®
RT9146/7
20V, 1A, Rail-to-Rail Operational Amplifier
General Description
Features
The RT9146/7 consists of a low power, high slew rate,
single supply rail-to-rail input and output operational
amplifier.
z
Rail-to-Rail Output Swing
z
Supply Voltage : 6V to 20V
Peak Output Current : 1A
High Slew Rate : 35V/μ
μs
Unity Gain Stable
RoHS Compliant and Halogen Free
The RT9146 contains a single amplifier and the RT9147
contains two amplifiers in one package.
z
z
z
z
The RT9146/7 has a high slew rate (35V/μs), 1A peak
output current and offset voltage below 15mV. The RT9146/
7 is ideal for Thin Film Transistor Liquid Crystal Displays
(TFT-LCD) .
The RT9146 is available in the WDFN-8L 3x3 package,
and the RT9147 is available in the WQFN-16L 4x4
package. The RT9146/7 are specified for operation over
the full −40°C to 85°C temperature range.
Applications
z
z
z
z
TFT-LCD Panels
Notebook Computers
Monitors
LCD TVs
Pin Configurations
(TOP VIEW)
NC
VINVIN+
VS-
RT9146
Package Type
QW : WDFN-8L 3x3
QWA : WDFN-8SL 3x3
7
3
6
4
9
5
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
NC
NC
VOUTB
NC
Package Type
QW : WQFN-16L 4x4
16
15
14
13
NC
1
12
VINB-
11
VINB+
10
VS-
9
VINA+
NC
2
VS+
3
NC
4
VS-
7
8
VINA-
RoHS compliant and compatible with the current require-
6
NC
NC
5
VOUTA
17
Richtek products are :
ments of IPC/JEDEC J-STD-020.
`
NC
VS+
VOUT
NC
RT9146
RT9147
`
8
2
WDFN-8L 3x3 / WDFN-8SL 3x3
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Note :
1
VS-
Ordering Information
Suitable for use in SnPb or Pb-free soldering processes.
WQFN-16L 4x4
RT9147
Marking Information
RT9146ZQW
85 YM
DNN
RT9146ZQWA
RT9147ZQW
85 : Product Code
2W : Product Code
YMDNN : Date Code
YMDNN : Date Code
2W YM
DNN
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
43 : Product Code
43 YM
DNN
YMDNN : Date Code
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT9146/7
Typical Application Circuit
VS+
VS+
VINx+
VINx-
+
VOUTx
RS*
-
TFT-LCD
Capacitance
VS-
* : RS may be needed for some applications.
Functional Pin Description
RT9146
Pin No.
WDFN-8L WDFN-8SL Pin Name
3x3
3x3
1, 5, 8
NC
No Internal Connection.
Pin Function
2
VIN−
Negative Input.
3
VIN+
Positive Input.
4,
9 (Exposed Pad)
VS−
Negative Supply Input. The exposed pad must be soldered to a large PCB
and connected to VS− for maximum power dissipation.
6
VOUT
Output.
7
VS+
Positive Supply Input. Bypass VS+ to VS− with a 0.1μF capacitor placed as
close as possible to the device.
RT9147
Pin No.
Pin Name
1, 2, 4, 5, 6, 13, 15, 16 NC
Pin Function
No Internal Connection.
3
VS+
Positive Supply Input. Bypass VS+ to VS− with a 0.1μF capacitor placed as
close as possible to the device.
7
VOUTA
Output of Amplifier A.
8
VINA−
Positive Input of Amplifier A.
9
VINA+
Negative Input of Amplifier A.
VS−
Negative Supply Input. The exposed pad must be soldered to a large PCB
and connected to VS− for maximum power dissipation.
11
VINB+
Positive Input of Amplifier B.
12
VINB−
Negative Input of Amplifier B.
14
VOUTB
Output of Amplifier B.
10,
17 (Exposed Pad)
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013
RT9146/7
Function Block Diagram
VS+
VINVIN+
-
VOUT
+
VS-
RT9146
VOUTA
VOUTB
VINA-
-
-
VINB-
VINA+
VS+
+
+
VINB+
VS-
RT9147
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
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3
RT9146/7
Absolute Maximum Ratings
z
z
z
z
z
z
z
z
z
(Note 1)
Supply Voltage, (VS+ to VS−) ------------------------------------------------------------------------------------------- 24V
VINx+, VINx− to VS− ------------------------------------------------------------------------------------------------------- −0.3V to 24V
VINx+ to VINx− -------------------------------------------------------------------------------------------------------------- ±5V
Power Dissipation, PD @ TA = 25°C
WDFN-8L 3x3 ---------------------------------------------------------------------------------------------------------------- 3.22W
WDFN-8SL 3x3 -------------------------------------------------------------------------------------------------------------- 3.22W
WQFN-16L 4x4 -------------------------------------------------------------------------------------------------------------- 3.51W
Package Thermal Resistance (Note 2)
WDFN-8L 3x3, θJA ----------------------------------------------------------------------------------------------------------- 31°C/W
WDFN-8L 3x3, θJC ----------------------------------------------------------------------------------------------------------- 8°C/W
WDFN-8SL 3x3, θJA --------------------------------------------------------------------------------------------------------- 31°C/W
WDFN-8SL 3x3, θJC -------------------------------------------------------------------------------------------------------- 8°C/W
WQFN-16L 4x4, θJA --------------------------------------------------------------------------------------------------------- 28.5°C/W
WQFN-16L 4x4, θJC -------------------------------------------------------------------------------------------------------- 7°C/W
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------------- 260°C
Junction Temperature ------------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range ---------------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------------ 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
z
z
z
(Note 4)
Supply Voltage, VS− = 0V, VS+ ----------------------------------------------------------------------------------------- 6V to 20V
Junction Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VS+ = 16V, VS− = 0V, VINx+ = VOUTx = VS+ / 2, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Characteristics
Input Offset Voltage
VOS
VCM = VS+ / 2
--
2
15
mV
Input Bias Current
IB
VCM = VS+ / 2
--
2
50
nA
Load Regulation
ΔVLOAD
IOUTx = 0 to −80mA
--
0.1
--
IOUTx = 0 to 80mA
--
−0.1
--
Common Mode Input
Range
CMIR
0.5
--
VS+
−0.5
V
Common Mode Rejection
Ratio
CMRR
0.5V ≤ VOUTx ≤ VS+ − 0.5V
--
95
--
dB
Open Loop Gain
AVOL
0.5V ≤ VOUTx ≤ VS+ − 0.5V
--
118
--
dB
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
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4
mV/mA
is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013
RT9146/7
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
0.6
1.5
V
VS+
− 1.5
VS+
− 0.3
--
V
800
1000
1400
mA
Output Characteristics
Output Swing Low
VOL
IL = −50mA
Output Swing High
VOH
IL = 50mA
Transient Peak Output
Current
IPK
Power Supply
Power Supply Rejection
Ratio
Quiescent Current
PSRR
VS+ = 6V to 20V, VCM = VOUTx = VS+ / 2
--
96
--
dB
IDD
No Load
--
4
--
mA
SR
4V step, 20% to 80%, AV = 1
--
35
--
V/μs
Setting to ±0.1% (AV = 1) tS
AV = 1, VOUTx = 2V step
RL = 10kΩ, CL = 10pF
--
270
--
ns
−3dB Bandwidth
BW
RL = 10kΩ, CL = 10pF
--
16
--
MHz
Gain-Bandwidth Product
GBWP
RL = 10kΩ, CL = 10pF
--
12
--
MHz
Phase Margin
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
PM
RL = 10kΩ, CL = 10pF
--
50°
--
--
TS
Temperature Rising
--
150
--
°C
--
20
--
°C
Dynamic Performance
Slew Rate
ΔT S
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
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5
RT9146/7
Typical Operating Characteristics
Supply Current vs. Temperature
Supply Current vs. Supply Voltage
5
Supply Current (mA)
Supply Current (mA)
5
4
3
2
4
3
2
1
Unity Gain, VIN+ = 8V,
VS+ = 16V, VS− = 0V
Unity Gain, VIN+ = VS+ / 2,
VS+ = 6V to 20V, VS− = 0V
1
0
6
8
10
12
14
16
18
20
-50
-25
0
Input Offset Voltage vs. Supply Voltage
50
75
100
125
Input Offset Voltage vs. Temperature
0.0
1
Input Offset Voltage (mV)
Input Offset Voltage (mV)
25
Temperature (°C)
Supply Voltage (V)
-0.5
-1.0
0
-1
-2
Unity Gain, VIN+ = 8V,
VS+ = 16V, VS− = 0V
Unity Gain, VIN+ = VS+ / 2,
VS+ = 6V to 20V, VS− = 0V
-1.5
-3
6
8
10
12
14
16
18
20
-50
-25
0
25
50
Supply Voltage (V)
Temperature (°C)
Output Voltage Swing vs. Supply Voltage
Rail to Rail
75
100
125
Output Voltage Swing (V)
0.4
Swing Low, VIN+ = 0V,
VIN− = 3V, ILOAD = −50mA
0.2
0.0
VIN+
(4V/Div)
-0.2
Swing High, VIN+ = 3V,
VIN− = 0V, ILOAD = 50mA
VOUT
(4V/Div)
-0.4
Unity Gain, VIN+ = 0.5V to 15.5V,
VS+ = 16V, VS− = 0V, f = 10kHz
VS+ = 6V to 20V, VS− = 0V
-0.6
6
8
10
12
14
16
18
20
Time (25μs/Div)
Supply Voltage (V)
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is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013
RT9146/7
Small Signal Response
Large Signal Response
VIN+_ac
coupled
(100mV/Div)
VIN+_ac
coupled
(2V/Div)
VOUT_ac
coupled
(100mV/Div)
VOUT_ac
coupled
(2V/Div)
Unity Gain, VIN+ = 6V to 10V,
VS+ = 16V, VS− = 0V, f = 100kHz
Unity Gain, VIN+ = 7.9V to 8.1V,
VS+ = 16V, VS− = 0V, f = 100kHz
Time (2.5μs/Div)
Time (2.5μs/Div)
Slew Rate
Slew Rate
Rising
Falling
VIN+
(5V/Div)
VIN+
(5V/Div)
VOUT
(5V/Div)
VOUT
(5V/Div)
Unity Gain, VIN+ = 4V to 8V,
VS+ = 16V, VS− = 0V, f = 10kHz
Time (50ns/Div)
Time (50ns/Div)
−3dB Bandwidth
Gain Bandwidth Product
Unity Gain, VIN+ = 8V, VS+ = 16V,
VS− = 0V, RL = 10kΩ, CL = 10pF
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
Unity Gain, VIN+ = 8V to 4V,
VS+ = 16V, VS− = 0V, f = 10kHz
Unity Gain, VIN+ = 8V, VS+ = 16V,
VS− = 0V, RL = 10kΩ, CL = 10pF
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RT9146/7
Applications Information
Operating Voltage
The RT9146/7 total supply voltage range is guaranteed
from 6V to 20V. The specifications are stable over both
full supply range and operating temperatures from −40°C
to 85°C. The output swing of the RT9146/7 typically
extends to within 1.5V of positive/negative supply rails
with 50mA load current source/sink. Decreasing the load
current will obtain an output swing even closer to the
supply rails.
