RT1650WSC

RT1650 Wireless Power Receiver Compliant with WPC General Description The RT1650 is a wireless power receiver compliant with WPC V1.1 standard. The RT1650 integrates a synchronous full-bridge rectifier, a low dropout regulator, and a Micro Controller Unit (MCU) for control and communication. The device receives AC power from a WPC compatible wireless transmitter and provides output power up to 7.5W, which could be used  High Accurate Received Power Calculation for FOD Function  10-bit ADC for Voltage/Current Measurement  Coil Power Loss Modeling for Optimized Compensation Adaptive Power Offset Compensation Low Quiescent Embedded 32-bit ARM Cortex-M0   as a power supply for a charger of mobile or consumer devices. MCU  32KB ROM/OTP, 1KB SRAM and 272B MTP The MCU-based controller can support bi-direction channel communication including Frequency Shift Keying (FSK) demodulation for power signal from the transmitter and Amplitude Shift Keying (ASK) modulation for power signal to the transmitter. The RT1650 provides Foreign Object Detection (FOD)  function to meet the requirement after WPC V1.1. It communicates with the transmitter for the received power to determine if a foreign object is present within the magnetic interface. This provides a higher level of safety. The RT1650 provides a programmable dynamic rectifier voltage control function to improve power efficiency, a programmable power management control for maximum power delivery, a programmable current limit for suitable load setting, a programmable temperature setting with external NTC for thermoregulation, and proper protection functions such as UVLO, OVP, and OTP.  Single-Chip WPC V1.1 Compliant Receiver  Integrated Synchronous Rectifier Switch  Support Output Power up to 7.5W  High Rectifier Efficiency up to 96%  High System Efficiency up to 80%  Programmable Loading for Synchronous Rectifier Operation Programmable Dynamic Rectifier Voltage Control for Optimized Transient Response and Power Efficiency Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00           July 2015 Power Transmitter Programmable Temperature Control Programmable Charge Status Packet Support Alignment with Transmitter Support Enable, Charge Complete and Fault Control Inputs Receiver Controlled EPT Packet Over Current Limit Over Voltage Protection Thermal Shutdown CSP 3.0mm x 3.4mm 48B (Pitch = 0.4mm) Low Profile (0.5mm Max.) Applications  Features   Easy Tuning for Communication and Control Parameters Support Bi-direction Channel Communication  FSK Demodulation for Power Signal from Wireless Power Transmitter  ASK Modulation for Power Signal to Wireless     WPC Compliant Receivers Cell Phones & Smart Phones Digital Cameras Power Banks Wireless Power Embedded Batteries  Headsets Portable Media Players  Hand-held Devices  is a registered trademark of Richtek Technology Corporation. www.richtek.com 1 RT1650 Ordering Information Pin Configurations (TOP VIEW) RT1650 Package Type WSC : WL-CSP-48B 3x3.4 (BSC) A1 A2 BOOT2 PGND Note : Richtek products are :  RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.  Suitable for use in SnPb or Pb-free soldering processes. RT1650 WSC YMDNN RT1650WSC : Product Number YMDNN : Date Code Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 2 A4 A5 A6 PGND PGND BOOT1 B1 B2 B3 B4 B5 B6 AC2 AC2 AC2 AC1 AC1 AC1 C1 C2 C3 C4 C5 C6 RECT RECT RECT RECT RECT COM1 D1 D2 D3 D4 D5 D6 OUT OUT OUT OUT OUT CLMP1 E1 E2 E3 E4 E5 E6 GND NC NC VDD1 VDD2 COM2 F1 F2 F3 F4 F5 F6 SCL SDA GPIO VDD1 VDD2 CLMP2 G2 G3 G1 Marking Information A3 PGND TS MODE0 MODE1 G4 G5 G6 NC NC PGND H1 H2 H3 H4 H5 H6 CHG ADEN ADD GND GND PGND WL-CSP-48B 3x3.4 (BSC) is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Typical Application Circuit Q1 PMDPB80XP USB or AC Adapter Input RT1650 ADEN OUT ADD C5 1μF/10V x 1 0.1μF/10V x 1 CCLAMP1 0.47μF/50V CCOMM1 22nF/50V CBOOT1 10nF/50V C 47nF/50V x 4 S COUT 1μF/10V x 1 0.1μF/10V x 1 CLMP1 R4 1.5k COM1 CHG RECT BOOT1 CRECT 10μF/16V x 2 AC1 CD 1.8μF/50V WPC Standard 12μH Coil D1 System Load SCL CBOOT2 10nF/50V CCOMM2 22nF/50V CCLAMP2 0.47μF/50V CVDD1 1μF/10V AC2 SDA GPIO BOOT2 MODE0 COM2 MODE1 CLMP2 VDD1 TS R1 33k VDD2 CVDD2 1μF/10V GND PGND NTC NCP15WF104F03RC 100k ohm Note : The component value and the maximum voltage rating is based on the WPC standard transmitter and 5V adapter application. The customer should modify it depend on the different design and application. Functional Pin Description Pin No. Pin Name I/O Pin Function Bootstrap Supply for Driving the High-side FETs of Synchronous Rectifier. Connect a 10nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2. A1 BOOT2 O A6 BOOT1 O A2 to A5 G6, H6 PGND B1 to B3 AC2 I B4 to B6 AC1 I C1 to C5 RECT O C6 COM1 O E6 COM2 O Open-Drain Output for Communication with Transmitter. Connect through a capacitor to AC1/AC2 for capacitive load modulation. D1 to D5 OUT O Power Output of Regulator. Power Ground. AC Power Input from Receiver Coil. Output of Synchronous Rectifier. Connect a ceramic capacitor (10F to 22F) between this pin to PGND. Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 3 RT1650 Pin No. Pin Name I/O Pin Function D6 CLMP1 O F6 CLMP2 O Open Drain Output for Over-voltage Clamp Protection. Connect a 0.47F ceramic capacitor between this pin to AC1/AC2. When the RECT voltage exceeds 11.5V, both switches will be turned on and the capacitors will act as a low impedance to protect the IC from damage. E1, H4, H5 E2, E3 G4, G5 GND Analog Ground. NC No Connection. Keep this pin as floating. power input or ground. Do not connect this pin to E4, F4 VDD1 O Voltage Supply for Internal Circuit. Connect a 1F ceramic capacitor between this pin and GND. E5, F5 VDD2 O Voltage Supply for Internal Circuit. Connect a 1F ceramic capacitor between this pin and GND. F1 SCL I I2C Compatible Series-Clock Input for internal register/MTP access. F2 SDA I/O I2C Compatible Series-Data Input/Output for internal register/MTP access. F3 GPIO I/O General Purpose Input/Output. H1 CHG O Open-Drain Indicator Output. When the output regulator is enabled, this pin is pulled to low. H2 ADEN O Enable Control Output for External P-FET connecting ADD and OUT. This pin is pulled to the higher of OUT and ADD when turning off the external FET. This voltage tracks approximately 4V below ADD when voltage is present at ADD. H3 ADD I Adapter Power Detection Input. Connect this pin to the adapter input. When a voltage is applied to this pin, wireless power is disabled and ADEN is pulled low. If not used, this pin should be connected to ground. Temperature Sense Input. Connect a NTC between this pin and GND for temperature sensing. If the temperature sensing function is not desired, connect a 24k resistor to GND. Host side can control this pin to send end power transfer (EPT) to the transmitter: pull-low for EPT fault; pull-up for EPT termination. G1 TS I G2 MODE0 I G3 MODE1 I Operation Mode Control Input. These two pins are used to set power source operation mode. [MODE0, MODE1] = [0, 0]. Auto mode. Adapter power prior. [MODE0, MODE1] = [0, 1]. Wireless power mode. [MODE0, MODE1] = [1, 0]. Adapter power mode and OTG mode [MODE0, MODE1] = [1, 1]. Disable both adapter and wireless powers. Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 4 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Function Block Diagram CLMP1 CLMP2 VDD1 VDD2 RECT ADD OTP OVP AC1 AC2 Regulator Adapter Detection ADEN UVLO Synchronous Rectifier Control OUT PGND - Clock Generator 9MHz BOOT1 BOOT2 + COM1 VOUT FSK DeCoder COM2 Packet Control ROM / OTP 32KB ROM 4KB (boot loader) MTP 272B CHG ADC 10-bit 40kHz VRECT Register Bank I2C Slave VREF GND IOUT TS VTS SCL SDA MCU 32-bit SRAM 1KB Mode Control MODE0 MODE1 GPIO GPIO Digital Control Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 5 RT1650 Operation MCU Based Digital Circuit Mode Control RT1650 is a SoC (System on Chip) produce, which contains system level feature to control the communication with power transmitter, power calculation and GPIO. The firmware can be programmed into OTP (One Time Programmable) memory, so that user can discuss the features with RICHTEK, and custom some functions and GPIO behavior. To flexibly control whole functions, this chip embedded a MTP (Multiple Time Programmable) memory to save various setting and parameters. The Mode control is using for the default mode, wireless mode, adapter mode and disable mode selection. external host can real-time information via I2C interface. AC2. This information can use for the FSK (Frequency Shift Key) decode to the WPC medium power standard. read some power Adapter Detection In the default mode and adapter mode, adapter detection block control the ADEN pin to follow the VADD-5V to avoid the PMOS damaged. FSK Decoder This block analysis the frequency from the AC1 and OVP (Over Voltage Protection) This information also can use for the power loss calculation of the resonant tank. The OVP function using to protect the abnormal power signal to let the RT1650 damaged. Once the VRECT exceeds 11.5V, this block will drive the CLAMP MOS to Packet Control avoid the over voltage damage. OTP (Over Temperature Protection) The OTP function shuts down the linear regulator operation when the junction temperature exceeds 150C. Once the junction temperature cools down by around 20C, the receiver will automatically resume operating. This block build up the WPC standard 2kHz bi-phase encoding scheme with the asynchronous serial format and the packet structure. This block control the open-drain MOS to achieve the ASK (Amplitude Shift Key) communication. Synchronous Rectifier Control This block detect the zero-cross of the AC1 and AC2 voltage then control the high-side and low-side MOS of the rectifier. RT1650 provide the Asynchronous, Half-synchronous and Full-synchronous control to optimize the rectifier efficiency. Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 6 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Absolute Maximum Ratings (Note 1)  Supply Input Voltage, AC1, AC2, RECT, COM1, COM2, OUT, CHG, CLMP1, CLMP2 ------------- 0.3V to 20V  Supply Input Voltage, ADD, ADEN-------------------------------------------------------------------------------- 0.3V to 30V  Supply Input Voltage, BOOT1, BOOT2 -------------------------------------------------------------------------- 0.3V to 26V  Supply Input Voltage, VDD1, VDD2, SDA, SCL, GPIO, TS ------------------------------------------------ 0.3V to 6V  Input Current, AC1, AC2--------------------------------------------------------------------------------------------- 2A(rms)  Output Current, OUT ------------------------------------------------------------------------------------------------- 2A  Output Sink Current, CHG ------------------------------------------------------------------------------------------ 15mA  Output Sink Current, COM1, COM2 ------------------------------------------------------------------------------ 1A  Power Dissipation, PD @ TA = 25C  WL-CSP-48B 3x3.4 --------------------------------------------------------------------------------------------------- 3.67W  Package Thermal Resistance  WL-CSP-48B 3x3.4, JA --------------------------------------------------------------------------------------------- 27.2C/W  Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260C  Junction Temperature ------------------------------------------------------------------------------------------------ 150C  Storage Temperature Range --------------------------------------------------------------------------------------- 65C to 150C  ESD Susceptibility  HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV  MM (Machine Model) ------------------------------------------------------------------------------------------------- 200V (Note 2) (Note 3) Recommended Operating Conditions (Note 4)  Supply Input Voltage Range, RECT ------------------------------------------------------------------------------ 5V to 10V  Input Current, RECT -------------------------------------------------------------------------------------------------- 1.5A  Output Current, OUT ------------------------------------------------------------------------------------------------- 1.5A  Sink Current, ADEN -------------------------------------------------------------------------------------------------- 1mA  Sink Current, COM ---------------------------------------------------------------------------------------------------- 500mA  Ambient Temperature Range--------------------------------------------------------------------------------------- 40C to 85C  Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C Electrical Characteristics (TA = 25C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit VRECT Rising : 0V  3V 2.6 2.7 2.8 V RECT UVLO Hysteresis VRECT Falling : 3V  0V -- 250 -- mV RECT Over-Voltage Threshold VRECT Rising : 7V  13V 11 11.5 12 V VRECT Falling : 13V  7V -- 150 -- mV Input RECT Under-voltage Lockout Threshold RECT Over-Voltage Hysteresis VRECT_UVLO VRECT_OVP Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 7 RT1650 Parameter Symbol Test Conditions Min Typ Max Unit Dynamic VRECT Setting-1 VRECT_SET1 (Note 5) -- 7 -- Dynamic VRECT Setting-2 VRECT_SET2 (Note 5) -- 6.3 -- Dynamic VRECT Setting-3 VRECT_SET3 (Note 5) -- 5.8 -- Dynamic VRECT Setting-4 VRECT_SET4 (Note 5) -- 5.3 -- V IOUT Hysteresis for Dynamic VRECT Settings IOUT_TH_HYS (Note 5) -- 5 -- % RECT Quiescent Current IQ -- 8 -- mA IOUT = 1mA 4.95 5 5.05 IOUT = 1A 4.94 4.99 5.04 IOUT = 1.5A 4.90 4.96 5.02 -- 100 200 mV 10 - 10 % A V Regulator Output OUT Regulation Voltage Regulator Drop-out Voltage VOUT_REG VDROP VRECT –VOUT, IOUT = 1A Output Current Limit Tolerance IOUT_LIMIT IOUT =1.5A OUT Leakage Current Disabled, VOUT = 5V -- 40 -- Programmable IOUT Threshold Range to Enable Half-Synchronous Rectifier IOUT Rising (Note 5) 50 -- 500 Programmable IOUT Threshold ISR_TH Range to Enable Full-Synchronous Rectifier IOUT Rising (Note 5) 150 -- 750 Programmable IOUT Hysteresis Range IOUT Falling (Note 5) 25 -- 100 IOUT_LKG V Synchronous Rectifier Rectifier Diode Voltage in Asynchronous Mode mA VDIODE IAC-VRECT = 250mA -- 0.65 -- V TS Thermoregulation Threshold VTS_REG VTS Falling (Note 5) -- 786 -- mV Too-Hot Protection Threshold VTS_HOT VTS Falling (Note 5) -- 278 -- mV VTS Rising (Note 5) -- 1.82 -- V -- 60 -- A (Note 5) -- 150 -- (Note 5) -- 20 -- TS Sense/Control Input Too-Cold Protection Threshold VTS_COLD TS Output Current ITS Over-Temperature Protection Over-Temperature Protection Threshold Over-Temperature Protection Hysteresis TJ °C CHG Indicator Output CHG Low-Level Output Voltage VCHG_L ISINK = 5mA -- -- 100 mV CHG Leakage Current when disabled ICHG_LKG VCHG = 20V -- -- 1 A Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 8 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Parameter Symbol Test Conditions Min Typ Max Unit -- 0.7 --  -- 2 -- kHz -- -- 1 A -- 0.5 --  VADD Rising : 0V  5V 3 3.6 4 V VADD Falling : 5V  0V -- 400 -- mV VADD = 5V , VRECT = 0V -- -- 60 A Pull-up Resistance from ADEN to OUT pin when Adapter RADD mode is disabled VADD = 0V, VOUT = 5V -- 275 350  ADD to ADEN Voltage when Adapter Mode is Enabled VADD = 5V, VADD – VADEN 3 4.25 5 V COM Outputs COM1, COM2 N-FET On-Resistance RON_COM COM1, COM2 Signaling Frequency f COM COM1, COM2 Leakage Current ICOM_LKG VRECT = 2.6V VCOM1 = VCOM2 = 20V CLAMP Outputs CLMP1, CLMP2 N-FET On-Resistance RON_CLM Adapter Power Enable Control ADD Detection Voltage Threshold VADD ADD Detection Voltage Hysteresis ADD Input Leakage Current IADD_LKG VAD_EN GPIO Input/Output GPIO Input Voltage (Logic-Low) VIL 0 -- 0.8 V GPIO Input Voltage (Logic-High) VIH 2 -- 5 V GPIO Output Voltage (Logic-Low) VOL -- -- 0.4 V GPIO Output Voltage (Logic-High) VOH 2.6 3.3 3.6 V -- -- 0.25 W Received Power (WPC Related Measurements) Received Power Accuracy I2C Compatible Interface