switches (See Table 1).
Power-up and Down Requirements.
There are no restrictions on the power-up or powerdown conditions of VCC and the voltages applied to
the potentiometer pins provided that VCC is always
more positive than or equal to VH, VL, and VW, i.e.,
VCC, VH, VL, VW. The VCC ramp rate specification is
always in effect.
FN8171.4
October 12, 2006
X9261
Figure 1. Detailed Potentiometer Block Diagram
One of Two Potentiometers
SERIAL
BUS
INPUT
SERIAL DATA PATH
FROM INTERFACE
CIRCUITRY
REGISTER 1
(DR1)
REGISTER 0
(DR0)
8
REGISTER 2
(DR2)
8
PARALLEL
BUS
INPUT
REGISTER 3
(DR3)
WIPER
COUNTER
REGISTER
(WCR)
RH
C
O
U
N
T
E
R
D
E
C
O
D
E
INC/DEC
LOGIC
IF WCR = 00[H] THEN RW = RL
IF WCR = FF[H] THEN RW = RH
UP/DN
MODIFIED SCK
UP/DN
CLK
RL
RW
DEVICE DESCRIPTION
Wiper Counter Register (WCR)
The X9261 contains two Wiper Counter Registers, one
for each DCP potentiometer. The Wiper Counter
Register can be envisioned as a 8-bit parallel and
serial load counter with its outputs decoded to select
one of 256 switches along its resistor array. The
contents of the WCR can be altered in four ways: it
may be written directly by the host via the Write Wiper
Counter Register instruction (serial load); it may be
written indirectly by transferring the contents of one of
four associated data registers via the XFR Data
Register instruction (parallel load); it can be modified
one step at a time by the Increment/Decrement
instruction (See Instruction section for more details).
Finally, it is loaded with the contents of its Data
Register zero (DR0) upon power-up.
The Wiper Counter Register is a volatile register; that
is, its contents are lost when the X9261 is powereddown. Although the register is automatically loaded
with the value in DR0 upon power-up, this may be
different from the value present at power-down.
Power-up guidelines are recommended to ensure
proper loadings of the DR0 value into the WCR.
5
Data Registers (DR)
Each potentiometer has four 8-bit nonvolatile Data
Registers. These can be read or written directly by the
host. Data can also be transferred between any of the
four Data Registers and the associated Wiper Counter
Register. All operations changing data in one of the
Data Registers is a nonvolatile operation and will take
a maximum of 10ms.
If the application does not require storage of multiple
settings for the potentiometer, the Data Registers can
be used as regular memory locations for system
parameters or user preference data.
Bits [7:0] are used to store one of the 256 wiper
positions or data (0~255).
Status Register (SR)
This 1-bit Status Register is used to store the system
status.
WIP: Write In Progress status bit, read only.
– When WIP=1, indicates that high-voltage write cycle
is in progress.
– When WIP=0, indicates that no high-voltage write
cycle is in progress.
FN8171.4
October 12, 2006
X9261
Table 1. Wiper Counter Register, WCR (8-bit), WCR[7:0]: Used to store the current wiper position (Volatile, V).
WCR7
WCR6
WCR5
WCR4
WCR3
WCR2
WCR1
WCR0
V
V
V
V
V
V
V
V
(MSB)
(LSB)
Table 2. Data Register, DR (8-bit), Bit [7:0]: Used to store wiper positions or data (Nonvolatile, NV).
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
NV
NV
NV
NV
NV
NV
NV
NV
MSB
LSB
DEVICE DESCRIPTION
Instructions
IDENTIFICATION BYTE ( ID AND A )
The first byte sent to the X9261 from the host,
following a CS going HIGH to LOW, is called the
Identification Byte. The most significant four bits of the
slave address are a device type identifier. The ID[3:0]
bits is the device id for the X9261; this is fixed as
0101[B] (refer to Table 3).
