RT6208
High Efficiency, 36V 100mA Synchronous Step-Down Converter
General Description
Features
The RT6208 is a high-efficiency, monolithic synchronous
step-down DC/DC converter that can deliver up to
Achieves Very High Efficiency in Low Load
Conditions
100mA output current from a 4.5V to 36V input supply. It
1% High Accuracy Feedback Voltage
requires only 25A typical supply current at no load
4.5V to 36V Input Voltage Range
while maintaining output voltage regulation. The RT6208
100mA Output Current
achieves Boundary Conduction Mode (BCM) operation,
Integrated High-Side and Low-Side Switches
low quiescent current and programmable high-side peak
No Compensation Required
current limit, providing high efficiency over a wide range
Low Quiescent Current
of load currents. It also provides soft-start protection to
Adjustable Peak Current Limit
eliminate input current surge during start-up. The low
Cycle-by-Cycle Over Current Protection
current
output
Input Under Voltage Lockout
disconnect, enabling easy power management in
Internal Soft-Start
battery-powered systems. The RT6208 is available in a
Thermal Shutdown Protection
(3A)
shutdown
mode
provides
SOT-23-6, SOT-23-8 and SOP-8 (Exposed Pad, with
power good function) packages.
Ordering Information
RT6208
Package Type
SP : SOP-8 (Exposed Pad-Option 1)
E : SOT-23-6
V8 : SOT-23-8
Lead Plating System
G : Green (Halogen Free and Pb Free)
Applications
Wireless Charger
Industrial and Commercial Low Power Systems
Green Electronics/Appliances
Point of Load Regulation for High-Performance
DSPs
MCU Supply in Wireless LED Lighting
Marking Information
RT6208GSP
Note :
Richtek products are :
RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes
RT6208
GSPYMDNN
RT6208GSP : Product Number
YMDNN : Date Code
RT6208GE
30=DNN
30= : Product Code
DNN : Date Code
RT6208GV8
0E=DNN
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May 2015
0E= : Product Code
DNN : Date Code
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RT6208
Pin Configurations
ISET
4
6
FB
5
EN
9
6
5
4
2
3
AGND
3
PGOOD
8
7
6
5
2
3
4
SW
NC
GND
GND
7
PGOOD
2
VIN
SW
VIN
FB
SW VIN ISET
8
EN
(TOP VIEW)
SOP-8 (Exposed Pad)
SOT-23-6
GND
ISET
FB GND EN
SOT-23-8
Functional Pin Description
Pin No
SOP-8
(Exposed Pad)
SOT-23-6 SOT-23-8
Pin Name
Pin Function
1
6
4
SW
Switch Node. Connect The Switching Node To External
Inductor.
2
5
3
VIN
Input Supply Voltage. Must bypass with a suitably large
ceramic capacitor.
3
--
--
NC
No Internal Connection.
ISET
High-Side Peak Current Set Pin. A resistor from this pin to
GND sets the high-side peak current limit. Leave floating
for the maximum peak current, 225mA. Short this pin to
GND for the minimum peak current, 50mA. A 1A current
is sourced out of this pin.
4
4
1
Enable Control Input. A voltage on this pin above 1.25V
enables the converter into normal mode; forcing this pin
below 0.3V shuts down the IC, reducing quiescent current
to 3A.
An internal 2A current pulls up enable pin for automatic
startup.
Feedback Voltage Input. This pin receives the feedback
voltage from a resistive divider connected across the
output.
Power Good Open Drain Output. Asserts low if output
voltage is low due to OTP, UVP, UVLO, EN shutdown or
during soft-start.
5
3
8
EN
6
1
7
FB
7
--
6
PGOOD
8,
9 (Exposed Pad)
2
2
GND
Power Ground. The exposed pad must be soldered to a
large PCB and connected to GND for maximum power
dissipation.
--
--
5
AGND
Analog Ground.
