RT9011-CJGQWB

RT9011 Portable Power Management 300mA Dual LDO Regulator General Description Features The RT9011 is a dual channel, low noise, and low dropout regulator sourcing up to 300mA at each channel. The range of output voltage is from 1.2V to 3.6V by operating from 2.5V to 5.5V input. z Wide Operating Voltage Ranges : 2.5V to 5.5V z Low-Noise for RF Application No Noise Bypass Capacitor Required Fast Response in Line/Load Transient TTL-Logic-Controlled Shutdown Input Low Temperature Coefficient Dual LDO Outputs (300mA/300mA) Ultra-low Quiescent Current 27μ μA/LDO High Output Accuracy 2% Short Circuit Protection Thermal Shutdown Protection Current Limit Protection Short Circuit Thermal Folded Back Protection Tiny TSOT-23-6 and 6-Lead/8-Lead/10-Lead WDFN Packages RoHS Compliant and 100% Lead (Pb)-Free The RT9011 offers 2% accuracy, extremely low dropout voltage (240mV @ 300mA), and extremely low ground current, only 27μA per LDO. The shutdown current is near zero current which is suitable for battery-power devices. Other features include current limiting, over temperature, output short circuit protection. z z z z z z z z z The RT9011 is short circuit thermal folded back protected. The IC lowers its OTP trip point from 165°C to 110°C when output short circuit occurs (VOUT < 0.4V) providing maximum safety to end users. The RT9011 can operate stably with very small ceramic output capacitors, reducing required board space and component cost. The RT9011 is available in fixed output voltages in the TSOT-23-6, WDFN-8L 2x2, WDFN-10L 3x3, WDFN-8L 3x3 and WDFN-6L 1.6x1.6 packages. z z z z Applications z z z Ordering Information z RT9011- z Package Type J6 : TSOT-23-6 QW : WDFN-8L 2x2 (W-Type) QWA : WDFN-10L 3x3 (W-Type) QWB : WDFN-8L 3x3 (W-Type) QWC : WDFN-6L 1.6x1.6 (W-Type) Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free) Note : Output Voltage : VOUT1/VOUT2 VOUT2 > VOUT1 is Recommended Richtek products are : ` RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. ` Suitable for use in SnPb or Pb-free soldering processes. DS9011-08 April 2011 z CDMA/GSM Cellular Handsets Battery-Powered Equipment Laptop, Palmtops, Notebook Computers Hand-Held Instruments PCMCIA Cards Portable Information Appliances Marking Information For marking information, contact our sales representative directly or through a Richtek distributor located in your area. Available Voltage Version Code Voltage Code Voltage Code Voltage A 3.5 D G 1.85 1.8 B 1.3 C 1.2 E H 2.1 2 F J 1.5 2.5 K N 2.6 2.85 L P 2.7 3 M Q 2.8 3.1 R V Y 3.2 2.9 1.9 S W 3.3 1.6 T X 2.65 3.15 www.richtek.com 1 RT9011 Pin Configurations (TOP VIEW) VOUT1 VIN EN1 5 2 VIN EN1 EN2 NC 4 3 1 2 3 8 GND 9 4 VOUT1 VOUT2 6 NC 5 GND 7 VIN EN1 EN2 NC NC 1 2 3 4 5 GND 11 10 9 8 7 9 6 VOUT1 VOUT2 NC NC GND VIN EN1 EN2 NC 1 2 3 8 7 GND 4 6 9 5 VOUT1 NC GND VOUT2 VIN EN1 EN2 6 1 2 3 GND 7 5 4 VOUT1 VOUT2 GND VOUT2 GND EN2 TSOT-23-6 WDFN-8L 2x2 WDFN-10L 3x3 WDFN-8L 3x3 WDFN-6L 1.6x1.6 Typical Application Circuit VIN VIN CIN 1uF VOUT1 RT9011 COUT1 VOUT1 1uF EN1 Chip Enable VOUT2 EN2 COUT2 VOUT2 1uF GND Functional Pin Description Pin No. TSOT-23-6 WDFN-8L WDFN-10L WDFN-8L WDFN-6L Pin Name 2x2 3x3 3x3 1.6x1.6 Pin Function 5 1 1 1 1 VIN Supply Input. 4 2 2 2 2 EN1 Chip Enable1 (Active High). 3 3 3 3 3 EN2 Chip Enable2 (Active High). 5, 6, 6, 4, Exposed Exposed Exposed Exposed GND soldered to a large PCB and connected to Pad (9) Pad (11) Pad (9) Pad (7) GND for maximum power dissipation. 