The AD[3:0] bits in the ID byte is the internal slave
address. The physical device address is defined by
the state of the A3 - A0 input pins. The slave address
is externally specified by the user. The X9261
compares the serial data stream with the address
input state; a successful compare of both address bits
is required for the X9261 to successfully continue the
command sequence. Only the device which slave
address matches the incoming device address sent
by the master executes the instruction. The A3-A0
inputs can be actively driven by CMOS input signals
or tied to VCC or VSS.
INSTRUCTION BYTE ( I[3:0] )
The next byte sent to the X9261 contains the instruction
and register pointer information. The three most
significant bits are used provide the instruction opcode
(I[3:0]). The RB and RA bits point to one of the four
Data Registers of each associated XDCP. The least
significant bit points to one of two Wiper Counter
Registers or Pots.The format is shown below in Table 4.
Table 3. Identification Byte Format
Device Type
Identifier
Slave Address
ID3
ID2
ID1
ID0
0
1
0
1
A3
A2
A1
(MSB)
A0
(LSB)
Table 4. Instruction Byte Format
Data
Register
Selection
Instruction
Opcode
I3
I2
I1
(MSB)
I0
RB
Pot Selection
(WCR Selection)
RA
0
P0
(LSB)
6
FN8171.4
October 12, 2006
X9261
Register Selection
Register Selected
RB
RA
DR0
0
0
DR1
0
1
DR2
1
0
DR3
1
1
DEVICE DESCRIPTION
Instructions
Four of the ten instructions are three bytes in length.
These instructions are:
– Read Wiper Counter Register – read the current
wiper position of the selected potentiometer,
– Write Wiper Counter Register – change current
wiper position of the selected potentiometer,
– Read Data Register – read the contents of the
selected Data Register;
– Write Data Register – write a new value to the
selected Data Register.
– Read Status - This command returns the contents
of the WIP bit which indicates if the internal write
cycle is in progress.
The basic sequence of the three byte instructions is
illustrated in Figure 3. These three-byte instructions
exchange data between the WCR and one of the Data
Registers. A transfer from a Data Register to a WCR is
essentially a write to a static RAM, with the static RAM
controlling the wiper position. The response of the
wiper to this action will be delayed by tWRL. A transfer
from the WCR (current wiper position), to a Data
Register is a write to nonvolatile memory and takes a
minimum of tWR to complete. The transfer can occur
between one of the two potentiometers and one of its
associated registers; or it may occur globally, where
the transfer occurs between all potentiometers and
one associated register. The Read Status Register
instruction is the only unique format (See Figure 5).
– XFR Data Register to Wiper Counter Register –
This transfers the contents of one specified Data
Register to the associated Wiper Counter Register.
– XFR Wiper Counter Register to Data Register –
This transfers the contents of the specified Wiper
Counter Register to the specified associated Data
Register.
– Global XFR Data Register to Wiper Counter
Register – This transfers the contents of all specified Data Registers to the associated Wiper Counter
Registers.
– Global XFR Wiper Counter Register to Data
Register – This transfers the contents of all Wiper
Counter Registers to the specified associated Data
Registers.
INCREMENT/DECREMENT COMMAND
The final command is Increment/Decrement (See
Figures 6 and 7). The Increment/Decrement command
is different from the other commands. Once the
command is issued and the X9261 has responded
with an acknowledge, the master can clock the
selected wiper up and/or down in one segment steps;
thereby, providing a fine tuning capability to the host.
For each SCL clock pulse (tHIGH) while SI is HIGH,
the selected wiper will move one resistor segment
towards the RH terminal. Similarly, for each SCL clock
pulse while SI is LOW, the selected wiper will move
one resistor segment towards the RL terminal. A
detailed illustration of the sequence and timing for this
operation are shown. See Instruction format for more
details.
