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RF5189_1

RF5189_1

  • 厂商:

    RFMD(威讯)

  • 封装:

  • 描述:

    RF5189_1 - 3V, 2.45GHz LINEAR POWER AMPLIFIER - RF Micro Devices

  • 数据手册
  • 价格&库存
RF5189_1 数据手册
RF51893V, 2.45GHz Linear Power Amplifier RF5189 3V, 2.45GHz LINEAR POWER AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: QFN, 12-Pin, 3 x 3 VCC1 VCC2 Features Single Power Supply 3.0V to 5.0V +30dBm Saturated Output Power 25dB Small Signal Gain High Linearity 2400MHz to 2500MHz Frequency Range BIAS1GND 3 RF IN 1 12 Input Match 11 Interstage Match 10 Output Match VCC2 9 RF OUT NC 2 8 RF OUT Bias 7 PWR SEN 4 VREG1 5 VREG2 6 BIAS2GND Applications IEEE802.11B WLAN Applications 2.5GHz ISM Band Applications Wireless LAN Systems Commercial and Consumer Systems Portable Battery-Powered Equipment Spread-Spectrum and MMDS Systems Functional Block Diagram Product Description The RF5189 is a linear, medium-power, high-efficiency amplifier IC designed specifically for battery-powered WLAN applications such as PC cards, mini PCI, and compact flash applications. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz WLAN and other spread-spectrum transmitters. The device is provided in a 12-pin QFN package with a backside ground. The RF5189 is designed to maintain linearity over a wide range of supply voltage and power output. The RF5189 is designed to reduce end-product BOM count by integrating all matching circuitry onto the chip. Ordering Information RF5189 RF5189PCBA-41X 3V, 2.45GHz Linear Power Amplifier Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 12 RF5189 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (VREG) DC Supply Current Input RF Power Operating Ambient Temperature Storage Temperature Moisture sensitivity Rating -0.5 to +6.0 -0.5 to 3.5 600 +10 -40 to +85 -40 to +150 JEDEC Level 2 Unit VDC V mA dBm °C °C Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Parameter Overall-11b Signal Frequency Range Maximum Linear Output Power VCC =3.0V VCC =5.0V Linear Efficiency Small Signal Gain Second Harmonic 802.11B Adjacent Channel Power Alternate Channel Power Isolation Input Return Loss Output VSWR Power Detect Voltage Min. Specification Typ. Max. Unit Condition T=25°C, VCC =3.0V, VREG =2.7V, Freq=2450MHz 2400 to 2500 MHz With 802.11B modulation (11Mbit/s) and meeting 802.11B spectral mask. 21 24 22 24 dBm dBm % 27 -35 -32 -52 dB dBc dBc dBc dB dB 2.4 3.0 0.5 V V V POUT =21dBm, VCC =3.0V POUT =21dBm, VCC =3.0V In “OFF” state, PIN =-5.0dBm 50 Ω reference 50 Ω reference P0 =21dBm Voltage supplied to control input; device is “ON” Voltage supplied to control input; device is “OFF” PIN =-7dBm 23 25 -38 -56 30 9.5 2:1 1.7 2.1 15.0 1.5:1 2.1 2.7 0 Power Down VREG “ON” VREG “OFF” Power Supply Operating Voltage Current Consumption 100 220 VREG Current (Total) 5 10 3.0 to 5.0 10 160 270 10 15 V μA mA mA mA mA VREG =0V No RF input, VCC =3.0V, and VREG =2.7V POUT =21dBm, VCC =3.0V, and VREG =2.7V VCC =3.0V VCC =5.0V 2 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212 RF5189 Pin 1 Function RF IN Description RF input. Input is matched to 50 Ω and DC block is provided internally. Interface Schematic VCC1 INTERSTAGE MATCH INPUT MATCH 2 3 4 NC BIAS1GND VREG1 No connect. Recommend connecting to ground. Ground for first stage bias circuit. For best performance, keep traces physi- See pin 4. cally short and connect immediately to ground plane. First stage input bias. This pin requires a regulated supply to maintain VREG1 nominal bias current. BIAS VREG2 BIAS GND1 BIAS GND2 5 6 7 8 VREG2 BIAS2GND PWR SEN RF OUT Second stage input bias. This pin requires a regulated supply to maintain nominal bias current. Usually connected to VREG1. Ground for second stage bias circuit. For best performance, connect to ground with a choke inductor. Provides an output voltage proportional to output RF level. RF output. Output is matched to 50 Ω and DC