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RT6208
Function Block Diagram
VIN
VCC
ISET
2V
UVLO
1μA
HS Switch
Current
Comparator
2μA
-
EN
5k
6V
FB
1.21 +
Shutdown
Comparator
1ms Ramp
LS Switch
Current
Comparator
PGOOD
Generator
The RT6208 is a step-down DC/DC converter with
internal power switches that uses Hysteresis Mode
control, combining low quiescent current, which results
in high efficiency across a wide range of load currents.
Mode
Current
Sense
GND
comparators are disabled, reducing the VIN pin supply
Operation
Hysteresis
SW
FB
Comparator
AGND
PGOOD
Current
Sense
Logic &
Deadtime
Control
+
+
0.8V
Internal
Regulator
operation
functions
by
using
Boundary Conduction Mode (BCM) to ramp the
inductor current through the internal power switches,
followed by a sleep cycle where the power switches are
off and the load current is supplied by the output
capacitor. During the sleep cycle, the RT6208 draws
only 25A of supply current. At light loads, the BCM
cycles are a small percentage of the total cycle time
which minimizes the average supply current, greatly
improving efficiency.
current to only 25A. As the load current discharges
the output capacitor, the voltage on the VFB pin
decreases. When this voltage falls 5mV below the
800mV reference, the feedback comparator trips and
enables BCM. At the beginning of the BCM, the internal
high-side power switch (P-channel MOSFET) is turned
on and the inductor current begins to ramp up. The
inductor current increases until either the current
exceeds the peak current comparator threshold, or the
ON time of the high-side MOSFET exceeds 5μs during
the time VFB is higher than 800mV, at which the
high-side power switch is turned off, and the Low-side
power switch is turned on. The inductor current ramps
down until the reverse current is close to zero. If the
voltage on the VFB pin is still less than the 800mV
Scheme of Hysteresis Mode
reference, the high-side power switch is turned on
The feedback comparator monitors the voltage on the
again and another cycle commences which keep the
VFB pin and compares it to an internal 800mV
inductor current operated in a boundary conduction
reference, as shown in Figure 1. If this voltage is
mode. The average current during the BCM will
greater than the reference, the comparator activates a
normally be greater than the average load current. For
sleep mode in which the power switches and current
this architecture, the maximum average output current
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RT6208
is equal to half of the peak current. The hysteresis
to ground, the inductor current will decay very slowly
nature of this control architecture results in a switching
during a single switching cycle. Since the high-side
frequency that is a function of the input voltage, output
switch turns on only when the inductor current is near
voltage and inductor value. This behavior provides
zero, the RT6208 inherently switches at a lower
inherent short‑circuit protection. If the output is shorted
frequency during short-circuit condition.
VREF
VFB
VREF - VHys
High-Side Peak Current (PC)
Inductor Current
Low-Side Zero Current (ZC)
Sleep
Mode
Stop Switch
Boundary Conduction
Mode
Sleep
Mode
Switch between High-Side PC and
Low-Side ZC
Figure 1. Hysteresis Mode
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RT6208
Absolute Maximum Ratings
(Note 1)
Supply Voltage, VIN --------------------------------------------------------------------------------------------------- 0.3V to 40V
Switch Voltage, SW ---------------------------------------------------------------------------------------------------- 0.3V to (VIN + 0.3V)
All Other Pins ------------------------------------------------------------------------------------------------------------ 0.3V to 6V
Power Dissipation, PD @ TA = 25C
SOP-8 (Exposed Pad) ------------------------------------------------------------------------------------------------ 3.26W
SOT-23-6 ------------------------------------------------------------------------------------------------------------------ 0.48W
SOT-23-8 ------------------------------------------------------------------------------------------------------------------ 0.53W
Package Thermal Resistance
(Note 2)
SOP-8 (Exposed Pad), JA ----------------------------------------------------------------------------------------- 30.6C/W
SOP-8 (Exposed Pad), JC ----------------------------------------------------------------------------------------- 3.4C/W
SOT-23-6, JA ----------------------------------------------------------------------------------------------------------- 208.2C/W
SOT-23-6, JC ----------------------------------------------------------------------------------------------------------- 32C/W
SOT-23-8, JA ----------------------------------------------------------------------------------------------------------- 186.2C/W
SOT-23-8, JC ----------------------------------------------------------------------------------------------------------- 47.4C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------- 260C
Junction Temperature ------------------------------------------------------------------------------------------------- 150C
Storage Temperature Range --------------------------------------------------------------------------------------- 65C to 150C
ESD Susceptibility
(Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)
Input Voltage Range -------------------------------------------------------------------------------------------------- 4.5V to 36V
Ambient Temperature Range -------------------------------------------------------------------------------------- 40C to 85C
Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter
Supply Current
Symbol
Min
Typ
Max
Unit
Active Mode
--
160
190
A
Sleep Mode
--
25
40
A
VEN = 0V
--
3
6
A
VFB Rising
0.792
0.8
0.808
V
3
5
7
mV
100
0
100
nA
Shutdown Mode
Test Conditions
Feedback Comparator Trip Voltage
VFB
Feedback Comparator Hysteresis
VFBHYS
Feedback Pin Current
IFB
High-Side Switch On-Resistance
RDS(ON)_H
--
3
--
Low-Side Switch On-Resistance
RDS(ON)_L
--
1.5
--
1
1.2
1.4
V
Enable Threshold Voltage
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Enable Rising
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RT6208
Parameter
Symbol
Test Conditions
Enable Hysteresis
Input Under Voltage Lockout Threshold VUVLO
VIN Rising
Min
Typ
Max
Unit
--
100
--
mV
3.9
4.2
4.5
V
Input Under Voltage Lockout
Hysteresis
ΔVUVLO
--
300
--
mV
Soft-Start Period
tSS
--
1
--
ms
200
225
250
500k from ISET to GND
--
135
--
ISET short to GND
--
50
--
Peak Current Comparator Propagation
Delay Time
ISET floating
I/t = 250mA/s
--
100
--
ns
Power Good Threshold - Rising
VFB Rising
--
87.5
--
%
Power Good Threshold - Falling
VFB Falling
--
82.5
--
%
--
150
--
C
ISET Floating
High-Side Peak Current Limit
Thermal Shutdown
TSD
mA
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT6208
Typical Application Circuit
L
RT6208
VIN
4.5V to 36V
SW
VIN
CIN
VOUT
R1
*CFF
COUT
FB
EN
(Open = automatic start)
R2
ISET
PGOOD
GND
AGND
*See Application Information for detail.
(Recommended Component Selections for a 100mA Loading application of Popular output Voltage)
VOUT (V)
CIN (F)
COUT (F)
L (H)
R2 (k)
R1 (k)
CFF (pF)
ISET
1.8
2.2
10
150
24
30
68
Floating
