®
RT9166/A
300/600mA, Ultra-Fast Transient Response LDO Regulator
General Description
Features
The RT9166/A series are CMOS low dropout regulators
optimized for ultra-fast transient response. The devices
are capable of supplying 300mA or 600mA of output current
with a dropout voltage of 230mV or 580mV respectively.
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The RT9166/A series are is optimized for CD/DVD-ROM,
CD/RW or wireless communication supply applications.
The RT9166/A regulators are stable with output capacitors
as low as 1μF. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio.
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The devices are available in fixed output voltages range of
1.2V to 4.5V with 0.1V per step. The RT9166/A regulators
are available in 3-lead SOT-23 (RT9166 only), SOT-89,
SOT-223, TO-92 and TO-252 packages.
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μA)
Low Quiescent Current (Typically 220μ
Guaranteed 300/600mA Output Current
Low Dropout Voltage : 230/580mV at 300/600mA
Wide Operating Voltage Ranges : 3V to 5.5V
Ultra-Fast Transient Response
Tight Load and Line Regulation
Current Limiting Protection
Thermal Shutdown Protection
Only Low-ESR Ceramic Capacitor Required for
Stability
Custom Voltage Available
RoHS Compliant and 100% Lead (Pb)-Free
Applications
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Ordering Information
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RT9166/A-
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CD/DVD-ROM, CD/RW
Wireless LAN Card/Keyboard/Mouse
Battery-Powered Equipment
XDSL Router
PCMCIA Card
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Package Type
VL : SOT-23-3 (L-Type) (RT9166 Only) z
X : SOT-89
XL : SOT-89 (L-Type)
Marking Information
G : SOT-223
GL : SOT-223 (L-Type)
For marking information, contact our sales representative
Z : TO-92
directly or through a Richtek distributor located in your
L : TO-252
area.
Lead Plating System
P : Pb Free
Pin Configurations
G : Green (Halogen Free and Pb Free)
(TOP VIEW)
Output Voltage
12 : 1.2V
13 : 1.3V
:
45 : 4.5V
1B : 1.25V
600mA Output Current
300mA Output Current
VIN
3
2
GND
VOUT
SOT-23-3 (L-Type) (RT9166)
Note :
Richtek products are :
`
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
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DS9166/A-23 June 2012
3
VOUT
2
GND
1
VIN
TO-92
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1
RT9166/A
1
3
1
VIN
GND
2
2
3
1
2
1
2
3
GND
VIN
(TAB)
VOUT
3
1
2
3
GND
VOUT GND
(TAB)
SOT-89
VIN VOUT
(TAB)
VOUT GND
(TAB)
SOT-89 (L-Type)
VIN
SOT-223
SOT-223 (L-Type)
VOUT
VIN
TO-252
Typical Application Circuit
RT9166/A
VIN
VIN
CIN
VOUT
COUT
GND
VOUT
1uF
1uF
μF minimum X7R or X5R dielectric is strongly recommended if ceramics are
Note: To prevent oscillation, a 1μ
used as input/output capacitors. When using the Y5V dielectric, the minimum value of the input/output
μF. (see Application
capacitance that can be used for stable over full operating temperature range is 3.3μ
Information Section for further details)
Functional Pin Description
Pin Name
Pin Function
VIN
Supply Input.
VOUT
Regulator Output.
GND
Common Ground.
Function Block Diagram
VIN
VOUT
Thermal
Shutdown
Error
Amplifier
-
+
Current
Limiting
Sensor
1.2V
Reference
GND
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is a registered trademark of Richtek Technology Corporation.
