NO.
Product Specification and Approval Sheet Version
PQ11-01ER
1
Page
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Surface Mountable PTC Resettable Fuse: FSMD2920 Series
1. Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: 2920 Dimension, Surface mountable, Solid state, Faster time to
trip than standard SMD devices
(d) Operation Current: 0.30A~5.00A
(e) Maximum Voltage: 6V~60VDC
(f) Temperature Range: -40℃ to 85℃
2. Agency Recognition
UL:
File No. E211981
C-UL: File No. E211981
TÜV:
File No. R50090556
3. Electrical Characteristics (23℃)
Part
Number
FSMD030-2920-R
FSMD050-2920-R
FSMD075-2920-R
FSMD075-60-2920-R
FSMD100-2920-R
FSMD110-60-2920R
FSMD125-2920-R
FSMD150-2920-R
FSMD185-2920-R
FSMD200-2920-R
FSMD200-24-2920-R
FSMD250-2920-R
FSMD260-2920-R
FSMD260-24-2920R
FSMD300-2920-R
FSMD300-15-2920R
FSMD300-24-2920R
FSMD330-2920R
FSMD400-16-2920R
FSMD500-16-2920R
Hold
Trip
Rated
Max.
Typical
Max. Time to Trip
Resistance
Current
Current
Voltage
Current
Power
Current
Time
RMIN
R1MAX
IH, A
IT, A
VMAX, VDC
IMAX, A
Pd, W
A
Sec
Ohm
Ohm
0.30
0.50
0.75
0.75
1.10
1.10
1.25
1.50
1.85
2.00
2.00
2.50
2.60
2.60
3.00
3.00
3.00
3.30
4.00
5.00
0.60
1.00
1.50
1.50
2.20
2.20
2.50
3.00
3.70
4.00
4.00
5.00
5.20
5.20
5.20
5.20
5.20
5.50
8.00
10.00
60
60
33
60
33
60
33
33
33
16
24
16
6
24
6
15
24
24
16
16
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
2.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
20.0
20.0
3.0
4.0
0.3
0.3
0.5
0.5
2.0
2.0
2.5
4.5
5.0
16.0
20.0
20.0
25.0
20.0
20.0
20.0
4.0
5.0
1.000
0.300
0.180
0.180
0.090
0.090
0.050
0.050
0.040
0.035
0.035
0.025
0.020
0.020
0.010
0.010
0.010
0.010
0.010
0.005
4.800
1.400
1.000
1.000
0.410
0.410
0.250
0.230
0.150
0.120
0.120
0.085
0.075
0.075
0.048
0.048
0.048
0.048
0.040
0.025
IH=Hold current-maximum current at which the device will not trip at 23℃still air.
IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
VMAX=Maximum voltage device can withstand without damage at it rated current (IMAX).
IMAX= Maximum fault current device can withstand without damage at rated voltage (VMAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.
NOTE: Specification subject to change without notice.
2021/03/25
NO.
PQ11-01ER
Product Specification and Approval Sheet Version
1
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4. FSMD Product Dimensions (Millimeters)
Part
Number
FSMD030-2920-R
FSMD050-2920-R
FSMD075-2920-R
FSMD075-60-2920-R
FSMD100-2920-R
FSMD110-60-2920R
FSMD125-2920-R
FSMD150-2920-R
FSMD185-2920-R
FSMD200-2920-R
FSMD200-24-2920-R
FSMD250-2920-R
FSMD260-2920-R
FSMD260-24-2920R
FSMD300-2920-R
FSMD300-15-2920R
FSMD300-24-2920R
FSMD330-2920R
FSMD400-16-2920R
FSMD500-16-2920R
A
B
C
D
E
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
6.73
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
7.98
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
4.80
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
5.44
0.60
0.60
0.40
0.60
0.40
0.40
0.40
0.40
0.30
0.30
0.20
0.30
0.30
0.65
0.40
0.40
0.65
0.65
0.40
0.40
1.15
1.15
1.15
1.15
1.00
1.70
0.90
0.90
0.90
0.90
0.80
0.90
0.90
1.15
0.90
1.15
1.15
1.15
1.50
1.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
0.90
Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.
