PACKAGE INFORMATION
PE-SON-6-0611
•
SON-6
Unit: mm
PACKAGE DIMENSIONS
6 4
2.6±0.2 3.0±0.15
0.85Max.
1
0.13±0.05
Bottom View
0.1 0.5 0.2±0.1
Attention: Tab suspension leads in the parts have VDD or GND level.(They are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns.
TAPING SPECIFICATION
0.2±0.1 ∅ 1.5+0.1 0 4.0±0.1 2.0±0.05
(0.3)
3
1.34
(0.3)
1.6±0.2
3.5±0.05
1.75±0.1 8.0±0.3
1.9 1.7Max. 4.0±0.1 ∅1.1±0.1
TR User Direction of Feed
TAPING REEL DIMENSIONS
(1reel=3000pcs)
REUSE REEL (EIAJ-RRM-08Bc)
11.4±1.0 9.0±0.3
21±0.8
0 180 −1.5
2±0.5
13±0.2 +1 60 0
3.2
PACKAGE INFORMATION
PE-SON-6-0611
POWER DISSIPATION (SON-6)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Board Material Board Dimensions Copper Ratio Through-hole Measurement Result
(Topt=25°C,Tjmax=125°C)
Mounting on Board (Wind velocity=0m/s) Glass cloth epoxy plactic (Double sided) 40mm × 40mm × 1.6mm Top side : Approx. 50% , Back side : Approx. 50% φ0.5mm × 44pcs
Standard Land Pattern Power Dissipation Thermal Resistance
600
Free Air 250mW -
500mW θja=(125−25°C)/0.5W=200°C/W
Power Dissipation PD(mW)
500 400 300 200 100 0 0 25 250
On Board
40
Free Air
50 75 85 100 Ambient Temperature (°C)
125
150
Power Dissipation
40
Measurement Board Pattern IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN
0.25 0.5
1.05 0.75
(Unit: mm)
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