RF2314

RF2314 0 Typical Applications • Broadband Gain Blocks • Final PA for Low-Power Applications • IF or RF Buffer Amplifiers Product Description The RF2314 is a general purpose, low-cost, high performance amplifier designed for operation from a 2.7V to 6V supply with low current consumption. The circuit configuration with resistive feedback allows for broadband cascadable amplification. Feedback with capacitive compensation extends the bandwidth of the amplifier, and is designed for optimized noise figure. The device is unconditionally stable and internally matched to 50 Ω. No external components are required. The RF2314 is available in a very small industry-standard SOT 5-lead surface mount package, enabling compact designs which conserve board space. 1.60 + 0.01 0.400 1 GENERAL PURPOSE LOW NOISE AMPLIFIER RoHS Compliant & Pb-Free Product • Driver Stage for Power Amplifiers • Oscillator Loop Amplifiers 0.15 0.05 2.90 + 0.10 0.950 2.80 + 0.20 3° MAX 0° MIN 0.45 + 0.10 0.127 1.44 1.04 Dimensions in mm. Optimum Technology Matching® Applied Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS Package Style: SOT 5-Lead Features • 150MHz to 2500MHz Operation • 2.7V to 6.0V Single Supply • +18dBm Output IP3 at 5V • 14dB Gain at 900MHz • 8.6dB Gain at 1900MHz • Low Current Consumption of 5mA at 3V GND 1 GND 2 RF IN 3 5 RF OUT 4 VCC Ordering Information RF2314 RF2314 PCBA General Purpose Low Noise Amplifier Fully Assembled Evaluation Board Functional Block Diagram RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Rev A6 051025 4-211 RF2314 Absolute Maximum Ratings Parameter Supply Voltage Supply Current Storage Temperature Rating 8.0 32 -40 to +150 Unit V mA °C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. RoHS marking based on EUDirective2002/95/EC (at time of this printing). However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Parameter Operating Range Overall Frequency Range Supply Voltage Operating Current (ICC) Operating Ambient Temperature Specification Min. Typ. Max. 150 2.7 2 9 -40 16.6 11 +3 -4 12.9 1.4 +9 -1 10 17 20 7.9 +12.5 -0.5 5.2 +15.3 +1.1 19.1 12 +14 +3 14.2 1.5 +18 +8 13 28 20 8.2 +22 +6.7 5.1 +23 +7.9 16 14 2500 6.0 9 16 +85 Unit MHz V mA mA C dB dB dB dBm dBm dB dB dB dB dBm dBm dB dBm dBm dB dB dB dBm dBm dB dB dB dB dBm dBm dB dB dB Condition 5.7 12.5 VCC =3V, Temp=27 oC VCC =5V, Temp=27 oC 3.0V Performance Gain Gain Noise Figure OIP3 OP1dB Input Return Loss Output Return Loss Isolation Gain OIP3 OP1dB Gain OIP3 OP1dB Freq=150MHz, VCC =3V, Temp=27 oC Freq=900MHz, VCC =3V, Temp=27 oC +1 6.5 +9 -2 4 +11 -1 9 +1 7 +3 Freq=1900MHz, VCC =3V, Temp=27 oC Freq=2400MHz, VCC =3V, Temp=27 oC 5.0V Performance Gain Gain Noise Figure OIP3 OP1dB Input Return Loss Output Return Loss Isolation Gain OIP3 OP1dB Gain OIP3 OP1dB Freq=150MHz, VCC =5V, Temp=27 oC Freq=900MHz, VCC =5V, Temp=27 oC +11 6 +18 +5 3.5 +19 +6 