ML485
RFMD + TriQuint = Qorvo
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
Applications
PCS / 3G Base station / Repeaters
WCDMA / LTE
WiMax / WiBro
ISM / Fixed Wireless
HPA Feedback Paths
MSOP 8 Package
Product Features
Functional Block Diagram
High Dynamic Range Mixer
Integrated LO Driver
+35 dBm Input IP3
8 dB Conversion Loss
RF: 1500 – 3200 MHz
LO: 1400 – 3500 MHz
IF: 40 – 300 MHz
+5 V Supply at 40 mA
0 dBm Drive Level
RoHS-compliant MSOP8 (14 mm2)
Pin 1 Reference Mark
LO
1
8 RF
GND
2
7 GND
GND
3
6 GND
VCC
4
5 IF
Backside Paddle - RF/DC GND
General Description
Pin Configuration
The ML485 high linearity converter combines a passive
GaAsFET mixer with an integrated LO driver in an ultrasmall
lead-free/green/RoHS-compliant
MSOP-8
package. The double-balanced integrated IC is able to
operate across a wide 1.5 – 3.2 GHz frequency range to
achieve +35 dBm Input IP3 while drawing a very low
40mA current. The ML485 can be used as an upconverter or down-converter in a low-side or high-side
LO configuration.
Pin No.
Symbol
1
2, 3, 6, 7
4
5
8
Backside Paddle
LO
GND
Vcc
IF
RF
GND
A LO buffer amplifier is integrated on the chip to allow for
operation directly from a synthesizer requiring only 0
dBm of LO drive level. The dual-stage LO driver
provides a stable input power level into the mixer to
allow for consistent performance over a wide range of
LO power levels. The converter requires no external
baluns and supports a wide range of IF frequencies.
Typical applications include frequency up/down
conversion, modulation and demodulation for receivers
and transmitters used in 2.5G and 3G mobile
infrastructure.
Due to the wide frequency range of
operation, the converter can also be used for WiMAX,
WiBro, ISM, LTE and fixed wireless applications
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
Ordering Information
Part No.
Description
ML485-G
1.5 – 3.2 GHz Mixer w/ Integrated LO Amp
ML485-PCB Fully Assembled Evaluation Board
Standard T/R size = 1000 pieces on a 7” reel
- 1 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Parameter
Min
Typ
Max Units
VCC
TCASE
Tj for >106 hours MTTF
+4.75
−40
+5.0
+5.25
+85
+150
Rating
−65 to +150 °C
+7 V
+27 dBm
+10 dBm
Storage Temperature
DC Voltage
Input IF / RF Power, CW, +25 °C
LO Power
V
°C
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: VCC =+5 V, Temp=+25 °C, 50 Ω system. (see note 1)
Parameter
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Units
RF Frequency Range
1700 – 1800
1800 – 2200
2300 – 2400
2500 – 2700
MHz
LO Frequency Range
1400 – 1750
1500 – 2150
2000 – 2350
2200 – 2650
MHz
40 – 300
40 – 300
40 – 300
40 – 300
MHz
IF Freq Range
SSB Conversion Loss
Input IP3 (see note 2)
9.4
+28
8.7
+34
+30
8.5
9
dB
+35
10
+37
+36
dBm
LO Leakage RF Port
−5
−2
−1
−1
dBm
LO Leakage IF Port
−11
−18
−25
−15
dBm
RF–IF Isolation
13
16
14
11
dB
RF Return Loss
13
13
15
16
dB
IF Return Loss
14
14
14
14
dB
LO Return Loss
10
10
12
13
dB
+20
Input P1dB
LO Drive Level
−2
0
Parameter
Supply Voltage
Supply Current
Thermal Resistance (see note 3)
+20
+4
Min
−2
0
Typ
+5
+19.5
+4
Max
40
84
−2
0
+19.5
+4
−2
0
dBm
+4
dBm
Units
V
mA
°C/W
Notes:
1. Specifications are shown with 0dBm LO drive and IF = 200 MHz in a down
converting configuration with a low-side LO.
2. IIP3 is measured with ∆f = 1 MHz with RFin = 0 dBm / tone.
3. Thermal resistance is specified junction to case.
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
- 2 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Performance Plots
Test conditions unless otherwise noted: VCC =+5 V, Temp=+25 °C, 50 Ω system.
Conversion Loss vs. RF Freq. vs. IF Freq.
Input IP3 vs. RF Freq. vs. IF Freq.
