X9268TS24-2.7

DATASHEET X9268 Dual Supply/Low Power/256-Tap/2-Wire Bus Dual Digitally-Controlled (XDCP™) Potentiometers FN8172 Rev.4.00 August 29, 2006 FEATURES DESCRIPTION • Dual–Two Separate Potentiometers • 256 Resistor Taps/Pot–0.4% Resolution • 2-Wire Serial Interface for Write, Read, and Transfer Operations of the Potentiometer • Wiper Resistance, 100 typical @ V+ = 5V, V- = -5V • 16 Nonvolatile Data Registers for Each Potentiometer • Nonvolatile Storage of Multiple Wiper Positions • Power-on Recall. Loads Saved Wiper Position on Power-up. • Standby Current VH, VL, and VW. (5) n = 0, 1, 2, …,255; m =0, 1, 2, …, 254. FN8172 Rev.4.00 August 29, 2006 Page 15 of 22 X9268 D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Symbol ICC1 Parameter VCC supply current (active) Test Conditions fSCL = 400kHz; VCC = +6V; SDA = Open; (for 2-Wire, Active, Read and Volatile Write States only) fSCL = 400kHz; VCC = +6V; SDA = Open; (for 2-Wire, Active, Nonvolatile Write State only) ICC2 VCC supply current (nonvolatile write) ISB VCC current (standby) ILI Min. Typ. Max. 3 Units mA 5 mA VCC = +6V; VIN = VSS or VCC; SDA = VCC; (for 2-Wire, Standby State only) 5 A Input leakage current VIN = VSS to VCC 10 A ILO Output leakage current VOUT = VSS to VCC 10 A VIH Input HIGH voltage VCC x 0.7 VCC + 1 V VIL Input LOW voltage -1 VCC x 0.3 V VOL Output LOW voltage 0.4 V VOH Output HIGH voltage IOL = 3mA ENDURANCE AND DATA RETENTION Parameter Min. Units Minimum endurance 100,000 Data changes per bit per register Data retention 100 years CAPACITANCE Symbol CIN/OUT(6) CIN(6) Max. Units Test Conditions Input / Output capacitance (SDA) Test 8 pF VOUT = 0V Input capacitance (SCL, WP, A3, A2, A1 and A0) 6 pF VIN = 0V POWER-UP TIMING Symbol Parameter tr VCC(6) VCC Power-up rate tPUR(7) Power-up to initiation of read operation Min. Max. Units 0.2 50 V/ms 1 ms POWER-UP AND DOWN REQUIREMENTS The are no restrictions on the sequencing of the bias supplies VCC, V+, and V- provided that all three supplies reach their final values within 1msec of each other. At all times, the voltages on the potentiometer pins must be less than V+ and more than V-. The recall of the wiper position from nonvolatile memory is not in effect until all supplies reach their final value. The VCC ramp rate spec is always in effect. A.C. TEST CONDITIONS Input Pulse Levels Input rise and fall times Input and output timing level VCC x 0.1 to VCC x 0.9 10ns VCC x 0.5 Notes: (6) This parameter is not 100% tested (7) tPUR and tPUW are the delays required from the time the (last) power supply (VCC-) is stable until the specific instruction can be issued. These parameters are periodically sampled and not 100% tested. FN8172 Rev.4.00 August 29, 2006 Page 16 of 22 X9268 EQUIVALENT A.C. LOAD CIRCUIT 5V 3V 1533 SDA pin SPICE Macromodel 867 RTOTAL RH SDA pin RL CW CL 100pF 100pF CL 10pF 25pF 10pF RW AC TIMING Symbol Parameter Min. Max. Units 400 kHz fSCL Clock Frequency tCYC Clock Cycle Time 2500 ns tHIGH Clock High Time 600 ns tLOW Clock Low Time 1300 ns tSU:STA Start Setup Time 600 ns tHD:STA Start Hold Time 600 ns tSU:STO Stop Setup Time 600 ns tSU:DAT SDA Data Input Setup Time 100 ns tHD:DAT SDA Data Input Hold Time 30 tR SCL and SDA Rise Time 300 ns tF SCL and SDA Fall Time 300 ns tAA SCL Low to SDA Data Output Valid Time 0.9 s tDH SDA Data Output Hold Time 0 ns TI Noise Suppression Time Constant at SCL and SDA inputs 50 ns tBUF Bus Free Time (Prior to Any Transmission) 1200 ns tSU:WPA A0, A1 Setup Time 0 ns tHD:WPA A0, A1 Hold Time 0 ns ns HIGH-VOLTAGE WRITE CYCLE TIMING Symbol Parameter tWR High-voltage write cycle time (store instructions) Typ. Max. Units 5 10 ms XDCP TIMING Symbol Parameter Min. Max. Units tWRPO Wiper response time after the third (last) power supply is stable 5 10 s tWRL Wiper response time after instruction issued (all load instructions) 5 10 s FN8172 Rev.4.00 August 29, 2006 Page 17 of 22 X9268 TIMING DIAGRAMS Start and Stop Timing (START) (STOP) tR tF SCL tSU:STA tHD:STA tSU:STO tR tF SDA Input Timing tCYC tHIGH SCL tLOW SDA tSU:DAT tHD:DAT tBUF Output Timing SCL SDA tAA FN8172 Rev.4.00 August 29, 2006 tDH Page 18 of 22 X9268 XDCP Timing (for All Load Instructions) (STOP) SCL LSB SDA tWRL VWx Write Protect and Device Address Pins Timing (START) SCL (STOP) ... (Any Instruction) ... SDA ... tSU:WPA tHD:WPA WP A0, A1 FN8172 Rev.4.00 August 29, 2006 Page 19 of 22 X9268 APPLICATIONS INFORMATION Basic Configurations of Electronic Potentiometers +VR VR RW I Three terminal Potentiometer; Variable voltage divider Two terminal Variable Resistor; Variable current Application Circuits Noninverting Amplifier VS Voltage Regulator + VO – VIN VO (REG) 317 R1 R2 Iadj R1 R2 VO = (1+R2/R1)VS VO (REG) = 1.25V (1+R2/R1)+Iadj R2 Offset Voltage Adjustment R1 Comparator with Hysterisis R2 VS VS – + 100k – VO + +12V FN8172 Rev.4.00 August 29, 2006 10k } 10k } TL072 10k VO R1 R2 VUL = {R1/(R1+R2)} VO(max) VLL = {R1/(R1+R2)} VO(min) -12V Page 20 of 22 X9268 Application Circuits (continued) Attenuator Filter C VS R2 R1 VO – – VS + R VO + R3 R4 R2 R1 = R2 = R3 = R4 = 10k R1 GO = 1 + R2/R1 fc = 1/(2RC) V O = G VS -1/2  G  +1/2 R2 } VS R1 } Inverting Amplifier Equivalent L-R Circuit R2 C1 – VS VO + + – R1 ZIN V O = G VS G = - R2/R1 R3 ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq (R1 + R3) >> R2 Function Generator C R2 – + R1 – } RA + } RB frequency  R1, R2, C amplitude  RA, RB FN8172 Rev.4.00 August 29, 2006 Page 21 of 22 X9268 X9268 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) N 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e  B S 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N  NOTES: MILLIMETERS 24 0° 24 8° 0° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 7 8° Rev. 1 4/06 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. © Copyright Intersil Americas LLC 2005-2006. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN8172 Rev.4.00 August 29, 2006 Page 22 of 22