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X9400WV24IZT1

X9400WV24IZT1

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    TSSOP-24_7.8X4.4MM

  • 描述:

    IC DGTL POT 10KOHM 64TAP 24TSSOP

  • 数据手册
  • 价格&库存
X9400WV24IZT1 数据手册
DATASHEET X9400 FN8189 Rev 4.00 September 2, 2015 Low Noise/Low Power/SPI Bus Quad Digitally Controlled Potentiometers (XDCP™) FEATURES DESCRIPTION • Four potentiometers per package • 64 resistor taps • SPI serial interface for write, read, and transfer operations of the potentiometer • Wiper resistance, 40 typical at 5V. • Four non-volatile data registers for each potentiometer • Non-volatile storage of multiple wiper position • Power-on recall. Loads saved wiper position on power-up. • Standby current < 1µA max • System VCC: 2.7V to 5.5V operation • Analog V+/V–: -5V to +5V • 10k, 2.5k end to end resistance • 100 yr. data retention • Endurance: 100,000 data changes per bit per register • Low power CMOS • 24 Ld SOIC and 24 Ld TSSOP • Pb-free plus anneal available (RoHS compliant) The X9400 integrates four digitally controlled potentiometers (XDCPs) on a monolithic CMOS integrated circuit. The digitally controlled potentiometer is implemented using 63 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI serial bus interface. Each potentiometer has associated with it a volatile Wiper Counter Register (WCR) and four nonvolatile Data Registers (DR0-3) that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array through the switches. Power-up recalls the contents of DR0 to the WCR. The XDCP can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. BLOCK DIAGRAM VCC Pot 0 VSS V+ V- R0 R1 HOLD R2 R3 CS SCK SO SI A0 A1 Interface and Control Circuitry WP VL0/RL0 R0 R1 R2 R3 Wiper Counter Register (WCR) Resistor Array Pot 2 VH2/RH2 VL2/RL2 VW0/RW0 VW2/RW2 VW1/RW1 VW3/RW3 8 Data R0 R1 R2 R3 FN8189 Rev 4.00 September 2, 2015 VH0/RH0 Wiper Counter Register (WCR) Wiper Counter Register (WCR) Resistor Array Pot 1 VH1/RH1 VL1/RL1 R0 R1 R2 R3 Wiper Counter Register (WCR) Resistor Array Pot 3 VH3/RH3 VL3/RL3 Page 1 of 20 X9400 Ordering Information PART NUMBER PART MARKING X9400WS24ZT1 (Note) (No longer available, X9400WS Z recommended replacement: X9400WS24IZT1) VCC LIMITS (V) POTENTIOMETER ORGANIZATION (k) TEMP. RANGE (°C) 5 ±10% 10 0 to +70 PACKAGE PKG. DWG. # 24 Ld SOIC (300 mil) M24.3 (Pb-free) Tape and Reel X9400WS24IZ* (Note) X9400WS ZI -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 X9400WV24IZ* (Note) X9400WV ZI -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 X9400WV24Z* (Note) (No longer available, X9400WV Z recommended replacement: X9400WS24IZT1) X9400WS24IZ-2.7* (Note) X9400WS ZG 2.7 to 5.5 X9400WV24IZ-2.7* (Note) (No longer available, X9400WV ZG recommended replacement: X9400WS24IZT1) X9400WV24Z-2.7* (Note) (No longer available, X9400WV ZF recommended replacement: X9400WS24IZT1) 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3 -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044 *Add "T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. FN8189 Rev 4.00 September 2, 2015 Page 2 of 20 X9400 PIN DESCRIPTIONS Host Interface Pins Serial Output (SO) SO is a push/pull serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock. the serial sequence. To pause, HOLD must be brought LOW while SCK is LOW. To resume communication, HOLD is brought HIGH, again while SCK is LOW. If the pause feature is not used, HOLD should be held HIGH at all times. Device Address (A0 - A1) SI is the serial data input pin. All opcodes, byte addresses and data to be written to the pots and pot registers are input on this pin. Data is latched by the rising edge of the serial clock. The address inputs are used to set the least significant 2 bits of the 8-bit slave address. A match in the slave address serial data stream must be made with the address input in order to initiate communication with the X9400. A maximum of 4 devices may occupy the SPI serial bus. Serial Clock (SCK) Potentiometer Pins The SCK input is used to clock data into and out of the X9400. VH/RH (VH0/RH0 - VH3/RH3), VL/RL (VL0/RL0 - VL3/RL3) Serial Input Chip Select (CS) When CS is HIGH, the X9400 is deselected and