+25 C, LO = 0 dBm, low-side LO
LO = 0 dBm, low-side LO, 25C
40
38
11
IF = 51 MHz
IF= 151 MHz
IF= 201 MHz
IF= 301 MHz
10
Input IP3 (dBm)
Conversion Loss (dB)
12
9
8
7
36
34
32
IF = 51 MHZ
IF = 151 MHz
IF = 201 MHz
IF = 301 MHz
30
28
6
26
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.3
1.5
1.7
1.9
RF Frequency (GHz)
L-R Isolation vs. LO Freq. vs.Temperature
3.1
3.3
Referenced with LO = 0 dBm
35
5
30
+85 °C
+25 °C
- 40 °C
4
L-I Isolation (dB)
L-R Isolation (dB)
2.9
L-I Isolation vs. LO Freq. vs. Temperature
Referenced with LO = 0 dBm
6
3
2
1
25
+85 °C
+25 °C
- 40 °C
20
15
10
0
5
1.5
1.7
1.9
2.1
2.3
2.5
2.7
LO Frequency (GHz)
2.9
3.1
3.3
1.5
1.7
1.9
2.1
2.3
2.5
2.7
LO Frequency (GHz)
2.9
R-I Isolation vs. LO Freq. vs. Temperature
Input P1dB vs. RF Frequency
Referenced with LO = 0 dBm
+25 C, IF=201 MHz, Low-side LO at 0 dBm
22
22
19
21
Input P1dB (dBm)
R-I Isolation (dB)
2.1
2.3
2.5
2.7
RF Frequency (GHz)
16
+85 °C
+25 °C
- 40 °C
13
10
3.1
3.3
3.1
3.3
20
19
18
17
7
16
4
1.5
1.7
1.9
2.1
2.3
2.5
2.7
LO Frequency (GHz)
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
2.9
3.1
3.3
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
RF Frequency (GHz)
- 3 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Performance Plots
Test conditions unless otherwise noted: VCC =+5 V, Temp=+25 °C, 50 Ω system.
Conversion Loss vs. RF Freq. vs. Temperature
Conversion Loss vs. RF Freq. vs. LO Power
LO = 0 dB, IF = 51 MHz, low-side LO
12
11
11
Conversion Loss (dB)
Conversion Loss (dB)
+25 C, IF = 51 MHz, low-side LO
12
10
9
8
+85 °C
+25 °C
- 40 °C
7
6
10
9
8
7
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
6
5
5
4
4
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
1.5
3.3
2.1
2.3
2.5
2.7
2.9
3.1
3.3
Conversion Loss vs. RF Freq. vs. LO Power
LO = 0 dB, IF = 201 MHz, low-side LO
+25 C, IF = 201 MHz, low-side LO
12
11
11
Conversion Loss (dB)
Conversion Loss (dB)
1.9
RF Frequency (GHz)
Conversion Loss vs. RF Freq. vs. Temperature
12
10
9
8
+85 °C
+25 °C
- 40 °C
7
6
5
10
9
8
7
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
6
5
4
4
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
3.3
1.5
Conversion Loss vs. RF Freq. vs. Temperature
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
3.3
Conversion Loss vs. RF Freq. vs. LO Power
LO = 0 dB, IF = 301 MHz, low-side LO
12
+25 C, IF = 301 MHz, low-side LO
12
11
11
Conversion Loss (dB)
Conversion Loss (dB)
1.7
10
9
8
+85 °C
+25 °C
- 40 °C
7
6
5
10
9
8
7
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
6
5
4
4
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
2.9
3.1
3.3
- 4 of 9 -
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
3.3
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Performance Plots
Test conditions unless otherwise noted: VCC =+5 V, Temp=+25 °C, 50 Ω system.
Input IP3 vs. RF Freq. vs. Temperature
Input IP3 vs. RF Frequency vs. LO Power
+25 C, IF = 51 MHz, low-side LO
40
40
38
38
+85 °C
+25 °C
- 40 °C
36
Input IP3 (dBm)
Input IP3 (dBm)
LO = 0 dBm, IF = 51 MHz, low-side LO
34
32
30
28
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
36
34
32
30
28
26
26
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
1.5
3.3
1.7
1.9
Input IP3 vs. RF Freq. vs. Temperature
2.7
2.9
3.1
3.3
+25 C, IF = 201 MHz, low-side LO
40
38
38
36
36
Input IP3 (dBm)
Input IP3 (dBm)
2.5
Input IP3 vs. RF Frequency vs. LO Power
LO = 0 dBm, IF = 201 MHz, low-side LO
34
32
+85 °C
+25 °C
- 40 °C
28
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
34
32
30
28
26
26
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
2.9
3.1
3.3
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.3
RF Frequency (GHz)
Input IP3 vs. RF Freq. vs. Temperature
Input IP3 vs. RF Frequency vs. LO Power
LO = 0 dBm, IF = 301 MHz, low-side LO
+25 C, IF = 301 MHz, low-side LO
40
40
38
36
LO = 4 dBm
LO = 0 dBm
LO = -2 dBm
38
+85 °C
+25 °C
- 40 °C
Input IP3 (dBm)
Input IP3 (dBm)
2.3
RF Frequency (GHz)
40
30
2.1
34
32
30
28
36
34
32
30
28
26
26
1.5
1.7
1.9
2.1
2.3
2.5
2.7
RF Frequency (GHz)
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
2.9
3.1
3.3
1.5
1.7
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.3
RF Frequency (GHz)
- 5 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Performance Plots
Test conditions unless otherwise noted: VCC =+5 V, Temp=+25 °C, 50 Ω system.