Four instructions require a two-byte sequence to
complete. These instructions transfer data between
the host and the X9261; either between the host and
one of the data registers or directly between the host
and the Wiper Counter Register. These instructions
are:
7
FN8171.4
October 12, 2006
X9261
Figure 2. Two-Byte Instruction Sequence
CS
SCK
SI
1
0
0
ID3 ID2 ID1 ID0
0
0
0
1
0
0
A1
A0
Internal
Address
Device ID
I3
I2
RB RA
I0
I1
Instruction
Opcode
P0
Register Pot/WCR
Address Address
Figure 3. Three-Byte Instruction Sequence (Write)
CS
SCL
SI
0
1
0
1
ID3 ID2 ID1 ID0
0
0
0
0
0
A1 A0
I3 I2
I0
Instruction
Opcode
Internal
Address
Device ID
I1
RB RA
P0
D7 D6 D5 D4 D3 D2 D1 D0
WCR[7:0]
or
Data Register Bit [7:0]
Register Pot/WCR
Address Address
Figure 4. Three-Byte Instruction Sequence (Read)
CS
SCL
SI
0
1
0
1
ID3 ID2 ID1 ID0
0
0
0
0
Internal
Address
Device ID
X
0
A1 A0
I3
I2
I1
I0
Instruction
Opcode
RB RA
P0
X
X
X
X
X
X
X
Don’t Care
Register Pot/WCR
Address Address
S0
D7 D6 D5 D4 D3 D2 D1 D0
WCR[7:0]
or
Data Register Bit [7:0]
8
FN8171.4
October 12, 2006
X9261
Figure 5. Three-Byte Instruction Sequence (Read Status Register)
CS
SCL
SI
0
1
0
1
ID3 ID2 ID1 ID0
0
0
0
0
1
A1 A0
I3
Internal
Address
Device ID
0
I2
1
0
1
I1 I0
Instruction
Opcode
RB RA
0
0
0
0
0
0
P0
0
WIP
Register Pot/WCR
Address Address
Status
Bit
Figure 6. Increment/Decrement Instruction Sequence
CS
SCL
SI
0
1
0
1
ID3 ID2 ID1 ID0
0
0
0
0
Device ID
0
A1 A0
I2
Internal
Address
I3
I1
I0
Instruction
Opcode
RB RA
P0
Register Pot/WCR
Address Address
I
N
C
1
I
N
C
2
I
N
C
n
D
E
C
1
D
E
C
n
Figure 7. Increment/Decrement Timing Limits
tWRID
SCK
SI
VOLTAGE OUT
RW
INC/DEC CMD ISSUED
9
FN8171.4
October 12, 2006
X9261
Table 5. Instruction Set
I3
1
I2
0
Instruction Set
I1
I0 RB RA
0
1
0
0
1
0
1
0
0
0
0
1/0
1
0
1
1
1/0
1/0
0
1/0
Write Data Register
1
1
0
0
1/0
1/0
0
1/0
XFR Data Register to
Wiper Counter Register
1
1
0
1
1/0
1/0
0
1/0
XFR Wiper Counter
Register to Data Register
1
1
1
0
1/0
1/0
0
1/0
Global XFR Data Registers
to Wiper Counter Registers
0
0
0
1
1/0
1/0
0
0
Global XFR Wiper Counter
Registers to Data Register
1
0
0
0
1/0
1/0
0
0
Increment/Decrement
Wiper Counter Register
0
0
1
0
0
0
0
1/0
Instruction
Read Wiper Counter
Register
Write Wiper Counter
Register
Read Data Register
Note:
0
0
P0
Operation
1/0
Read the contents of the Wiper Counter
Register pointed to by P0
Write new value to the Wiper Counter
Register pointed to by P0
Read the contents of the Data Register
pointed to by P0 and RB - RA
Write new value to the Data Register
pointed to by P0 and RB - RA
Transfer the contents of the Data Register
pointed to by P0 and RB - RA to its
associated Wiper Counter Register
Transfer the contents of the Wiper Counter
Register pointed to by P0 to the Data
Register pointed to by RB - RA
Transfer the contents of the Data Registers
