RF2361PCBA-L

RF2361 0 Typical Applications • TDMA/CDMA/FM Cellular PCS LNA • Low Noise Transmit Driver Amplifier • General Purpose Amplification • Commercial and Consumer Systems 3V LOW NOISE AMPLIFIER/ 3V PA DRIVER AMPLIFIER Product Description The RF2361 is a low noise amplifier with a very high dynamic range designed for digital cellular applications. The device functions as an outstanding front end low noise amplifier or power amplifier driver amplifier in the transmit chain of digital subscriber units where low transmit noise power is a concern. When used as an LNA, the bias current can be set externally. When used as a PA driver, the IC can operate directly from a single cell Li-ion battery and includes a power down feature that can be used to completely turn off the device. The IC is featured in a standard SOT 5-lead plastic package. NOTE: The RF2361 is a non-Pb-free product. If a Pb-free product with the same functionality and package is desired, please see the RF2878. Optimum Technology Matching® Applied Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS 1.60 + 0.01 0.400 1 0.15 0.05 2.90 + 0.10 0.950 2.80 + 0.20 3° MAX 0° MIN 0.45 + 0.10 0.127 1.44 1.04 Dimensions in mm. Package Style: SOT 5-Lead Features • Low Noise and High Intercept Point • Adjustable Bias Current • Power Down Control • Single 2.5V to 6.0V Power Supply • 150MHz to 2500MHz Operation • Extremely Small SOT 5-Lead Package RF IN 1 5 GND2 GND1 2 VPD 3 4 RF OUT Ordering Information RF2361 3V Low Noise Amplifier/ 3V PA Driver Amplifier RF2361 PCBA-D Fully Assembled Evaluation Board (Driver) RF2361 PCBA-L Fully Assembled Evaluation Board (LNA) RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Functional Block Diagram Rev A9 050117 4-331 RF2361 Absolute Maximum Ratings Parameter Supply Voltage, VCC Power Down Voltage, VPD Input RF Level Operating Ambient Temperature Storage Temperature Rating -0.5 to +8.0 < VCC +10 -40 to +85 -40 to +150 Unit VDC VDC dBm °C °C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Parameter Overall RF Frequency Range Specification Min. Typ. Max. 150 to 2500 Unit MHz Condition Low Noise Amplifier 881MHz Performance Gain Noise Figure Input IP3 19.5 19.5 20 20 1.4 1.4 +6.0 +5.5 dB dB dB dB dBm dBm 1.6 1.6 Low Noise Amplifier 1950MHz Performance Gain Noise Figure Input IP3 12.5 12.5 13 13 1.3 1.3 +16.5 +16.0 dB dB dB dB dBm dBm 1.5 1.5 Driver Amplifier 836MHz Performance Gain 19.5 19.5 19.5 25 20.5 20.5 20.5 +32.0 +29.0 +27.8 1.9 1.85 1.8 25 25 25 1.8:1 1.25:1 14.4 12.5 11.5 21.5 21.5 21.5 35 dB dB dB dBm dBm dBm dB dB dB dB dB dB Schematic per LNA Application; T=25°C, RF=881MHz, VPD =2.8V, R1=1k Ω VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA Schematic per LNA Application; T=25°C, RF=1950MHz, VPD =2.8V, R1=1k Ω VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA Schematic per Driver Amplifier Application; T=25°C, RF=836MHz, VPD =2.8V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V Using External LC network used on evaluation board. VCC =3.5V VCC =3.0V VCC =2.7V Output IP3 Noise Figure 2.0 2.0 2.0 Reverse Isolation Input VSWR Output VSWR P1dB 13 12 10.5 2.0:1 2.0:1 dBm dBm dBm 4-332 Rev A9 050117 RF2361 Parameter Power Supply Voltage (VCC) Voltage (VPD) Current Consumption Driver Amplifier 