FSMD050-1210

Surface Mount PPTC FSMD1210 Series FEATURES •1210 size, Surface mount •Application: All high-density boards •Operation Current: 50mA ~ 0.750mA •Maximum Voltage: 8V ~ 60V •Temperature Range: -40°C to 85°C •RoHS Compliant RoHS ü AGENCY RECOGNITION •UL (E211981) •C-UL (E211981) •TUV (R50090556) ELECTRICAL CHARACTERISTICS (23°C) Part Number FSMD005-1210 FSMD010-1210 FSMD020-1210 FSMD035-1210 FSMD050-1210 FSMD075-1210 Hold Current IH, A 0.05 0.10 0.20 0.35 0.50 0.75 Trip Current IT, A 0.15 0.25 0.40 0.70 1.00 1.50 Rated Voltage VMAX, Vdc 60 60 30 16 16 8 Maximum Current IMAX, A 10 10 10 40 40 40 Typical Power Pd, W 0.6 0.6 0.6 0.6 0.6 0.6 Max Time to Trip Current Amp 0.25 0.50 8.0 8.0 8.0 8.0 Time Sec 1.50 1.50 0.02 0.20 0.10 0.10 Resistance Tolerance RMIN R1MAX OHMS 3.60 1.60 0.80 0.32 0.25 0.13 OHMS 50.00 15.00 5.00 1.30 0.90 0.40 * Devices with hold current up to 1.5 amps are in development IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD1210 PRODUCT DIMENSIONS (MILLIMETERS) D B A Top and bottom view Side view C Part Number FSMD005-1210 FSMD010-1210 FSMD020-1210 FSMD035-1210 FSMD050-1210 FSMD075-1210 Min 3.0 3.0 3.0 3.0 3.0 3.0 A Max Min 3.43 2.35 3.43 2.35 3.43 2.35 3.43 2.35 3.43 2.35 3.43 2.35 B Max 2.8 2.8 2.8 2.8 2.8 2.8 Min C Max 0.60 1.15 0.60 1.15 0.40 0.85 0.40 0.80 0.30 0.75 0.30 0.70 D Min 0.25 0.25 0.25 0.25 0.25 0.25 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com C5ED03 REV 2007.8.14 Surface Mount PPTC FSMD1210 Series THERMAL DERATING CURVE Thermal Derating Curv e, FSMD1210 Serie s 200% RoHS ü Percen t o f Rated Ho ld an d T rip Cu rren t 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23°C B 100 10 C DE F Time-to-trip (S) 1 0.1 0.01 A A= B= C= D= E= F= FSMD005-1210 FSMD010-1210 FSMD020-1210 FSMD035-1210 FSMD050-1210 FSMD075-1210 0.001 0.1 1 Fault current (A) 10 100 PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD1210 device NOMINAL PAD DIMENSIONS (MILLIMETERS) SOLDER REFLOW 20 to 40 Seconds 260 °C Ramp-up 3°C/Second Max Ramp-down 6°C/Second Max 2.80 217 °C f 200 °C 150 °C Preheat 1.0 2.0 1.0 25 °C 60 to 180 Seconds 60 to 150 Seconds Solder Reflow Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: