RF3397

RF3397General Purpose Amplifier RF3397 GENERAL PURPOSE AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: QFN, 12-Pin, 3 x 3 GND GND 11 DC to >6000MHz Operation Internally Matched Input and Output 15.5dB Small Signal Gain +25.5dBm Output IP3 +12.5dBm Output P1dB Footprint Compatible with MicroX RF IN 2 NC 3 NC 1 12 GND 10 9 NC 8 RF OUT 7 NC 6 GND Features 4 GND 5 GND Applications Basestation Applications Broadband, Low-Noise Gain Blocks IF or RF Buffer Amplifiers Driver Stage for Power Amplifiers Final PA for Low-Power Applications High Reliability Applications Functional Block Diagram Product Description The RF3397 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 Ω gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50 Ω input and output impedances and requires only two external DCbiasing elements to operate as specified. The device is designed for cost effective high reliability in a plastic package. The 3mmx3mm footprint is compatible with standard ceramic and plastic Micro-X packages. Ordering Information RF3397 RF3397PCBA-41X General Purpose Amplifier Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 10 RF3397 Absolute Maximum Ratings Parameter Input RF Power Operating Ambient Temperature Storage Temperature ICC Rating +13 -40 to +85 -60 to +150 60 Unit dBm °C °C mA Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Parameter Overall Frequency Range 3dB Bandwidth Gain Min. Specification Typ. DC to >6000 4.4 Max. Unit MHz GHz dB Freq=500MHz Freq=850MHz Freq=2000MHz Freq=3000MHz Freq=4000MHz Freq=6000MHz dB Freq=2000MHz Condition T=25 °C, ICC =40mA (See Note 1.) 15.4 15.3 13.5 16.4 16.3 15.5 14.5 14.0 13.5 17.3 17.5 dB dB dB Noise Figure Input VSWR Output VSWR Output IP3 Output P1dB Reverse Isolation 24.5 +24.5 +12.0 +11.5 2.8 1.7:1 2:1 25.5 +25.5 +13.0 +12.5 19 208 113 In a 50 Ω system, DC to 6000MHz In a 50 Ω system, DC to 6000MHz dBm dBm dBm dBm dB °C/W °C Freq=850MHz Freq=2000MHz Freq=850MHz Freq=2000MHz Freq=2000MHz ICC =40mA, PDISS =135mW. (See Note 3.) VPIN =3.38V TAMB =+85°C TAMB =+85°C With 22 Ω bias resistor At pin 8 with ICC =40mA At evaluation board connectors, ICC =40mA See Note 2. Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failures 51,709 3.55 4.2 3.65 4.5 40 3.7 4.8 60 years V V mA Power Supply Device Operating Voltage Operating Current Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used. Note 2: The RF3397 must be operated at or below 60mA in order to achieve the thermal performance stated above. Operating at 40mA will ensure the best possible combination of reliability and electrical performance. Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 60mA over all intended operating conditions. 2 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A6 DS061016 RF3397 Pin 1 2 Function NC RF IN Description No internal connections. It is not necessary to ground this pin. RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. DC coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. No internal connections. It is not necessary to ground this pin. RF output and bias pin. Biasing is accomplished with an external series resistor and choke inductor to VCC. The resistor is selected to set the DC current into this pin to a desired level. The resistor value is determined by the following equation: RF OUT Interface Schematic 3 4 5 6 7 8 NC GND GND GND NC RF OUT ( V SUPPLY – V DEVICE ) R = -----------------------------------------------------I CC Care should also be taken in the resistor selection to ensure that the current into the part never exceeds 60mA over the planned operating temperature. This means that a resistor between the supply and this pin is always required, even if a supply near 3.6V is available, to provide DC feedback to prevent thermal runaway. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. The supply side of the bias network should also be well bypassed. No internal connections. It is not necessary to ground this pin. Ground connection. Ground connection. Ground connection. Ground connection. To ensure best performance, avoid placing ground vias directly beneath the part. RF IN 9 10 11 12 Die Flag NC GND GND GND GND Package Drawing 0.05 C 2 PLCS 0.10 C A -A3 1 3.00 2 PLCS 0.10 C B 0.20 REF. 0.90 0.85 0.05 0.00 3.00 0.10 C B 2 PLCS 12° MAX SEATING PLANE 0.10 C A 2 PLCS 2.75 SQ -B- -C- 0.10 M C A B 0.60 0.24 TYP 0.35 0.30 PIN 1 ID R0.20 1.90 1.60 0.45 0.35 Dimensions in mm. Shaded lead is pin 1. 