FSMD200-1812

Surface Mount PPTC FSMD 1812 Series FEATURES •1812 size Surface Mount •Application: All high-density boards •Operation Current: 140mA ~ 1.6A •Maximum Voltage: 6V ~ 60V •Temperature Range: -40°C to 85°C •RoHS Compliant RoHS ü AGENCY RECOGNITION •UL (E211981) •C-UL (E211981) •TÜV (R50004084) ELECTRICAL CHARACTERISTICS (23°C) Part Number FSMD014-1812 FSMD020-1812 FSMD035-1812 FSMD050-1812 FSMD075-1812 FSMD110-1812 FSMD110-16-1812 FSMD125-1812 FSMD150-1812 FSMD160-1812 FSMD200-1812 Hold Current IH, A 0.14 0.20 0.35 0.50 0.75 1.10 1.10 1.25 1.50 1.60 2.00 Trip Current IT, A 0.30 0.40 0.70 1.00 1.50 2.20 1.95 2.50 3.00 3.20 3.50 Rated Voltage VMAX, Vdc 60 30 16 16 16 8 16 6 6 6 8 Maximum Current IMAX, A 10 10 40 40 40 100 40 40 40 40 40 Typical Power Pd, W 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 Max Time to Trip Current Amp 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Time Sec 0.008 0.02 0.10 0.15 0.20 0.30 0.50 0.40 0.50 0.50 2.00 Resistance Tolerance RMIN R1MAX OHMS 1.20 0.80 0.32 0.15 0.11 0.04 0.04 0.05 0.04 0.03 0.02 OHMS 6.50 5.00 1.50 1.00 0.45 0.21 0.18 0.14 0.11 0.10 0.07 IH=Hold current-maximum current at which the device will not trip at 23°C still air. IT=Trip current-maximum current at which the device will always trip at 23°C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. R MIN=Minimum device resistance at 23°C prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD PRODUCT DIMENSIONS (MILLIMETERS) D B A Top and bottom view Figure 1 Figure 2 Side view C Part Number FSMD014-2920 FSMD020-2920 FSMD035-2920 FSMD050-2920 FSMD075-2920 FSMD110-2920 FSMD110-16-2920 FSMD125-2920 FSMD150-2920 FSMD160-2920 FSMD200-2920 Min 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 A Max Min B Max Min C Max D Min 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 C5ED04 REV 2007.8.14 4.73 3.07 3.41 0.60 0.90 4.73 3.07 3.41 0.60 0.90 4.73 3.07 3.41 0.40 0.70 4.73 3.07 3.41 0.35 0.65 4.73 3.07 3.41 0.35 0.65 4.73 3.07 3.41 0.25 0.55 4.73 3.07 3.41 0.25 0.90 4.73 3.07 3.41 0.25 0.55 4.73 3.07 3.41 0.25 0.55 4.73 3.07 3.41 0.25 0.90 4.73 3.07 3.41 0.50 0.90 RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com Surface Mount PPTC FSMD 1812 Series THERMAL PRODUCT DIMENSIONS (MILLIMETERS) Thermal Derating Curve, FSMD Series Percent of Rated Hold and Trip Current 200% RoHS ü 150% 100% 50% A B A= FSMD 075, 110, 110-16, 125, 150 160 & 200 B= FSMD 014, 020, 035 & 050 0% 40 20 0 20 40 60 80 Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23°C A = FSMD014 AB 100 C D E FGH I J B = FSMD020 C = FSMD035 D = FSMD050 E = FSMD075 F = FSMD110/110-16 G = FSMD125 H = FSMD150 10 Time- to- tr ip ( S) 1 0.1 0.01 0.001 0.1 1 Fault current (A) 10 100 I = FSMD160 J FSMD200 PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device NOMINAL PAD DIMENSIONS (MILLIMETERS) 260 °C SOLDER RELOW 20 to 40 Seconds Ramp-up 3°C/Second Max Ramp-down 6°C/Second Max 3.5 217 °C f 200 °C 150 °C Preheat 1.78 3.45 1.78 25 °C 60 to 180 Seconds 60 to 150 Seconds Solder Reflow Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: