®
RT9148/9
20V, 350mA, Rail-to-Rail Operational Amplifier
General Description
Features
The RT9148/9 consists of a low power, high slew rate,
single supply rail-to-rail input and output operational
amplifier. The RT9148 contains a single amplifier and
RT9149 contains two amplifiers in one package.
Rail-to-Rail Output Swing
Supply Voltage : 6V to 20V
Peak Output Current : 350mA
High Slew Rate : 35V/μ
μs
Unity Gain Stable
RoHS Compliant and Halogen Free
The RT9148/9 has a high slew rate (35V/μs), 350mA peak
output current and offset voltage below 15mV. The
RT9148/9 is ideal for Thin Film Transistor Liquid Crystal
Displays (TFT-LCD).
The RT9148 is available in the WDFN-6L 2x2, TSOT-23-5
and UDFN-6L 2x2 packages. The RT9149 is available in
the WDFN-8L 3x3 package. The RT9148/9 are specified
for operation over the full temperature range from −40°C to
85°C.
Marking Information
Applications
TFT LCD Panels
Notebook Computers
Monitors
LCD TVs
Ordering Information
RT9148
Package Type
QW : WDFN-6L 2x2 (W-Type)
RT9148ZQW
0E : Product Code
0EW
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
W : Date Code
RT9148
RT9148GJ5
Package Type
J5 : TSOT-23-5
QU : UDFN-6L 2x2 (U-Type)
00 : Product Code
00=DNN
DNN : Date Code
Lead Plating System
G : Green (Halogen Free and Pb Free)
RT9148GQU
2D : Product Code
2DW
RT9149
W : Date Code
Package Type
QW : WDFN-8L 3x3 (W-Type)
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
RT9149ZQW
86 YM
DNN
86 : Product Code
Note :
YMDNN : Date Code
Richtek products are :
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9148/9-04
October 2013
Suitable for use in SnPb or Pb-free soldering processes.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT9148/9
Pin Configurations
1
NC
VS+
2
5
3
7
4
6
VS+
VIN-
5
4
VIN+
VINVOUT
2
VOUTA
VINAVINA+
VS-
3
1
8
2
7
3
VS-
VS-
VS-
(TOP VIEW)
6
4
9
5
VS+
VOUTB
VINBVINB+
VOUT VS- VIN+
WDFN-6L 2x2 / UDFN-6L 2x2
TSOT-23-5
WDFN-8L 3x3
RT9148
RT9148
RT9149
Typical Application Circuit
VS+
VS+
VINx+
VINx-
+
RS*
VOUTx
-
TFT-LCD
Capacitance
VS-
* : RS may be needed for some applications.
Function Block Diagram
VS+
VIN+
VIN-
-
VOUT
+
VS-
WDFN-6L 2x2 / UDFN-6L 2x2
RT9148
VS+
VIN+
VIN-
+
-
VOUT
VS-
TSOT-23-5
RT9148
VOUTA
VOUTB
VINA-
-
-
VINB-
VINA+
VS+
+
+
VINB+
VS-
WDFN-8L 3x3
RT9149
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is a registered trademark of Richtek Technology Corporation.
DS9148/9-04
October 2013
RT9148/9
Functional Pin Description
RT9148
Pin No.
Pin Name
WDFN-6L 2x2,
TSOT-23-5
UDFN-6L 2x2
Pin Function
1,
7 (Exposed Pad)
2
VS
Negative Supply Input.
2
--
NC
No Internal Connection.
3
5
VS+
Positive Supply Input.
4
1
VOUT
Output.
5
4
VIN
Negative Input.
6
3
VIN+
Positive Input.
RT9149
Pin No.
Pin Name
1
VOUTA
Output of Amplifier A.
2
VINA
Negative Input of Amplifier A.
3
VINA+
Positive Input of Amplifier A.
VS
Negative Supply Input.
5
VINB+
Positive Input of Amplifier B.
6
VINB
Negative Input of Amplifier B.
7
VOUTB
Output of Amplifier B.
8
VS+
Positive Supply Input.
4, 9 (Exposed Pad)
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9148/9-04
Pin Function
October 2013
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RT9148/9
Absolute Maximum Ratings
(Note 1)
Supply Voltage, (VS+ to VS−) ------------------------------------------------------------------------------------------- 24V
VINx+, VINx− to VS− ------------------------------------------------------------------------------------------------------- −0.3V to 24V
VINx+ to VINx− -------------------------------------------------------------------------------------------------------------- ±5V
Power Dissipation, PD @ TA = 25°C
WDFN-6L 2x2 ---------------------------------------------------------------------------------------------------------------- 2.1W
TSOT-23-5 --------------------------------------------------------------------------------------------------------------------- 0.43W
UDFN-6L 2x2 ----------------------------------------------------------------------------------------------------------------- 2.09W
WDFN-8L 3x3 ---------------------------------------------------------------------------------------------------------------- 3.22W
Package Thermal Resistance (Note 2)
WDFN-6L 2x2, θJA ----------------------------------------------------------------------------------------------------------- 47.5°C/W
TSOT-23-5, θJA --------------------------------------------------------------------------------------------------------------- 230.6°C/W
UDFN-6L 2x2, θJA ------------------------------------------------------------------------------------------------------------ 47.7°C/W
WDFN-8L 3x3, θJA ----------------------------------------------------------------------------------------------------------- 31°C/W
WDFN-8L 3x3, θJC ----------------------------------------------------------------------------------------------------------- 8°C/W
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------------- 260°C
Junction Temperature ------------------------------------------------------------------------------------------------------- 150°C
Storage Temperature Range ---------------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------------ 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)
Supply Voltage, VS− = 0V, VS+ ----------------------------------------------------------------------------------------- 6V to 20V
Junction Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ---------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VS+ = 16V, VS− = 0V, VINx+ = VOUTx = VS+ / 2, RL = 10kΩ and CL = 10pF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Characteristics
Input Offset Voltage
VOS
VCM = VS+ / 2
--
2
15
mV
Input Bias Current
IB
VCM = VS+ / 2
--
2
50
nA
Load Regulation
VLOAD
IL = 0 to 80mA
--
0.1
--
IL = 0 to 80mA
--
0.1
--
0.5
--
VS+
0.5
V
Common Mode Input
Range
Common Mode Rejection
Ratio
Open Loop Gain
CMIR
CMRR
0.5V VOUTx VS+ 0.5V
--
95
--
dB
AVOL
0.5V VOUTx VS+ 0.5V
--
118
--
dB
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
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mV/mA
is a registered trademark of Richtek Technology Corporation.
DS9148/9-04
October 2013
RT9148/9
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Characteristics
Output Swing Low
VOL
IL = 50mA
--
0.6
1.5
V
Output Swing High
VOH
IL = 50mA
VS+
1.5
VS+
0.3
--
V
Transient Peak Output
Current
IPK
300
350
400
mA
Power Supply
Power Supply Rejection
Ratio
Quiescent Current
PSRR
VS+ = 6V to 20V, VCM = VOUTx = VS+ / 2
--
96
--
dB
IDD
No Load
--
4
--
mA
SR
4V step, 20% to 80%, AV = 1
--
35
--
V/s
Setting to ±0.1% (AV = 1) tS
AV = 1, VOUTx = 2V step
RL = 10k, CL = 10pF
--
270
--
ns
3dB Bandwidth
BW
RL = 10k, CL = 10pF
--
16
--
MHz
Gain-Bandwidth Product
GBWP
RL = 10k, CL = 10pF
--
12
--
MHz
Phase Margin
PM
RL = 10k, CL = 10pF
--
50
--
--
Dynamic Performance
Slew Rate
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9148/9-04
October 2013
is a registered trademark of Richtek Technology Corporation.
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RT9148/9
Typical Operating Characteristics
Supply Current / Amplifier vs. Supply Voltage
Supply Current / Amplifier vs. Temperature
5
Supply Current (mA)
Supply Current (mA)
5
4
3
2
4
3
2
1
Unity Gain, One OP, VINx+ = VS+ / 2,
VS+ = 6V to 20V, VS− = 0V
Unity Gain, One OP, VINx+ = 8V,
VS+ = 16V, VS− = 0V
1
0
6
8
10
12
14
16
18
20
-50
-25
0
Supply Voltage (V)
Input Offset Voltage vs. Supply Voltage
50
75
100
125
Input Offset Voltage vs. Temperature
0.5
2
Input Offset Voltage (mV)
Input Offset Voltage (mV)
25
Temperature (°C)
0.0
-0.5
1
0
-1
Unity Gain, VINA+ = VS+ / 2,
VS+ = 6V to 20V, VS− = 0V
Unity Gain, VINA+ = 8V, VS+ = 16V, VS− = 0V
-1.0
-2
6
8
10
12
14
16
18
20
-50
-25
0
25
50
Supply Voltage (V)
Temperature (C)
Output Voltage Swing vs. Supply Voltage
Rail to Rail
75
100
125
Output Voltage Swing (V)
0.4
Unity Gain,
f = 10kHz
Swing Low, VINA+ = 0V,
VINA− = 3V, ILOAD = −50mA
0.2
0.0
Swing High, VINA+ = 3V,
VINA− = 0V, ILOAD = 50mA
-0.2
VINA+
(2.8V/Div)
VOUTA
(2.8V/Div)
-0.4
VS+ = 6V to 20V, VS− = 0V
VINA+ = 0.5V to 15.5V, VS+ = 16V, VS− = 0V
-0.6
6
8
10
12
14
16
18
20
Time (25μs/Div)
Supply Voltage (V)
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is a registered trademark of Richtek Technology Corporation.
DS9148/9-04
October 2013
RT9148/9
Small Signal Response
Large Signal Response
VINA+_ac
coupled
(100mV/Div)
VINA+_ac
coupled
(2V/Div)
VOUTA_ac
coupled
(100mV/Div)
VOUTA_ac
coupled
(2V/Div)
Unity Gain, VINA+ = 7.9V to 8.1V,
VS+ = 16V, VS− = 0V, f = 100kHz
Unity Gain, VINA+ = 6V to 10V,
VS+ = 16V, VS− = 0V, f = 100kHz
Time (2.5μs/Div)
Time (2.5μs/Div)
Slew Rate
Slew Rate
Falling
Rising
VINA+
(5V/Div)
VINA+
(5V/Div)
VOUTA
(5V/Div)
VOUTA
(5V/Div)
Unity Gain, VINA+ = 4V to 8V,
VS+ = 16V, VS− = 0V, f = 10kHz
Time (50ns/Div)
Time (50ns/Div)
−3dB Bandwidth
Gain Bandwidth Product
Unity Gain, VINA+ = 8V, VS+ = 16V,
VS− = 0V, RL = 10kΩ, CL = 10pF
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
DS9148/9-04
Unity Gain, VINA+ = 8V to 4V,
VS+ = 16V, VS− = 0V, f = 10kHz
October 2013
Unity Gain, VINA+ = 8V, VS+ = 16V,
VS− = 0V, RL = 10kΩ, CL = 10pF
is a registered trademark of Richtek Technology Corporation.
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RT9148/9
Applications Information
The RT9148/9 is a high performance operational amplifier
capable of driving large loads for different applications. A
high slew rates, rail-to-rail input and output capability, and
low power consumption are the features which make the
RT9148/9 ideal for LCD applications. The RT9148/9 also
has wide bandwidth and phase margin to drive a load with
10kΩ resistance and 10pF capacitance.
Operating Voltage
The RT9148/9 total supply voltage range is guaranteed
from 6V to 20V. The specifications are stable over both
the full supply range and operating temperatures from
−40°C to 85°C. The output swing of the RT9148/9 typically
extends to within 1.5V of positive/negative supply rails
with 50mA load current source/sink. Decreasing the load
current will obtain an output swing even closer to the
supply rails.
