FSMD010-0805-R

NO. Product Specification and Approval Sheet Version PQ29-101ER 1 Page 1/4 Surface Mountable PTC Resettable Fuse: FSMD0805 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~1.10A (e) Maximum Voltage: 6V~24VDC (f) Temperature Range: -40℃ to 85℃ 2. Agency Recognition UL: File No. E211981 C-UL: File No. E211981 TÜV: File No. R50090556 3. Electrical Characteristics (23℃) Part Number FSMD010-0805-R FSMD010-24-0805-R FSMD020-0805-R FSMD035-0805-R FSMD050-0805R FSMD050-9-0805R FSMD075-0805R FSMD100-0805R FSMD110-0805R Hold Trip Rated Max. Typical Max. Time to Trip Resistance Current Current Voltage Current Power Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W Amp Sec Ohm Ohm 0.10 0.10 0.20 0.35 0.50 0.50 0.75 1.00 1.10 0.30 0.30 0.50 0.75 1.00 1.00 1.50 1.95 2.20 15 24 9 6 6 9 6 6 6 100 100 100 100 100 100 100 100 100 0.5 0.5 0.5 0.5 0.5 0.5 0.6 0.6 0.6 0.50 0.50 8.00 8.00 8.00 8.00 8.00 8.00 8.00 1.50 1.50 0.02 0.10 0.10 0.10 0.20 0.30 0.20 0.700 0.700 0.400 0.250 0.150 0.150 0.090 0.060 0.050 6.000 6.000 3.500 1.200 0.850 0.850 0.350 0.210 0.200 IH=Hold current-maximum current at which the device will not trip at 23℃ still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. VMAX=Maximum voltage device can withstand without damage at it rated current (IMAX). IMAX= Maximum fault current device can withstand without damage at rated voltage (VMAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc. NOTE : Specification subject to change without notice. 2021/03/25 NO. PQ29-101ER Product Specification and Approval Sheet Version 1 Page 2/4 4. FSMD Product Dimensions (Millimeters) A Part Number B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. FSMD010-0805-R 2.00 2.30 1.20 1.50 0.30 1.00 0.20 0.60 0.10 0.45 FSMD010-24-0805-R 2.00 2.30 1.20 1.50 0.30 1.00 0.20 0.60 0.10 0.45 FSMD020-0805-R 2.00 2.30 1.20 1.50 0.30 1.00 0.20 0.60 0.10 0.45 FSMD035-0805-R 2.00 2.30 1.20 1.50 0.25 0.75 0.20 0.60 0.10 0.45 FSMD050-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 FSMD050-9-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 FSMD075-0805R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 FSMD100-0805R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 FSMD110-0805R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 5. Thermal Derating Curve FSMD0805 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (℃) Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc. NOTE : Specification subject to change without notice. 2021/03/25 NO. PQ29-101ER Product Specification and Approval Sheet Version 1 Page 3/4 6. Typical Time-To-Trip at 23℃ A 100 C D E FG 10 Time-to-trip (s) A =FSMD010-0805-R / A =FSMD010-24-0805-R B =FSMD020-0805-R C =FSMD035-0805-R D =FSMD050-0805R / D =FSMD050-9-0805R E =FSMD075-0805R F =FSMD100-0805R G =FSMD110-0805R B 1 0.1 0.01 0.1 1 10 Fault Current (A) 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System F S M D □ □ □ - □ □ - 0805 - R Part Marking System F1 Voltage Rating Current Rating F □ Part Identification Fuzetec Logo Example F1 =FSMD010-0805-R FB =FSMD010-24-0805-R F2 =FSMD020-0805-R F3 =FSMD035-0805-R F3 =FSMD035-0805-R F5 =FSMD050-0805R FA =FSMD050-9-0805R F7 =FSMD075-0805R F0 =FSMD100-0805R FC =FSMD110-0805R Warning: - Each product should be carefully evaluated and tested for their suitability of application. - Operation beyond the specified maximum rating or improper use may result in damage and possible electrical arcing and/or flame. - PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. - Avoid contact of PPTC device with chemical solvent, including some inert material such as silicone based oil, lubricant and etc. Prolonged contact will damage the device performance. - Additional protection mechanism are strongly recommended to be used in conjunction with the PPTC device for protection against abnormal or failure conditions. - Avoid use of PPTC device in a constrained space such as potting material, housing and containers where have limited space to accommodate device thermal expansion and/or contraction. Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc. NOTE : Specification subject to change without notice. 2021/03/25 NO. Product Specification and Approval Sheet Version PQ29-101ER 1 Page 4/4 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD0805 device Pad dimensions (millimeters) A B Device Nominal Nominal All 0805 Series 1.20 1.00 C Nominal 1.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat: Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak: 20-40 seconds Temperature (tp) Ramp-Down Rate: 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature: Note 1: All temperatures refer to of the package, measured on the package body surface. Reflow Profile Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max paste thickness is 0.25mm.(Nominal) 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment: < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc. NOTE : Specification subject to change without notice. 2021/03/25