1 7 9 5 5 VOUT2 Channel 2 Output Voltage. 6 8 10 8 6 VOUT1 Channel 1 Output Voltage. -- 4, 6 4, 5, 7, 8 4, 7 -- NC No Internal Connection. 2 www.richtek.com 2 Common Ground. The exposed pad must be DS9011-08 April 2011 RT9011 Function Block Diagram EN1 Shutdown and Logic Control 0.2uA VIN - VREF MOS Driver + Error Amplifier VOUT1 Current-Limit and Thermal Protection GND EN2 Shutdown and Logic Control 0.2uA - VREF + Error Amplifier MOS Driver VOUT2 Current-Limit and Thermal Protection GND DS9011-08 April 2011 www.richtek.com 3 RT9011 Absolute Maximum Ratings (Note 1) Supply Input Voltage -----------------------------------------------------------------------------------------------------Other I/O Pin Voltages --------------------------------------------------------------------------------------------------z Power Dissipation, PD @ TA = 25°C TSOT-23-6 ------------------------------------------------------------------------------------------------------------------WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------WDFN-10L 3x3 ------------------------------------------------------------------------------------------------------------WDFN-8L 3x3 -------------------------------------------------------------------------------------------------------------WDFN-6L 1.6x1.6 --------------------------------------------------------------------------------------------------------z Package Thermal Resistance (Note 2) TSOT-23-6, θJA ------------------------------------------------------------------------------------------------------------WDFN-8L 2x2, θJA --------------------------------------------------------------------------------------------------------WDFN-10L 3x3, θJA ------------------------------------------------------------------------------------------------------WDFN-8L 3x3, θJA --------------------------------------------------------------------------------------------------------WDFN-6L 1.6x1.6, θJA ---------------------------------------------------------------------------------------------------z Junction Temperature ----------------------------------------------------------------------------------------------------z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------z Storage Temperature Range -------------------------------------------------------------------------------------------z ESD Susceptibility (Note 3) HBM (Human Body Mode) ---------------------------------------------------------------------------------------------MM (Machine Mode) -----------------------------------------------------------------------------------------------------z z Recommended Operating Conditions z z z z −0.3V to 7V −0.3V to 7V 0.455W 0.606W 0.926W 0.926W 0.571W 220°C/W 165°C/W 108°C/W 108°C/W 175°C/W 150°C 260°C −65°C to 150°C 2kV 200V (Note 4) Supply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V Enable Input Voltage ------------------------------------------------------------------------------------------------------ 0V to 5.5V Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C Electrical Characteristics (VIN = VOUT + 1V, VEN = VIN, CIN = COUT = 1μF, TA = −40°C to 85°C, unless otherwise specified.) Parameter Symbol Input Voltage Dropout Voltage Test Conditions VIN = 2.5V to 5.5V (Note 5) VDROP IOUT = 300mA Min Typ Max Unit 2.5 -- 5.5 V -- 240 330 