PRX_AC IOUT = 0A to 1A (Note 5) (Note 5) Logic Input (SDA, SCL) Low Level VSCL_L -- -- 0.6 V Logic Input (SDA, SCL) High Level VSCL_H 1.2 -- -- V SCL Clock Frequency f CLK 10 -- 400 kHz Output Fall Time tFL2COUT -- -- 250 ns Bus Free Time Between Stop/Start tBUF 1.3 -- -- s Hold Time Start Condition tHD_STA 0.6 -- -- s Setup Time for Start Condition tSU_STA 0.6 -- -- s Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 9 RT1650 Parameter Symbol Test Conditions Min Typ Max Unit SCL Low Time tLOW 1.3 -- -- s SCL High Time tHIGH 0.6 -- -- s Data Setup Time tSU_DAT 100 -- -- ns Data Hold Time tHD_DAT 0 -- 900 ns Setup Time for Stop Condition tSU_STO 0.6 -- -- s Logic Input (MODE0, MODE1) VMODE_L Low Level -- -- 0.6 V Logic Input (MODE0, MODE1) VMODE_H High Level 1.2 -- -- V 3 5 7 kHz Mode Control Communication Interface FSK Modulation Frequency Change f FSK fOP = 175kHz (Note 5) Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is measured at the exposed pad of the package. Note 3. Devices are ESD sensitive. Handling precaution recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. Specification is guaranteed by design and/or correlation with statistical process control. Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 10 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Typical Operating Characteristics Rectifier Efficiency 100 80 95 70 90 Efficiency (%) Efficiency (%) System Efficiency 90 60 50 40 30 85 80 75 70 20 65 10 WPC A10 Tx WPC A10 Tx 60 0 0 1 2 3 4 5 6 7 0 8 1 2 Output Power (W) Receiver Efficiency 4 5 6 7 8 Rectifier Voltage 100 7.5 95 7.0 6.5 90 85 VRECT (V) Efficiency (%) 3 Output Power (W) 80 75 70 6.0 5.5 Rising Falling 5.0 4.5 4.0 65 3.5 WPC A10 Tx 3.0 60 0 1 2 3 4 5 6 7 0.00 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20 1.35 1.50 8 Output Power (W) Output Current (A) Output Voltage vs. Output Current Start-Up without Loading 5.010 Output Voltage (V) 5.008 5.006 5.004 5.002 VRECT (2V/Div) 5.000 VOUT (2V/Div) 4.998 4.996 IOUT (500mA/Div) 4.994 0.00 0.15 0.30 0.45 0.60 0.75 0.90 1.05 1.20 1.35 1.50 IOUT = 0A, WPC A10 Tx Time Time (500ms/Div) ( xx μs/Div) Output Current (A) Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 11 RT1650 Load Transient Response Start-Up with Loading VRECT (2V/Div) VOUT (2V/Div) VRECT (2V/Div) VOUT (2V/Div) IOUT (500mA/Div) IOUT (500mA/Div) IOUT = 0A to 1A, WPC A10 Tx IOUT = 1A, WPC A10 Tx Time (500ms/Div) Time (500ms/Div) Load Transient Response Synchronous Rectifier IOUT = 1A VRECT (2V/Div) VOUT (2V/Div) IAC1 IOUT (500mA/Div) (1A/Div) IOUT = 1A to 0A, WPC A10 Tx VAC1VAC2 (2V/Div) Time (500ms/Div) Time (5s/Div) Dynamic Rectifier Voltage Communication VRECT (2V/Div) VRECT (2V/Div) VOUT (2V/Div) IOUT (500mA/Div) COMM1 (2V/Div) IOUT = 150mA to 450mA Time (500ms/Div) Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 12 Time (3.29ms/Div) is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Default Mode Battery Full Detection VADD = 10V, MODE0 = 0, MODE1 = 0 COMM1 (5V/Div) VRECT (5V/Div VRECT (2V/Div) VOUT (5V/Div) VOUT (2V/Div) IOUT (100mA/Div) IBat_full = 50mA VADD (5V/Div) Time (100ms/Div) Time (200ms/Div) Adapter Mode VRECT (5V/Div) Wireless Mode VRECT (5V/Div) VOUT (5V/Div) VOUT (5V/Div) VADD (5V/Div) VADD = 10V, MODE0 = 1, MODE1 = 0 VADD (5V/Div) VADD = 10V, MODE0 = 0, MODE1 = 1 Time (200ms/Div) Time (200ms/Div) Disable Mode OTG Mode VRECT (5V/Div) VRECT (5V/Div VOUT (5V/Div) VOUT (5V/Div) VADD (5V/Div) VADD (5V/Div) VADD = 10V, MODE0 = 1, MODE1 = 1 Time (200ms/Div) Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 VADD = 10V, MODE0 = 1, MODE1 = 0 Time (500ms/Div) is a registered trademark of Richtek Technology Corporation. www.richtek.com 13 RT1650 Functional Description Description of the Wireless Power System The power transferred to power receiver is controlled A wireless power system is composed by a power transmitter with one or more primary coils and a power receiver in a mobile system. Power transmitter will transfer power via a DC-to-AC inverter to drive a strong-coupled inductor to power receiver in a mobile by itself. The power receiver sends communication packets with control error voltage information to the power transmitter for power tracking. The bit rate of the communication link from receiver to transmitter is 2kbps. device. Mobile Device Load Sensing& Control Output Power Sensing Power Pick-up Communications Control Unit & Control Unit Power Conversion Unit Sensing Control Communications & Control Unit Input Power Sensing & Control System Unit Base Station Figure 1. Wireless Power System Start-up Power Transfer phases When the receiver is placed on the power pad, the receiver coil is inductively coupled to the magnetic flux generated by the coil in the power pad which consequently induces a voltage in the receiver coil. The internal synchronous rectifier feeds this voltage to the RECT pin which has the filter capacitor. The RT1650 communicates to the transmitter by switching on and off the COM FETs. There are 4 power transfer phases for the WPC V1.1. Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 14  Selection : As soon as the Power Transmitter applies a Power Signal, the Power Receiver shall enter the selection phase.  