RF6886
RF68863.6V,
100MHz to
1000 MHz Linear Power
Amplifier
3.6V, 100MHz TO 1000MHz LINEAR POWER
AMPLIFIER
Features
100MHz to 1000MHz
Single 3.6V Power Supply
34dBm OP1dB
36.5dBm Saturated Output
Power
>50% Efficiency
23
22
21
20
Vreg1
NC
24
NC
VBias
Pwr Ref
Package: QFN, 24-Pin, 4mmx4mm
19
18
RFout
2
17
RFout
Vcc
3
16
RFout
NC
4
15
RFout
Vreg2
5
14
RFout
RFin
6
13
RFout
Vcc
1
Vcc
Bias
Applications
7
CDMA/GSM/EDGE Repeater
Final Amplifier
NC
450MHz and 865MHz to
955MHz ISM Band Amplifier
General Purpose High Power
Amplifier
TETRA Handheld/Walkie-Talkie
Final Amplifier
HPA Driver
8
9
10
11
12
NC
NC
NC
NC
NC
Functional Block Diagram
Product Description
The RF6886 is a linear, high power, high efficiency amplifier designed to use as a
final stage/driver in linear or saturated transmit applications. The device is manufactured on an advanced InGaP HBT process and is provided in a 24-pin leadless
chip carrier with backside ground. External matching allows for use in standard
bands from 100MHz to 1000MHz.
Ordering Information
RF6886SR
RF6886SQ
RF6886TR7
RF6886TR13
RF6886PCK-410
RF6886PCK-411
7” Reel with 100 pieces
Sample bag with 25 pieces
7” Reel with 750 pieces
13” Reel with 2500 pieces
865MHz to 955MHz PCBA with 5-piece sample bag
433MHz to 470MHz PCBA with 5-piece sample bag
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
BiFET HBT
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
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1 of 16
RF6886
Absolute Maximum Ratings
Parameter
Rating
Unit
VC2 Collector Quiescent Bias
Current (ICQ2)
350
mA
VC1 Collector Quiescent Bias
Current (ICQ1)
150
mA
Maximum Supply Current
(ICC1 +ICC2)
3100
mA
Device Voltage (VD)
4.0
V
Power Dissipation
5
W
-40 to +85
°C
Max RF Input 50 Output Load
12
dBm
Max RF Output 50 Load
38
dBm
Operating Lead Temperature
(TAMBIENT)
Output Load VSWR
See Theory of Operation Section
Storage Temperature Range
-40 to +150
°C
Operating Junction Temperature
(TJ)
150
°C
ESD Rating - Human Body Model
(HBM)
Class 1A
V
Moisture Sensitivity Level (MSL)
MSL1
Parameter
Min.
Specification
Typ.
Max.
Unit
Typical Electrical Specifications
for 433MHz to 470MHz
Operating Frequency
OP1dB
Small SIgnal Gain
Saturated Output Power (PSAT)
Saturated Efficiency
Condition
See 433MHz to 470MHz Evaluation Board Schematic
433
450
34.5
470
MHz
VCC =3.6V, VREG1 =VREG2 =3.1V, ICQ total=390mA
dBm
33
dB
36.8
dBm
55
%
Saturated Output Power (PSAT)
36.3
dBm
Saturated Efficiency
54.5
%
Saturated Output Power (PSAT)
VCC=3.3V, VREG1=VREG2=3.1V, ICQ total=380mA
35.2
dBm
Saturated Efficiency
53
%
TETRA ADJ Channel Power
-38
dBc
VCC=3.6V, VREG1 =VREG2 =2.7V, ICQ total=187mA
TETRA ALT Channel Power
-53
dBc
TETRA: PAR=2.6dB, POUT =32dBm, 24.3kHz channel BW,
ADJ offset=25kHz, ALT offset=50kHz
CDMA ADJ Channel Power
-50
dBc
CDMA ALT Channel Power
-67
dBc
2 of 16
VCC=3.0V, VREG1=VREG2=3.1V, ICQ total=370mA
CDMA: PAR=4.5dB, POUT =32dBm, 1.23MHz channel BW,
ADJ CH offset/BW=750kHz/30kHz, ALT CH
offset/BW=1.98MHz/30kHz
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RF6886
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
See 865MHz to 955MHz Evaluation Board Schematic.