mV 1.2 -- 3.6 V Output voltage range VOUT V OUT Accuracy ΔV IOUT = 1mA to 300mA −3 -- +3 % Line Regulation ΔVLINE VIN = (VOUT + 0.3V) to 5.5V or VIN > 2.5V, whichever is larger -- -- 0.2 %/V Load Regulation ΔVLOAD 1mA < IOUT< 300mA -- -- 0.6 % RLOAD = 1Ω 330 450 700 mA Current Limit Quiescent Current IQ VEN > 1.5V -- 58 80 μA Shutdown Current IQ_SD VEN < 0.4V -- -- 1 μA VIH VIN = 2.5V to 5.5V, Power On 1.5 -- -- VIL VIN = 2.5V to 5.5V, Shutdown -- -- 0.4 EN Threshold V To be continued www.richtek.com 4 DS9011-08 April 2011 RT9011 Parameter Symbol Test Conditions Output Voltage TC V OUT Discharge Resistance in Shutdown (Note 6) V IN = 5V, EN1 = EN2 = GND Min Typ Max Unit -- 100 -- ppm/°C -- 3 -- kΩ EN Pull Low Current IEN -- 0.2 -- μA Thermal Shutdown TSD -- 170 -- °C Thermal Shutdown Hysteresis ΔT SD -- 40 -- °C f = 100Hz -- 70 -- f = 1kHz -- 70 -- f = 10kHz -- 70 -- f = 100kHz -- 54 -- f = 200kHz -- 45 -- f = 300kHz -- 38 -- C OUT1 = COUT2 = 10uF, 10Hz to 100kHz, IOUT1 = IOUT2 = 1mA -- 100 -- PSRR VIN = VOUT + 1V, COUT = 2.2μF ILOAD = 50mA Output Voltage Noise PSRR dB uVrms Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 3. Devices are ESD sensitive. Handling precaution recommended. Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV. Note 6. It is guaranteed by design. DS9011-08 April 2011 www.richtek.com 5 RT9011 Typical Operating Characteristics Output Voltage vs. Temperature Output Voltage vs. Temperature 3.4 RT9011-GS, VOUT1 1.85 Output Voltage (V) Output Voltage (V) 1.9 1.8 1.75 RT9011-GS, VOUT2 3.35 3.3 3.25 3.2 1.7 -50 -25 0 25 50 75 100 -50 125 -25 Temperature (°C) 50 75 100 125 Dropout Voltage vs. Load Current 350 RT9011-GS VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R RT9011-GS, VOUT2 TJ = 125°C 300 Dropout Voltage (mV) Quiescent Current (uA) 65 25 Temperature (°C) Quiescent Current vs. Temperature 70 0 60 55 250 TJ = 25°C 200 150 TJ = -40°C 100 50 50 0 -50 -25 0 25 50 75 100 125 0 100 150 200 250 Load Current (mA) Power-On Line Transient Response RT9011-FM Both ILOAD = 10mA 300 RT9011-GS, Both ILOAD = 1mA VIN = 3.8V to 4.8V VIN 4.8 (V) VEN (5V/Div) 3.8 VOUT2 (10mV/Div) VOUT1 (1V/Div) VOUT2 (2V/Div) POR (5V/Div) VOUT1 (10mV/Div) Time (10μs/Div) www.richtek.com 6 50 Temperature (°C) Time (100μs/Div) DS9011-08 April 2011 RT9011 Line Transient Response Line Transient Response RT9011-GS, Both ILOAD = 10mA VIN = 3.8V to 4.8V RT9011-GS, Both ILOAD = 50mA VIN = 3.8V to 4.8V VIN 4.8 (V) VIN 4.8 (V) VOUT2 (10mV/Div) VOUT2 (10mV/Div) VOUT1 (10mV/Div) VOUT1 (10mV/Div) 3.8 3.8 Time (100μs/Div) Time (100μs/Div) Line Transient Response Load Transient Response RT9011-GS, Both ILOAD = 100mA VIN = 3.8V to 4.8V VIN 4.8 (V) RT9011-GS, ILOAD = 10mA to 50mA VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R IOUT (50mA/Div) 3.8 VOUT2 (10mV/Div) VOUT1 (20mV/Div) VOUT1 (10mV/Div) VOUT2 (20mV/Div) Time (100μs/Div) Time (250μs/Div) Load Transient Response Start Up RT9011-GS, ILOAD = 10mA to 100mA VIN = VEN = 4.3V CIN = COUT1 = COUT2 = 1uF/X7R IOUT (100mA/Div) RT9011-FM, VIN = 5V IOUT1 = IOUT2 = 50mA (5V/Div) V EN V OUT2 VOUT1 (20mV/Div) V OUT1 VOUT2 (20mV/Div) (1V/Div) Time (250μs/Div) DS9011-08 April 2011 Time (5μs/Div) www.richtek.com 7 RT9011 PSRR PSRR EN Pin Shutdown Response 20 RT9011-FM, VIN = 5V IOUT1 = IOUT2 = 50mA IOUT = 50mA 0 V EN PSRR(dB) (5V/Div) V OUT2 V OUT1 -20 -40 -60 (1V/Div) -80 Time (50μs/Div) 10 100 1000 1k 