the SO pin is at high impedance, and (unless an internal write cycle is underway) the device will be in the standby state. CS LOW enables the X9400, placing it in the active power mode. It should be noted that after a power-up, a HIGH to LOW transition on CS is required prior to the start of any operation. Hold (HOLD) HOLD is used in conjunction with the CS pin to select the device. Once the part is selected and a serial sequence is underway, HOLD may be used to pause the serial communication with the controller without resetting The VH/RH and VL/RL inputs are equivalent to the terminal connections on either end of a mechanical potentiometer. VW/RW (VW0/RW0 - VW3/RW3) The wiper outputs are equivalent to the wiper output of a mechanical potentiometer. Hardware Write Protect Input (WP) The WP pin when LOW prevents nonvolatile writes to the Data Registers. Analog Supplies (V+, V-) The analog Supplies V+, V- are the supply voltages for the XDCP analog section. PIN CONFIGURATION SOIC TSSOP V+ VCC 1 24 VL0/RL0 2 23 VL3/RL3 VH0/RH0 3 22 VH3/RH3 21 VW3/RW3 VW0/RW0 CS 4 5 WP 6 SI 7 A1 8 X9400 WP A1 2 23 CS VL1/RL1 VH1/RH1 3 22 VW0/RW0 4 21 VH0/RH0 5 20 VL0/RL0 6 19 VCC 18 V+ A0 19 SO VSS 18 HOLD 17 SCK VH2/RH2 VL2/RL2 SCK VL1/RL1 9 16 10 15 VH2/RH2 VW1/RW1 11 14 VW2/RW2 12 13 FN8189 Rev 4.00 September 2, 2015 24 20 VH1/RH1 SS 1 VW1/RW1 VL2/RL2 V SI V- X9400 V- 7 VW2/RW2 8 17 VL3/RL3 9 16 VH3/RH3 10 15 VW3/RW3 11 14 A0 12 13 SO HOLD Page 3 of 20 X9400 Wiper Counter Register (WCR) PIN NAMES Symbol Description SCK Serial Clock SI, SO Serial Data A0 - A1 Device Address VH0/RH0 - VH3/RH3, VL0/RL0 - VL3/RL3 Potentiometer Pins (terminal equivalent) VW0/RW0 - VW1/RW1 Potentiometer Pins (wiper equivalent) WP Hardware Write Protection VCC System Supply Voltage VSS System Ground NC No Connection DEVICE DESCRIPTION The X9400 is a highly integrated microcircuit incorporating four resistor arrays and their associated registers and counters and the serial interface logic providing direct communication between the host and the XDCP potentiometers. Serial Interface The X9400 supports the SPI interface hardware conventions. The device is accessed via the SI input with data clocked in on the rising SCK. CS must be LOW and the HOLD and WP pins must be HIGH during the entire operation. The X9400 contains four Wiper Counter Registers, one for each XDCP potentiometer. The WCR is equivalent to a serial-in, parallel-out register/counter with its outputs decoded to select one of sixty-four switches along its resistor array. The contents of the WCR can be altered in four ways: it may be written directly by the host via the write Wiper Counter Register instruction (serial load); it may be written indirectly by transferring the contents of one of four associated data registers via the XFR Data Register or global XFR data register instructions (parallel load); it can be modified one step at a time by the increment/decrement instruction. Finally, it is loaded with the contents of its Data Register zero (DR0) upon power-up. The Wiper Counter Register is a volatile register; that is, its contents are lost when the X9400 is powered-down. Although the register is automatically loaded with the value in DR0 upon power-up, this may be different from the value present at power-down. Data Registers Each potentiometer has four 6-bit nonvolatile Data Registers. These can be read or written directly by the host. Data can also be transferred between any of the four Data Registers and the associated Wiper Counter Register. All operations changing data in one of the data registers is a nonvolatile operation and will take a maximum of 10ms. The SO and SI pins can be connected together, since they have three state outputs. This can help to reduce system pin count. If the application does not require storage of multiple settings for the potentiometer, the Data Registers can be used as regular memory locations for system parameters or user preference data. Array Description Data Register Detail The X9400 is comprised of four resistor arrays. Each array contains 63 discrete resistive segments that are connected in series. The physical ends of each array are equivalent to the