R1121N SERIES
LOW NOISE 150mA LDO REGULATOR
NO.EA-058-111026
OUTLINE
The R1121N Series are CMOS-based voltage regulator ICs with high output voltage accuracy, extremely low
supply current, low ON-resistance, and high Ripple Rejection. Each of these voltage regulator ICs consists of a
voltage reference unit, an error amplifier, resistors, a current limit circuit, and a chip enable circuit.
These ICs perform with low dropout voltage and a chip enable function. The line transient response and load
transient response of the R1121N Series are excellent, thus these ICs are very suitable for the power supply for
hand-held communication equipment.
The output voltage of these ICs is fixed with high accuracy.
Since the package for these ICs is SOT-23-5 (Mini-mold) package , high density mounting of the ICs on
boards is possible.
FEATURES
•
•
•
•
•
•
•
•
Supply Current ................................................................ Typ. 35μA
Standby Mode ................................................................. Typ. 0.1μA
Dropout Voltage .............................................................. Typ. 0.2V (IOUT=100mA)
Ripple Rejection.............................................................. Typ. 70dB(f=1kHz)
Temperature-Drift Coefficient of Output Voltage ............. Typ. ±100ppm/°C
Line Regulation ............................................................... Typ. 0.05%/V
Output Voltage Accuracy................................................. ±2.0%
Output Voltage Range..................................................... 1.5V to 5.0V (0.1V steps)
(For other voltages, please refer to MARK INFORMATIONS.)
• Package ........................................................................ SOT-23-5 (Mini-mold)
• Built-in chip enable circuit ( 2 types; A: active “L”, B: active “H”)
• Pin-out............................................................................. Similar to the TK112,TK111
APPLICATIONS
• Power source for cellular phones such as GSM, CDMA and various kinds of PCSs.
• Power source for domestic appliances such as cameras, VCRs and camcorders.
• Power source for battery-powered equipment.
1
R1121N
BLOCK DIAGRAM
R1121Nxx1A
R1121Nxx1B
3
1
3
VOUT
VDD
Vref
VOUT
Vref
Current Limit
CE
1
VDD
GND
4
2
CE
Current Limit
GND
4
2
SELECTION GUIDE
The output voltage, the active type for the ICs can be selected at the user's request.
Product Name
R1121Nxx1∗-TR-FE
Package
Quantity per Reel
Pb Free
Halogen Free
SOT-23-5
3,000 pcs
Yes
Yes
xx : The output voltage can be designated in the range from 1.5V(15) to 5.0V(50) in 0.1V steps.
(For other voltages, please refer to MARK INFORMATIONS.)
∗ : Designation of Active Type.
(A) "L" active
(B) "H" active
2
R1121N
PIN CONFIGURATION
SOT-23-5
5
4
(mark side)
1
2
3
PIN DESCRIPTION
Pin No
Symbol
Description
1
VOUT
Output pin
2
GND
Ground Pin
3
VDD
4
CE or CE
Chip Enable Pin
5
NC
No Connection
Input Pin
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
9.0
V
VIN
Input Voltage
VCE
Input Voltage( CE or CE Pin)
-0.3 ~ VIN+0.3
V
VOUT
Output Voltage
-0.3 ~ VIN+0.3
V
IOUT
Output Current
200
mA
420
mW
∗
PD
Power Dissipation (SOT-23-5)
Topt
Operating Temperature Range
-40 ~ 85
°C
Tstg
Storage Temperature Range
-55 ~ 125
°C
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
3
R1121N
ELECTRICAL CHARACTERISTICS
•
R1121Nxx1A
Symbol
Topt=25°C
Item
VOUT
Output Voltage
IOUT
Output Current
Conditions
VIN = Set VOUT + 1V
1mA <
= IOUT <
= 30mA
Min.
Typ.
VOUT
×0.98
Max.
