RF7222

RF7222 3V W-CDMA BAND 2 LINEAR PA MODULE Package Style: Module, 10-Pin, 3mmx3mmx1.0mm Features          VBAT HSDPA and HSPA+ Compliant Low Voltage Positive Bias Supply (3.0V to 4.35V) +28.5dBm Linear Output Power (+27.0dBm HSDPA and HSPA+) High Efficiency Operation 39% at POUT =+28.5dBm 19% at POUT =+19.0dBm (Without DC/DC Converter) Low Quiescent Current in Low Power Mode: 17mA Internal Voltage Regulator Eliminates Need for External Reference Voltage (VREF) 3-Mode Power States with Digital Control Interface Integrated Power Coupler Integrated Blocking and Collector Decoupling Capacitors Applications   WCDMA/HSDPA/HSUPA Wireless Handsets and Data Cards Dual-Mode UMTS Wireless Handsets RF IN VMODE1 VMODE0 VEN 1 10 VCC 2 3 Bias Control & PA/VMODE Enable 4 5 9 RF OUT 8 CPL IN 7 GND 6 CPL OUT Functional Block Diagram Product Description The RF7222 is a high-power, high-efficiency, linear power amplifier designed for use as the final RF amplifier in 3V, 50 W-CDMA mobile cellular equipment and spread-spectrum systems. This PA is developed for UMTS Band 2 which operates in the 1850MHz to 1910MHz frequency band. The RF7222 has two digital control pins, providing the option of one of three power modes to optimize performance and current drain at lower power levels. The part also has an integrated directional coupler which eliminates the need for an external discrete coupler at the output. The RF7222 is fully HSDPA and HSPA+ compliant and is assembled in a 10pin, 3mmx3mm module. Ordering Information RF7222 RF7222PCBA-410 3V W-CDMA Band 2 Linear PA Module Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT  SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MEMS LDMOS RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Prelim DS110228 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 7 RF7222 Absolute Maximum Ratings Parameter Supply Voltage in Standby Mode Rating Unit 6.0 V Supply Voltage in Idle Mode 6.0 V Supply Voltage in Operating Mode, 50 Load 6.0 V Supply Voltage, VBAT 6.0 V Control Voltage, VMODE0, VMODE1 3.5 V Control Voltage, VEN 3.5 V RF - Input Power +6 dBm RF - Output Power +30 dBm Output Load VSWR (Ruggedness) 10:1 RoHS status based on EUDirective2002/95/EC (at time of this document revision). Operating Ambient Temperature -30 to +110 °C Storage Temperature -55 to +150 °C Parameter Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. Min. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Specification Typ. Max. Unit Condition Recommended Operating Conditions Operating Frequency Range 1850 1910 MHz VBAT +3.0 +3.4 +4.35 V 1 +3.4 +4.35 V VCC +3.0 VEN 0 1.4 VMODE0, VMODE1 1.8 0 1.5 1.8 0.5 V PA disabled. 3.0 V PA enabled. 0.5 V Logic “low”. 3.0 V Logic “high”. POUT Maximum Linear Output (HPM) 28.52,3 dBm High Power Mode (HPM) Maximum Linear Output (MPM) 19.02,3 dBm Medium Power Mode (MPM) Maximum Linear Output (LPM) 8.02,3 dBm Low Power Mode (LPM) Ambient Temperature -30 +25 +85 °C Notes: 1. Minimum VCC for max POUT is indicated. 2. For operation at VCC =+3.2V, derate POUT by 0.6dB. For operation at VCC =3.0V, derate POUT by 1.3dB. 3. POUT is specified for 3GPP (Voice) modulation. For HSDPA and HSPA+ operation, derate POUT by 1.5dB: HSDPA Configuration: c12, d15, hs24 HSPA+ Configuration: Rel7 Subtest 1 2 of 7 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Prelim DS110228 RF7222 Parameter Min. Specification Typ. Max. Unit Condition T=+25C, VCC =VBAT =+3.4V, VEN =+1.8V, 50 system, WCDMA Rel 99 Modulation unless otherwise specified. Electrical Specifications Gain 25.0 26.5 dB HPM, POUT =28.5dBm 15 17.5 dB MPM, POUT 19.0dBm 10.5 Gain Linearity ACLR - 5MHz Offset ACLR - 10MHz Offset PAE Without DC/DC Converter 14.5 dB LPM, POUT 8.0dBm ±0.2 dB HPM, 19.0dBmPOUT 28.5dBm HPM, POUT =28.5dBm -39 -36 dBc -42 -36 dBc MPM, POUT =19.0dBm -42 -36 dBc LPM, POUT =8.0dBm -52 -47 dBc HPM, POUT =28.5dBm -58 -47 dBc MPM, POUT =19.0dBm -60 -47 dBc