Short-Circuit Condition
An internal short-circuit protection is implemented to
protect the device from output short-circuit. The RT9146/
7 limits the short-circuit current to ±1A if the output is
directly shorted to positive/negative supply rails.
LCD Panel Applications
The RT9146/7 is mainly designed for LCD V-com buffer.
The operational amplifier has 1A instantaneous source/
sink peak current.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-8L 3x3 package, the thermal resistance, θJA, is
31°C/W on a standard JEDEC 51-7 four-layer thermal test
board. For WDFN-8SL 3x3 package, the thermal
resistance, θJA, is 31°C/W on a standard JEDEC 51-7
four-layer thermal test board. For WQFN-16L 4x4 package,
the thermal resistance, θJA, is 28.5°C/W on a standard
JEDEC 51-7 four-layer thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by the
following formula :
P D(MAX) = (125°C − 25°C) / (31°C/W) = 3.22W for
WDFN-8L 3x3 package
P D(MAX) = (125°C − 25°C) / (31°C/W) = 3.22W for
WDFN-8SL 3x3 package
PD(MAX) = (125°C − 25°C) / (28.5°C/W) = 3.51W for
WQFN-16L 4X4 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 1 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
4.0
Maximum Power Dissipation (W)1
The RT9146/7 is a high performance operational amplifier
capable of driving large loads for different applications. A
high slew rates, rail-to-rail input and output capability, and
low power consumption are the features which make the
RT9146/7 ideal for LCD applications. The RT9146/7 also
has wide bandwidth and phase margin to drive a load with
10kΩ resistance and 10pF capacitance.
Four-Layer PCB
WQFN-16L 4x4
3.5
3.0
WDFN-8L 3x3
2.5
WDFN-8SL 3x3
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve of Maximum Power Dissipation
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013
RT9146/7
Layout Consideration
PCB layout is very important for designing power converter
circuits. The following layout guidelines should be strictly
followed for best performance of the RT9146/7.
`
Place the power components as close to the IC as
possible. The traces should be wide and short,
especially for the high current loop.
`
A series resistance may be needed at the output for
some applications.
`
Connect a 0.1μF capacitor from VINx+ to ground and
place it as close to the IC as possible for better
performance.
`
The exposed pad of the chip should be connected to a
large PCB plane for maximum thermal consideration.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
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9
RT9146/7
Outline Dimension
D2
D
L
E
E2
1
e
SEE DETAIL A
b
2
1
2
1
A
A1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.950
3.050
0.116
0.120
D2
2.100
2.350
0.083
0.093
E
2.950
3.050
0.116
0.120
E2
1.350
1.600
0.053
0.063
e
L
0.650
0.425
0.026
0.525
0.017
0.021
W-Type 8L DFN 3x3 Package
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is a registered trademark of Richtek Technology Corporation.
DS9146/7-03 May 2013
RT9146/7
2
1
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.900
3.100
0.114
0.122
D2
2.250
2.350
0.089
0.093
E
2.900
3.100
0.114
0.122
E2
1.450
1.550
0.057
0.061
0.650
e
L
0.300
0.026
0.400
0.012
0.016
W-Type 8SL DFN 3x3 Package
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9146/7-03 May 2013
is a registered trademark of Richtek Technology Corporation.
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11
RT9146/7
D
SEE DETAIL A
D2
L
1
E
E2
e
b
A
A1
A3
1
1
2
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.250
0.380
0.010
0.015
D
3.950
4.050
0.156
0.159
D2
2.000
2.450
0.079
0.096
E
3.950
4.050
0.156
0.159
E2
2.000
2.450
0.079
0.096
e
L
0.650
0.500
0.026
0.600
0.020
0.024
W-Type 16L QFN 4x4 Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS9146/7-03 May 2013
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