RT2560Q-33GSP

® RT2560Q 36V, 2μ μA IQ, 100mA Low Dropout Voltage Linear Regulator General Description Features The RT2560Q is a high voltage linear regulator offering the benefits of high input voltage, low dropout voltage, low quiescent current and low external components.     The feature of low quiescent current as low as 2μA is ideal for powering the battery equipment to a longer service life. The RT2560Q is stable with the ceramic output capacitor over its wide input range from 3.5V to 36V and the entire range of output load current (0mA to 100mA).       Ordering Information  RT2560QPackage Type SP : SOP-8 (Exposed Pad-Option 2) Lead Plating System G : Green (Halogen Free and Pb Free)  100mA Output Current 3.5V to 36V Input Voltage Range Dropout Voltage : 0.55V at 10mA Fixed Output Voltage : 2.5V, 3.3V, 5V, 12V Stable with Ceramic or Tantalum Capacitor Current Limit Protection Over-Temperature Protection SOP-8 (Exposed Pad) Package RoHS Compliant and Halogen Free Applications  Output Voltage 25 : 2.5V 33 : 3.3V 50 : 5V C0 : 12V AEC-Q100 Grade3 Certification 2μ μA Quiescent Current ±2% Output Accuracy   Portable, Battery Powered Equipment Ultra Low Power Microcontrollers Notebook Computers Pin Configurations Note : Richtek products are :  (TOP VIEW) RoHS compliant and compatible with the current require-  8 VCC ments of IPC/JEDEC J-STD-020. Suitable for use in SnPb or Pb-free soldering processes. NC 2 VOUT 3 NC 4 Marking Information GND NC 7 GND 6 NC 5 NC 9 SOP-8 (Exposed Pad) For marking information, contact our sales representative directly or through a Richtek distributor located in your area. Simplified Application Circuit RT2560Q VCC VCC VOUT VOUT CIN COUT GND Copyright © 2016 Richtek Technology Corporation. All rights reserved. DS2560Q-01 February 2016 is a registered trademark of Richtek Technology Corporation. www.richtek.com 1 RT2560Q Functional Pin Description Pin No. 1 Pin Name Pin Function VCC Supply Voltage Input. NC No Internal Connection. 3 VOUT Regulator Output. 7, 9 (Exposed Pad) GND Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. 2, 4, 5, 6, 8 Function Block Diagram VOUT VCC Bandgap Reference R1 - + OCP OTP GND R2 Operation The RT2560Q is a high input voltage linear regulator designed specially for low external components system. The input voltage range is from 3.5V to 36V. The minimum required output capacitance for stable operation is 1μF effective capacitance after consideration of the temperature and voltage coefficient of the capacitor. Output Transistor The RT2560Q builds in a P-MOSFET output transistor which provides a low switch-on resistance for low dropout voltage applications. Current Limit The RT2560Q provides current limit function to prevent the device from damages during over-load or short-circuit condition. This current is detected by an internal sensing transistor. Over-Temperature Protection The over-temperature protection function will turn off the P-MOSFET when the junction temperature exceeds 150°C (typ.). Once the junction temperature cools down by approximately 20°C, the regulator will automatically resume operation. Error Amplifier The Error Amplifier compares the internal reference voltage with the output feedback voltage from the internal divider, and controls the Gate voltage of P-MOSFET to support good line regulation and load regulation at output voltage. Copyright © 2016 Richtek Technology Corporation. All rights reserved. www.richtek.com 2 is a registered trademark of Richtek Technology Corporation. DS2560Q-01 February 2016 RT2560Q Absolute Maximum Ratings        (Note 1) VCC to GND --------------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C SOP-8 (Exposed Pad) -------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2) SOP-8 (Exposed Pad), θJA --------------------------------------------------------------------------------------------SOP-8 (Exposed Pad), θJC -------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -----------------------------------------------------------------------------Junction Temperature ---------------------------------------------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------------------ESD Susceptibility (Note 3) HBM (Human Body Model) --------------------------------------------------------------------------------------------- Recommended Operating Conditions −0.3V to 40V 2.041W 49°C/W 8°C/W 260°C 150°C −65°C to 150°C 2kV (Note 4)  Supply Input Voltage, VCC --------------------------------------------------------------------------------------------- 3.5V to 36V Junction Temperature Range ------------------------------------------------------------------------------------------- −40°C to 125°C  Ambient Temperature Range ------------------------------------------------------------------------------------------- −40°C to 85°C  Electrical Characteristics ((VOUT + 1V) < VCC < 36V, TA = −40°C to 85°C, unless otherwise specified.) Parameter DC Output Voltage Dropout Voltage Symbol VOUT VDROP Test Conditions IOUT = 10mA Min Typ Max VOUT = 3.3V 3.234 -- 3.366 VOUT = 2.5V 2.45 -- 2.55 VOUT = 5V 4.9 -- 5.1 VOUT = 12V 11.79 -- 12.24 -- 0.32 0.55 -- 2 3.5 -- 3.5 5 -- 0.04 0.5 % 0.5 -- 0.5 % 115 175 300 mA IOUT = 10mA Unit V V VOUT = 3.3V VCC Quiescent Current IQ IOUT = 0mA, VCC = 12V VOUT = 5V IOUT = 0mA, VCC = 24V Line Regulation VLINE VOUT = 2.5V VOUT = 12V IOUT = 10mA A VOUT = 3.3V Load Regulation VLOAD 0mA < IOUT < 50mA, VCC = 12V VOUT = 5V 0mA < IOUT < 50mA, VCC = 24V Output Current Limit ILIM VOUT = 2.5V VOUT = 12V VOUT = 3.3V VOUT = 0.5 x VOUT(normal), VOUT = 2.5V VCC = 12V VOUT = 5V VOUT = 0.5 x VOUT(normal), VOUT = 12V VCC = 24V Copyright © 2016 Richtek Technology Corporation. All rights reserved. DS2560Q-01 February 2016 is a registered trademark of Richtek Technology Corporation. www.richtek.com 3 RT2560Q Parameter Symbol Thermal Shutdown Temperature (Junction Temperature) TSD Thermal Shutdown Hysteresis TSD Test Conditions IOUT = 30mA Min Typ Max Unit -- 150 -- C -- 20 -- C Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is measured at the exposed pad of the package. The PCB copper area with exposed pad is 70mm2. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Typical Application Circuit RT2560Q VCC 1 CIN 1µF VCC VOUT 3 VOUT COUT (Effective Capacitance  1µF) GND 7, 9 (Exposed Pad) Copyright © 2016 Richtek Technology Corporation. All rights reserved. www.richtek.com 4 is a registered trademark of Richtek Technology Corporation. DS2560Q-01 February 2016 RT2560Q Typical Operating Characteristics Output Voltage vs. Input Voltage 3.320 3.33 3.315 3.32 3.310 Output Voltage (V) Output Voltage (V) Output Voltage vs. Temperature 3.34 3.31 3.30 VCC = 24V VCC = 12V 3.29 3.28 3.305 3.300 3.295 3.290 3.27 3.285 VOUT = 3.3V VOUT = 3.3V, IOUT = 0.01A 3.26 3.280 -50 -25 0 25 50 75 100 125 4 8 12 Temperature (°C) 3.5 2.15 3.0 2.5 VCC = 36V VCC = 12V VCC = 4V 1.0 0.5 28 32 36 2.10 2.05 2.00 1.95 1.90 1.85 VOUT = 3.3V VOUT = 3.3V, IOUT = 0A 0.0 1.80 -50 -25 0 25 50 75 100 125 4 8 12 Temperature (°C) 16 20 24 28 32 36 Input Voltage (V) Output Current Limit vs. Temperature Output Current Limit vs. Input Voltage 300 Output Current Limit (mA) 300 Output Current Limit (mA) 24 Quiescent Current vs. Input Voltage 2.20 Quiescent Current (µA) Quiescent Current (µA) Quiescent Current vs. Temperature 1.5 20 Input Voltage (V) 4.0 2.0 16 250 200 VCC = 24V VCC = 12V 150 100 50 250 200 150 100 50 VOUT = 3.3V 0 VOUT = 3.3V 0 -50 -25 0 25 50 75 100 Temperature (°C) Copyright © 2016 Richtek Technology Corporation. All rights reserved. DS2560Q-01 February 2016 125 4 8 12 16 20 24 28 32 36 Input Voltage (V) is a registered trademark of Richtek Technology Corporation. www.richtek.com 5 RT2560Q PSRR vs. Frequency Dropout Voltage vs. Load Current 0 5 4 -20 TA = 125°C TA = 25°C TA = −40°C 3 -30 PSRR (dB) Dropout Voltage (V) -10 2 -40 -50 IOUT = 25mA IOUT = 10mA -60 -70 -80 1 VOUT = 3.3V -90 VCC = 12V, VOUT = 3.3V -100 0 0 10 20 30 40 50 60 70 80 90 100 10000 100000 Load Transient Response Load Transient Response 1000000 VOUT (50mV/Div) VCC = 12V, VOUT = 3.3V, IOUT = 0 to 100mA IOUT (50mA/Div) VCC = 12V, VOUT = 3.3V, IOUT = 0 to 50mA Time (1ms/Div) Time (1ms/Div) Power On from VCC Power Off from VCC V CC (5V/Div) VOUT (2V/Div) VOUT (2V/Div) VCC = 12V, VOUT = 3.3V, IOUT = 100mA Time (5ms/Div) Copyright © 2016 Richtek Technology Corporation. All rights reserved. www.richtek.com 6 1000 Frequency (Hz) V CC (5V/Div) IOUT (100mA/Div) 100 Load Current (mA) VOUT (50mV/Div) IOUT (50mA/Div) 10 IOUT (100mA/Div) VCC = 12V, VOUT = 3.3V, IOUT = 100mA Time (25ms/Div) is a registered trademark of Richtek Technology Corporation. DS2560Q-01 February 2016 RT2560Q Ground Current vs. Load Current Ground Current (µA) 200 150 100 50 Rising, TA = 25°C Rising, TA = −40°C Rising, TA = 125°C Falling, TA = 25°C Falling, TA = −40°C Falling, TA = 125°C VCC = 12V, VOUT = 3.3V 0 0.001 0.01 0.1 1 10 100 1000 Load Current (mA) Copyright © 2016 Richtek Technology Corporation. All rights reserved. DS2560Q-01 February 2016 is a registered trademark of Richtek Technology Corporation. www.richtek.com 7 RT2560Q Application Information Capacitor Selection Like any low dropout linear regulator, the RT2560Q's external input and output capacitors must be properly selected for stability and performance. Use a 1μF or larger input capacitor and place it close to the IC's VCC and GND pins. Any output capacitor met the minimum 1mΩ ESR (Equivalent Series Resistance) and effective capacitance larger than 1μF requirement may be used. Place the output capacitor close to the IC's VOUT and GND pins. Increasing capacitance and decreasing ESR can improve the circuit's PSRR and line transient response. Over-Temperature Protection Thermal protection limits power dissipation to prevent IC overheat. When the operation junction temperature exceeds 150°C, the over-temperature protection circuit starts the thermal shutdown function and turns the regulator off. The regulator turns on again after the junction temperature cools down by 20°C. Power Dissipation For continuous operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is : The maximum power dissipation at TA = 25°C can be calculated by following formula : P D(MAX) = (125°C − 25°C) / (75°C/W) = 1.33W (SOP-8 Exposed Pad on the minimum layout) P D(MAX) = (125°C − 25°C) / (49°C/W) = 2.04W (SOP-8 Exposed Pad on the 70mm2 copper area layout) Layout Considerations The thermal resistance θJA of SOP-8 (Exposed Pad) is determined by the package design and the PCB design. However, the package design had been designed. If possible, it's useful to increase thermal performance by the PCB design. The thermal resistance θJA can be decreased by adding a copper under the exposed pad of SOP-8 (Exposed Pad) package. As shown in Figure 1, the amount of copper area to which the SOP-8 (Exposed Pad) is mounted affects thermal performance. When mounted to the standard SOP-8 (Exposed Pad) pad (Figure 1.a), θJA is 75°C/W. Adding copper area of pad under the SOP-8 (Exposed Pad) (Figure 1.b) reduces the θJA to 64°C/W. Even further, increasing the copper area of pad to 70mm2 (Figure 1.e) reduces the θJA to 49°C/W. PD = (VIN − VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junctions to ambient. The maximum power dissipation can be calculated by following formula : (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W PD(MAX) = (TJ(MAX) − TA) / θJA Where T J(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification, the maximum junction temperature is 125°C. The junction to ambient thermal resistance for SOP-8 (Exposed Pad) package is 75°C/W on the standard JEDEC 51-7 (4 layers, 2S2P) thermal test board. The copper thickness is 2oz. Copyright © 2016 Richtek Technology Corporation. All rights reserved. www.richtek.com 8 (b) Copper Area = 10mm2, θJA = 64°C/W is a registered trademark of Richtek Technology Corporation. DS2560Q-01 February 2016 RT2560Q The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. The Figure 2 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. (C) Copper Area = 30mm2, θJA = 54°C/W 2.2 (d) Copper Area = 50mm2, θJA = 51°C/W Power Dissipation (W) 2.0 1.8 Copper Area 70mm2 50mm2 30mm2 10mm2 Min. Layout 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 JEDEC 4-Layer PCB 0.0 0 20 40 60 80 100 120 140 Ambient Temperature (°C) Figure 2. Derating Curve for Package (e) Copper Area = 70mm2, θJA = 49°C/W Figure 1. Thermal Resistance vs. Copper Area Layout Thermal Design Copyright © 2016 Richtek Technology Corporation. All rights reserved. DS2560Q-01 February 2016 is a registered trademark of Richtek Technology Corporation. www.richtek.com 9 RT2560Q Outline Dimension H A M EXPOSED THERMAL PAD (Bottom of Package) Y J X B F C I D Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 4.801 5.004 0.189 0.197 B 3.810 4.000 0.150 0.157 C 1.346 1.753 0.053 0.069 D 0.330 0.510 0.013 0.020 F 1.194 1.346 0.047 0.053 H 0.170 0.254 0.007 0.010 I 0.000 0.152 0.000 0.006 J 5.791 6.200 0.228 0.244 M 0.406 1.270 0.016 0.050 X 2.000 2.300 0.079 0.091 Y 2.000 2.300 0.079 0.091 X 2.100 2.500 0.083 0.098 Y 3.000 3.500 0.118 0.138 Option 1 Option 2 8-Lead SOP (Exposed Pad) Plastic Package Richtek Technology Corporation 14F, No. 8, Tai Yuen 1st Street, Chupei City Hsinchu, Taiwan, R.O.C. Tel: (8863)5526789 Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries. www.richtek.com 10 DS2560Q-01 February 2016