HPM, POUT =28.5dBm 19 % MPM, POUT =19.0dBm 80 mA MPM, POUT =16.0dBm 38 mA LPM, POUT =8.0dBm mA LPM, POUT =0.0dBm 39 16 Current Drain 20 Quiescent Current LPM, POUT =8.0dBm % 35 85 125 mA HPM, DC only 20 28 mA MPM, DC only LPM, DC only 17 24 mA Enable Current 0.3 1.0 mA Source or sink current. VEN =1.8V. Mode Current (IMODE0, IMODE1) 0.3 1.0 mA Source or sink current. VMODE0, VMODE1 =1.8V. Leakage Current 5.0 15.0 A Noise Power in Receive Band -137 -134 dBm/Hz Input Impedance 1.7:1 DC only. VCC =VBAT =4.35V, VEN =VMODE0 =VMODE1 =0.5V. All power modes, measured at duplex offset frequency (FTX+80MHz). Rx: 1930MHz to 1990MHz, POUT 28.5dBm VSWR No ext. matching, POUT 28.5dBm, all modes. Harmonic, 2FO -27 -15 dBm POUT 28.5dBm, all power modes. Harmonic, 3FO -35 -20 dBm POUT 28.5dBm, all power modes. -70 dBc All spurious, POUT 28.5dBm, all conditions, load VSWR6:1, all phase angles. +30 ° Phase shift at 19dBm when switching from HPM to MPM and MPM to LPM at 8dBm. DC Enable Time 10 S DC only. Time from VEN =high to stable idle current (90% of steady state value). RF Rise/Fall Time 6 S POUT 28.5dBm, all modes. 90% of target, DC settled prior to RF. Spurious Output Level Insertion Phase Shift -30 Coupling Factor 19.5 dB POUT 28.5dBm, all modes. Coupling Accuracy - Temp/Voltage ±0.5 dB POUT 28.5dBm, all modes. -30°CT85°C, 3.0VVCC & VBAT 4.35V, referenced to 25°C, 3.4V conditions. Coupling Accuracy - VSWR ±0.7 dB POUT 28.5dBm, all modes, load VSWR=2:1, ±0.7dB accuracy corresponds to 12dB directivity. Coupler termination resistance=33. Prelim DS110228 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 7 RF7222 Pin 1 2 Function VBAT RF IN 3 4 5 6 7 8 VMODE1 VMODE0 VEN CPL_OUT GND CPL_IN 9 10 Pkg Base RF OUT VCC GND Description Supply voltage for bias circuitry and the first stage amplifier. RF input internally matched to 50 and DC blocked. Input matching includes a shunt inductor to ground which would short DC voltage placed on this pin. Digital control input for power mode selection (see Operating Modes truth table). Digital control input for power mode selection (see Operating Modes truth table). Digital control input for PA enable and disable (see Operating Modes truth table). Coupler output. This pin must be grounded. Coupler input used for cascading couplers in series. Terminate this pin with a 50 resistor if not connected to another coupler. RF output internally matched to 50and DC blocked. Supply voltage for first and second stage amplifier. Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical impedance to the ground plane. VEN VMODE0 VMODE1 VBAT VCC Low Low Low 3.0V to 4.35V 3.0V to 4.35V Conditions/Comments Low X X 3.0V to 4.35V 3.0V to 4.35V Standby Mode High Low Low 3.0V to 4.35V 3.0V to 4.35V High power mode High High Low 3.0V to 4.35V 3.0V to 4.35V Medium power mode High High High 3.0V to 4.35V 3.0V to 4.35V Low power mode Power down mode Package Drawing 4 of 7 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Prelim DS110228 RF7222 Preliminary Application Schematic VBAT VCC 1 C5 4.7uF C72 10nF J1 RF IN 2 9 VMODE0 C102 10nF 4 VEN C112 10nF 5 C82 10nF J2 RF OUT C6 4.7uF C4 22uF 8 3 VMODE1 C92 10nF 10 Bias Control & PA/VMODE Enable R23 50  7 6 J3 CPL OUT Notes: 1. Place these capacitors as close to PA as possible. 2. 50  resistor will be removed if pin 8 is connected to another coupler. Coupler Directivity can be improved with R2 = 33 Prelim DS110228 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 7 RF7222 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern (Top View) Note: Shaded area represents Pin 6 of 7 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Prelim DS110228 RF7222 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. PCB Solder Mask Pattern (Top View) Note: Shaded area represents Pin 1 location. Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. Prelim DS110228 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 7