3.3
2.2
10
150
24
75
120
Floating
5
2.2
10
150
24
126
150
Floating
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RT6208
Typical Operating Characteristics
Efficiency vs. Load Current
90
80
80
70
Efficiency (%)
Efficiency (%)
Efficiency vs. Load Current
90
VIN = 5V
VIN = 12V
60
VIN = 24V
VIN = 36V
50
VIN = 5V
70
VIN = 12V
VIN = 24V
60
VIN = 36V
50
VOUT = 1.8V
VOUT = 3.3V
40
40
0.1
1
10
100
0.1
1
Load Current (mA)
10
100
Load Current (mA)
Efficiency vs. Load Current
Ground Current vs. Input Voltage
90
160
157
Ground Current (μA)
Efficiency (%)
80
VIN = 12V
70
VIN = 24V
VIN = 36V
60
50
154
151
148
145
142
139
136
133
VOUT = 5V
40
BCM
130
0.1
1
10
100
4
8
12
Load Current (mA)
190
27
180
24
170
160
VIN = 36V
VIN = 24V
140
130
120
110
20
24
28
32
36
Ground Current vs. Input Voltage
30
Ground Current (μA)
Ground Current (μA)
Ground Current vs. Temperature
200
150
16
Input Voltage (V)
Sleep Mode
21
18
15
12
9
6
Shutdown Mode
3
BCM
0
100
-50
-25
0
25
50
75
100
Temperature (°C)
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125
4
8
12
16
20
24
28
32
36
Input Voltage (V)
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RT6208
Ground Current vs. Temperature
UVLO vs. Temperature
50
4.6
VIN = 36V
40
High
4.4
Sleep Mode
35
UVLO (V)
Ground Current (μA)
45
30
25
20
4.2
4.0
Low
15
Shutdown Mode
10
3.8
5
0
3.6
-50
-25
0
25
50
75
100
125
-50
-25
0
Temperature (°C)
FB Voltage vs. Temperature
50
75
9
0.804
8
0.802
0.800
0.798
125
7
6
5
4
0.796
3
VIN = 24V, L = 100μH, C OUT = 10μF, Load = 30mA
VIN = 24V
2
0.794
-50
-25
0
25
50
75
100
-50
125
-25
HS Peak Current Limit vs. Input Voltage
25
50
75
100
125
HS Peak Current Limit vs. Temperature
250
250
HS Peak Current Limit (mA)
225
ISET = Floating
200
175
150
125
ISET = 500kΩ
100
75
50
ISET = GND
25
0
225
ISET = Floating
200
175
150
125
ISET = 500kΩ
100
75
50
ISET = GND
25
VIN = 24V
0
4
8
12
16
20
24
28
32
Input Voltage (V)
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Temperature (°C)
Temperature (°C)
HS Peak Current Limit (mA)
100
FB Voltage Hysteresis vs. Temperature
0.806
FB Voltage (V)
FB Voltage (V)
25
Temperature (°C)
May 2015
36
-40
-10
20
50
80
110
140
Temperature (°C)
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RT6208
Switch On-Resistance vs. Temperature
5.0
4.5
4.5
Switch On-Resistance (Ω)
Switch On-Resistance (Ω)1
Switch On-Resistance vs. Input Voltage
5.0
4.0
3.5
3.0
High-Side
2.5
2.0
1.5
1.0
Low-Side
4.0
3.5
3.0
High-Side
2.5
2.0
1.5
Low-Side
1.0
0.5
0.5
0.0
0.0
4
8
12
16
20
24
28
32
-50
36
-25
Switch Leakage Current vs. Temperature
25
50
75
100
125
EN Threshold Voltage vs. Temperature
0.1
1.4
0.09
EN Threshold Voltage (V)
Switch Leakage Current (μA)1
0
Temperature (°C)
Input Voltage (V)
0.08
0.07
0.06
0.05
0.04
0.03
0.02
1.3
Rising
1.2
1.1
Falling
1.0
0.9
0.01
VIN = 24V
0
0.8
-50
-25
0
25
50
75
100
125
-40
-10
20
50
80
Temperature (°C)
Temperature (°C)
Switching
Soft-Start
110
140
VOUT_ac
(20mV/Div)
SW
(20V/Div)
Inductor
Current
(100mA/Div)
VOUT
(1V/Div)
VIN = 24V, VOUT = 5V, ILOAD = 100mA
Time (5s/Div)
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VIN = 24V, VOUT = 5V
Time (500s/Div)
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RT6208
Short Circuit Response
Load Transient Respone
VIN = 36V, VOUT = 5V, ILOAD = 100mA
VIN = 24V, VOUT = 5V, ILOAD = 0 to 100mA
VOUT_ac
(50mV/Div)
VOUT
(2V/Div)
Inductor
Current
(100mA/Div)
Load Current
(50mA/Div)
Time (1ms/Div)
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RT6208
The typical RT6208 application circuit is shown on
R
VOUT = VREF 1 + 1
R2
page 7 of this data sheet. External component
Where VREF is the reference voltage (0.8V typ.).