block is provided internally. See pin 4. See pin 4. VCC2 OUTPUT MATCH RF OUT 9 10 11 12 Pkg Base RF OUT VCC2 VCC2 VCC1 GND Same as pin 8. Second stage output bias. Supply should be connected through a choke inductor sized appropriately to handle the output bias current. Same as pin 10. First stage output bias. This pin is sensitive to bypass capacitors placed close to it. Place an RF short approximately 200mils from this pin before any other supply connections. Ground connection. The backside of the package should be connected to the ground plane through a short path (i.e., vias under the device will be required). See pin 8. See pin 8. See pin 8. See pin 1. Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 12 RF5189 Package Drawing 3.00 Pin 1 ID A 1.55 1.35 Pin 1 ID 0.50 TYP 3.00 0.15 C 2 PLCS 1.45 0.15 C 2 PLCS B 0.45 TYP 0.25 0.10 M C A B 0.05 0.203 REF 0.1 C 0.08 C 0.925 0.775 Dimensions in mm. 0.102 REF C Shaded areas represent pin 1. 4 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212 RF5189 Theory of Operation The RF5189 is a two-stage device with a nominal gain of 25dB in the 2.4GHz to 2.5GHz ISM band. The RF5189 is designed primarily for IEEE802.11B WLAN applications where the available supply voltage and current are limited. This amplifier will operate to (and below) the lowest expected voltage made available by a typical PCMCIA slot in a laptop PC, and will maintain required linearity at decreased supply voltages. The RF5189 requires only a single positive supply of 3.0V nominal (or greater) to operate to full specifications. Power control is provided through two bias control input pins (VREG1 and VREG2), but in most applications these are tied together and used as a single control input. There is no external matching required on the input and output of the part, thus allowing minimal bill of material (BOM) parts count in end applications. Both the input and the output of the device are DC-blocked. For best results, the PA circuit layout from the evaluation board should be copied as closely as possible, particularly the ground layout and ground vias. Other configurations may also work, but the design process is much easier and quicker if the layout is copied from the RF5189 evaluation board. Gerber files of our designs are available on request. The RF5189 is not a difficult part to implement, but care in circuit layout and component selection is always advisable when designing circuits to operate at 2.5GHz. The choke inductors on VCC2 and BIAS2GND should be chosen so that they are parallel self-resonant at the frequency of operation. In addition, the supply side of the choke inductor on VCC2 should be bypassed with a capacitor that is series self-resonant at the frequency of operation. In practice, VCC1 and the supply side of the choke on VCC2 will be tied to the same supply. It is important to isolate VCC1 from other RF and low-frequency bypass capacitors on this supply line. This can be accomplished using a suitably-long transmission line which is RF shorted on the other end as described above. Ideally the length of this line will be a quarter wavelength, but it only needs to be long enough so that the effects of other supply bypass capacitors on the VCC1 line are minimized. If board space is a concern, this isolation can also be accomplished with an RF choke inductor or ferrite bead. The RF5189 has primarily been characterized with a voltage on VREG1 and VREG2 of 2.7VDC. However, the RF5189 will operate from a wide range of control voltages. If you prefer to use a control voltage that is significantly different than 2.7VDC, contact RFMD Sales or Applications Engineering for additional data and guidance. Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 12 RF5189 Evaluation Board Schematic VCC P1 C14 1 μF L1 12 nH P1-1 1 2 P1-3 3 4 P1-5 12 J1 RF IN 50 Ω μstrip 1 Input Match PDETECT GND VREG2 GND VREG1 5 CON5 11 Interstage Match 10 Output Match 9 50 Ω μstrip P2 1 GND GND VCC1 2 8 J2 RF OUT 2 P2-3 3 CON3 3 Bias 7 C13 1000 pF 5 6 PDETECT P3-1 P3 1 VCC CON1 P4 1 GND CON1 C13 1000 pF L2 10 nH VREG2 4 C3 1000 pF VREG1 6 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212 RF5189 Evaluation Board Layout Board Size 1.10" x 1.85" Board Thickness 0.032”, Board Material FR-4 Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 12 RF5189 30.0 28.0 26.0 24.0 22.0 300.0 350.0 POUT, Gain, ICC Total versus PIN (Typical) @ VCC=3.0V, VREG=2.7V 400.0 POUT, Gain, ICC Total versus VREG @ VCC=3.0V 27.0 26.0 25.0 24.0 250.0 300.0 Gain (dB), POUT (dBm) Gain(dB), Pout(dBm) 20.0 18.0 16.0 200.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 -20.0 -18.0 -16.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 Pout(dBm) Gain(dB) ICC_Total(mA) 0.0 100.0 150.0 23.0 22.0 21.0 200.0 ICC Total (mA) 150.0 20.0 19.0 18.0 17.0 16.0 Pout(dBm) Gain(dB) ICC_Total(mA) 14.0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 0.0 50.0 100.0 50.0 15.0 PIN (dBm) Vreq(V) POUT, PDETECT versus PIN (Typical) @ VCC=3.0, VREG=2.7 over Temp (-40, +25, +85)°C Pout(dBm) @ + 25 C 28.0 26.0 24.0 Pout(dBm) @ +85 c Pout(dBm) @ -40 C PDETECT (V) @ +25 C PDETECT (V) @ + 85 C 22.0 20.0 PDETECT (V) @ -40 C 3.5 4.0 4.5 Channel Frequency versus Gain (Typical) for VCC=3.0V, 3.3V, and 5.0V, VREG1=VREG2=2.7V and POUT=21dBm 30.0 30.0 5.0 29.0 28.0 27.0 POUT (dBm) 18.0 16.0 3.0 26.0 Gain (dB) 2.5 14.0 12.0 10.0 2.0 25.0 24.0 1.5 8.0 6.0 1.0 23.0 22.0 Gain(dB)@Vcc=3.0Volts Gain(dB)@Vcc=3.3Volts Gain(dB)@Vcc=5.0 Volts 4.0 0.5 2.0 0.0 -20.0 0.0 -2.0 21.0 20.0 2.412 2.417 2.422 2.427 2.432 2.437 2.442 2.447 2.452 2.457 2.462 2.467 2.472 2.477 2.482 -18.0 -16.0 -14.0 -12.0 Frequency (GHz) PIN (dBm) -10.0 -8.0 -6.0 -4.0 8 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212 PDETECT (V) ICC Total (mA) 250.0 RF5189 300.0 280.0 260.0 240.0 220.0 ICQ, ICC_Total, POUT versus VREG (Typical) @ VCC=3.0V, PIN=5dBm ICQ(mA) ICC_Total(mA) Pout(dBm) IREG, POUT versus VREG (Typical) @ VCC=3.0V, 10.0 Ireg(mA) 9.0 Pout(dBm) 26.0 24.0 22.0 25.0 PIN=-5.0dBm 30.0 28.0 20.0 8.0 7.0 ICQ, ICC_Total (mA) 200.0 20.0 IREG_Total (mA) 160.0 140.0 120.0 100.0 80.0 60.0 40.0 20.0 0.0 1.6 1.7 1.8 1.9 2.0 2.1 2.2 0.0 5.0 10.0 POUT (dBm) 16.0 5.0 14.0 4.0 3.0 12.0 10.0 8.0 2.0 1.0 6.0 4.0 2.0 0.0 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 0.0 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.0 VREG (V) VREG (V) Spectral Mask (Typical): VCC=3.0V, VREG1=VREG2=2.7V, Spectral Mask (Typical): VCC=3.0V, VREG1=VREG2=2.7V, POUT=18dBm, PIN=-7.55dBm, and ICC_Total=168mA POUT=21dBm, PIN=-4.0dBm, and ICC_Total=210mA Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 9 of 12 POUT (dBm) 180.0 15.0 6.0 18.0 RF5189 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3 μinch to 8 μinch gold over 180 μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.69 x 0.28 (mm) Typ. B = 0.28 x 0.69 (mm) Typ. C = 1.45 (mm) Sq. 1.00 Typ. Pin 12 Dimensions in mm. B Pin 1 B B Pin 9 A 0.50 Typ. A A 0.78 Typ. B B B Pin 6 A C A A 1.00 Typ. 0.78 Typ. 0.50 Typ. Figure 1. PCB Metal Land Pattern (Top View) 10 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212 RF5189 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB Metal Land Pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The centergrounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.79 x 0.38 (mm) Typ. B = 0.38 x 0.79 (mm) Typ. C = 1.55 (mm) Sq. 1.00 Typ. Pin 12 Dimensions in mm. B Pin 1 B B Pin 9 A 0.50 Typ. A A 0.78 Typ. B B B Pin 6 A C A A 1.00 Typ. 0.78 Typ. 0.50 Typ. Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB Metal Land Pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Rev A8 DS071212 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 11 of 12 RF5189 12 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A8 DS071212
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