NOTE: Specification subject to change without notice.
2021/03/25
NO.
Product Specification and Approval Sheet Version
PQ11-01ER
1
Page
3/5
5. Thermal Derating Curve
Percent of Rated Hold and Trip Current
FSMD2920 Series
200%
150%
100%
50%
0%
-40
-20
0
20
40
Ambient Temperature (℃)
60
80
6. Typical Time-To-Trip at 23℃
A B
CDE FGHI JK LM NO
100
10
Time-to-trip (s)
A = FSMD030-2920-R
B = FSMD050-2920-R
C = FSMD075-2920-R /
075-60-2920-R
D = FSMD100-2920-R
E = FSMD110-60-2920R
F = FSMD125-2920-R
G = FSMD150-2920-R
H = FSMD185-2920-R
I = FSMD200-2920-R /
200-24-2920-R
J = FSMD250-2920-R
K = FSMD260-2920-R /
260-24-2920R
L= FSMD300-2920-R /
300-15-2920R /
300-24-2920R
M = FSMD330-2920R
N = FSMD400-16-2920R
O = FSMD500-16-2920R
1
0.1
0.01
0.001
0.1
1
10
100
Fault Current (A)
Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.
NOTE: Specification subject to change without notice.
2021/03/25
NO.
Product Specification and Approval Sheet Version
PQ11-01ER
1
Page
4/5
7. Material Specification
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
8. Part Numbering and Marking System
Part Numbering System
F S M D □ □ □ – □ □ – 2920 R (– R)
Voltage Rating
Current Rating
Part Marking System
F200L
F
□ □ □ L
Part Identification
Fuzetec Logo
Example
F
075L
60
F
□ □ □ L
□ □
Example
Part Identification
Fuzetec Logo
Warning: - Each product should be carefully evaluated and tested for their suitability of application.
- Operation beyond the specified maximum rating or improper use may result in damage and possible electrical arcing and/or flame.
- PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged
trip are not anticipated.
- Avoid contact of PPTC device with chemical solvent, including some inert material such as silicone based oil, lubricant and etc.
Prolonged contact will damage the device performance.
- Additional protection mechanism are strongly recommended to be used in conjunction with the PPTC device for protection against
abnormal or failure conditions.
- Avoid use of PPTC device in a constrained space such as potting material, housing and containers where have limited space to
accommodate device thermal expansion and/or contraction.
Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.
NOTE: Specification subject to change without notice.
2021/03/25
NO.
Product Specification and Approval Sheet Version
PQ11-01ER
1
Page
5/5
9. Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD2920 device
Pad dimensions (millimeters)
A
B
Device
Nominal
Nominal
All 2920 Series
5.10
2.30
C
Nominal
5.60
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.
Preheat:
Temperature Min (Tsmin)
150 ℃
Temperature Max (Tsmax)
200 ℃
Time (tsmin to tsmax)
60-180 seconds
Time maintained above:
Temperature(TL)
217 ℃
Time (tL)
60-150 seconds
Peak/Classification Temperature(Tp) : 260 ℃
Time within 5℃ of actual Peak:
20-40 seconds
Temperature (tp)
Ramp-Down Rate:
6 ℃/second max.
8 minutes max.
Time 25 ℃ to Peak Temperature:
Note 1: All temperatures refer to of the package,
measured on the package body surface.
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
1. Recommended max paste thickness is
0.25mm.(Nominal)
2. Devices can be cleaned using standard
methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment: < 30℃ / 60%RH
Caution:
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. Devices are not designed to be wave soldered
to the bottom side of the board.
Reflow Profile
Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.
NOTE: Specification subject to change without notice.
2021/03/25
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