selection is determined by the maximum load current
The resistive divider attenuates the ripple signal on FB
requirement and begins with the selection of the peak
pin as well. A small feed forward capacitor CFF can be
current programming resistor, RISET. The inductor
added in parallel with the upper feedback resistor R1. It
value L can then be determined, followed by capacitors
helps to reduce switch-noise coupling on the FB pin
CIN and COUT.
and increases the FB pin ripple voltage to improve
Application Information
switching stability and avoid double pulses. The CFF
Peak Current Resistor Selection
The peak current comparator has a maximum current
limit of 225mA nominally, which results in a maximum
average current of 112mA. For applications that
value
is
dependent
on
the
feedback
network
impedance and the peak-peak ripple voltage on the
output. Recommended CFF values range from 47pF to
470pF.
demand less current, the peak current threshold can be
reduced to as little as 50mA. The threshold can be
Inductor Selection
easily programmed with an appropriately chosen
The inductor, input voltage, output voltage and peak
resistor (RISET) between the ISET pin and ground.
current determine the switching frequency of the
The value of resistor for a particular peak current can
RT6208. For a given input voltage, output voltage and
be computed by following equation
peak current, the inductor value sets the maximum
RISET = IPEAK 0.05 5.88 106
switching frequency when the load current is close to
1/2 of the peak current. A good first choice for the
where 50mA < IPEAK < 225mA.
inductor value can be determined by the following
The peak current is internally limited to be within the
equation :
range of 50mA to 225mA. Shorting the ISET pin to
ground programs the current limit to 50mA, and leaving
VOUT
1 VOUT
L =
VIN
fMAX IPEAK
it floating sets the current limit to the maximum value of
The variation in switching frequency would be
225mA. When selecting this resistor value, be aware
calculated with inductor, load current, input and output
that the maximum average output current for this
voltage. Large output capacitors will result in multiple
architecture is limited to half of the peak current.
switching cycles in BCM. The discharge time and
Therefore, be sure to select a value that sets the peak
charge time of operation frequency can follow below
current with enough margin to provide adequate load
equation :
current under all foreseeable operating conditions.
Discharge time (Sleep Mode) : T1 = C OUT
Output Voltage Setting and Feedback Network
Charge time (Boundary Conduction Mode) :
The resistive divider allows the FB pin to sense the
output voltage. The output voltage is set by an external
VHys.
ILOAD
T2 = COUT
0.5
VHys.
IPEAK ILOAD
resistive voltage divider according to the following
equation :
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Operation Frequency f =
1
T1 + T2
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RT6208
Input Under Voltage Lockout
height requirements in the design.
The RT6208 implements a protection feature which
The output capacitor, COUT, filters the inductor’s ripple
disables switching when the input voltage is too low. If
current and stores energy to satisfy the load current
VIN falls below 3.9V typical, an under voltage detector
when the RT6208 is in sleep mode. The value of the
disables switching. Switching is enabled when the input
output capacitor must be large enough to accept the
voltage exceeds 4.2V typical (4.5V maximum).
energy stored in the inductor without a large change in
output
Enable Operation
The EN pin can be used to shutdown or activate the
chip. Pulling the EN pin low (1.4V) will turn on the device again. Leaving the
EN pin floating will pull the EN pin up to 2V internally
voltage.