Unit
VOUT
×1.02
V
Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
VIN = Set VOUT + 1V
1mA <
= IOUT <
= 80mA
ΔVOUT/ΔIOUT
Load Regulation
VDIF
Dropout Voltage
ISS
Supply Current
VIN = Set VOUT + 1V
35
70
μA
Supply Current (Standby)
VIN = VCE = Set VOUT + 1V
0.1
1.0
μA
ΔVOUT/ΔVIN
Line Regulation
Set VOUT+0.5V <
= VIN <
= 8.0V
IOUT = 30mA
0.05
0.20
%/V
RR
Ripple Rejection
f = 1kHz, Ripple 0.5Vp-p
VIN = Set VOUT + 1V
VIN
Input Voltage
Istandby
ΔVOUT/
ΔTopt
12
70
2.0
IOUT = 30mA
−40°C <
= Topt <
= 85°C
ISC
Short Current Limit
VOUT = 0V
RPU
CE Pull-up Resistance
2.5
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
Output Noise
mV
Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
Output Voltage
Temperature Coefficient
en
40
BW=10Hz to 100kHz
dB
8.0
V
±100
ppm/°C
50
mA
5.0
10.0
MΩ
1.5
VIN
V
0.00
0.25
V
30
μVrms
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
4
R1121N
•
R1121Nxx1B
Symbol
Topt=25°C
Item
VOUT
Output Voltage
IOUT
Output Current
ΔVOUT/ΔIOUT
Load Regulation
VDIF
Dropout Voltage
ISS
Supply Current
Istandby
Supply Current (Standby)
ΔVOUT/ΔVIN
Line Regulation
RR
Ripple Rejection
VIN
Input Voltage
ΔVOUT/
ΔTopt
Conditions
VIN = Set VOUT + 1V
1mA <
= IOUT <
= 30mA
Min.
VIN = Set VOUT + 1V
1mA <
= IOUT <
= 80mA
12
Unit
VOUT
×1.02
V
40
mV
Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
VIN = Set VOUT + 1V
VIN = Set VOUT + 1V
VCE =GND
Set VOUT + 0.5V <
= VIN <
= 8.0V
IOUT = 30mA
f = 1kHz, Ripple 0.5Vp-p
VIN = Set VOUT + 1V
35
70
μA
0.1
1.0
μA
0.05
0.20
%/V
70
2.0
IOUT = 30mA
−40°C <
= Topt <
= 85°C
ISC
Short Current Limit
VOUT = 0V
RPD
CE Pull-down Resistance
2.5
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
Output Noise
Max.
Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
Output Voltage
Temperature Coefficient
en
Typ.
VOUT
×0.98
BW=10Hz to 100kHz
dB
8.0
V
±100
ppm/°C
50
mA
10.0
MΩ
1.5
VIN
V
0.00
0.25
V
5.0
30
μVrms
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
5
R1121N
ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE
Topt = 25°C
Output Current
IOUT (mA)
Condition
Output Voltage
VOUT (V)
1.5
1.8
<
=
<
=
VOUT
VOUT
<
=
<
=
1.7
5.0
Min.
100
150
VIN - VOUT = 1.0V
Topt = 25°C
Output Voltage
VOUT (V)
Condition
1.5
1.6
1.7
1.8 <
=
2.0 <
=
2.5 <
=
2.8 <
=
3.4 <
=
VOUT
VOUT
VOUT
VOUT
VOUT
<
=
<
=
<
=
<
=
<
=
1.9
2.4
2.7
3.3
5.0
Dropout Voltage
VDIF (V)
Min.
0.50
0.40
0.30
IOUT = 100mA
Typ.
Max.
0.60
0.35
0.24
0.20
0.17
1.40
0.70
0.35
0.30
0.26
Note : When set Output Voltage is equal or less than 2.0V,
VIN should be equal or more than 2.0V.
OPERATION
R1121Nxx1A
1
R1121Nxx1B
5
1
VOUT
VDD
5
VOUT
VDD
R1
R1
Vref
CE
3
Vref
Current Limit
R2
GND
2
CE
3
Current Limit
R2
GND
2
In these ICs, fluctuation of output voltage, VOUT is detected by feed-back registers R1, R2, and the result is
compared with a reference voltage by the error amplifier, so that a constant voltage is output.
A current limit circuit for protection in short mode and a chip enable circuit, are included.