0.375 0.275 1.15 0.85 0.65 Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 10 RF3397 Application Schematic VCC 10 nF 22 pF 47 nH 12 1 22 pF RF IN 2 3 4 5 6 8 22 pF 7 11 10 9 RBIAS RF OUT Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) P1 P1-1 1 2 P1-3 3 CON3 12 C1 100 pF 1 2 3 4 5 6 11 10 9 8 7 VCC GND NC R1 22 Ω L1 100 nH C3 100 pF C4 1 μF VCC P1-1 J1 RF IN 50 Ω μstrip C2 100 pF 50 Ω μstrip J2 RF OUT NOTE: Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz. For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2 should be increased. 4 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A6 DS061016 RF3397 Evaluation Board Layout Board Size 1.195" x 1.000" Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Overlay of Suggested Micro-X and 3mmx3mm Layouts Showing Compatibility Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 10 RF3397 Gain versus Frequency Across Temperature 17.0 Output P1dB versus Frequency Across Temperature 16.0 -40°C +25°C +85°C 14.0 ICC=40mA ICC=40mA -40°C +25°C +85°C 16.0 15.0 Gain (dB) 14.0 Output P1dB (dBm) 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 12.0 10.0 13.0 8.0 12.0 6.0 11.0 10.0 100.0 4.0 100.0 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 4100.0 Frequency (MHz) Frequency (MHz) Output IP3 versus Frequency Across Temperature 30.0 Noise Figure versus Frequency Over Temperature 5.0 ICC=40mA -40°C +25°C +85°C ICC=40mA -40°C +25°C +85°C 25.0 4.5 OIP3 (dBm) 20.0 Noise Figure (dB) 600.0 1100.0 1600.0 2100.0 2600.0 3100.0 3600.0 4100.0 4.0 3.5 15.0 3.0 10.0 2.5 5.0 100.0 2.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 Frequency (MHz) Frequency (MHz) Input VSWR versus Frequency Across Temperature 5.0 Output VSWR versus Frequency Across Temperature 5.0 ICC=40mA -40°C +25°C +85°C ICC=40mA -40°C +25°C +85°C 4.5 4.5 4.0 4.0 3.5 3.5 VSWR 3.0 VSWR 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 3.0 2.5 2.5 2.0 2.0 1.5 1.5 1.0 100.0 1.0 100.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 Frequency (MHz) Frequency (MHz) 6 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A6 DS061016 RF3397 21.5 Reverse Isolation versus Frequency Across Temperature, ICC=40mA -40°C +25°C +85°C Current versus Voltage 60.0 55.0 50.0 (At Evaluation Board Connector, RBIAS=22Ω ) 21.0 20.5 Reverse Isolation (dB) 45.0 20.0 40.0 19.5 ICC (mA) 35.0 30.0 25.0 19.0 18.5 20.0 18.0 15.0 10.0 1100.0 2100.0 3100.0 4100.0 5100.0 6100.0 4.0 4.2 4.4 4.6 4.8 5.0 -40°C +25°C +85°C 17.5 100.0 Frequency (MHz) VCC (V) Current versus Voltage 60.0 Power Dissipated versus Voltage at Pin 8 0.25 (At Pin 8 of the RF3397) TAMB=85°C 50.0 0.20 40.0 Power Dissipated (W) -40°C +25°C +85°C Vcc= 4.5V 3.4 3.5 3.6 3.7 3.8 3.9 4.0 0.15 ICC (mA) 30.0 0.10 20.0 10.0 0.05 0.0 0.00 3.38 3.43 3.48 3.53 3.58 3.63 VPIN (V) VPIN (V) Junction Temperature versus Power Dissipated 140.00 TAMB=+85°C 135.00 130.00 125.00 TMAX (°C) 120.00 115.00 110.00 105.00 100.00 0.09 0.11 0.13 0.15 0.17 0.19 0.21 PDISS (W) Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 10 RF3397 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3 μinch to 8 μinch Gold over 180 μinch Nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Mask Pattern A = 0.59 x 0.32 (mm) Typ. 0.80 (mm) Typ. 1.00 (mm) 0.40 (mm) Typ. Pin 1 0.70 (mm) 1.00 (mm) Typ. Typ. A A A A 2.20 (mm) Typ. 3.20 (mm) Typ. 0.65 (mm) Typ. 0.95 (mm) Typ. A A 0.30 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 1. PCB Metal Land Pattern (Top View) 8 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A6 DS061016 RF3397 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.72 x 0.45 (mm) Typ. 0.72 (mm) Typ. 1.15 (mm) 0.41 (mm) Typ. Pin 1 0.75 (mm) Typ. 1.05 (mm) Typ. A A A A 2.27 (mm) Typ. 3.32 (mm) Typ. 0.65 (mm) Typ. 1.01 (mm) Typ. A A 0.45 (mm) Typ. 0.65 (mm) Typ. 1.30 (mm) Typ. 2.60 (mm) Figure 2. PCB Solder Mask (Top View) Thermal Pad and Via Design The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 9 of 10 RF3397 10 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A6 DS061016