TQP4M0013

TQP4M0013 High Isolation Absorptive SPST Switch Applications        WLAN Cellular Infrastructure Test and Measurement Smart Energy UHF/VHF LMR General Purpose Broadband Wireless 8-pin 2x2 mm DFN Package Product Features        Functional Block Diagram General Purpose Low Insertion Loss +49 dBm Input IP3 High Isolation Absorptive Single Positive Voltage Control Small 2x2 mm SMT Package Pin 1 Reference Mark NC 1 GND 2 8 RF2 7 VCTRL Controller GND 3 6 VDD NC 4 5 RF1 Backside Paddle - RF/DC GND General Description Pin Configuration The TQP4M0013 is a GaAs FET single-pole, single throw (SPST) high isolation absorptive switch. The TQP4M0013 may be operated using a DC supply range from 3 to 5 Volts and with control signals operating from 3 to 5 Volts. The TQP4M0013 has 100-4000 MHz broadband performance. The TQP4M0013 is packaged in a RoHS-compliant, compact 2x2 mm surface-mount leadless package. Pin No. Label 1, 4 2, 3 5 6 7 8 NC GND RF1 VDD VCTRL RF2 This SPST switch is targeted for use in wireless infrastructure, test and measurement, or can be used for any general purpose RF application. Ordering Information Part No. Description TQP4M0013 TQP4M0013-PCB SPST Absorptive Switch 0.1-4.0 GHz Evaluation Board Standard T/R size = 2500 pieces on a 7” reel Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc - 1 of 6 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP4M0013 High Isolation Absorptive SPST Switch Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Rating Storage Temperature RF Input Power, CW, 50Ω, T = 25°C Supply Voltage (VDD) Control Voltage (VCTRL) -65 to 165°C +33 dBm +6 V VDD+0.5 V Operation of this device outside the parameter ranges given above may cause permanent damage. Min VDD Operating Temp. Range Typ 3.0 -40 Max Units 5.0 +105 V °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VDD = +5 V, VCTRL = 0 V (low) or 3.3 V (high), Temp.=+25°C, 50 Ω system Parameter Conditions Min Control Voltage (VCTRL) Low High 100 0 1.8 Insertion Loss 1 GHz 2 GHz 3 GHz Operational Frequency Range 0.55 0.71 0.77 1 GHz 2 GHz 3 GHz 1 GHz 2 GHz 3 GHz 1 GHz 2 GHz 3 GHz f=1 GHz f=1 GHz Pin=+15 dBm/tone, Δf= 1 MHz Isolation RF1/RF2 Return Loss Insertion Loss State RF2 Return Loss Isolation Loss State Input P1dB Input IP3 tON,tOFF (50% CTL to 10/90% RF) Switching Speed tON,tOFF (50% CTL to 2/98% RF) Total Supply current (IDD) Control Voltages Typ 38 Max Units 4000 0.2 VDD MHz V V 0.87 dB 50 43 37 15 15 17 16 15 17 +35 dBm +49 dBm 150 150 82 ns ns uA dB dB dB Switch Control Truth Table State Bias Condition VCTRL Signal Path State (RF1 to RF2) Low High ≤ 0.2 V ≥ 1.8 V Low High Off (isolation) On (Insertion Loss) Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc - 2 of 6 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP4M0013 High Isolation Absorptive SPST Switch TQP4M0013-PCB Evaluation Board VCTRL VDD J5 C3 C4 C1 C1 J1 C2 J4 C3 C4 5.6pF 5.6pF C2 J2 U1 RF 2 33pF 8 7 6 RF 1 33pF 5 J6 GND Controller U1 1 C5 2 3 4 Backside Paddle C6 Notes: 1. Capacitance values shown for C1, C2, C3 and C4 are required to achieve data sheet RF performance specifications. Typical Performance − TQP4M0013-PCB Test conditions unless otherwise noted: VDD = +5 V, Temp=25°C, 50 Ω system Parameter Units Typical Value Frequency Insertion Loss (1) RF1/RF2 Port Return Loss (Insertion Loss State) RF1 to RF2 Isolation Input P1dB Input IP3 (Pin=+15 dBm/tone, Δf=1 MHz) 1 0.55 15 50 +35 +49 2 0.71 15 43 3 0.77 17 37 GHz dB dB dB dBm dBm +50 Notes: 1. Insertion loss values reflect de-embedding of eval board RF line losses. Performance Plots − TQP4M0013-PCB Test conditions unless otherwise noted: VDD =+5 V, VCTRL = +3.3 V, Temp=+25°C, 50 Ω system Insertion Loss vs. Frequency 0 On State RF1 to RF2 Isolation vs. Frequency 0 Off State Temp.