2.7 12.5 2.5 to 6.0 2.8 21.5 2.9 27 V V mA Specification Min. Typ. Max. Unit T = 25 °C Condition 18 19 Power Down 20 23 22 29 10 mA mA μA Driver Amplifier 1880MHz Performance Gain 13.0 13.0 13.0 27 14.0 14.0 14.0 +35.0 +31.0 +28.8 1.85 1.8 1.75 19 19 19 1.6:1 1.6:1 15.6 14.1 13.1 2.5 to 6.0 2.8 19.5 14.5 14.5 14.5 38 dB dB dB dBm dBm dBm dB dB dB dB dB dB VCC =3.5V; VPD =2.8V; VPD +VCC - Current Consumption from VPD is 2.0mA Typ. @ VPD =2.8V and 3.0mA Max @ VPD =2.9 V VCC =3.5V; VPD =2.7V; VPD + VCC VCC =3.5V; VPD =2.9V; VPD + VCC VCC =3.5V; VPD ≤ 0.9 V Schematic per Driver Amplifier Application; T=25°C, RF=1880MHz, VPD =2.8V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V Using External LC network used on evaluation board. VCC =3.5V VCC =3.0V VCC =2.7V T = 25 °C Output IP3 Noise Figure 2.0 2.0 2.0 Reverse Isolation Input VSWR Output VSWR P1dB 14 13 12 2.0:1 2.0:1 dBm dBm dBm V V mA Power Supply Voltage (VCC) Voltage (VPD) Current Consumption Driver Amplifier 2.7 11.5 2.9 25.5 16 18 Power Down 18 20.5 20 27 10 mA mA μA VCC =3.5V; VPD =2.8V; VPD +VCC - Current Consumption from VPD is 2.0mA Typ.@ VPD =2.8V and 3.0mA Max @ VPD =2.9 V VCC =3.5V; VPD =2.7V; VPD + VCC VCC =3.5V; VPD =2.9V; VPD + VCC VCC =3.5V; VPD ≤ 0.9 V Rev A9 050117 4-333 RF2361 Pin 1 Function RF IN Description RF input pin. This pin is DC coupled and matched to 50 Ω at 836 MHz. Interface Schematic To Bias Circuit RF OUT RF IN 2 3 GND1 VPD Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. For low noise amplifier applications, this pin is used to control the bias current. See plots for bias current settings. An external resistor (R1) can be used to set the bias current for any VPD voltage. For driver amplifier applications, this is the Power Down pin for the IC. VPD =2.8V +/- 0.1V is required for proper operation. VPD< 0.9V turns off the Part. External RF bypassing is required. The trace length between the pin and the bypass capacitors should be minimized. The ground side of the bypass capacitors should connect immediately to ground plane. Nominal current required for VPD =2.8V is 2.0mA typical and 3.0mA Max (@ VPD =2.9V). PD 4 RF OUT 5 GND2 Amplifier Output pin. This pin is an open-collector output. It must be biased to either VCC or pin 4 through a choke or matching inductor. This pin is typically matched to 50 Ω with a shunt bias/matching inductor and series blocking/matching capacitor. Refer to application schematics. Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. 4-334 Rev A9 050117 RF2361 Application Schematic: Low Noise Amplifier ~881MHz Operation J1 RF IN 22 nF 1 5 2 1k Ω VPD 10 nF 100 pF 3 4 12 nH VCC 100 pF 10 nF 2 pF J2 RF OUT Application Schematic: Low Noise Amplifier ~1950MHz Operation J1 RF IN 22 nF 1 5 2 1k Ω VPD 10 nF 100 pF 3 4 3.3 nH VCC 100 pF 10 nF 1 pF J2 RF OUT Rev A9 050117 4-335 RF2361 Application Schematic: Driver Amplifier ~836MHz Operation J1 RF IN 22 nF 1 5 2 0Ω VPD 10 nF 100 pF 3 4 12 nH VCC 100 pF 10 nF 2 pF J2 RF OUT Application Schematic: Driver Amplifier ~1880MHz Operation J1 RF IN 22 nF 1 5 2 0Ω VPD 10 nF 100 pF 3 4 3.3 nH VCC 100 pF 10 nF 1 pF J2 RF OUT 4-336 Rev A9 050117 RF2361 Evaluation Board Schematic: Low Noise Amplifier ~881MHz Operation (Download Bill of Materials from www.rfmd.com.) P1 