fixed terminals of a mechanical potentiometer (VH/RH and VL/RL inputs). (MSB) (LSB) D5 D4 D3 D2 D1 D0 NV NV NV NV NV NV At both ends of each array and between each resistor segment is a CMOS switch connected to the wiper (VW/RW) output. Within each individual array only one switch may be turned on at a time. These switches are controlled by a wiper counter register (WCR). The six bits of the WCR are decoded to select, and enable, one of sixty-four switches. FN8189 Rev 4.00 September 2, 2015 Page 4 of 20 X9400 Figure 1. Detailed Potentiometer Block Diagram (One of Four Arrays) Serial Data Path Serial Bus Input From Interface Circuitry Register 0 6 Parallel Bus Input Wiper Counter Register (WCR) Register 3 If WCR = 00[H] then VW/RW = VL/RL If WCR = 3F[H] then VW/RW = VH/RH C o u n t e r Register 1 8 Register 2 VH/RH UP/DN Modified SCL D e c o d e INC/DEC Logic UP/DN VL/RL CLK VW/RW Write in Process The contents of the Data Registers are saved to nonvolatile memory when the CS pin goes from LOW to HIGH after a complete write sequence is received by the device. The progress of this internal write operation can be monitored by a write in process bit (WIP). The WIP bit is read with a read status command. Figure 2. Identification Byte Format Device Type Identifier 0 1 0 1 0 0 A1 A0 Device Address INSTRUCTIONS Identification (ID) Byte Instruction Byte The first byte sent to the X9400 from the host, following a CS going HIGH to LOW, is called the Identification byte. The most significant four bits of the slave address are a device type identifier, for the X9400 this is fixed as 0101[B] (refer to Figure 2). The next byte sent to the X9400 contains the instruction and register pointer information. The four most significant bits are the instruction. The next four bits point to one of the four pots and, when applicable, they point to one of four associated registers. The format is shown below in Figure 3. The two least significant bits in the ID byte select one of four devices on the bus. The physical device address is defined by the state of the A0 - A1 input pins. The X9400 compares the serial data stream with the address input state; a successful compare of both address bits is required for the X9400 to successfully continue the command sequence. The A0 - A1 inputs can be actively driven by CMOS input signals or tied to VCC or VSS. The remaining two bits in the slave byte must be set to 0. FN8189 Rev 4.00 September 2, 2015 Page 5 of 20 X9400 Figure 3. Instruction Byte Format Register Select I3 I2 I1 Instructions I0 R1 R0 P1 P0 Pot Select The four high order bits of the instruction byte specify the operation. The next two bits (R1 and R0) select one of the four registers that is to be acted upon when a register oriented instruction is issued. The last two bits (P1 and P0) selects which one of the four potentiometers is to be affected by the instruction. Four of the ten instructions are two bytes in length and end with the transmission of the instruction byte. These instructions are: – XFR Data Register to Wiper Counter Register—This transfers the contents of one specified Data Register to the associated Wiper Counter Register. – XFR Wiper Counter Register to Data Register —This transfers the contents of the specified Wiper Counter Register to the specified associated Data Register. – Global XFR Data Register to Wiper Counter Register — This transfers the contents of all specified Data Registers to the associated Wiper Counter Registers. – Global XFR Wiper Counter Register to Data Register — This transfers the contents of all Wiper Counter Registers to the specified associated Data Registers. Five instructions require a three-byte sequence to complete. These instructions transfer data between the host and the X9400; either between the host and one of the data registers or directly between the host and the Wiper Counter Register. These instructions are: – Read Wiper Counter Register—read the current wiper position of the selected pot, – Write Wiper Counter Register—change current wiper position of the selected pot, – Read Data Register—read the contents of the selected data register; – Write Data Register—write a new value to