pointed to by RB - RA of all four pots to their
respective Wiper Counter Registers
Transfer the contents of both Wiper Counter
Registers to their respective data Registers
pointed to by RB - RA of all four pots
Enable Increment/decrement of the Control
Latch pointed to by P0
1/0 = data is one or zero
INSTRUCTION FORMAT
Read Wiper Counter Register (WCR)
CS
Falling
Edge
Device Type
Identifier
0
1
0
1
Device
Addresses
Instruction
Opcode
0 0 A1 A0 1
0
0
1
WCR
Addresses
0
0
Wiper Position
(Sent by X9261 on SO)
W
C
0 P0
R
7
W
C
R
6
W
C
R
5
W
C
R
4
W
C
R
3
W
C
R
2
W
C
R
1
CS
W Rising
C Edge
R
0
Write Wiper Counter Register (WCR)
Device Type
Identifier
CS
Falling
Edge 0
1
0
1
Device
Addresses
Instruction
Opcode
0 0 A1 A0 1
0
1
0
WCR
Addresses
0
0
W
C
0 P0
R
7
Data Byte
(Sent by Host on SI)
W
C
R
6
W
C
R
5
W
C
R
4
W
C
R
3
W
C
R
2
W
C
R
1
CS
W Rising
C Edge
R
0
Read Data Register (DR)
Device Type
Device
Instruction
DR and WCR
Data Byte
CS
CS
Identifier
Addresses
Opcode
Addresses
(Sent by X9271 on SO)
Falling
Rising
Edge 0 1 0 1 0 0 A1 A0 1 0 1 1 RB RA 0 P0 D D D D D D D D Edge
7 6 5 4 3 2 1 0
10
FN8171.4
October 12, 2006
X9261
Device Type
Identifier
Device
Addresses
Instruction
Opcode
DR and WCR
Addresses
CS
Falling
Edge 0 1 0 1 0 0 A1 A0 1 1 0 0 RB RA
0
Data Byte
(Sent by Host on SI)
CS
Rising
D D D D D D D D Edge
P0
7 6 5 4 3 2 1 0
HIGH-VOLTAGE
WRITE CYCLE
Write Data Register (DR)
Global Transfer Data Register (DR) to Wiper Counter Register (WCR)
Device Type
CS
Identifier
Falling
Edge 0 1 0 1
Device
Addresses
0
Instruction
Opcode
DR
Addresses
CS
Rising
0 A1 A0 0 0 0 1 RB RA 0 0 Edge
Global Transfer Wiper Counter Register (WCR) to Data Register (DR)
Device Type
Device
Instruction
DR
CS
CS
Identifier
Addresses
Opcode
Addresses
Falling
Rising
Edge 0 1 0 1 0 0 A1 A0 1 0 0 0 RB RA 0 0 Edge
HIGH-VOLTAGE
WRITE CYCLE
Transfer Wiper Counter Register (WCR) to Data Register (DR)
Device Type
Device
Instruction
DR and WCR
CS
CS
Identifier
Addresses
Opcode
Addresses
Falling
Rising
Edge 0 1 0 1 0 0 A1 A0 1 1 1 0 RB RA 0 P0 Edge
HIGH-VOLTAGE
WRITE CYCLE
Transfer Data Register (DR) to Wiper Counter Register (WCR)
Device Type
Device
Instruction
DR and WCR
CS
CS
Identifier
Addresses
Opcode
Addresses
Falling
Rising
Edge 0 1 0 1 0 0 A1 A0 1 1 0 1 RB RA 0 P0 Edge
Increment/Decrement Wiper Counter Register (WCR)
Device Type
Device
Instruction
WCR
Increment/Decrement
CS
CS
Identifier
Addresses
Opcode
Addresses
(Sent by Master on SDA)
Falling
Rising
Edge 0 1 0 1 0 0 A1 A0 0 0 1 0 X X 0 P0 I/D I/D . . . . I/D I/D Edge
Read Status Register (SR)
Device Type
Device
Instruction
WCR
Data Byte
CS
Identifier
Addresses
Opcode
Addresses
(Sent by X9261 on SO)
Falling
Edge 0 1 0 1 0 0 A1 A0 0 1 0 1 0 0 0 1 0 0 0 0 0 0 0 WIP
Notes: (1)
(2)
(2)
(3)
CS
Rising
Edge
“A1 ~ A0”: stands for the device addresses sent by the master.
WPx refers to wiper position data in the Counter Register
“I”: stands for the increment operation, SI held HIGH during active SCK phase (high).
“D”: stands for the decrement operation, SI held LOW during active SCK phase (high).
11
FN8171.4
October 12, 2006
X9261
ABSOLUTE MAXIMUM RATINGS
COMMENT
Temperature under bias .................... -65C to +135C
Storage temperature.......................... -65C to +150C
Voltage on SCK any address input
with respect to VSS ................................. -1V to +7V
V = | (VH - VL) |................................................... 5.5V
Lead temperature (soldering, 10s) .................... 300C
IW (10s) .............................................................. ±6mA
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; the functional operation of
the device (at these or any other conditions above
those listed in the operational sections of this
specification) is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temp
Commercial
Industrial
Min.
0C
-40C
Max.
+70C
+85C
Supply Voltage (VCC)(4) Limits
5V 10%
Device
X9261
POTENTIOMETER CHARACTERISTICS (Over recommended industrial operating conditions unless otherwise stated.)
Parameter
Symbol
RTOTAL
RTOTAL
Limits
Min.
Typ.
End to End Resistance
100
End to End Resistance
50
Max.
Units
Test Conditions
k
T version
k
U version
End to End Resistance Tolerance
±20
%
Power Rating
50
mW
25C, each pot
IW
Wiper Current
±3
mA
RW
Wiper Resistance
300
IW = 3mA @ V+ = 3V
RW
Wiper Resistance
150
IW = 3mA @ V+ = 5V
VTERM
Voltage on any RH or RL Pin
VCC
V
VSS = 0V
Noise
VSS
-120
Resolution
dBV
0.4
Ref: 1V
%
Absolute Linearity (1)
±1
MI(3)
Rw(n)(actual) - Rw(n)(expected)(5)
Relative Linearity (2)
±0.6
MI(3)
Rw(n + 1) - [Rw(n) + MI](5)
Temperature Coefficient of RTOTAL
300
Ratiometric Temp. Coefficient
CH/CL/CW
Potentiometer Capacitances
Ial
RW, RH, RL Leakage
ppm/C
20
10/10/25
0.1
10.0
ppm/°C
pF
See Macro model
µA
Device in stand by.
Vin = VSS to VCC
Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a
potentiometer.
(2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a
potentiometer. It is a measure of the error in step size.
(3) MI = RTOT / 255 or (RH - RL) / 255, single pot
(4) During power-up VCC > VH, VL, and VW.
(5) n = 0, 1, 2, …,255; m = 0, 1, 2, …, 254.
12
FN8171.4
October 12, 2006
X9261
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
400
A
fSCK = 2.5 MHz, SO = Open, VCC = 6V
Other Inputs = VSS
5
mA
fSCK = 2.5MHz, SO = Open, VCC = 6V
Other Inputs = VSS
ICC1
VCC supply current
(active)
ICC2
VCC supply current
(nonvolatile write)
ISB
VCC current (standby)
5
A
SCK = SI = VSS, Addr. = VSS,
CS = VCC = 6V
ILI
Input leakage current
10
A
VIN = VSS to VCC
ILO
Output leakage current
10
A
VOUT = VSS to VCC
VIH
Input HIGH voltage
VCC x 0.7
VCC + 1
V
VIL
Input LOW voltage
-1
VCC x 0.3
V
VOL
Output LOW voltage
0.4
V
IOL = 3mA
VOH
Output HIGH voltage
VCC - 0.8
V
IOH = -1mA, VCC +3V
VOH
Output HIGH voltage
VCC - 0.4
V
IOH = -0.4mA, VCC +3V
1
ENDURANCE AND DATA RETENTION
Parameter
Min.