RF Return Loss vs. RF Frequency
IF Return Loss vs. IF Frequency
+25 C, LO = 0 dBm
+25 C, LO = 0 dBm
0
-5
IF Return Loss (dB)
RF Return Loss (dB)
0
-10
-15
-20
IF = 51 MHz
IF = 201 MHz
IF = 301 MHz
-25
-30
1600
-5
-10
-15
IF = 1550 MHz
IF = 1650 MHz
IF = 1750 MHz
-20
IF = 1850 MHz
IF = 1950 MHz
IF = 2050 MHz
-25
1800
2000
2200
2400
2600
2800
3000
50
100
150
RF Frequency (MHz)
200
250
300
IF Frequency (MHz)
LO Return Loss vs. LO Frequency
+25 C, LO = 0 dBm
LO Return Loss (dB)
0
-5
-10
-15
-20
-25
1600
1800
2000
2200
2400
2600
2800
3000
3200
LO Frequency (MHz)
Spur Table
Spur table is N fRF – M fLO mixer spurious products for 0 dBm input power, unless otherwise noted.
RF Frequency = 1842 MHz, LO Frequency = 1642 MHz, All values in dBc relative to the IF Power Level.
M
0
N
0
1
2
3
4
5
1
2
3
4
5
2
22
35
18
85
3
0
30
23
47
35
47
81
39
51
57
70
87
80
94
72
78
81
95
93
91
93
88
88
95
95
95
92
95
95
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
- 6 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
RFMD + TriQuint = Qorvo
Down Conversion Application Circuit: ML485-PCB
J4
J4
Vcc=+5V
J5
J1
C1
IF Port
C
1
5
6
U1
J2
7
4
U1
ML485
8
RF Input
0.01uF
3
2
1
J3
LO Port
Pin Configuration and Description
Pin 1 Reference Mark
LO
1
8 RF
GND
2
7 GND
GND
3
6 GND
VCC
4
5 IF
Backside Paddle - RF/DC GND
Pin No.
Symbol
1
LO
Description
Local Oscillator Injection. Internally DC Blocked
2, 3, 6, 7
GND
RF/DC Ground
4
Vcc
Supply voltage. An external bypass capacitor should be used near this pin.
5
IF
Intermediate Frequency
8
RF
Radio Frequency
RF/DC Ground. Follow recommended via pattern and ensure good solder
attach for best thermal and electrical performance.
Backside Paddle
GND
Evaluation Board PCB Information
Qorvo PCB 1069129 Material and Stack-up
1 oz. Cu top layer
0.014"
Nelco N-4000-13
1 oz. Cu inner layer
0.062" ± 0.006"
Finished Board
Thickness
Core
1 oz. Cu inner layer
0.014"
Nelco N-4000-13
1 oz. Cu bottom layer
50 ohm line dimensions: width = 0.026”, spacing = 0.025”
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
- 7 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
RFMD + TriQuint = Qorvo
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
Package Marking and Dimensions
Marking: Part Code – M42
Lot Code – YXX
.650 [0.26]
4.877 [1.92]
NOTES:
1. All dimensions are in millimeters. Angles are in
degrees.
2. Except where noted, this part outline conforms to
JEDEC standard MO-187.
3. Dimension and tolerance formats conform to
ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering
conform to JESD 95-1 SPP-012
2.997 [1.18]
2.997 [1.18]
DETAIL "A"
.864±.051 [.034±.002]
.152±.051 [.006±.002]
SEATING PLANE
.076[.003 +0.002
-0.001 ]
.229-.357 [.009-014]
1.700 [.067]
1.727 [.068]
GAUGE PLANE
.254 [.010]
Exposed Paddle
2.360 [.093]
0°-6°
.533±.102
[.021±.004]
DETAIL "A"
Bottom View
PCB Mounting Pattern
3
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Datasheet Rev. G 02-05-16
© 2016 TriQuint Semiconductor, Inc
- 8 of 9 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
ML485
RFMD + TriQuint = Qorvo
1.5-3.2 GHz High IP3 Mixer with Integrated LO Amp
Product Compliance Information
ESD Sensitivity Ratings
Solderability
Compatible with both lead-free (260 °C maximum reflow
temperature) and tin/lead (245 °C maximum reflow
temperature) soldering processes.
Caution! ESD-Sensitive Device
Contact plating: Matte Tin
ESD Rating:
Value:
Test:
Standard:
Class 0B
125 V to