DS9166/A-23 June 2012
RT9166/A
Absolute Maximum Ratings
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(Note 1)
Supply Input Voltage ------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
SOT-23-3 --------------------------------------------------------------------------------------------------------------SOT-89 -----------------------------------------------------------------------------------------------------------------SOT-223 ---------------------------------------------------------------------------------------------------------------TO-252 -----------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
SOT-23-3, θJA ---------------------------------------------------------------------------------------------------------SOT-89, θJA -----------------------------------------------------------------------------------------------------------SOT-89, θJC -----------------------------------------------------------------------------------------------------------SOT-223, θJA ----------------------------------------------------------------------------------------------------------SOT-223, θJC ---------------------------------------------------------------------------------------------------------TO-252, θJA -----------------------------------------------------------------------------------------------------------TO-252, θJC -----------------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------------Storage Temperature Range --------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) -----------------------------------------------------------------------------------------
Recommended Operating Conditions
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6.5V
0.4W
0.571W
0.740W
1.470W
250°C/W
175°C/W
58°C/W
135°C/W
15°C/W
68°C/W
7°C/W
260°C
150°C
−65°C to 150°C
2kV
(Note 4)
Supply Input Voltage ------------------------------------------------------------------------------------------------- 2.8V to 5.5V
Junction Temperature Range --------------------------------------------------------------------------------------- − 40°C to 125°C
Ambient Temperature Range --------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V or VIN = 2.8V whichever is greater, CIN = 1μF, COUT = 1μF, TA = 25° C, unless otherwise specified)
Parameter
Symbol
Output Voltage Accuracy
RT9166
Current Limit
Quiescent Current
RT9166A
(Note 5)
Dropout Voltage
(Note 6)
RT9166
RT9166A
RT9166
RT9166A
Min
Typ
Max
Unit
−1
--
3
%
300
--
--
600
--
--
ΔVOUT
IOUT = 1mA
ILIM
RLOAD = 1Ω
IQ
IOUT = 0mA
--
220
300
IOUT = 300mA
--
230
--
IOUT = 600mA
--
580
--
VIN = (VOUT + 0.3V) to 5.5V,
IOUT = 1mA
--
0.2
--
1mA < IOUT < 300mA
--
15
35
1mA < IOUT < 600mA
--
30
55
f = 1kHz, COUT = 1μF
--
−55
--
dB
VDROP
ΔVLINE
Line Regulation
Load Regulation
(Note 7)
Test Conditions
ΔVLOAD
mA
μA
mV
%/V
mV
Power Supply Rejection Rate
PSRR
Thermal Shutdown Temperature
TSD
--
170
--
°C
Thermal Shutdown Hysteresis
ΔTSD
--
40
--
°C
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DS9166/A-23 June 2012
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RT9166/A
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under
no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground
pin current.
Note 6.The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 7. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 300mA and 600mA respectively.
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DS9166/A-23 June 2012
RT9166/A
Typical Operating Characteristics
Power Supply Rejection Ratio
Dropout Voltage vs. Load Current
700
CIN = 1uF
COUT = 1uF
600
VIN = 5V
CIN = 1uF
COUT = 1uF
TJ = 125°C
-10
500
TJ = 25°C
400
300
TJ = −40°C
200
-20
PSRR (dB)
Dropout Voltage (mV)
0
-30
100mA
-40
1mA
-50
100
0
-60
0
100
200
300
400
500
10
600
1k
10k
Load Current (mA)
Frequency (Hz)
Region of Stable COUT ESR vs. Load Current
Output Noise
100.00
Output Noise Signal (μV)
10.00
Instable
1.00
Stable
0.10
Instable
0.01
100k
1M
ILOAD = 100mA
COUT = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF to 4.7uF
COUT ESR (Ω)
100
400
200
0
-200
-400
f = 10Hz to 100KHz
0.00
0
100
200
300
400
500
Time (1ms/DIV)
600
Load Current (mA)
Current Limit vs. Input voltage
900
850
850
Current Limit (mA)
Current Limit (mA)
Current Limit vs. Input voltage
900
800
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
750
800
750
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
RT9166-33xX
700
700
3
3.5
4
4.5
5
Input voltage (V)
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9166/A-23 June 2012
5.5
3
3.5
RT9166-33xVL
4
4.5
5
5.5
Input voltage (V)
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RT9166/A
Current Limit vs. Temperature
900
850
850
Current Limit (mA)
Current Limit (mA)
Current Limit vs. Temperature
900
800
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
750
800
750
RT9166-33xX
700
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
RT9166-33xVL
700
-40
-50
-25
0
25
50
75
100
125
-50
-40
-25
0
Temperature (°C)
240
240
Quiescent Current (µA) 1
Quiescent Current (µA) 1
260
220
200
180
-25
0
25
50
180
160
VIN = 5V
CIN = 1uF
COUT = 1uF
RT9166-33xVL
75
100
125
-50
-40
-25
0
25
50
75
Temperature Stability
3.35
3.35
Output Voltage (V)
3.40
3.30
3.25
3.30
3.25
VIN = 5V
CIN = 1uF
COUT = 1uF
RT9166-33xX
3.20
RT9166-33xVL
3.20
-25
0
25
50
75
100
Temperature (°C)
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125
Temperature Stability
3.40
-40
-50
100
Temperature (°C)
Temperature (°C)
VIN = 5V
CIN = 1uF
COUT = 1uF
125
200
140
-50
-40
100
220
RT9166-33xX
140
Output Voltage (V)
75
Quiescent Current vs. Temperature
Quiescent Current vs. Temperature
VIN = 5V
CIN = 1uF
COUT = 1uF
50
Temperature (°C)
260
160
25
125
-40
-50
-25
0
25
50
75
100
125
Temperature (°C)
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DS9166/A-23 June 2012
RT9166/A
VIN = 5V, ILOAD = 1 to 150mA
CIN = COUT = 1uF (Ceramic, X7R)
Load
Current (mA)
200
100
0
20
0
-20
Load Transient Response
RT9166-33xX
Time (100μs/Div)
Output Voltage
Deviation (mV)
Output Voltage
Deviation (mV)
Load
Current (mA)
Load Transient Response
200
VIN = 5V, ILOAD = 1 to 150mA
CIN = COUT = 1uF (Ceramic, X7R)
100
0
20
0
-20
RT9166-33xVL
Time (100μs/Div)
Output Voltage
Deviation (mV)
Input Voltage
Deviation (V)
Line Transient Response
5
VIN = 4 to 5V
CIN = 1uF
COUT = 1uF
4
20
0
-20
Time (100μs/Div)
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DS9166/A-23 June 2012
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RT9166/A
Application Information
Like any low-dropout regulator, the RT9166/A series
requires input and output decoupling capacitors. These
capacitors must be correctly selected for good performance
(see Capacitor Characteristics Section). Please note that
linear regulators with a low dropout voltage have high
internal loop gains which require care in guarding against
oscillation caused by insufficient decoupling capacitance.
Input Capacitor
An input capacitance of ≅ 1μF is required between the
device input pin and ground directly (the amount of the
capacitance may be increased without limit). The input
capacitor MUST be located less than 1 cm from the device
to assure input stability (see PCB Layout Section). A lower
ESR capacitor allows the use of less capacitance, while
higher ESR type (like aluminum electrolytic) require more
capacitance.
Capacitor types (aluminum, ceramic and tantalum) can
be mixed in parallel, but the total equivalent input
capacitance/ESR must be defined as above to stable
operation.
There are no requirements for the ESR on the input
capacitor, but tolerance and temperature coefficient must
be considered when selecting the capacitor to ensure the
capacitance will be ≅ 1μF over the entire operating
temperature range.
Output Capacitor
The RT9166/A is designed specifically to work with very
small ceramic output capacitors. The recommended
minimum capacitance (temperature characteristics X7R
or X5R) is 1μF to 4.7μF range with 10mΩ to 50mΩ range
ceramic capacitor between LDO output and GND for
transient stability, but it may be increased without limit.
Higher capacitance values help to improve transient. The
output capacitor's ESR is critical because it forms a zero
to provide phase lead which is required for loop stability.
(When using the Y5V dielectric, the minimum value of
the input/output capacitance that can be used for stable
over full operating temperature range is 3.3μF.)
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No Load Stability
The device will remain stable and in regulation with no
external load. This is specially important in CMOS RAM
keep-alive applications.
Input-Output (Dropout) Voltage
A regulator's minimum input-to-output voltage differential
(dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this determines the
useful end-of-life battery voltage. Because the device uses
a PMOS, its dropout voltage is a function of drain-tosource on-resistance, RDS(ON), multiplied by the load
current :
VDROPOUT = VIN − VOUT = RDS(ON) x IOUT
Current Limit
The RT9166/A monitors and controls the PMOS' gate
voltage, minimum limiting the output current to 300mA for
RT9166 and 600mA for RT9166A. The output can be
shorted to ground for an indefinite period of time without
damaging the part.