Short Circuit Condition
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-6L 2x2 packages, the thermal resistance, θJA, is
47.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. For TSOT-23-5 packages, the thermal
resistance, θJA, is 230.6°C/W on a standard JEDEC 51-7
four-layer thermal test board. For UDFN-6L 2x2 packages,
the thermal resistance, θJA, is 47.7°C/W on a standard
JEDEC 51-7 four-layer thermal test board. For WDFN-8L
3x3 packages, the thermal resistance, θJA, is 31°C/W on
a standard JEDEC 51-7 four-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by the following formula :
PD(MAX) = (125°C − 25°C) / (47.5°C/W) = 2.1W for
WDFN-6L 2x2 package
PD(MAX) = (125°C − 25°C) / (230.6°C/W) = 0.43W for
TSOT-23-5 package
An internal short circuit protection is implemented to
protect the device from output short circuit. The
RT9148/9 limits the short circuit current to ±350mA if the
output is directly shorted to positive/negative supply rails.
PD(MAX) = (125°C − 25°C) / (47.7°C/W) = 2.09W for
WDFN-6L 2x2 package
LCD Panel Applications
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 1 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
The RT9148/9 is mainly designed for LCD V-com buffer.
The operational amplifier has 350mA instantaneous source/
sink peak current.
P D(MAX) = (125°C − 25°C) / (31°C/W) = 3.22W for
WDFN-8L 3x3 package
Thermal Considerations
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
Maximum Power Dissipation (W)1
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
4.0
Four-Layer PCB
3.6
WDFN 8L 3x3
3.2
2.8
2.4
UDFN 6L 2x2
2.0
WDFN 6L 2x2
1.6
1.2
0.8
TSOT-23-5
0.4
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve of Maximum Power Dissipation
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is a registered trademark of Richtek Technology Corporation.
DS9148/9-04
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RT9148/9
Layout Consideration
PCB layout is very important for designing power converter
circuits. The following layout guidelines should be strictly
followed for best performance of the RT9148/9.
Place the power components as close to the IC as
possible. The traces should be wide and short,
especially for the high current loop.
A series resistance may be needed at the output for
some applications.
Connect a 0.1μF capacitor from VINx+ to ground and
place it as close to the IC as possible for better
performance.
The exposed pad of the chip should be connected to a
large PCB plane for maximum thermal consideration.
Copyright © 2013 Richtek Technology Corporation. All rights reserved.
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RT9148/9
Outline Dimension
D2
D
L
E
E2
1
e
b
A
A1
SEE DETAIL A
2
1
2
1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.350
0.008
0.014
D
1.950
2.050
0.077
0.081
D2
1.000
1.450
0.039
0.057
E
1.950
2.050
0.077
0.081
E2
0.500
0.850
0.020
0.033
e
L
0.650
0.300
0.026
0.400
0.012
0.016
W-Type 6L DFN 2x2 Package
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RT9148/9
H
D
L
B
C
b
A
A1
e
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
1.000
0.028
0.039
A1
0.000
0.100
0.000
0.004
B
1.397
1.803
0.055
0.071
b
0.300
0.559
0.012
0.022
C
2.591
3.000
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
TSOT-23-5 Surface Mount Package
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RT9148/9
2
1
2
1
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min.
Max.
Min.
Max.
A
0.500
0.600
0.020
0.024
A1
0.000
0.050
0.000
0.002
A3
0.100
0.175
0.004
0.007
b
0.200
0.300
0.008
0.012
D
1.900
2.100
0.075
0.083
D2
1.350
1.450
0.053
0.057
E
1.900
2.100
0.075
0.083
E2
0.750
0.850
0.030
0.033
e
L
0.650
0.300
0.026
0.400
0.012
0.016
U-Type 6L DFN 2x2 Package
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RT9148/9
D2
D
L
E
E2
1
e
SEE DETAIL A
b
2
1
2
1
A
A1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
2.950
3.050
0.116
0.120
D2
2.100
2.350
0.083
0.093
E
2.950
3.050
0.116
0.120
E2
1.350
1.600
0.053
0.063
e
L
0.650
0.425
0.026
0.525
0.017
0.021
W-Type 8L DFN 3x3 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9148/9-04
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