=+25°C RF2 Return Loss vs. Frequency 0 Temp.=+25°C Temp.=+25° -10 -0.5 -5 -1.5 |S22| (dB) Isolation (dB) |S21| (dB) -20 -1 -30 -40 On (Insertion Loss) State -10 Off (Isolation) State -15 -50 -2 -20 -60 -2.5 -70 0 500 1000 1500 2000 Frequency (MHz) Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc 2500 3000 -25 0 500 1000 1500 2000 Frequency (MHz) - 3 of 6 - 2500 3000 0 500 1000 1500 2000 2500 3000 Frequency (MHz) Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP4M0013 High Isolation Absorptive SPST Switch Pin Configuration and Description Pin 1 Reference Mark NC 1 GND 2 8 RF2 7 VCTRL Controller GND 3 6 VDD NC 4 5 RF1 Backside Paddle - RF/DC GND Pin No. Symbol 1, 4 2, 3 5 6 7 8 Backside Paddle Description N/C GND RF1 VDD VCTL RF2 No electrical connection. Provide grounded land pads for PCB mounting integrity. RF/DC Ground RF Port 1. DC block required. Bias Voltage Control Voltage RF Port 2. DC block required. Internal resistive termination in off (isolation) state. RF/DC GND RF/DC Ground. Use recommended via pattern and ensure good solder attach for best thermal and electrical performance. Evaluation Board PCB Specifications PCB 1094173 Material and Stack-Up 0.014" 0.062" ± 0.006" Finished Board Thickness Nelco N-4000-13 εr=3.7 typ. 1 oz. Cu top layer 1 oz. Cu inner layer Core 1 oz. Cu inner layer 0.014" Nelco N-4000-13 1 oz. Cu bottom layer 50 ohm input/output (I/O) line structure Width = 0.028” Gap = 0.028” Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc - 4 of 6 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP4M0013 High Isolation Absorptive SPST Switch Mechanical Information Package Marking and Dimensions Marking: Product Code – 013 Assembly code - XXX 2.00±0.05 Terminal 1 Identifier 0.80±0.05 Exp. DAP Terminal 1 Identifier 0.200x45° 0.85±0.05 013 XXX 2.00±0.05 1.60±0.05 Exp. DAP 0.50 BSC 0.30±0.050 TOP VIEW 0.25±0.05 0.203 Ref 0.00-0.05 BOTTOM VIEW SIDE VIEW Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012 PCB Mounting Pattern 0.64 PACKAGE OUTLINE 0.50 PITCH, TYP 8X 0.30 8X 0.67 0.35 0.70 2X 0.20 3 3X Ø.254 (.010) PLATED THRU VIA HOLES 1.60 Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc - 5 of 6 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com TQP4M0013 High Isolation Absorptive SPST Switch Product Compliance Information ESD Sensitivity Ratings Solderability Caution! ESD-Sensitive Device Compatible with both lead-free (260°C max. reflow temperature) and tin/lead (245°C max. reflow temperature) soldering processes. Package contact plating: NiPdAu ESD Rating: Value: Test: Standard: Class 0B Passes >125 V and < 250 V Human Body Model (HBM) JEDEC Standard JS-001-2012 ESD Rating: Value: Test: Standard: Class C3 Passes >1000 volts Charged Device Model (CDM) JEDEC Standard JESD22-C101 RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). MSL Rating MSL Rating: Level 1 Test: 260°C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 This product also has the following attributes:  Lead Free  Halogen Free (Chlorine, Bromine)  Antimony Free  TBBP-A (C15H12Br402) Free  PFOS Free  SVHC Free Important Notice For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@triquint.com Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: sjcapplications.engineering@triquint.com Contact Information The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev. F 10-13-15 © 2015 TriQuint Semiconductor, Inc - 6 of 6 - Disclaimer: Subject to change without notice www.triquint.com / www.qorvo.com