10000 10k 100000 100k 1000000 1M Frequency(Hz) Noise RT9011-GS, No LOAD VIN = VEN = 4.5V(By battery) 150 CIN = COUT1 = COUT2 = 1uF/X7R RT9011-GS, ILOAD = 50mA VIN = VEN = 4.5V(By battery) 300 CIN = COUT1 = COUT2 = 1uF/X7R 100 200 Noise (μV/Div) Noise (μV/Div) Noise 50 0 -50 100 0 -100 -100 -200 -150 -300 Time (10ms/Div) Time (10ms/Div) EN1 Pin Response EN2 Pin Response VEN1 VEN2 VEN1 VEN1 (2V/Div) VEN1 VEN2 (2V/Div) VEN2 VEN2 (2V/Div) V OUT2 (2V/Div) V OUT1 V OUT1 (1V/Div) Time (10ms/Div) www.richtek.com 8 (1V/Div) V OUT2 Time (10ms/Div) DS9011-08 April 2011 RT9011 Applications Information Like any low-dropout regulator, the external capacitors used with the RT9011 must be carefully selected for regulator stability and performance. Using a capacitor whose value is > 1μF on the RT9011 input and the amount of capacitance can be increased without limit. The input capacitor must be located a distance of not more than 0.5 inch from the input pin of the IC and returned to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor. The capacitor with larger value and lower ESR (equivalent series resistance) provides better PSRR and line-transient response. The output capacitor must meet both requirements for minimum amount of capacitance and ESR in all LDOs application. The RT9011 is designed specifically to work with low ESR ceramic output capacitor in space-saving and performance consideration. Using a ceramic capacitor whose value is at least 1μF with ESR is > 20mΩ on the RT9011 output ensures stability. The RT9011 still works well with output capacitor of other types due to the wide stable ESR range. Figure 1. shows the curves of allowable ESR range as a function of load current for various output capacitor values. Output capacitor of larger capacitance can reduce noise and improve load transient response, stability, and PSRR. The output capacitor should be located not more than 0.5 inch from the VOUT pin of the RT9011 and returned to a clean analog ground. Region of Stable COUT ESR vs. Load Current Region ESR (Ω) (Ω) OUT ESR RegionofofStable StableCCOUT 100 RT9011-FM, VIN = 5V CIN = COUT1 = COUT2 = 1uF/X7R Thermal Considerations Thermal protection limits power dissipation in RT9011. When the operation junction temperature exceeds 170°C, the OTP circuit starts the thermal shutdown function and turns the pass element off. The pass element turns on again after the junction temperature cools by 40°C. RT9011 lowers its OTP trip level from 170°C to 110°C when output short circuit occurs (VOUT < 0.4V) as shown in Figure 2. It limits IC case temperature under 100°C and provides maximum safety to customer while output short circuit occurring. VOUT Short to GND 0.4V VOUT IOUT TSD 170 °C 110 °C OTP Trip Point 110 °C IC Temperature 80 °C Figure 2. Short Circuit Thermal Folded Back Protection when Output Short Circuit Occurs (Patent) For continuous operation, do not exceed absolute maximum operation junction temperature 125°C. The power dissipation definition in device is : 10 Unstable Range 1 PD = (VIN-VOUT) x IOUT + VIN x IQ Stable Range 0.1 0.01 The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : Simulation Verify 0.001 0 50 100 150 200 Load Current (mA) Figure 1. Stable Cout ESR Range DS9011-08 April 2011 250 300 PD(MAX) = ( TJ(MAX) - TA ) /θJA Where T J(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. www.richtek.com 9 RT9011 For recommended