To
achieve
an
output
voltage
peak-peak ripple less than 1% of the output voltage,
the output capacitor must be :
I
COUT 50 L PEAK
VOUT
2
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
and enable RT6208.
dissipation depends on the thermal resistance of the IC
Soft-Start
package, PCB layout, rate of surrounding airflow, and
The RT6208 provides an internal soft-start function to
difference between junction and ambient temperature.
prevent large inrush current and output voltage
The maximum power dissipation can be calculated by
overshoot when the converter starts up. The soft-start
the following formula :
automatically begins once the chip is enabled. During
PD(MAX) = (TJ(MAX) TA) / JA
soft-start, it clamps the ramp of internal reference
where TJ(MAX) is the maximum junction temperature,
voltage which is compared with FB signal. The typical
TA is the ambient temperature, and JA is the junction to
soft-start duration is 1ms.
ambient thermal resistance.
For recommended operating condition specifications,
CIN and COUT Selection
The input capacitance, CIN, is needed to filter the
triangular current at the Source of the high-side
MOSFET. To prevent large ripple current, a low ESR
input capacitor sized for the maximum RMS current
should be used. The approximate RMS current
equation is given :
the maximum junction temperature is 125C. The
junction to ambient thermal resistance, JA, is layout
dependent. For SOP-8 (Exposed Pad) package, the
thermal resistance, JA, is 30.6C/W on a standard
JEDEC 51-7 four-layer thermal test board. For
SOT-23-6 package, the thermal resistance, JA, is
208.2C/W on a standard JEDEC 51-7 four-layer
IRMS = IOUT(MAX)
VOUT
VIN
VIN
1
VOUT
This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT / 2. This simple worst case condition is
commonly used for design because even significant
deviations do not offer much relief. Choose a capacitor
rated at a higher temperature than required. Several
capacitors may also be paralleled to meet size or
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May 2015
thermal test board. For SOT-23-8 package, the thermal
resistance, JA, is 186.2C/W on a standard JEDEC
51-7 four-layer thermal test board. The maximum
power dissipation at TA = 25C can be calculated by
the following formula :
PD(MAX) = (125C 25C) / (30.6C/W) = 3.26W for
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RT6208
PD(MAX) = (125C 25C) / (208.2C/W) = 0.48W for
SOT-23-6 package
PD(MAX) = (125C 25C) / (186.2C/W) = 0.53W for
SOT-23-8 package
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 2
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
Maximum Power Dissipation (W)1
4.0
Four-Layer PCB
3.5
3.0
SOP-8 (Exposed Pad)
2.5
2.0
1.5
1.0
SOT-23-8
0.5
SOT-23-6
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 2. Derating Curve of Maximum Power
Dissipation
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS6208-00
May 2015
RT6208
Outline Dimension
Dimensions In Millimeters
Symbol
Dimensions In Inches
Min
Max
Min
Max
A
4.801
5.004
0.189
0.197
B
3.810
4.000
0.150
0.157
C
1.346
1.753
0.053
0.069
D
0.330
0.510
0.013
0.020
F
1.194
1.346
0.047
0.053
H
0.170
0.254
0.007
0.010
I
0.000
0.152
0.000
0.006
J
5.791
6.200
0.228
0.244
M
0.406
1.270
0.016
0.050
X
2.000
2.300
0.079
0.091
Y
2.000
2.300
0.079
0.091
X
2.100
2.500
0.083
0.098
Y
3.000
3.500
0.118
0.138
Option 1
Option 2
8-Lead SOP (Exposed Pad) Plastic Package
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS6208-00
May 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT6208
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.889
1.295
0.031
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.250
0.560
0.010
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-6 Surface Mount Package
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
16
is a registered trademark of Richtek Technology Corporation.
DS6208-00
May 2015
RT6208
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.000
1.450
0.039
0.057
A1
0.000
0.150
0.000
0.006
B
1.500
1.700
0.059
0.067
b
0.220
0.500
0.009
0.020
C
2.600
3.000
0.102
0.118
D
2.800
3.000
0.110
0.118
e
0.585
0.715
0.023
0.028
H
0.100
0.220
0.004
0.009
L
0.300
0.600
0.012
0.024
SOT-23-8 Surface Mount Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is bel ieved to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS6208-00
May 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
17
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