Short-Circuit Protection
The device is short circuit protected and in the event of a
peak over-current condition, the short-circuit control loop
will rapidly drive the output PMOS pass element off. Once
the power pass element shuts down, the control loop will
rapidly cycle the output on and off until the average power
dissipation causes the thermal shutdown circuit to
respond to servo the on/off cycling to a lower frequency.
Please refer to the section on thermal information for power
dissipation calculations.
Capacitor Characteristics
It is important to note that capacitance tolerance and
variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required
amount of capacitance is provided over the full operating
temperature range. In general, a good tantalum capacitor
will show very little capacitance variation with temperature,
but a ceramic may not be as good (depending on dielectric
type).
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RT9166/A
Aluminum electrolytics also typically have large
temperature variation of capacitance value.
Equally important to consider is a capacitor's ESR change
with temperature: this is not an issue with ceramics, as
their ESR is extremely low. However, it is very important
in Tantalum and aluminum electrolytic capacitors. Both
show increasing ESR at colder temperatures, but the
increase in aluminum electrolytic capacitors is so severe
they may not be feasible for some applications.
Ceramic :
For values of capacitance in the 10μF to 100μF range,
ceramics are usually larger and more costly than tantalums
but give superior AC performance for by-passing high
frequency noise because of very low ESR (typically less
than 10mΩ). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half
of the rated voltage applied to it. The Z5U and Y5V also
exhibit a severe temperature effect, losing more than 50%
of nominal capacitance at high and low limits of the
temperature range.
X7R and X5R dielectric ceramic capacitors are strongly
recommended if ceramics are used, as they typically
maintain a capacitance range within ±20% of nominal over
full operating ratings of temperature and voltage. Of course,
they are typically larger and more costly than Z5U/Y5U
types for a given voltage and capacitance.
Tantalum :
Solid tantalum capacitors are recommended for use on
the output because their typical ESR is very close to the
ideal value required for loop compensation. They also work
well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability : a good
quality tantalum will typically show a capacitance value
that varies less than 10 to 15% across the full temperature
range of 125°C to −40°C. ESR will vary only about 2X
going from the high to low temperature limits.
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DS9166/A-23 June 2012
The increasing ESR at lower temperatures can cause
oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the
stability range at room temperature).
Aluminum :
This capacitor type offers the most capacitance for the
money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and
have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic
is higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic
can exhibit an ESR increase of as much as 50X when
going from 25°C down to −40°C.
It should also be noted that many aluminum electrolytics
only specify impedance at a frequency of 120Hz, which
indicates they have poor high frequency performance. Only
aluminum electrolytics that have an impedance specified
at a higher frequency (between 20kHz and 100kHz) should
be used for the device. Derating must be applied to the
manufacturer's ESR specification, since it is typically only
valid at room temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
Thermal Considerations
Thermal protection limits power dissipation in RT9166/A.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 40°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature. The power
dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
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RT9166/A
be calculated by following formula :
PCB Layout
PD (MAX) = (TJ(MAX) − TA) / θJA
Good board layout practices must be used or instability
can be induced because of ground loops and voltage drops.
The input and output capacitors MUST be directly
connected to the input, output, and ground pins of the
device using traces which have no other currents flowing
through them.
Where T J(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification,
where TJ(MAX) is the maximum junction temperature of the
die (125°C) and TA is the operated ambient temperature.
The junction to ambient thermal resistance θJA is layout
dependent. For SOT-23-3 packages, the thermal
resistance θJA is 250°C/W on the standard JEDEC 51-3
single-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by following
formula :
PD (MAX) = ( 125°C − 25°C) / 250°C/W = 0.400W for
SOT-23-3 packages
PD (MAX) = ( 125°C − 25°C) / 175°C/W = 0.571W for
SOT-89 packages
PD (MAX) = ( 125°C − 25°C) / 135°C/W = 0.740W for
SOT-223 packages
PD (MAX) = ( 125°C − 25°C) / 68°C/W = 1.470W for
TO-252 packages
Maximum Power Dissipation (mW)
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. Figure 1 of derating curves allows the
designer to see the effect of rising ambient temperature
on the maximum power allowed.
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Single Layer PCB
TO-252
The best way to do this is to layout CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the
external circuit ground so that the regulator and its
capacitors have a “single point ground”.
It should be noted that stability problems have been seen
in applications where “vias” to an internal ground plane
were used at the ground points of the device and the input
and output capacitors. This was caused by varying ground
potentials at these nodes resulting from current flowing
through the ground plane. Using a single point ground
technique for the regulator and it’ s capacitors fixed the
problem. Since high current flows through the traces going
into VIN and coming from VOUT, Kelvin connect the capacitor
leads to these pins so there is no voltage drop in series
with the input and output capacitors.
Optimum performance can only be achieved when the
device is mounted on a PC board according to the diagram
below :
VIN
GND
SOT-223
SOT-89
VOUT
SOT-23-3
0
Figure 2. SOT-23-3 Board Layout
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve of Maximum Power Dissipation
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RT9166/A
Outline Dimension
H
D
L
C
B
e
A
A1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.889
1.295
0.035
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.356
0.508
0.014
0.020
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
1.803
2.007
0.071
0.079
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-3 Surface Mount Package
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RT9166/A
D
D1
A
B
C
C1
e
e
H
A
b
b1
b
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.397
1.600
0.055
0.063
b
0.356
0.483
0.014
0.019
B
2.388
2.591
0.094
0.102
b1
0.406
0.533
0.016
0.021
C
3.937
4.242
0.155
0.167
C1
0.787
1.194
0.031
0.047
D
4.394
4.597
0.173
0.181
D1
1.397
1.753
0.055
0.069
e
1.448
1.549
0.057
0.061
H
0.356
0.432
0.014
0.017
3-Lead SOT-89 Surface Mount Package
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DS9166/A-23 June 2012
RT9166/A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.400
1.800
0.055
0.071
A1
0.020
0.100
0.001
0.004
b
0.600
0.840
0.024
0.033
B
3.300
3.700
0.130
0.146
C
6.700
7.300
0.264
0.287
D
6.300
6.700
0.248
0.264
b1
2.900
3.100
0.114
0.122
e
2.300
0.091
H
0.230
0.350
0.009
0.014
L
1.500
2.000
0.059
0.079
L1
0.800
1.100
0.031
0.043
3-Lead SOT-223 Surface Mount Package
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9166/A-23 June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
13
RT9166/A
D
U
C
D1
R
B
T
V
E
S
L1
L3
b1
b
L2
e
b2
A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
2.184
2.388
0.086
0.094
B
0.889
2.032
0.035
0.080
b
0.508
0.889
0.020
0.035
b1
1.016 Ref.
0.040 Ref.
b2
0.457
0.584
0.018
0.023
C
0.457
0.584
0.018
0.023
D
6.350
6.731
0.250
0.265
D1
5.207
5.461
0.205
0.215
E
5.334
6.223
0.210
0.245
e
2.108
2.438
0.083
0.096
L1
9.398
10.414
0.370
0.410
L2
L3
0.508 Ref.
0.635
1.016
0.020 Ref.
0.025
0.040
U
3.810 Ref.
0.150 Ref.
V
3.048 Ref.
0.120 Ref.
R
0.200
0.850
0.008
0.033
S
2.500
3.400
0.098
0.134
T
0.500
0.850
0.020
0.033
3-Lead TO-252 Surface Mount Package
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
is a registered trademark of Richtek Technology Corporation.
DS9166/A-23 June 2012
RT9166/A
A
D
E
L
b
e
C
D1
A1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
3.175
4.191
0.125
0.165
A1
1.143
1.372
0.045
0.054
b
0.406
0.533
0.016
0.021
C
0.406
0.533
0.016
0.021
D
4.445
5.207
0.175
0.205
D1
3.429
5.029
0.135
0.198
E
4.318
5.334
0.170
0.210
e
1.143
1.397
0.045
0.055
12.700
L
0.500
3-Lead TO-92 Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9166/A-23 June 2012
www.richtek.com
15
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