TA =25 °C
Operating Frequency
865
OP1dB
900
955
33.5
Small Signal Gain
29
Saturated Output Power (PSAT)
31.0
33.5
36.2
Saturated Efficiency
50
MHz
VCC =3.6V, VREG1 =VREG2 =3.1V, ICQ total=390mA
dBm
dB
Frequency = 900MHz
dBm
54
%
Saturated Output Power (PSAT)
35.5
dBm
Saturated Efficiency
53.5
%
Saturated Output Power (PSAT)
34.4
dBm
Saturated Efficiency
52.5
%
CDMA ADJ Channel Power
-52
dBc
CDMA ALT Channel Power
-66
dBc
CDMA: PAR=4.5dB, POUT =31.5dBm, 1.23MHz channel
BW, ADJ CH offset/BW=750kHz/30kHz, ALT CH
offset/BW=1.98MHz/30kHz
VCC =3.6V, VREG1 =VREG2 =3.1V
Quiescent Current (ICQ)
VCC=3.0V, VREG1=VREG2=3.1V ICQ total=370mA
390
420
mA
Leakage Current
5
10
uA
VCC =3.6V, VREG1 =VREG2 =0V
Current at VREG1 and VREG2 (IREG1
and IREG2)
3
mA
VCC =3.6V, VREG1 =VREG2 =3.1V. VREG1/2 supplied through
220 bias resistance (see evaluation board schematic).
Thermal Resistance, RTH
11
°C/W
DS140303
340
VCC=3.3V, VREG1=VREG2=3.1V ICQ total=380mA
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RF6886
Pin
1, 2, 3
Function
VCC1
5
6
VREG2
RF IN
Description
Interface Schematic
Inter-stage match and bias for first stage output. Connect inter-stage
matching capacitor to pin with a short trace. Connect low frequency
bypass capacitor to this pin with a long trace. See evaluation board layout for detail.
This pin requires a regulated supply to set output stage DC bias.
RF Input. An external blocking capacitor is required if this pin is connected to DC path.
VCC
Bond Wire
Inductance
RF IN
BIAS
4,
7-12,
20, 21
13, 14,
15, 16,
17, 18
19
22
23
NC
RF OUT
No Connect.
RF Output and bias for the output stage. The power supply for the output transistor needs to be supplied to this pin. This can be done
through an RF inductor that supports the required DC currents.
RF OUT
BIAS
VREG1
VCC BIAS
PWR SENSE
This pin requires a regulated supply to set driver stage DC bias.
Bias circuitry supply voltage.
PWR SEN and PWR REF pins can be used in conjunction with an external feedback path to provide an RF power control function for the
RF6886. The power control function is based on sampling the RF drive
to the final stage of the RF6886.
RF OUT
PWR SEN
PWR REF
BIAS
24
Pkg
Base
4 of 16
PWR REF
GND
Same as pin 23.
Ground connection. The backside of the package should be connected
to the ground plane through a short path, i.e., vias under the device are
required.
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RF6886
Theory of Operation
This section provides specific guidelines for operation of RF6886.
Applications can generally be placed into two categories:
1. High power applications
• Output power ranging between 34.5 - 36.5dBm
• Efficiency >50% in band of interest
2. Linear applications
• RF6886 shows linearity along the lines of a handset power amplifier in terms of adjacent channel power (ACP)
performance, with the distinct advantage of obtaining ACP compliance at >2x comparative output power. Resultant
output power for linear operation will depend on the waveform being considered.
All pertinent specifications and performance curves are seen in the tabular and graph sections of the data sheet. The first
standard evaluation board has been matched for 865MHz to 955MHz. Operation with VCC=3.6V shows output power >36dBm
and efficiency >50%. For reduced power ranges, efficiency is maintained, with no change to output match, by lowering VCC. See
data for 3.3/3.0V in the tables provided. The standard evaluation board also demonstrates impressive linearity, shown with
conventional CDMA modulation.
The same data set format is also provided for the 433MHz to 470MHz evaluation board. Nominal data is taken with VCC=3.6V
and VREG1/2=3.1V. For linear operation, it has been shown that reducing VREG1/2 to 2.7 - 2.8V enhances performance. This
can be explained by observing how the compression characteristic behaves. Operation with VREG=3.1V shows gradual (soft)
compression once power exceeds 31dBm. With VREG reduced to 2.7 - 2.8V, small signal gain drops by 1 - 2dB. Self bias is now
more prominent at 31dBm, and gain expansion offsets slow compression. The result is flattening of the gain characteristic,
extending effective compression point out in power. Waveform distortion is reduced as compared to the VREG=3.1V case, and
adjacent channel power improves. The sole advantage in using VREG=3.1V would be a slightly higher value for saturated output power.
