Surface Mount PPTC FSMD 0805 Series
FEATURES
• 0805 size Surface Mount •Application: All high-density boards •Operation Current: 100mA ~ 350mA •Maximum Voltage: 6V ~ 15V •Temperature Range: -40°C to 85°C •RoHS Compliant
RoHS
ü
AGENCY RECOGNITION
•UL (Pending) •C-UL (Pending) •TÜV (Pending)
ELECTRICAL CHARACTERISTICS (23°C)
Part Number FSMD010-0805 FSMD020-0805 FSMD035-0805 Hold Current IH, A 0.10 0.20 0.35 Trip Current IT, A 0.30 0.50 0.75 Rated Voltage VMAX, Vdc 15 9 6 Maximum Current IMAX, A 100 100 100 Typical Power Pd, W 0.5 0.5 0.5 Max Time to Trip Current Amp 0.50 8.00 8.00 Time Sec 1.500 0.02 0.10 Resistance Tolerance RMIN R1MAX OHMS 0.70 0.40 0.25 OHMS 6.000 3.500 1.200
IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: solder-plated copper
FSMD PRODUCT DIMENSIONS (MILLIMETERS)
B
Marking
A
B
D
Part Number FSMD010-0805 FSMD020-0805 FSMD035-0805 2.00 2.00 2.00
A 2.2 2.2 2.2 1.20 1.20 1.20
B 1.5 1.5 1.5
C Max
D Min
Min Max Min Max Min
0.20 0.55 1.00 0.20 0.55 1.00 0.20 0.47 0.75
RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
C5ED01 2008.1.30
Surface Mount PPTC FSMD 0805 Series
THERMAL PRODUCT DIMENSIONS (MILLIMETERS)
Thermal Derating Curve, FSMD0805 Series
200%
RoHS
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Percent of Rated Hold and Trip Current
150%
100%
50%
A= FSMD 075, 100 B= FSMD 014, 020, 035 & 050
40 20 0 20 40 60 80
0%
Ambient Temperature (C)
TYPICAL TIME-TO-TRIP AT 23°C
A 100 10
Time-to-trip (S)
B
C
1 0.1 0.01 0.001 0.1 1 Fault current (A) 10
A = FSMD010 - 0805 B = FSMD020 - 0805 C = FSMD035 - 0805
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER RELOW
Solder Reflow Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for regular. This may cause damage to other components. 1. Recommended maximum past thickness is 0.25mm. 2. Devices can be cleaned by using standard industry methods and solvents. 3. Storage Environment:
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