P1-1 1 2 3 C7 4.7μ F VPD GND VCC J1 RF IN 50 Ω μ strip C3 22 nF 1 5 2 R1 1k Ω VPD C1 10 nF C2 220 pF 2361410 Rev- 50 Ω μ strip 3 4 L1 12 nH C4 2 pF 50 Ω μ strip J2 RF OUT VCC C5 220 pF C6 10 nF Evaluation Board Schematic: Driver Amplifier ~836MHz Operation P1 P1-1 1 2 3 C7 4.7μ F VPD GND VCC J1 RF IN 50 Ω μ strip C3 22 nF 1 5 2 R1 0Ω VPD C1 10 nF C2 220 pF 2361400 Rev- 50 Ω μ strip 3 4 L1 12 nH C4 2 pF 50 Ω μ strip J2 RF OUT VCC C5 220 pF C6 10 nF Rev A9 050117 4-337 RF2361 Evaluation Board Layout - 900MHz Driver Board Size 0.948” x 1.063” Board Thickness 0.031”; Board Material FR-4 Evaluation Board Layout - 900MHz LNA 4-338 Rev A9 050117 RF2361 26.0 25.5 25.0 24.5 24.0 23.5 Driver Amp 836 MHz ICC versus VPD 2.7V Icc (mA) 3.0V Icc (mA) 3.3V Icc (mA) 3.6V Icc (mA) 20.92 20.90 20.88 20.86 20.84 20.82 20.80 20.78 20.76 20.74 20.72 Driver Amp 836 MHz Gain versus VPD 2.7V Gain (dB) 3.0V Gain (dB) 3.3V Gain (dB) 3.6V Gain (dB) ICC (mA) 23.0 22.5 22.0 21.5 21.0 20.5 20.0 19.5 19.0 2.7 2.8 2.9 3.0 Gain (dB) 2.70 2.80 2.90 3.00 VPD VPD 33.0 Driver Amp 836 MHz OIP3 versus VPD 2.7V OIP3 (dBm) 3.0V OIP3 (dBm) 3.3V OIP3 (dBm) 3.6V OIP3 (dBm) 15.0 Driver Amp 836 MHz POUT 1dB versus VPD 14.5 2.7V P 1dB (dBm) 3.0V P 1dB (dBm) 3.3V P 1dB (dBm) 3.6V P 1dB (dBm) 32.0 14.0 31.0 POUT 1dB (dBm) 13.5 OIP3 (dBm) 30.0 13.0 12.5 29.0 12.0 28.0 11.5 27.0 2.7 2.8 2.9 3.0 11.0 2.7 2.8 2.9 3.0 VPD VPD 2.05 Driver Amp 836 MHz Noise Figure versus VPD 2.7V NF (dB) 3.0V NF (dB) 3.3V NF (dB) 3.6V NF (dB) 2.00 1.95 NF (dB) 1.90 1.85 1.80 1.75 1.70 2.70 2.80 2.90 3.00 VPD Rev A9 050117 4-339 RF2361 19.95 Low Noise Amplifier 881 MHz Gain versus ICC 2.7V Gain (dB) 3.0V Gain (dB) 3.3V Gain (dB) 3.6V Gain (dB) 29.0 28.5 28.0 27.5 Low Noise Amplifier 881 MHz OIP3 versus ICC 2.7V OIP3 (dBm) 3.0V OIP3 (dBm) 3.3V OIP3 (dBm) 3.6V OIP3 (dBm) 19.90 19.85 19.80 19.75 OIP3 (dBm) 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.00 Gain (dB) 27.0 26.5 26.0 25.5 19.70 19.65 25.0 19.60 24.5 24.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 19.55 6.00 ICC ICC (mA) 9.0 8.5 8.0 7.5 Low Noise Amplifier 881 MHz IIP3 versus ICC 2.7V IIP3 (dBm) 3.0V IIP3 (dBm) 3.3V IIP3 (dBm) 3.6V IIP3 (dBm) 13.5 Low Noise Amplifier 881 MHz POUT 1dB versus ICC 2.7V Pout 1dB (dBm) 3.0V Pout 1dB (dBm) 3.3V Pout 1dB (dBm) 3.6V Pout 1dB (dBm) 13.0 12.5 POUT 1dB (dBm) IIP3 (dBm) 7.0 6.5 6.0 5.5 12.0 11.5 11.0 10.5 5.0 4.5 4.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.0 9.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 ICC (mA) ICC (mA) 1.42 1.41 1.40 1.39 Low Noise Amplifier 881 MHz Noise Figure versus ICC 2.7V NF (dB) 3.0V NF (dB) 3.3V NF (dB) 3.6V NF (dB) NF (dB) 1.38 1.37 1.36 1.35 1.34 1.33 6.00 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.00 ICC 4-340 Rev A9 050117 RF2361 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3 μinch to 8 μinch gold over 180 μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.70 x 1.00 (mm) Typ. Dimensions in mm. Pin 1 Pin 5 A 0.95 Typ. A A 1.90 Typ. A A 2.60 Figure 1. PCB Metal Land Pattern (Top View) Rev A9 050117 4-341 RF2361 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.90 x 1.20 (mm) Typ. Dimensions in mm. Pin 1 Pin 5 A 0.95 Typ. A A 1.90 Typ. A A 2.60 Figure 2. PCB Solder Mask (Top View) 4-342 Rev A9 050117