Ping : The power Receiver should send the Digital Ping Packet to power Transmitter then into next phase. If not, the system shall revert to the Selection phase. The power Receiver also can send the End Power transfer Packet to stop the power Transmitter. is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650  Identification & Configuration : In this phase, the Power Receiver identifies the revision of the System Description Wireless Power Transfer the Power  Receiver complies and configuration information such as the maximum power that the Power Receiver intends to provide at its output. The Power Transmitter uses this information to create a Power Transfer Contract. Power Transfer : In this phase, the Power Transmitter continues to provide power to the Power Receiver. The power Receiver sends the Control Error Packet for adjusting the Primary Cell current. The Power Transmitter stops to provide power when the Received Power Packet is too low to trigger the FOD function or End Power Transfer Packet is sent from power Receiver. apply Power Signal no response abort Digital Ping Ping power transfer complete extend Digital Ping no Power Transfer Contract unexpected Packet transmission error time-out Selection Identification & Configuration Power transfer Contract established Reconfigure Power Transfer Contract violation unexpected Packet time-out Power Transfer power transfer complete Figure 2. WPC V1.1 Low Power Transfer Phases Micro Controller Unit Memory Map The memory mapping of MCU can be divided into 3 blocks, Code, SRAM and Peripheral. Each region has its recommend usage, and the memory access behavior could depend on which memory region you table, which is a part of the program image. In OTP version of chip, the programmable user firmware will be stored in this area. SRAM The SRAM region starts from 0x2000_0000 and the total access size is 1KB. It’s primarily used to store are accessing to. data, including stack. Code Peripheral The size of the code region is 32KB. It is primarily used to store program code, including the exception vector There are 2 peripheral blocks in RT1650, MTP and peripheral registers. MTP (Multiple Time Programmable Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 15 RT1650 Memory) is primarily used to save non-volatile user setting data and part of MTP store internal factory setting. User firmware can control some of chip hardware behavior via peripheral registers. It also could be an interface to communicate with external I2C via the registers. 0x0000_0000 0x0000_7FFF ROM / OTP 32 KB Code < IOUT_TH1 VRECT_SET1 IOUT_TH1 to IOUT_TH2 VRECT_SET2 MTP 272B IOUT_TH2 to IOUT_TH3 VRECT_SET3 > IOUT_TH3 VRECT_SET4 SRAM 0x4000_01FF reserved 0x5000_1FFF Rectifier Voltage Target reserved 0x4000_0000 0x5000_0000 Rectifier Voltage Control function to optimize the transient response and power efficiency for applications. Table 1 and Figure 4 show an example to summarize how the rectifier behavior is dynamically adjusted based the registers VRECT_SETx[7:0] (x = 1 to 4), which are available to be programmed by users. Output Current, IOUT SRAM 1 KB 0x2000_03FF The RT1650 provides a programmable Dynamic Table 1. Dynamic Rectifier Voltage Setting reserved 0x2000_0000 Programmable Dynamic Rectifier Voltage Control Peripheral Peripheral Register Figure 3. Memory Map If Ext. Charger w/ DPM (ex. VDPM = 4.9V) Dynamic Operation Area VRECT_SET1 VRECT_SET2 VRECT Tracking Stop Above UVLO VRECT_SET3 VRECT_SET4 Overloading Operation Area UVLO OTP Triggered VOUT VRECT IOUT_TH1 IOUT_TH2 IOUT_TH3 IOUT_LIMIT I (A) Figure 4. Dynamic Rectifier Voltage vs. Output Current Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 16 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Thermal Management Temperature, Current The RT1650 provides an external device thermal management function with an external NTC thermistor and a resistor connected between TS pin and GND pin shown as Figure 5. User can use this function to control the temperature of the coil, battery or other device. An internal current source (60A) is provided to the external NTC thermistor and generates a voltage at the Regulation_temp Temperature Thermal regulation is active Current-limit Loading Output Current Time TS pin. The TS voltage is detected and sent to the ADC converter for external device thermal manage control. The NTC thermistor should be placed as close as possible to the device such as battery or mobile device. The recommended NTC thermistor is NCP15WF104F03RC RT1650 ITS TS ADC Figure 7. Thermoregulation Control R1 RNTC GND Figure 5. NTC Circuit for Device Temperature (tolerance ±1%, β = 4250k). The typical resistance of the NTC is 100k at 25C. The recommended resistance for R1 is 33k(±1%).The value of the NTC thermistor at the desired temperature can be estimated by the following equation. RNTC_Reg = RO Detection and Thermoregulation Req = The thermal management function is shown as Figure 6. If the temperature is higher than Hot_temp or lower than Cold_temp threshold, the RT1650 will send the EPT to disable the power transfer. When the detected temperature increases and reaches the desired Regulation_temp, RT1650 will decrease the current limit to reduce the output current to regulate the temperature. When the detected temperature is lower than the Regulation_temp, the current limit will increase to the default value. This function is shown as Figure 7. Temperature Send EPT   β 1 -1 TReg T0   e R1  RNTC_Reg R1+RNTC_Reg where TReg is the desired regulation temperature degree Kelvin. RO is the nominal resistance temperature T0 and β is the temperature coefficient the NTC thermistor. Req is the equivalent resistor NTC thermistor in parallel with R1. in at of of Figure 8 shows the equivalent resistance of the thermistor in parallel with R1 resistor varies with operating temperature. Figure 9 shows the VTS voltage with operating temperature. Customer can select the desire temperature and calculate the mapping data by the following equation. Hot_temp Periodically reduce current limit to regulate temperature. Thermal regulation is active. Regulation_temp Cold_temp Send EPT Data = (VTS/2 x 1024) If the thermal management function is not used (RNTC = open), the resistor R1 = 24k must be connected between the TS and GND pins Figure 6. Thermal Management Function Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 17 RT1650 effectively a capacitor connected between AC1 and AC2. The impedance seen by the coil will be reflected in the primary as a change in current. 35 Resistance (kΩ) 30 CS 25 AC1 Ccom 20 Coil 15 COM1 Cd COM2 10 Ccom 5 AC2 0 -50 -25 0 25 50 75 100 125 150 Figure 10. Capacitive Load Modulation Temperature (degree-C) The RT1650 supports FSK demodulation to receive the power signal from the transmitter shown as Figure 11. Figure 8. Equivalent Resistance for Temperature Sensing 2.0 1.8 1.6 VTS (V) 1.4 The change in frequency between high and low states is dependent on the operating frequency. The power transmitter should modulate the power signal at specific times during the Negotiation phase to avoid interrupting communication packets from the receiver. The FSK modulation scheme should be compliant with WPC Volume II V0.9. 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Figure 11. FSK Modulation Power Signal Figure 9. Thermal Sensing Voltage Communication The RT1650 supports two communication modulations, Amplitude Shift Keying (ASK), Frequency Shift Keying (FSK), to communicate with the power transmitter. For ASK modulation, the RT1650 provides two integrated communication N-FETs which are connected to the COM1 and COM2 pins. These N-FETs are used for modulating the secondary load current which allows the RT1650 to communicate Control Error and configuration information to the transmitter. Figure 10 shows the RT1650 operating with capacitive load modulation. When the N-FETs are turned-on, there is Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 18 Bit Encoding Scheme According to WPC protocol, the RT1650 uses a differential bi-phase encoding scheme to modulate data bits onto the Power Signal. The internal clock signal has a frequency 2kHz. The Receiver shall encode a ONE bit using two transitions in the Power Signal, such that the first transition coincides with the rising edge of the clock signal, and the second transition coincides with the falling edge of the clock signal. The Receiver shall encode a ZERO bit using a single transition in the Power Signal, which coincides with the rising edge of the clock signal. Figure 12 shows an example of the differential bi-phase encoding. is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Operation Mode Control The RT1650 provides 2 input pins for operating mode control. Table 4 shows an example of operating mode Figure 12. Example of the Differential Bi-phase Encoding End Power Transfer Packet (WPC Header 0x02) The End Power Transfer (EPT) packet is a special command for the RT1650 to request the transmitter to terminate power transfer. Table 2 specifies the reasons coulomb and their responding data field value. The condition column corresponds to the values sent by the RT1650 for a given reason. Table 2. End Power Transfer (EPT) packet Reason Value Condition Unknown 0x00 VADD > 3.6V Charge Complete 0x01 From I2C, MODE0 = High or VTS = High Internal Fault 0x02 TJ > 150°C Over Temperature 0x03 VTS < VTS_HOT, VTS > VTS_COLD or VTS = Low Over Voltage 0x04 Over Current Battery Failure Reconfigure No Response wireless power operation only In adapter mode, the wireless power is turned off always and ADEN is pulled low to turn on external switch for adapter power In this mode, it allows an external charger operating in USB OTG mode to connect the OUT pin to power the USB at ADD pin. If both MODE0 and MODE1 pins are pulled to high, the wireless power and adapter power are disabled. Table 4. Operation Mode Control Wireless Adapter Mode MODE0 MODE1 OTG Power Power Default 0 0 ON ON(*) OFF Wireless 0 1 ON OFF OFF Not Sent Adapter 1 0 OFF ON Allowed 0x05 Not Sent Disable 1 1 OFF OFF OFF 0x06 From I2C 0x07 Not Sent 0x08 VRECT target doesn’t converge Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 control for wireless power and external adapter power. In default mode, both MODE0 and MODE1 are low, the wireless power is enabled and the adapter power has a higher priority. The wireless power is the normally operation. Once the adapter power is detected, the wireless power will be turned off and the ADEN will be pulled low to turn on the external switch for connecting the adapter power to system load. When the MODE1 is pulled to high, the adapter power will be turned off by the external switch and enters wireless mode to allow July 2015 (*)Note: If both adapter power and wireless power are present, adapter power is given higher priority. is a registered trademark of Richtek Technology Corporation. www.richtek.com 19 RT1650 I2C Interface The RT1650 provides I2C interface to communicate with external host device. Besides OTP firmware programming and MTP setting programming can be approached through the I2C interface, the external host can also communicate with the RT1650 to achieve more flexible applications. For example, the host can read the ADC information via the I2C Interface. In not fixed, the registers definition can be costumed by firmware. If user need to read other information via I2C, please discuss with RICHTEK firmware engineer. I2C Slave 0100010X (in binary format) 0x44 / 0x45 (hex format, include R/W bit) 2 addition, the I C is used to read the internal status and the power source is from the VRECT. If the wireless function disable or in the adapter mode, the I2C can’t be accessed. Table 3 shows the register definition. It’s MSB 0 1 LSB 0 0 0 1 0 R/W Table 3. RT1650 Register Definition Address MSB LSB 0x64 7 0 Vrect Vrect (4V to 8V), unit = 15.68mV 0x66 7 0 Vout Vout (3V to 6V), unit = 11.76mV 0x67 7 0 Iout Iout (0A to 2A), unit = 7.84mA 0x78 7 0 last CE packet last CE packet 0x79 7 0 last RP packet last RP packet 0x7A 7 0 Received Power [7:0] (mW) low byte of Received Power (mW) 0x7B 6 0 Received Power [14:8] (mW) high byte of Received Power (mW) 0x7B 7 7 Received Power updating flag 0: Received Power is valid 1: Received Power is updating, not valid 0x10 7 7 Vout enable 0: Vout is disable 1: Vout is enable 0x02 7 0 freq_cnt[7:0] 0x03 5 0 freq_cnt[13:8] 0x7C 3 0 Name Description Frequency = 1000 / ((freq_cnt[13:0] * 0.11) /128) KHz WPC status 0:booting 1: ping phase 2: ID_CF phase 3: Negotiation phase 4: power transfer phase WPC phase status GPIO Interface The RT1650 provides a programmable General Purpose Input/Output (GPIO) pin. The GPIO can be used as an input or used as a status indicator for different application. Before use this GPIO, user should discuss its functions with RICHTEK and then RICHTEK code its function into firmware. GPIO can be programmed as an output port, be a status indicator. For example,   To indicate thermal regulation is active  To indicate battery is full or charging is complete GPIO can be programmed as input port, to connect external signal and inform MCU. For example,  Enable/Disable the output  Enable the End Power Packet To control LED flashing when Rx position search Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 20 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Option for GPIO   Internal pull-up option (pull-up to 3.3V)  Internal pull-low option GPIO can be push-pull or open-drain architecture when GPIO programmed as an output. Table 5. RT1650 GPIO Specification Symbol Description Min Vil input logic low voltage Vih input logic high voltage Vol output low voltage Voh output high voltage when push-pull architecture Voh output high voltage when open-drain architecture Typ Max 0.8V 2V 5V 0.4V Indicator Output An open-drain output pin, CHG, is provided to indicate the status of wireless power receiver. The CHG pin can be connected to a LED for charge status indicator. When the output of the RT1650 is enabled, the open-drain N-FET at CHG pin will be pulled to low 2.6V 3.3V Hi-Z (OTP) feature to prevent excessive power dissipation from overheating the device. The OTP function shuts down the linear regulator operation when the junction temperature exceeds 150°C. Once the junction temperature cools down by around 20°C, the receiver will automatically resume operating. level. Foreign Object Detection Input Over-Voltage Protection When the input voltage increases suddenly, the RT1650 adjusts voltage-control loop to maintain regulator output voltage and sends control error packets to the transmitter every 30ms until the input voltage comes back to the VRECT target level (refer to Dynamic Rectifier Voltage Control Section). Once the VRECT voltage exceeds its over-voltage threshold (11.5V typ.), the RT1650 turns on the N-FETs at CLMP1 and CLMP2 pins to shunt the input current through external capacitors. By the way the CLAMP function may affect the communication signal to let the Tx re-start up. Over-Temperature Protection The RT1650 provides an Over Temperature Protection CP PTX,AC PRX,AC CS AC1 The RT1650 is a WPC 1.1.1 compatible device. In order to enable a power transmitter to monitor the power loss across the interface as one of the possible methods to limit the temperature rise of foreign objects, the RT1650 reports its received power to the power transmitter. The received power equals the power that is available from the output of the power receiver plus any power that is lost in producing that output power (the power loss in the secondary coil and series resonant capacitor, the power loss in the shielding of the power receiver, the power loss in the rectifier). In WPC1.1.1 specification, Foreign Object Detection (FOD) is enforced. This means the RT1650 will send received power information with known accuracy to the transmitter. The received power is sensed as the Figure 13. RECT M VS LP POUT PRECT OUT VRECT LS CD Rectifier IOUT CRECT Regulator COUT AC2 Figure 13. Received Power Sensed Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 21 RT1650 Charge Current Battery Charge Complete Detection Charge Complete The RT1650 supports battery charge complete Delay Time detection function. A programmable charge complete current threshold and a programmable charge complete delay time are provided. This function can be used to send the Charge Status packet (0x05) to the transmitter for indicating a full charged status 100%. Note that this packet does not turn off the transmitter. The charge complete current from 0mA to 510mA and the The charge complete time is seconds to 3825 seconds and seconds. threshold is adjustable default value is 50mA. also adjustable from 0 the default value is 180 Charge Complete Current Threshold time Figure 14. Battery Charge Complete Detection There are 3 operation modes when the charge complete status is detected. The first mode is to send a CS packet (0x05) to transmitter only. The CS packet does not turn off the transmitter. In the second mode, the RT1650 will send a CS packet (0x05) and an EPT packet to transmitter. In the third mode, the RT1650 will send a CS packet (0x05) and stop communication with the transmitter. Charge Complete Detection CS Mode 1 Send CS Packet (0x05) 2 3 Send CS Packet (0x05) Send CS Packet (0x05) Send EPT Packet (0x02) Stop Communication Figure 15. Operation Modes of Charge Complete Detection Receiver Coil and Resonant Capacitors According to WPC specification, the dual resonant circuit of the power receiver comprises the receiver coil and capacitors C1 and C2. The receiver coil design is related to system design. Coil shape, material, inductance and shielding need to be considered. Shielding provides protection from interference between wireless power system and mobile electronic device. The recommended coil self-inductance is between 8H to 13H. The capacitance of the resonant capacitors can be calculated by the following equations. Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 22 C1= C2= 1 L'S   2 fS  2 1 LS   2 fd  2 1 C1 In these equations, fs is resonant frequency with typical value 100kHz; and fd is another resonant frequency with typical value 1000kHz. L’s is coil self-inductance when placed on the interface surface of a transmitter; and Ls is the self-inductance when placed away from the transmitter. is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Firmware Setting Please refer to another document for detailed description of firmware setting. 16 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation. Maximum Power Dissipation (W) 1 Thermal Considerations For continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula : PD(MAX) = (TJ(MAX)  TA) / JA 3.5 3.0 2.5 2.0 1.5 1.0 0.5 25 50 75 100 125 Ambient Temperature (°C) Figure 16. Derating Curve of Maximum Power Dissipation For recommended operating condition specifications, the maximum junction temperature is 125C. The WL-CSP-48B 3x3.4 package 4.0 0 TA is the ambient temperature, and JA is the junction to ambient thermal resistance. PD(MAX) = (125C  25C) / (27.2C/W) = 3.67W for Four-Layer PCB 4.5 0.0 where TJ(MAX) is the maximum junction temperature, junction to ambient thermal resistance, JA, is layout dependent. For WL-CSP-48B 3x3.4 package, the thermal resistance, JA, is 27.2C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at TA = 25C can be calculated by the following formula : 5.0 Layout Considerations Follow the PCB layout performance of the IC.    guidelines for optimal Keep the traces of main current paths as short and wide as possible. Place the capacitors as close as possible to the IC. Power ground should be as large as possible and connected to a power plane for thermal dissipation. The maximum power dissipation depends on the operating ambient temperature for fixed TJ(MAX) and thermal resistance, JA. The derating curve in Figure Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 23 RT1650 Power trace should be as short and wide as possible. RX2 RX1 CS1 CS2 CS3 CRECT1 CS4 CD1 CD2 CBOOT2 CRECT2 CBOOT1 PGND PGND PGND PGND BOOT1 AC2 AC2 AC2 AC1 AC1 AC1 RECT RECT RECT RECT RECT COM1 OUT OUT OUT OUT OUT CLMP1 PGND NC NC VDD1 VDD2 COM2 SCL SDA GPIO VDD1 VDD2 CLMP2 NC NC PGND PGND PGND PGND CCLMP1 COUT BOOT2 CCOM1 GND VOUT ADEN ADD CCOM2 CHG MODE0 MODE1 CCLMP2 CVDD2 CVDD1 TS Power ground should be as large as possible and connect to the ground plane for thermal dissipation. Figure 17. PCB Layout Guide Copyright © 2015 Richtek Technology Corporation. All rights reserved. www.richtek.com 24 is a registered trademark of Richtek Technology Corporation. DS1650-00 July 2015 RT1650 Outline Dimension Dimensions In Millimeters Symbol Dimensions In Inches Min. Max. Min. Max. A 0.450 0.500 0.018 0.020 A1 0.170 0.230 0.007 0.009 b 0.240 0.300 0.009 0.012 D 3.350 3.450 0.132 0.136 D1 E 2.800 2.950 0.110 3.050 0.116 0.120 E1 2.000 0.079 e 0.400 0.016 48B WL-CSP 3x3.4 Package (BSC) Richtek Technology Corporation 14F, No. 8, Tai Yuen 1st Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries. Copyright © 2015 Richtek Technology Corporation. All rights reserved. DS1650-00 July 2015 is a registered trademark of Richtek Technology Corporation. www.richtek.com 25