Units
Minimum endurance
100,000
Data changes per bit per register
Data retention
100
years
CAPACITANCE
Max.
Units
COUT(6)
Symbol
Output capacitance (SO)
Test
8
pF
VOUT = 0V
Test Conditions
CIN(6)
Input capacitance (A0, A1, SI, CS, WP, HOLD, and SCK)
6
pF
VIN = 0V
POWER-UP TIMING
Symbol
tr VCC
(6)
tPUR(7)
Parameter
VCC Power-up rate
Power-up to initiation of read operation
Min.
Max.
Units
0.2
50
V/ms
1
ms
POWER-UP AND DOWN REQUIREMENTS
The are no restrictions on the power-up or power-down conditions of VCC and the voltages applied to the potentiometer pins provided that VCC is always more positive than or equal to VH, VL, and VW, i.e., VCC VH, VL, VW. The
VCC power-up timing spec is always in effect.
A.C. TEST CONDITIONS
Input Pulse Levels
VCC x 0.1 to VCC x 0.9
Input rise and fall times
10ns
Input and output timing level
VCC x 0.5
Notes: (6) This parameter is not 100% tested
(7) tPUR and tPUW are the delays required from the time the (last) power supply (VCC-) is stable until the specific instruction can be issued.
These parameters are periodically sampled and not 100% tested.
13
FN8171.4
October 12, 2006
X9261
EQUIVALENT A.C. LOAD CIRCUIT
5V
3V
1462
SPICE Macromodel
1382
RTOTAL
RL
RH
SO pin
SO pin
CW
CL
2714
1217
100pF
100pF
CL
10pF
25pF
10pF
RW
AC TIMING
Symbol
Parameter
Min.
Max.
Units
2
MHz
fSCK
SSI/SPI clock frequency
tCYC
SSI/SPI clock cycle rime
tWH
SSI/SPI clock high rime
200
ns
tWL
SSI/SPI clock low time
200
ns
tLEAD
Lead time
250
ns
tLAG
Lag time
250
ns
tSU
SI, SCK, HOLD and CS input setup time
50
ns
tH
SI, SCK, HOLD and CS input hold time
50
ns
tRI
SI, SCK, HOLD and CS input rise time
2
s
tFI
SI, SCK, HOLD and CS input fall time
2
s
tDIS
SO output disable time
tV
SO output valid time
tHO
SO output hold time
tRO
SO output rise time
100
ns
tFO
SO output fall time
100
ns
tHOLD
HOLD time
400
ns
tHSU
HOLD setup time
100
ns
tHH
HOLD hold time
100
ns
tHZ
HOLD low to output in high Z
100
ns
tLZ
HOLD high to output in low Z
100
ns
TI
Noise suppression time constant at SI, SCK, HOLD and CS inputs
10
ns
tCS
CS deselect time
2
s
tWPASU
WP, A0, A1 setup time
0
ns
tWPAH
WP, A0, A1 hold time
0
ns
14
500
0
ns
250
ns
200
ns
0
ns
FN8171.4
October 12, 2006
X9261
HIGH-VOLTAGE WRITE CYCLE TIMING
Symbol
Parameter
tWR
High-voltage write cycle time (store instructions)
Typ.
Max.
Units
5
10
ms
XDCP TIMING
Symbol
Parameter
Min.
Max. Units
tWRPO
Wiper response time after the third (last) power supply is stable
5
10
s
tWRL
Wiper response time after instruction issued (all load instructions)
5
10
s
SYMBOL TABLE
WAVEFORM
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A
Center Line
is High
Impedance
TIMING DIAGRAMS
Input Timing
tCS
CS
SCK
tSU
SI
SO
tH
tLAG
tCYC
tLEAD
tWL
...
tWH
...