Low thermal resistance enables reliable high power operation, provided that output load is set to achieve efficiency equal to or
better than that seen on the RFMD evaluation boards.
The maximum rating for output load VSWR on page 2 calls out requirement for discussion in this section. RF6886 has shown
excellent performance into 50, but any system using it as a final amplifier will have to take VSWR variation into account. Test
on properly matched evaluation board has shown that rated output power is obtained with 10dBm at RF input. Practically
speaking then, at or near 10dBm would be a maximum reasonable limit for input power. When considering VSWR variation,
ruggedness is one of the main considerations. Ruggedness here, being the worse case VSWR which can be tolerated for a transient period without damage to the device. The following maximum VSWR limits apply:
VCC
Freq
POUT into 50 Load
(Across Band)
Maximum Practical
Input Drive
Maximum Output VSWR
(Survival)
V
MHz
dBm
dBm
3.6
865 to 955
36.2 to 35.2
10
3.5:1
3.3
35.5 to 34.4
10
5.0:1
3
34.4 to 33.4
8
5.0:1
37 to 36.4
10
3.5:1
3.3
36.3 to 35.6
10
5.0:1
3
35.2 to 34.5
8
5.0:1
3.6
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433 to 470
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RF6886
In each case, VSWR was tested over phase, with device on/off cycle done several times at phase angle where current was maximum. Test showed that the best off/on sequence for RF6886 is as follows:
Turn on:
1. Apply VCC
2. Apply VREF1/2
3. Apply drive at RF input
Turn off:
1. Remove drive at RF input
2. Bring down voltage at VREF1/2
3. Bring down VCC (not necessary in system of course)
Many systems will use closed loop power control. When taking output VSWR variation into account, the limits in table above
still apply, with same practical maximum limit on RF drive. At some phase angles, higher output powers will not be attainable.
Thus, a limit on maximum drive should be taken into account to prevent overdrive of the device by power control circuit.
The VSWR limits set here apply to the most demanding case, where input drive is set for maximum output power. For example,
Pout >36dBm, VCC=3.6V, Pin=10dBm. It is entirely conceivable that the amplifier be used in a linear application at backed off
power. In that case, it follows that a higher VSWR could be tolerated. As an example, consider 32dBm output power with
VCC=3.6V. Test showed that power control loop would achieve 32dBm from 865MHz to 955MHz over phase into 5:1 VSWR. The
increased VSWR specification as compared to the 3:5:1 limit in table comes about for the following reason:
The harshest condition is encountered at phase angle where 10dBm drive results in forward power >38.5dBm and current >
>3000mA. A power control loop sensing forward (coupled) power would back input drive down in this case and prevent damage. That provided it reacts quickly enough. The more limiting factor in this case, phase angle for lowest power presents a situation where target power cannot be achieved. That even if drive is allowed to go beyond practical maximum. But because the
amplifier was seen to achieve 32dBm over phase along with ruggedness, the increased VSWR specification becomes reasonable in the presence of power control and lower output power requirement. So, a multitude of scenarios could exist, with test
being required to determine allowable VSWR specification.
Power control can be implemented via several different methodologies, using circuitry external to RF6886. One method
already touched upon, sampling forward coupled output power and feedback to adjust at one of two points in the system:
1. With constant drive level at RF6886 input, adjust voltage level at VREG1 and/or VREG2. VREG1/2 can be tied together,
or one of the two can be kept constant with the other adjusted.
2. With VREF1/2 constant, RF drive at device input can be adjusted via feedback to a system control point behind
RF6886.
Two RF6886 output pins are also available for use in a power control scheme, PWR SENSE (pin 23) and PWR REF (pin 24).
Viewing the evaluation board schematics, it can be seen that both pins are tied to VCC through 390 resistors. Both pins sink
current, resulting in following voltages at respective board connectors:
V_PWR REF = VCC - 390*I_PWR_REF
V_PWR SENSE = VCC - 390*I_PWR_SENSE
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DS140303
RF6886
V_PWR_REF output pin yields a voltage proportional to DC component of total output stage drive current, while V_PWR_SENSE
output pin does likewise for DC + RF components. Subtraction between these voltages gives result proportional to RF current
only, and therefore output power as well. Graphs of Log 10 (V_PWR REF - V_PWR SENSE) vs. RF6886 power out are shown for
two scenarios:
1. RF drive at device input = constant 10dBm, with ramp at VREG1/2.
2. VREG1/2 = constant 3.1V, with RF drive ramp from 0 - 10dBm.
In both cases, it can be seen that output power versus Log of this difference maintains a linear relationship up to 33.5dBm.