operating conditions specification of RT9011, the maximum junction temperature is 125°C. The junction to ambient thermal resistance ( θJA is layout dependent ) for TSOT-23-6 is 220°C/W, WDFN-8L 2x2 is 165°C/W, WDFN-10L 3x3 is 108°C/W, WDFN-8L 3x3 is 108°C/W and WDFN-8L 1.6x1.6 is 175°C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : PD(MAX) = ( 125°C − 25°C ) / (220°C/W) = 0.455W for TSOT-23-6 packages PD(MAX) = ( 125°C − 25°C ) / (165°C/W) = 0.606W for WDFN-8L 2x2 packages PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for WDFN-10L 3x3 packages PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for WDFN-8L 3x3 packages PD(MAX) = ( 125°C − 25°C ) / (175°C/W) = 0.571W for WDFN-6L 1.6x1.6 packages The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. For RT9011 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. 1 Single Layer PCB Power Dissipation (W) 0.9 WDFN-8L 3x3 WDFN-10L 3x3 0.8 0.7 WDFN-8L 2x2 0.6 0.5 TSOT-23-6 0.4 0.3 WDFN-6L 1.6x1.6 0.2 0.1 0 0 25 50 75 100 125 Ambient Temperature (°C) Figure 3. Derating Curves for RT9011 Packages www.richtek.com 10 DS9011-08 April 2011 RT9011 Outline Dimension H D L C B b A A1 e Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 1.000 0.028 0.039 A1 0.000 0.100 0.000 0.004 B 1.397 1.803 0.055 0.071 b 0.300 0.559 0.012 0.022 C 2.591 3.000 0.102 0.118 D 2.692 3.099 0.106 0.122 e 0.838 1.041 0.033 0.041 H 0.080 0.254 0.003 0.010 L 0.300 0.610 0.012 0.024 TSOT-23-6 Surface Mount Package DS9011-08 April 2011 www.richtek.com 11 RT9011 D2 D L E E2 1 SEE DETAIL A 2 e A A1 1 2 1 b DETAIL A Pin #1 ID and Tie Bar Mark Options A3 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 1.950 2.050 0.077 0.081 D2 1.000 1.250 0.039 0.049 E 1.950 2.050 0.077 0.081 E2 0.400 0.650 0.016 0.026 e L 0.500 0.300 0.020 0.400 0.012 0.016 W-Type 8L DFN 2x2 Package www.richtek.com 12 DS9011-08 April 2011 RT9011 D2 D L E E2 1 SEE DETAIL A 2 e A A1 1 2 1 b DETAIL A Pin #1 ID and Tie Bar Mark Options A3 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.180 0.300 0.007 0.012 D 2.950 3.050 0.116 0.120 D2 2.300 2.650 0.091 0.104 E 2.950 3.050 0.116 0.120 E2 1.500 1.750 0.059 0.069 e L 0.500 0.350 0.020 0.450 0.014 0.018 W-Type 10L DFN 3x3 Package DS9011-08 April 2011 www.richtek.com 13 RT9011 D2 D L E E2 1 e SEE DETAIL A 2 b 2 1 DETAIL A Pin #1 ID and Tie Bar Mark Options A A1 1 A3 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 2.950 3.050 0.116 0.120 D2 2.100 2.350 0.083 0.093 E 2.950 3.050 0.116 0.120 E2 1.350 1.600 0.053 0.063 e L 0.650 0.425 0.026 0.525 0.017 0.021 W-Type 8L DFN 3x3 Package www.richtek.com 14 DS9011-08 April 2011 RT9011 D2 D L E E2 1 e 2 b A A1 SEE DETAIL A 1 2 1 DETAIL A Pin #1 ID and Tie Bar Mark Options A3 Note : The configuration of the Pin #1 identifier is optional, but must be located within the zone indicated. Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A3 0.175 0.250 0.007 0.010 b 0.200 0.300 0.008 0.012 D 1.550 1.650 0.061 0.065 D2 0.950 1.050 0.037 0.041 E 1.550 1.650 0.061 0.065 E2 0.550 0.650 0.022 0.026 e L 0.500 0.190 0.020 0.290 0.007 0.011 W-Type 6L DFN 1.6x1.6 Package Richtek Technology Corporation Richtek Technology Corporation Headquarter Taipei Office (Marketing) 5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377 Email: marketing@richtek.com Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. DS9011-08 April 2011 www.richtek.com 15