MSB
tRI
tFI
LSB
High Impedance
15
FN8171.4
October 12, 2006
X9261
Output Timing
CS
SCK
...
tV
tDIS
...
MSB
SO
SI
tHO
LSB
ADDR
Hold Timing
CS
tHSU
tHH
SCK
...
tRO
tFO
SO
tHZ
tLZ
SI
tHOLD
HOLD
XDCP Timing (for All Load Instructions)
CS
SCK
...
tWRL
SI
...
MSB
LSB
VWx
SO
High Impedance
Write Protect and Device Address Pins Timing
(Any Instruction)
CS
tWPASU
tWPAH
WP
A0
A1
16
FN8171.4
October 12, 2006
X9261
APPLICATIONS INFORMATION
Basic Configurations of Electronic Potentiometers
+VR
VR
RW
I
Three terminal Potentiometer;
Variable voltage divider
Two terminal Variable Resistor;
Variable current
Application Circuits
Noninverting Amplifier
VS
Voltage Regulator
+
VO
–
VIN
VO (REG)
317
R1
R2
Iadj
R1
R2
VO = (1+R2/R1)VS
VO (REG) = 1.25V (1+R2/R1)+Iadj R2
Offset Voltage Adjustment
R1
Comparator with Hysterisis
R2
VS
VS
–
+
VO
100k
–
VO
+
}
}
TL072
R1
R2
10k
10k
+12V
10k
VUL = {R1/(R1+R2)} VO(max)
VLL = {R1/(R1+R2)} VO(min)
-12V
17
FN8171.4
October 12, 2006
X9261
Application Circuits (continued)
Attenuator
Filter
C
VS
+
R2
R1
VS
VO
–
–
R
VO
+
R3
R4
R2
R1 = R2 = R3 = R4 = 10k
R1
GO = 1 + R2/R1
fc = 1/(2RC)
V O = G VS
-1/2 G +1/2
R1
R2
}
}
Inverting Amplifier
Equivalent L-R Circuit
VS
R2
C1
–
VS
VO
+
+
–
R1
ZIN
V O = G VS
G = - R2/R1
R3
ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq
(R1 + R3) >> R2
Function Generator
C
R2
–
+
R1
–
} RA
+
} RB
frequency R1, R2, C
amplitude RA, RB
18
FN8171.4
October 12, 2006
X9261
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
SYMBOL
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
24
0°
24
8°
0°
7
8°
Rev. 1 4/06
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
19
FN8171.4
October 12, 2006
X9261
Thin Shrink Small Outline Package Family (TSSOP)
MDP0044
0.25 M C A B
D
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
A
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
(N/2)+1
N
PIN #1 I.D.
E
E1
0.20 C B A
1
(N/2)
B
2X
N/2 LEAD TIPS
TOP VIEW
0.05
e
C
H
A
1.20
1.20
1.20
1.20
1.20
Max
A1
0.10
0.10
0.10
0.10
0.10
±0.05
A2
0.90
0.90
0.90
0.90
0.90
±0.05
b
0.25
0.25
0.25
0.25
0.25
+0.05/-0.06
c
0.15
0.15
0.15
0.15
0.15
+0.05/-0.06
D
5.00
5.00
6.50
7.80
9.70
±0.10
E
6.40
6.40
6.40
6.40
6.40
Basic
E1
4.40
4.40
4.40
4.40
4.40
±0.10
e
0.65
0.65
0.65
0.65
0.65
Basic
L
0.60
0.60
0.60
0.60
0.60
±0.15
L1
1.00
1.00
1.00
1.00
1.00
Reference
Rev. E 12/02
NOTES:
SEATING
PLANE
0.10 M C A B
b
0.10 C
N LEADS
SIDE VIEW
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
SEE DETAIL “X”
c
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
END VIEW
L1
A
A2
GAUGE
PLANE
0.25
L
A1
0° - 8°
DETAIL X
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
20
FN8171.4
October 12, 2006
工商网监
湘ICP备2023018690号