Non-linear behavior past 33.5dBm is caused by 2 contributors:
1. Compression beginning to take effect at RF6886 1st and/or 2nd stage.
2. PWR_REF and PWR_SENSE transistor collector voltage reduction and associated compression. Note that changing
390 value will influence curve shape and shift graphs up/down on y-axis.
As an additional exercise to investigate #2 above, like graphs are shown for 180 pull up resistor vs. 390. With 180 in
place, internal PWR_REF and PWR_SENSE transistors retain higher collector voltage, and do not enter into compression. As a
result, we see altered curves as compared to 390 case. Log (V_PWR_REF - V_PWR_SENSE) continue to increase, with
increasing slope, vs. output power. One other interesting data point, the curve for ramp at VREG1/2 now closely resembles that
for ramp at RF input.
The curves will remain consistent for a given frequency and temperature provided the following remain constant:
1. REF/SENSE resistance (Does not change value in design. This only noted for clarity)
2. Output load VSWR
Practically speaking then, this method offers a relatively simple approach, with presumably less accuracy as compared to
closed loop control which couples forward power at output. In the coupled power method, VSWR variation will of course also
impact accuracy.
Here are general schematics for approaches utilizing PWR_REF/PWR_SENSE pins in described power control schemes:
Approach 1:
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RF6886
Approach 2:
Approach #1 feeds back to variable gain stage behind RF6886. Approach #2 utilizes feedback to VREG1/2 pins of RF6886.
Recall Log of the Loop Reference Voltage is shown in graphs for both methods. In the circuits shown above, no Log function is
performed. Data for V_delta = (V_PWR_REF - V_PWR_SENSE) vs. Output Power out is collected, and Loop Reference Voltage is
set to V_delta(s) for corresponding Output Power(s). Data can be collected at selected frequency and temperature points,
depending on accuracy desired in a particular application.
Next, a discussion covering RF6886 used in balanced configuration. The application as depicted here:
This configuration can be implemented with readily available surface mount hybrid couplers, and offers significant performance and reliability advantages. Use single ended RF6886 3.6V specifications for reference:
1. >38.5dBm output power
2. Linear performance with 2.5dB increase in power for equivalent adjacent channel power specification
3. Immunity to antenna VSWR variation
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DS140303
RF6886
One key consideration will be output side isolated port 50 termination resistance. In the case where output VSWR deviates
significantly from 50, reflected power will be absorbed in the isolated port. This will require placement of resistor bank capable of handling power dissipation while fault condition exists.
Finally, consider the maximum allowable operating device voltage, listed at 4.0V in the table on page 2. Operating with
VCC =4.0 V enables higher compression point, which becomes attractive in two types of applications:
1. High power, high efficiency
2. Linear, requiring specification compliance at higher power level
Viewing curves in the graph section, it can be seen that device junction temperature stays below 150°C (85°C ambient) up to
rated power levels. Junction temperature becomes a more critical specification with higher operating voltage. It should be
stressed again here that a properly matched output load impedance is required to provide high efficiency. Load impedance
has been measured on both standard evaluation boards. The table below contains that data:
Standard Evaluation
Board Load Impedance
Freq
MHz
A+jB
MHz
A+jB
865
1.983+j 0.157
433
1.997-j 0.941
900
1.983+j 0.579
450
1.866-j 0.251
928
1.953+j 0.789
470
1.778-j 0.268
955
1.969+j 0.914
Freq
Standard Evaluation
Board Load Impedance
In any application where greater than 3.6V operation is being considered, use of an isolator at RF6886 output is recommended. This, of course, excludes the balanced configuration already discussed. The recommendation would also hold for
VCC 3.6V, in cases where potential output VSWR conditions exceed those outlined previously in this section.
