DATASHEET
X9271
Single Supply/Low Power/256-Tap/SPI Bus Single, Digitally Controlled (XDCP™)
Potentiometer
The X9271 integrates a single, digitally controlled
potentiometer (XDCP™) on a monolithic CMOS integrated
circuit.
The digitally controlled potentiometer is implemented by
using 255 resistive elements in a series array. Between each
element are tap points connected to the wiper terminal
through switches. The position of the wiper on the array is
controlled by the user through the SPI bus interface. The
potentiometer has associated with it a volatile Wiper Counter
Register (WCR) and four nonvolatile data registers that can
be directly written to and read by the user. The contents of
the WCR control the position of the wiper on the resistor
array though the switches. Power-up recalls the contents of
the default data register (DR0) to the WCR.
The XDCP can be used as a three-terminal potentiometer or
as a two-terminal variable resistor in a wide variety of
applications including control, parameter adjustments, and
signal processing.
FN8174
Rev 5.00
October 15, 2015
Features
• 256 Resistor Taps
• SPI Serial Interface for Write, Read, and Transfer
Operations of Potentiometer
• Wiper Resistance, 100Ω typical at VCC = 5V
• 16 Nonvolatile Data Registers
• Nonvolatile Storage of Multiple Wiper Positions
• Power-on Recall; Loads Saved Wiper Position on
Power-up
• Standby Current VH, VL, and VW.
14. n = 0, 1, 2, …,255; m = 0, 1, 2, …., 254.
FN8174 Rev 5.00
October 15, 2015
Page 11 of 19
X9271
D.C. Operating Characteristics
Across the recommended operating conditions unless otherwise specified.
LIMITS
SYMBOL
MIN
(Note 17)
PARAMETER
TYP
MAX
(Note 17)
UNITS
400
µA
fSCK = 2.5MHz, SO = Open, VCC = 6V
Other Inputs = VSS
5
mA
fSCK = 2.5MHz, SO = Open, VCC = 6V
Other Inputs = VSS
TEST CONDITIONS
ICC1
VCC Supply Current
(Active)
ICC2
VCC Supply Current
(Nonvolatile Write)
ISB
VCC Current (Standby)
3
µA
SCK = SI = VSS, Addr. = VSS,
CS = VCC = 6V
ILI
Input Leakage Current
10
µA
VIN = VSS to VCC
ILO
Output Leakage Current
10
µA
VOUT = VSS to VCC
VIH
Input HIGH Voltage
VCC x 0.7
VCC + 1
V
VIL
Input LOW Voltage
-1
VCC x 0.3
V
VOL
Output LOW Voltage
0.4
V
IOL = 3mA
VOH
Output HIGH Voltage
VCC - 0.8
V
IOH = -1mA, VCC +3V
VOH
Output HIGH Voltage
VCC - 0.4
V
IOH = -0.4mA, VCC +3V
1
Endurance and Data Retention
PARAMETER
MIN.
(Note 17)
UNITS
Minimum Endurance
100,000
Data changes per bit per register
Data Retention
100
Years
Capacitance
SYMBOL
TEST
MAX.
(Note 17)
UNITS
TEST CONDITIONS
8
pF
VOUT = 0V
CIN/OUT (Note 15)
Input / Output Capacitance (SI)
COUT (Note 15)
Output Capacitance (SO)
8
pF
VOUT = 0V
CIN (Note 15)
Input Capacitance (A0, CS, WP, HOLD, and SCK)
6
pF
VIN = 0V
Power-Up Timing
SYMBOL
tr VCC (Note 15)
PARAMETER
VCC Power-up Rate
MIN.
(Note 17)
MAX.
(Note 17)
UNITS
0.2
50
V/ms
tPUR (Note 16)
Power-up to Initiation of Read Operation
1
ms
tPUW (Note 16)
Power-up to Initiation of Write Operation
50
ms
A.C. Test Conditions
INPUT PULSE LEVELS
Input Rise and Fall Times
Input and Output Timing Level
VCC x 0.1 to VCC x 0.9
10ns
VCC x 0.5
NOTES:
15. This parameter is not 100% tested.
16. tPUR and tPUW are the delays required from the time the (last) power supply (VCC-) is stable until the specific instruction can be issued. These
parameters are periodically sampled and are not 100% tested.
17. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
FN8174 Rev 5.00
October 15, 2015
Page 12 of 19
X9271
Equivalent A.C. Load Circuit
5V
SPICE MACROMODEL
3V
1462Ω
1382
RTOTAL
RH
SO pin
RL
SO pin
2714 Ω
1217
100pF
CW
CL
100pF
CL
10pF
25pF
10pF
RW
AC Timing
SYMBOL
PARAMETER
MIN
MAX
UNITS
2.5
MHz
fSCK
SSI/SPI Clock Frequency
tCYC
SSI/SPI Clock Cycle Time
500
ns
tWH
SSI/SPI Clock High Time
200
ns
tWL
SSI/SPI Clock Low Time
200
ns
tLEAD
Lead Time
250
ns
tLAG
Lag Time
250
ns
tSU
SI, SCK, HOLD and CS Input Setup Time
50
ns
tH
SI, SCK, HOLD and CS Input Hold Time
50
ns
tRI
SI, SCK, HOLD and CS Input Rise Time
2
µs
tFI
SI, SCK, HOLD and CS Input Fall Time
2
µs
tDIS
SO Output Disable Time
250
ns
tV
SO Output Valid Time
200
ns
tHO
SO Output Hold Time
tRO
SO Output Rise Time
100
ns
tFO
SO Output Fall Time
100
ns
tHOLD
HOLD Time
400
ns
tHSU
HOLD Setup Time
100
ns
tHH
HOLD Hold Time
100
ns
tHZ
HOLD Low to Output in High Z
100
ns
tLZ
HOLD High to Output in Low Z
100
ns
TI
Noise Suppression Time Constant at SI, SCK, HOLD and CS Inputs
10
ns
tCS
CS Deselect Time
2
µs
tWPASU
WP, A0 Setup Time
0
ns
tWPAH
WP, A0 Hold Time
0
ns
0
0
ns
High-voltage Write Cycle Timing
SYMBOL
tWR
PARAMETER
High-voltage Write Cycle Time (Store Instructions)
FN8174 Rev 5.00
October 15, 2015
TYP
MAX
UNITS
5
10
ms
Page 13 of 19
X9271
XDCP Timing
SYMBOL
PARAMETER
MIN
MAX
UNITS
tWRPO
Wiper Response Time After Third (Last) Power Supply is Stable
5
10
µs
tWRL
Wiper Response Time After Instruction Issued (All Load Instructions)
5
10
µs
Symbol Table
WAVEFORM
INPUTS
OUTPUTS
Must be steady
Will be steady
May change from Low to High
Will change from Low to High
May change from High to Low
Will change from High to Low
Don’t Care: Changes Allowed
Changing: State Not Known
N/A
Center Line is High Impedance
Timing Diagrams
Input Timing
tCS
CS
SCK
tSU
tH
...
tWH
tWL
tRI
tFI
...
MSB
SI
tLAG
tCYC
tLEAD
LSB
High Impedance
SO
Output Timing
CS
SCK
tV
MSB
SO
SI
tHO
...
...
tDIS
LSB
ADDR
FN8174 Rev 5.00
October 15, 2015
Page 14 of 19
X9271
Hold Timing
CS
tHSU
tHH
SCK
...
tRO
tFO
SO
tHZ
tLZ
SI
tHOLD
HOLD
XDCP Timing (for All Load Instructions)
CS
SCK
...
...
MSB
SI
tWRL
LSB
VWx
SO
High Impedance
Write Protect and Device Address Pins Timing
(Any Instruction)
CS
WP
tWPASU
tWPAH
A0
A1
FN8174 Rev 5.00
October 15, 2015
Page 15 of 19
X9271
Applications information
Basic Configurations of Electronic Potentiometers
+VR
VR
RW
I
3-terminal Potentiometer;
Variable Voltage Divider
2-terminal Variable Resistor;
Variable Current
Application Circuits
VS
+
VO
–
VIN
VO (REG)
317
R1
R2
Iadj
R1
R2
VO = (1+R2/R1)VS
VO (REG) = 1.25V (1+R2/R1)+Iadj
FIGURE 7. NONINVERTING AMPLIFIER
R1
R2
FIGURE 8. VOLTAGE REGULATOR
VS
VS
–
VO
+
100kΩ
–
VO
}
TL072
}
+
R1
R2
10kΩ
10kΩ
+12V
10kΩ
-12V
FIGURE 9. OFFSET VOLTAGE ADJUSTMENT
FN8174 Rev 5.00
October 15, 2015
VUL = {R1/(R1+R2)} VO(max)
RLL = {R1/(R1+R2)} VO(min)
FIGURE 10. COMPARATOR WITH HYSTERESIS
Page 16 of 19
X9271
Application Circuits (Continued)
C
VS
R2
R1
R
VO
+
R3
R4
R2
R1 = R2 = R3 = R4 = 10k
R1
GO = 1 + R2/R1
fc = 1/(2RC)
VO = G VS
-1/2 G +1/2
}
VS
R2
}
FIGURE 11. ATTENUATOR
R1
VO
–
–
VS
+
FIGURE 12. FILTER
R2
C1
VS
+
–
–
VO
+
R1
ZIN
R3
VO = G VS
G = - R2/R1
ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq
(R1 + R3) >> R2
FIGURE 13. INVERTING AMPLIFIER
FIGURE 14. EQUIVALENT L-R CIRCUIT
C
R2
–
+
R1
–
} RA
+
} RB
Frequency R1, R2, C
Amplitude RA, RB
FIGURE 15. FUNCTION GENERATOR
FN8174 Rev 5.00
October 15, 2015
Page 17 of 19
X9271
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
October 15, 2015
FN8174.5
CHANGE
- Updated Ordering Information Table on page 2.
- Added Revision History.
- Added About Intersil Verbiage.
About Intersil
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Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
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FN8174 Rev 5.00
October 15, 2015
Page 18 of 19
X9271
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
1
3
5.00 ±0.10
SEE
DETAIL "X"
8
14
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3
1
0.20 C B A
7
B
0.65
0.09-0.20
TOP VIEW
END VIEW
1.00 REF
0.05
H
C
0.90 +0.15/-0.10
1.20 MAX
SEATING
PLANE
0.25 +0.05/-0.06
0.10 C
0.10
GAUGE
PLANE
0.25
5
0°-8°
0.05 MIN
0.15 MAX
CBA
SIDE VIEW
0.60 ±0.15
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
(5.65)
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
FN8174 Rev 5.00
October 15, 2015
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
Page 19 of 19