10 +9 7 +10 Freq=1900MHz, VCC =5V, Temp=27 oC Freq=2400MHz, VCC =5V, Temp=27 oC 4-212 Rev A6 051025 RF2314 Pin 1 2 3 Function GND GND RF IN Description Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. Same as pin 1. RF input pin. This pin is internally DC-blocked and thus does not require an external blocking capacitor. The input impedance of this pin is internally matched to 50 Ω using resistive feedback. VCC Interface Schematic 300 Ω RF OUT RF IN 4 5 VCC RF OUT Supply connection. Generally, there is no need for an external bypass capacitor. RF output pin. The output impedance of this pin is internally matched to 50 Ω using resistive feedback. See pin 3 schematic. See pin 3 schematic. Application Schematic 1 2 RF IN 3 4 5 RF OUT VCC Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 1 2 NC 3 1 2 RF IN J1 50 Ω μstrip 3 4 C2 560 pF + VCC GND 231440050 Ω μstrip 5 RF OUT J2 P1-1 C1 6.8 μF Rev A6 051025 4-213 RF2314 Evaluation Board Layout Board Size 1.0” x 1.0” Board Thickness 0.031”, Board Material FR-4 4-214 Rev A6 051025 RF2314 Gain versus Temperature Frequency=900MHz 14.50 Vcc=3V 16.00 14.00 Vcc=5V 14.00 13.50 12.00 18.00 OIP3 versus Temperature Frequency=900MHz OIP3 (dBm) Gain (dB) 10.00 8.00 6.00 4.00 13.00 12.50 12.00 2.00 11.50 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 0.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 Vcc=3V Vcc=5V 80.00 100.00 Temp (oC) Temperature (oC) OP1dB versus Temperature Frequency=900MHz 6.00 14.00 ICC versus Temperature Frequency=900MHz 4.00 12.00 2.00 10.00 OP1dB (dBm) Vcc=3V 0.00 Vcc=5V ICC (mA) 8.00 Vcc=3V Vcc=5V -2.00 6.00 -4.00 4.00 -6.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 2.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 Temperature (oC) Temperature (oC) Gain versus Temperature Frequency=1900MHz 8.60 Vcc=3V 8.40 Vcc=5V 21.00 8.20 19.00 8.00 25.00 23.00 OIP3 versus Temperature Frequency=1900MHz Vcc=3V OIP3 (dBm) Gain (dB) 17.00 Vcc=5V 15.00 13.00 11.00 7.80 7.60 7.40 9.00 7.20 7.00 5.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 7.00 -60.00 Temperature (oC) Temperature (oC) Rev A6 051025 4-215 RF2314 OP1dB versus Temperature Frequency=1900MHz 9.00 14.00 ICC versus Temperature Frequency=1900MHz 7.00 12.00 10.00 5.00 OP1dB (dBm) Vcc=3V ICC (mA) 8.00 Vcc=5V 6.00 Vcc=3V 3.00 Vcc=5V 1.00 4.00 -1.00 2.00 -3.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 0.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 Temperature (oC) Temperature (oC) Gain versus Temperature Frequency=2400MHz 6.50 24.00 OIP3 versus Temperature Frequency=2400MHz 22.00 6.00 20.00 5.50 OIP3 (dBm) Gain (dB) 18.00 5.00 16.00 14.00 4.50 Vcc=3V Vcc=5V 4.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 10.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 12.00 Vcc=3V Vcc=5V Temperature (oC) Temperature (oC) OP1dB versus Temperature Frequency=2400MHz 10.00 14.00 ICC versus Temperature Frequency=2400MHz 8.00 12.00 10.00 6.00 OP1dB (dBm) Vcc=3V ICC (mA) 8.00 Vcc=5V 6.00 4.00 Vcc=3V Vcc=5V 2.00 4.00 0.00 2.00 -2.