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RF6886
Evaluation Board Schematic
433MHz to 470MHz
Vreg1
Key locations shown in red type. Output capacitors are
Johanson Hi-Q tight tolerance
10uF
Vcc
10uF
Vreg2
390
390
PWR SEN
PWR REF
10uF
1uF
1uF
1uF
0
24
23
22
21
20
19
18
1
Bias
220
2.2 uF
100 pF
0 jumpers in place of ferrites
used on 865 MHz to 955 MHz board
2.2 uF
1uF
RF IN
0
220
1 uF
220 pF @ C46
0
22 pF
2
17
3
16
4
15
5
14
6
13
7
8
9
10
11
12.55nH
Coilcraft 1606
0
2.2 uF
100 pF
RF OUT
10 pF @ C16
27//10//1.2 pF
@ C17/18/19
12
8.2 nH @ L3
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DS140303
RF6886
Evaluation Board Schematic
865MHz to 955MHz
Vreg1
Key locations shown in red type. Output capacitors are
Johanson Hi-Q tight tolerance
10uF
Vcc
10uF
Vreg2
390
390
PWR SEN
PWR REF
10uF
1uF
1uF
220
1 uF @ C4
220 pF @ C6
2.2 uF
1uF
24
23
22
21
20
19
18
1
Bias
220
2.2 uF
RF IN
39 pF
2 A, low DC resistance ferrites
(see evaluation board BOM)
1uF
2
17
3
16
4
15
5
14
6
13
7.5 pF
7
8
9
10
11
5.6 nH
Coilcraft 1606
1.5 nH
27 pF
39 pF
RF OUT
15//12//10 pF @
C8//C13//C14
5.6/0.5 pF @
C17/C18
12
2.7 nH @ L3
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11 of 16
RF6886
Typical Electrical Performance, 25°C:
433MHz to 470MHz Evaluation Board Schematic
865MHz to 955MHz Evaluation Board
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DS140303
RF6886
Thermal Performance, 900MHz, 85°C:
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RF6886
Power Control Performance, REF/SENSE Pull-Up Resistance=390, 25°C:
865MHz to 955MHz Evaluation Board, Constant Power at RF IN, Ramp at VREG1/2
865MHz to 955MHz Evaluation Board, Power Ramp at RF IN, Constant 3.1V at VREG1/2
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DS140303
RF6886
Power Control Performance, REF/SENSE Pull-Up Resistance=180, 25°C:
865MHz to 955MHz Evaluation Board, Constant Power at RF IN, Ramp at VREG1/2
865MHz to 955MHz Evaluation Board, Power Ramp at RF IN, Constant 3.1V at VREG1/2
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15 of 16
RF6886
Package Drawing
PCB Patterns
A = 0.234 x 0.475 (mm)
B = 0.475 x 0.234 (mm)
C = 1.125 x 1.125 (mm)
A = 0.400 x 0.668 (mm)
B = 0.668 x 0.400 (mm)
C = 2.840 x 2.840 (mm)
A = 0.260 x 0.528 (mm)
B = 0.528 x 0.260 (mm)
C = 2.700 x 2.700 (mm)
10x 0.266
10x 0.100
A
12x 0.250
10x
0.100
A
A
A
A
A
B
2x 1.250
B
B
2x 0.750
B
B
2x 0.250
0.000
B
B
2x 0.250
B
B
2x 0.750
B
2x 1.250
12x 0.110
B
B
2x 1.250
B
2x 0.750
B
B
2x 0.250
0.000
B
B
2x 0.250
B
B
2x 0.750
B
2x 1.250
C
B
A
A
C
C
2x 1.250
B
2x 0.750
B
2x 0.725
2x 0.250
B
0.000
2x 0.250
2x 0.325
C
B
C
B
B
B
6x 1.864
6x 1.864
A
2x 1.250
2x 1.250
A
2x 0.750
2x 0.750
PCB METAL PATTERN
A
2x 0.250
2x 0.250
A
6x 1.864
0.000
2x 0.250
A
2x 0.750
A
2x 1.250
A
6x 1.864
B
12x 0.339
B
6x 1.864
A
6x 1.864
A
2x 0.250
0.000
2x 1.250
6x 1.864
A
2x 0.750
B
A
2x 0.325
10x 0.240
12x 0.110
12x 0.250
A
A
B
B
10x 0.240
C
A
A
12x 0.339
B
B
B
A
6x 1.864
A
A
PCB SOLDER MASK PATTERN
A
A
A
A
2x 0.750
2x 0.725
2x 1.250
6x 1.864
6x 1.864
6x 1.864
2x 1.250
A
2x 0.750
A
2x 0.250
2x 0.725
A
2x 0.750
A
2x 0.725
2x 0.250
0.000
A
2x 1.250
A
6x 1.864
10x 0.240
PCB STENCIL PATTERN
Thermal vias for center slug "C" should be incorporated into
the PCB design. The number and size of thermal vias will
depend on the application, the power dissipation, and the
electrical requirements. Example of the number and size of
vias can be found on the RFMD evaluation board layout.
Notes:
1. Shaded are represents Pin 1.
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
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DS140303