RF7211

RF7211 3V W-CDMA BAND 11/21 LINEAR PA MODULE Package Style: Module, 10-Pin, 3mmx3mmx1.0mm Features           VBAT HSPA+ Compliant Low Voltage Positive Bias Supply (3.0V to 4.2V) +28dBm Linear W-CDMA Rel 99 Output Power (+26.5dBm HSPA+ and HSDPA) High Efficiency Operation 38% at POUT =28dBm 33% at POUT =+26.5dBm 16% at POUT =+18.0dBm (Without DC/DC Converter) Low Quiescent Current in Low Power Mode: 18mA Internal Voltage Regulator Eliminates the Need for External Reference Voltage (VREF) 3-Mode Power States with Digital Control Interface Supports DC/DC Converter Operation Integrated Power Coupler Integrated Blocking and Collector Decoupling Capacitors RF IN VMODE1 VMODE0 VEN 1 10 VCC 2 3 Bias Control & PA/VMODE Enable 4 5 9 RF OUT 8 CPL IN 7 GND 6 CPL OUT Functional Block Diagram Product Description The RF7211 is a high-power, high-efficiency, linear power amplifier designed for use as the final RF amplifier in 3V, 50 W-CDMA mobile cellular equipment and spread-spectrum systems. This PA is developed for UMTS Band 11 and 21 operating in the transmit frequency band from 1427.9MHz to 1462.9MHz. The RF7211 has two digital control pins to select one of three power modes to optimize performance and current drain at lower power levels. The part also has an integrated directional coupler which eliminates the need for an external discrete coupler at the output. The RF7211 is fully HSPA+ compliant and is assembled in a 10pin, 3mmx3mm module. Applications   WCDMA/HSDPA/HSPA+ Wireless Handsets and Data Cards Dual-Mode UMTS Wireless Handsets and Data Cards Ordering Information RF7211 RF7211PCBA-410 3V W-CDMA Band 11/21 Linear PA Module Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT  SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MEMS LDMOS RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. DS100603 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 8 RF7211 Absolute Maximum Ratings Parameter Rating Unit Supply Voltage in Standby Mode 6.0 V Supply Voltage in Idle Mode 6.0 V Supply Voltage in Operating Mode, 50 Load 6.0 V Supply Voltage, VBAT 6.0 V Control Voltage, VMODE0, VMODE1 3.5 V Control Voltage, VEN 3.5 V RF - Input Power +6 dBm RF - Output Power +30 dBm Output Load VSWR (Ruggedness) 10:1 Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). Operating Ambient Temperature -30 to +110 °C Storage Temperature -55 to +150 °C The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. No damage as long as only one parameter is at limit at one time with the other parameters set at recommended operating conditions. Parameter Min. Specification Typ. Max. Unit Condition Recommended Operating Conditions Operating Frequency Range 1462.9 MHz VBAT +3.0 +3.4 +4.2 V VCC +3.01 +3.4 +4.2 V 0.5 V PA disabled. 1.8 3.0 V PA enabled. 0.5 V Logic “low”. 3.0 V Logic “high”. VEN 1427.9 0 1.4 VMODE0, VMODE1 0 1.5 1.8 POUT Maximum Linear Output (HPM) 26.52,3 dBm High Power Mode (HPM) Maximum Linear Output (MPM) 18.02,3 dBm Medium Power Mode (MPM) Maximum Linear Output (LPM) 7.02,3 dBm Low Power Mode (LPM) Ambient Temperature -30 +25 +85 °C Notes: 1 Minimum VCC for max POUT is indicated. VCC down to 0.5V may be used for backed-off power when using DC/DC converter to conserve battery current. 2 For operation at VCC =+3.0V, derate POUT by 1.3dB. At VCC =3.2V, derate POUT by 0.6dB. 3P OUT 2 of 8 is specified for HSDPA and HSPA+ modulation: HSDPA Configuration: c=12, d15, hs24 HSPA+ Configuration: 3GPP Release 7 Subtest 1 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS100603 RF7211 Parameter Min. Specification Typ. Max. Unit Condition TC =+25C, VCC =VBAT =+3.4V, VEN =+1.8V, HSPA+ Modulation, and 50 system, unless otherwise specified. Electrical Specifications Gain 25.0 dB MPM, POUT 18.0dBm 15 dB LPM, POUT 7.0dBm dB HPM, 18.0dBmPOUT 26.5dBm -36.5 dBc HPM, POUT =26.5dBm 16.5 10 13.5 ±0.4 -39 ACLR - 10MHz Offset -39 -36.5 dBc MPM, POUT =18.0dBm -38 -36.5 dBc LPM, POUT =7.0dBm -55 -48 dBc HPM, POUT =26.5dBm -54 -48 dBc MPM, POUT =18.0dBm -55 -48 dBc LPM, POUT =7.0dBm 33 40 % 12 16 25 % MPM, POUT =18.0dBm 2.8 4.1 7 % LPM, POUT =7.0dBm 27.5 Quiescent Current 20 14 Gain Linearity Current Drain HPM, POUT =26.5dBm 30 ACLR - 5MHz Offset PAE Without DC/DC Converter dB 26.5 HPM, POUT =26.5dBm 328 400 477 mA HPM, POUT =26.5dBm 93 120 155 mA MPM, POUT =18.0dBm 21 36 53 mA LPM, POUT =7.0dBm 65 100 140 mA HPM, DC only 5 24 35 mA MPM, DC only 5 18 28 mA LPM, DC only Enable Current 0.3 1.0 mA Source or sink current. VEN =1.8V. Mode Current (IMODE0, IMODE1) 0.3 1.0 mA Source or sink current. VMODE0, VMODE1 =1.8V. Leakage Current 5.0 15.0 A DC only. VCC =VBAT =4.2V, VEN =VMODE0 =VMODE1 =0V. Noise Power in Receive Band -135 dBm/Hz All power modes, measured at duplex offset frequency (FTX+48MHz). Rx: 1475.9MHz to 1510.9MHz, POUT 26.5dBm Input Impedance 1.7:1 VSWR No ext. matching, POUT 26.5dBm, all modes. Harmonic 2FO -20 Harmonic 3FO -40 Spurious Output Level -13 -70 Insertion Phase Shift ±30 dBm POUT 26.5dBm, all power modes. dBm POUT 26.5dBm, all power modes. dBc All spurious, POUT 26.5dBm, all conditions, load VSWR6:1, all phase angle. ° Phase shift at 18dBm when switching from HPM to MPM and MPM to LPM. DC Enable Time 10 S DC only. Time from VEN =high to stable idle current (90% of steady state value). RF Rise/Fall Time 6 S POUT 26.5dBm, all modes. 90% of target, DC settled prior to RF. Coupling Factor 19.5 dB POUT 26.5dBm, all modes. Coupling Accuracy - Temp/Voltage ±0.5 dB POUT 26.5dBm, all modes. -30°CTC 85°C, 3.0VVCC & VBAT 4.2V, referenced to 25°C, 3.4V conditions. Coupling Accuracy - VSWR ±0.7 dB POUT 26.5dBm, all modes, load VSWR=2:1, ±0.7dB accuracy corresponds to 12dB directivity. DS100603 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 8 RF7211 Pin 1 2 3 4 5 6 7 8 Function VBAT RF IN VMODE1 VMODE0 VEN CPL OUT GND CPL IN 9 10 RF OUT VCC Pkg Base GND Description Supply voltage for bias circuitry and the first stage amplifier. RF input internally matched to 50 and DC blocked. Digital control input for power mode selection (see Operating Modes truth table). Digital control input for power mode selection (see Operating Modes truth table). Digital control input for PA enable and disable (see Operating Modes truth table). Coupler output. This pin must be grounded. Coupler input used for cascading couplers in series. Terminate this pin with a 50 resistor if not connected to another coupler. RF output internally matched to 50 and DC blocked. Supply voltage for the second stage amplifier which can be connected to battery supply or output of DC-DC converter. Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical impedance to the ground plane. VEN VMODE0 VMODE1 VBAT VCC Low Low Low 3.0V to 4.2V 3.0V to 4.2V Power down mode Low X X 3.0V to 4.2V 3.0V to 4.2V Standby Mode High Low Low 3.0V to 4.2V 3.0V to 4.2V High Power Mode (HPM) High High Low 3.0V to 4.2V 3.0V to 4.2V Medium Power Mode (MPM) High High High 3.0V to 4.2V 3.0V to 4.2V Low Power Mode (LPM) High Low Low 3.0V to 4.2V 0.5V Optional lower VCC in Low Power Mode (LPM) Conditions/Comments Package Drawing 4 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS100603 RF7211 Preliminary Application Schematic VBAT VCC 1 C5 4.7uF C72 10nF J1 RF IN 2 9 3 VMODE1 C92 10nF 10 VMODE0 C102 10nF 4 VEN C112 10nF 5 C82 10nF J2 RF OUT C6 4.7uF C4 22uF 8 Bias Control & PA/VMODE Enable R23 50  7 6 J3 CPL OUT NOTES: 1 VCC and VBAT are connected together if DC-DC converter is not used. 2 Place these capacitors as close to PA as possible. 3 50  resistor will be removed if pin 8 is connected to another coupler. DS100603 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 8 RF7211 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern Figure 1. PCB Metal Land Pattern (Top View) 6 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS100603 RF7211 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. DS100603 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 8 RF7211 8 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. DS100603