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 0.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 80.00 100.00 Temperature (oC) Temperature (oC) 4-216 Rev A6 051025 RF2314 S11 of Evaluation Board versus Frequency 5.0 S22 of Evaluation Board versus Frequency 4.5 VCC = 3.0 V VCC = 3.0 V 4.5 4.0 4.0 3.5 Output VSWR Input VSWR 3.5 3.0 3.0 2.5 2.5 2.0 2.0 1.5 1.5 1.0 0.0 0.5 1.0 1.5 2.0 2.5 1.0 0.0 0.5 1.0 1.5 2.0 2.5 Frequency (GHz) Frequency (GHz) S11 of Evaluation Board versus Frequency 4.5 S22 of Evaluation Board versus Frequency 7.0 VCC = 5.0 V VCC = 5.0 V 4.0 6.0 3.5 5.0 3.0 Output VSWR 0.0 0.5 1.0 1.5 2.0 2.5 Input VSWR 4.0 2.5 3.0 2.0 1.5 2.0 1.0 1.0 0.0 0.5 1.0 1.5 2.0 2.5 Frequency (GHz) Frequency (GHz) -10.0 Reverse Isolation (S12) of Evaluation Board versus Frequency -15.0 Reverse Isolation (dB) -20.0 -25.0 -30.0 Vcc=3V Vcc=5V -35.0 0.0 0.5 1.0 1.5 2.0 2.5 Frequency (GHz) Rev A6 051025 4-217 RF2314 S11 Plot, VCC = Vcc=3V RF2314 S11 Plot, 3V 1.0 0.6 S22 Plot, VCC = 3V S22 Plot, Vcc=3V 1.0 0.6 Swp Max 6GHz Swp Max 6GHz 2.0 0.8 2. 0 0.8 5 GHz 3. 0 4 GHz 10.0 10.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0 3 GHz 2 GHz 150 MHz 4 GHz 2 GHz 1 GHz 150 MHz 4.0 5.0 0 10.0 Swp Min 0.01GHz Swp Max 6GHz .0 -2 -0. 6 -0. 6 -0.8 Swp Min 0.01GHz -0.8 S11 Plot, Vcc=5V S11 Plot,VCC = 5V 1.0 0.6 0.6 Swp Max 6GHz S22 Plot, VCC = 5V S22 Plot, Vcc=5V 2. 0 0.8 0.8 1.0 -1.0 -1.0 3 .0 5 GHz 2. 0 .0 -2 3 .0 4 GHz 10.0 10.0 3 GHz 2 GHz 1 GHz 150 MHz 150 MHz .4 -0 -0 .4 .0 -2 -0. -0. Swp Min 0.01GHz -0.8 -0.8 . -2 6 6 0 Swp Min 0.01GHz -1.0 4-218 -1.0 Rev A6 051025 -4. 0 -5.0 -3 .0 -4. 0 -5.0 -0.2 -0.2 -10.0 -10.0 2 GHz 1 GHz 10.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0.2 0.4 0.6 0.8 1.0 2.0 3.0 4.0 5.0 0 0 0.2 4.0 5.0 5 GHz 4 GHz -3 .4 -0 .4 -0 -4. 0 -5.0 .0 0. 4 -4. 0 -5.0 -0.2 1 GHz -0.2 4.0 5.0 -10.0 0.2 4.0 5.0 0. 4 5 GHz -10.0 -3 . -3 .0 0 0. 4 3.0 4.0 5.0 10.0 0. 4 0.2 0.2 10.0 RF2314 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3 μinch to 8 μinch Gold over 180 μinch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.70 x 1.00 (mm) Typ. Pin 1 Pin 5 A 0.95 (mm) Typ. A A 1.90 (mm) Typ. A A 2.60 (mm) Figure 1. PCB Metal Land Pattern (Top View) PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.90 x 1.20 (mm) Typ. A 0.95 (mm) Typ. A 1.90 (mm) Typ. A A A 2.60 (mm) Figure 2. PCB Solder Mask Pattern (Top View) Rev A6 051025 4-219 RF2314 Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern shown has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias between 0.203mm to 0.330mm finished hole size with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Via 0.203 - 0.330 (mm) Finished Hole Figure 3. Thermal Pad and Via Design (RFMD qualification) 4-220 Rev A6 051025