the selected data register. – Read Status—This command returns the contents of the WIP bit which indicates if the internal write cycle is in progress. The sequence of these operations is shown in Figure 5 and Figure 6. The final command is Increment/Decrement. It is different from the other commands, because it’s length is indeterminate. Once the command is issued, the master can clock the selected wiper up and/or down in one resistor segment steps; thereby, providing a fine tuning capability to the host. For each SCK clock pulse (tHIGH) while SI is HIGH, the selected wiper will move one resistor segment towards the VH/RH terminal. Similarly, for each SCK clock pulse while SI is LOW, the selected wiper will move one resistor segment towards the VL/RL terminal. A detailed illustration of the sequence and timing for this operation are shown in Figure 7 and Figure 8. The basic sequence of the two byte instructions is illustrated in Figure 4. These two-byte instructions exchange data between the WCR and one of the data registers. A transfer from a Data Register to a WCR is essentially a write to a static RAM, with the static RAM controlling the wiper position. The response of the wiper to this action will be delayed by tWRL. A transfer from the WCR (current wiper position), to a data register is a write to nonvolatile memory and takes a minimum of tWR to complete. The transfer can occur between one of the four potentiometers and one of its associated registers; or it may occur globally, where the transfer occurs between all potentiometers and one associated register. FN8189 Rev 4.00 September 2, 2015 Page 6 of 20 X9400 Figure 4. Two-Byte Instruction Sequence CS SCK SI 0 1 0 1 0 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 Figure 5. Three-Byte Instruction Sequence (Write) CS SCK SI 0 1 0 0 1 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 0 0 D5 D4 D3 D2 D1 D0 Figure 6. Three-Byte Instruction Sequence (Read) CS SCK SI Don’t Care 0 1 0 0 1 0 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0 S0 0 0 D5 D4 D3 D2 D1 D0 Figure 7. Increment/Decrement Instruction Sequence CS SCK SI 0 1 FN8189 Rev 4.00 September 2, 2015 0 1 0 0 A1 A0 I3 I2 I1 I0 0 0 P1 P0 I N C 1 I N C 2 I N C n D E C 1 D E C n Page 7 of 20 X9400 Figure 8. Increment/Decrement Timing Limits tWRID SCK SI Voltage Out VW/RW INC/DEC CMD Issued Table 1. Instruction Set Read Wiper Counter Register I3 1 I2 0 Instruction Set I1 I0 R1 R0 P1 0 1 0 0 P1 Write Wiper Counter Register 1 0 1 0 Read Data Register 1 0 1 1 R1 R0 P1 Write Data Register 1 1 0 0 R1 R0 P1 XFR Data Register to Wiper Counter Register 1 1 0 1 R1 R0 P1 XFR Wiper Counter Register to Data Register 1 1 1 0 R1 R0 P1 Global XFR Data Register to Wiper Counter Register 0 0 0 1 R1 R0 0 Global XFR Wiper Counter Register to Data Register 1 0 0 0 R1 R0 0 Increment/Decrement Wiper Counter Register Read Status (WIP bit) 0 0 1 0 0 0 P1 0 1 0 1 0 0 0 Instruction FN8189 Rev 4.00 September 2, 2015 0 0 P1 P0 Operation P0 Read the contents of the Wiper Counter Register pointed to by P1 - P0 P0 Write new value to the Wiper Counter Register pointed to by P1 - P0 P0 Read the contents of the Data Register pointed to by P1 - P0 and R1 - R0 P0 Write new value to the Data Register pointed to by P1 - P0 and R1 - R0 P0 Transfer the contents of the Data Register pointed to by R1 - R0 to the Wiper Counter Register pointed to by P1 - P0 P0 Transfer the contents of the Wiper Counter Register pointed to by P1 - P0 to the Register pointed to by R1 - R0 0 Transfer the contents of the Data Registers pointed to by R1 - R0 of all four pots to their respective Wiper Counter Register 0 Transfer the contents of all Wiper Counter Registers to their respective data Registers pointed to by R1 - R0 of all four pots P0 Enable Increment/decrement of the Wiper Counter Register pointed to by P1 - P0 1 Read the status of the internal write cycle, by checking the WIP bit. Page 8 of 20 X9400 Instruction Format Notes: (1) (2) (3) (4) “A1 ~ A0”: stands for the device addresses sent by the master. WPx refers to wiper position data in the Counter Register “I”: stands for the increment operation, SI held HIGH during active SCK phase (high). “D”: stands for the decrement operation, SI held LOW during active SCK phase (high). Read Wiper Counter Register (WCR) device type device instruction identifier addresses opcode CS Falling Edge 0 1 0 1 0 0 A A 1 0 0 1 1 0 WCR addresses 0 wiper position (sent by X9400 on SO) CS Rising W W W W W W P P 0 0 0 P P P P P P Edge 1 0 5 4 3 2 1 0 Write Wiper Counter Register (WCR) device type identifier device addresses instruction opcode CS Falling Edge 0 1 0 1 0 0 A A 1 1 0 0 1 WCR addresses 0 0 Data Byte (sent by Host on SI) CS W W W W W W Rising P P 0 0 0 P P P P P P Edge 1 0 5 4 3 2 1 0 Read Data Register (DR) device type identifier device addresses instruction opcode DR and WCR addresses CS Falling Edge 0 1 0 1 0 0 A A 1 0 1 1 R R P 1 0 1 0 1 Data Byte (sent by X9400 on SO) CS W W W W W W Rising P 0 0 P P P P P P Edge 0 5 4 3 2 1 0 Write Data Register (DR) device type device identifier addresses instruction opcode DR and WCR addresses CS Falling Edge 0 1 0 1 0 0 A A 1 1 0 0 R 1 0 1 R 0 P 1 P 0 Data Byte (sent by host on SI) CS W W W W W W Rising 0 0 P P P P P P Edge 5 4 3 2 1 0 HIGH-VOLTAGE WRITE CYCLE Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR and WCR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 1 0 1 R R P P Edge 1 0 1 0 1 0 Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device instruction DR and WCR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 1 1 0 R R P P Edge 1 0 1 0 1 0 FN8189 Rev 4.00 September 2, 2015 HIGH-VOLTAGE WRITE CYCLE Page 9 of 20 X9400 Increment/Decrement Wiper Counter Register (WCR) device type device instruction WCR increment/decrement CS CS identifier addresses opcode addresses (sent by master on SDA) Falling Rising Edge 0 1 0 1 0 0 A A 0 0 1 0 X X P P I/ I/ . . . . I/ I/ Edge 1 0 1 0 D D D D Global Transfer Data Register (DR) to Wiper Counter Register (WCR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 0 0 0 1 R R 0 0 Edge 1 0 1 0 Global Transfer Wiper Counter Register (WCR) to Data Register (DR) device type device instruction DR CS CS identifier addresses opcode addresses Falling Rising Edge 0 1 0 1 0 0 A A 1 0 0 0 R R 0 0 Edge 1 0 1 0 HIGH-VOLTAGE WRITE CYCLE Read Status device type device instruction wiper Data Byte identifier addresses opcode addresses (sent by X9400 on SO) CS CS Falling Rising W Edge 0 1 0 1 0 0 A A 0 1 0 1 0 0 0 1 0 0 0 0 0 0 0 I Edge 1 0 P FN8189 Rev 4.00 September 2, 2015 Page 10 of 20 X9400 ABSOLUTE MAXIMUM RATINGS COMMENT Temperature under bias .................... -65C to +135C Storage temperature ......................... -65C to +150C Voltage on SCK, SCL or any address input with respect to VSS ......................... -1V to +7V Voltage on V+ (referenced to VSS)........................ 10V Voltage on V- (referenced to VSS)........................-10V (V+) - (V-) .............................................................. 12V Any VH ....................................................................V+ Any VL ......................................................................VLead temperature (soldering, 10 seconds) ........ 300C IW (10 seconds)................................................±12mA Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temp Commercial Industrial Min. 0C -40C Max. +70C +85C Device X9400 X9400-2.7 Supply Voltage (VCC) Limits 5V 10% 2.7V to 5.5V ANALOG CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.) Limits Symbol Max. Unit End to end resistance ±20 % Power rating 50 mW IW Wiper current ±6 mA RW Wiper resistance 150 250  Wiper Current =  1mA, VCC = 3V 40 100  Wiper Current =  1mA, VCC = 5V V RTOTAL Vv+ VvVTERM Parameter Voltage on V+ Pin Voltage on V- Pin Min. Typ. X9400 +4.5 +5.5 X9400-2.7 +2.7 +5.5 X9400 -5.5 -4.5 X9400-2.7 -5.5 -2.7 V- V+ Voltage on any VH/RH or VL/RL Pin Noise Resolution Absolute linearity (1) Relative linearity (2) Temperature coefficient of RTOTAL V dBV 1.6 % -0.2 +1 MI(3) +0.2 MI(3) 300 Ratiometric temp. coefficient Potentiometer capacitances 10/10/25 IAL RH, RL, RW leakage current 0.1 Ref: 1kHz Rw(n)(actual) - Rw(n)(expected) Rw(n + 1) - [Rw(n) + MI] ppm/C ±20 CH/CL/CW 25C, each pot V -120 -1 Test Conditions 10 ppm/°C pF See Spice Macromodel µA VIN = VSS to VCC. Device is in stand-by mode. Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. (2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a potentiometer. It is a measure of the error in step size. (3) MI = RTOT/63 or (RH - RL)/63, single pot FN8189 Rev 4.00 September 2, 2015 Page 11 of 20 X9400 D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Limits Symbol Parameter Min. Typ. Max. Units Test Conditions 400 µA fSCK = 2MHz, SO = Open, Other Inputs = VSS ICC1 VCC supply current (Active) ICC2 VCC supply current (Nonvolatile Write) 1 mA fSCK = 2MHz, SO = Open, Other Inputs = VSS ISB VCC current (standby) 1 µA SCK = SI = VSS, Addr. = VSS ILI Input leakage current 10 µA VIN = VSS to VCC ILO Output leakage current 10 µA VOUT = VSS to VCC VIH Input HIGH voltage VCC x 0.7 VCC + 0.5 V VIL Input LOW voltage -0.5 VCC x 0.1 V VOL Output LOW voltage 0.4 V IOL = 3mA ENDURANCE AND DATA RETENTION Parameter Min. Unit Minimum endurance 100,000 Data changes per bit per register Data retention 100 years CAPACITANCE Symbol COUT (4) CIN(4) Test Max. Unit Test Conditions Output capacitance (SO) 8 pF VOUT = 0V Input capacitance (A0, A1, SI, and SCK) 6 pF VIN = 0V POWER-UP TIMING Symbol tPUR (5) tPUW(5) tR VCC(4) Parameter Max. Unit Power-up to initiation of read operation 1 ms Power-up to initiation of write operation 5 ms 50 V/msec VCC Power-up ramp POWER-UP REQUIREMENTS (Power-up sequencing can affect correct recall of the wiper registers) The preferred power-on sequence is as follows: First VCC, then the potentiometer pins, RH, RL, and RW. Voltage should not be applied to the potentiometer pins before V+ or V- is applied. The VCC ramp rate specification should be met, and any glitches or slope changes in the VCC line should be held to > R2 Function Generator C R2 – + R1 – } RA + } RB frequency  R1, R2, C amplitude  RA, RB FN8189 Rev 4.00 September 2, 2015 Page 17 of 20 X9400 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE September 2, 2015 FN8189.4 Updated Ordering Information Table on page 2. Added Revision History and About Intersil sections. Updated POD M24.3 from rev 1 to rev 2. Changes since rev 1: Updated to new POD standard by removing table listing dimensions and putting dimensions on drawing. Added Land Pattern. Updated POD MDP004 from rev E to rev F. Changes since rev E: Added dimensions (MILLIMETERS) to table column heading. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at © Copyright Intersil Americas LLC 2005-2015. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see FN8189 Rev 4.00 September 2, 2015 Page 18 of 20 X9400 Package Outline Drawing M24.3 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC) Rev 2, 3/11 24 INDEX AREA 7.60 (0.299) 7.40 (0.291) 10.65 (0.419) 10.00 (0.394) DETAIL "A" 1 2 3 TOP VIEW 1.27 (0.050) 0.40 (0.016) SEATING PLANE 2.65 (0.104) 2.35 (0.093) 15.60 (0.614) 15.20 (0.598) 0.75 (0.029) x 45° 0.25 (0.010) 0.30 (0.012) 0.10 (0.004) 1.27 (0.050) 0.51 (0.020) 0.33 (0.013) 8° 0° 0.32 (0.012) 0.23 (0.009) SIDE VIEW “B” SIDE VIEW “A” 1.981 (0.078) 9.373 (0.369) 1.27 (0.050) NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions in ( ) are not necessarily exact. 8. This outline conforms to JEDEC publication MS-013-AD ISSUE C. 0.533 (0.021) TYPICAL RECOMMENDED LAND PATTERN FN8189 Rev 4.00 September 2, 2015 Page 19 of 20 X9400 Thin Shrink Small Outline Package Family (TSSOP) MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A MILLIMETERS (N/2)+1 N SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE PIN #1 I.D. E E1 1 (N/2) B 0.20 C B A 2X N/2 LEAD TIPS TOP VIEW 0.05 e C SEATING PLANE H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 ±0.05 A2 0.90 0.90 0.90 0.90 0.90 ±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 ±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. F 2/07 0.10 M C A B b 0.10 C N LEADS SIDE VIEW NOTES: 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. SEE DETAIL “X” 3. Dimensions “D” and “E1” are measured at dAtum Plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. c END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0° - 8° DETAIL X FN8189 Rev 4.00 September 2, 2015 Page 20 of 20
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