6
R1121N
TEST CIRCUITS
CE
CE
4
4
VDD
3
IN
VOUT
R1121Nxx1B Series
1
VOUT
VDD
3
IN
OUT
R1121Nxx1B Series
OUT
1
ISS
IOUT
2.2μF
2
2.2μF
2
0.1μF
GND
0.1μF
GND
Supply current Test
Circuit
Standard test Circuit
Fig.1 Standard test Circuit
Fig.2 Supply Current Test Circuit
CE
CE
4
4
IN
VDD
3
VOUT
R1121Nxx1B Series
OUT
1
IN
IOUT
P.G
VDD
3
VOUT
R1121Nxx1B Series
OUT
1
2
2
GND
1μF
Ripple Rejection, Line
Transient Response
Test Circuit
Fig.3 Ripple Rejection, Line Transient
Response Test Circuit
GND
I1
I2
Load Transient Response
Test Circuit
Fig.4 Load Transient Response Test Circuit
7
R1121N
TYPICAL CHARACTERISTICS
1) Output Voltage vs. Output Current
R1121N181B
R1121N301B
Topt = 25°C
Topt = 25°C
2.0
3.5
5.0V
3.0
3.8V
1.6
2.8V
Output Voltage VOUT (V)
Output Voltage VOUT (V)
1.8
1.4
1.2
2.3V
1.0
0.8
0.6
VIN = 2.1V
0.4
4.0V
2.5
2.0
3.5V
1.5
VIN = 3.3V
1.0
0.5
0.2
0.0
0.0
0
100
200
300
400
Output Current IOUT (mA)
500
0
100
R1121N401B
200
300
400
Output Current IOUT (mA)
500
R1121N501B
Topt = 25°C
Topt = 25°C
6.0
5.0
5.0
4.0
6.0V
3.5
Output Voltage (V)
Output Voltage VOUT (V)
4.5
5.0V
3.0
2.5
4.5V
2.0
VIN = 4.3V
1.5
7.0V
4.0
6.0V
3.0
5.5V
2.0
VIN = 5.3V
1.0
1.0
0.5
0.0
0.0
0
100
200
300
400
Output Current IOUT (mA)
0
500
100
200
300
400
Output Current IOUT (mA)
500
2) Output Voltage vs. Input Voltage
R1121N181B
R1121N301B
Topt = 25°C
Topt = 25°C
3.1
2.0
IOUT=1mA
3.0
IOUT = 1mA
Output Voltage VOUT (V)
Output Voltage VOUT (V)
1.9
1.8
1.7
1.6
1.5
1.4
30mA
2.9
2.8
2.7
30mA
2.6
1.3
50mA
1.2
1.0
8
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
7.0
8.0
2.5
2.0
50mA
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
7.0
8.0
R1121N
R1121N401B
R1121N501B
Topt = 25°C
Topt = 25°C
4.5
5.5
5.0
Output Voltage VOUT (V)
Output Voltage VOUT (V)
IOUT = 1mA
4.0
3.5
30mA
3.0
3.0
4.0
3.5
30mA
3.0
50mA
2.5
2.0
IOUT = 1mA
4.5
50mA
4.0
5.0
6.0
Intput Voltage VIN (V)
7.0
2.5
2.0
8.0
3.0
4.0
5.0
6.0
Intput Voltage VIN (V)
7.0
8.0
3) Dropout Voltage vs. Output Current
R1121N181B
R1121N301B
1.20
0.40
0.35
Topt = 85°C
0.80
0.60
25°C
0.40
-40°C
Dropout Voltage VDIF (V)
Dropout Voltage VDIF (V)
1.00
0.20
Topt = 85°C
0.30
25°C
0.25
0.20
-40°C
0.15
0.10
0.05
0.00
0.00
0
50
100
Output Current IOUT (mA)
150
0
0.40
0.35
0.35
0.30
Topt = 85°C
0.25
25°C
0.20
0.15
-40°C
0.10
150
R1121N501B
0.40
0.05
Dropout Voltage VDIF (V)
Dropout Voltage VDIF (V)
R1121N401B
50
100
Output Current IOUT (mA)
0.30
Topt = 85°C
0.25
25°C
0.20
0.15
-40°C
0.10
0.05
0.00
0.00
0
50
100
Output Current IOUT (mA)
150
0
50
100
Output Current IOUT (mA)
150
9
R1121N
4) Output Voltage vs. Temperature
R1121N181B
1.90
1.88
3.08
1.86
3.06
1.84
1.82
1.80
1.78
1.76
1.74
3.04
3.02
3.00
2.98
2.96
2.94
2.92
1.72
1.70
-50
VIN = 4.0V
IOUT = 30mA
3.10
Output Voltage VOUT (V)
Output Voltage VOUT (V)
R1121N301B
VIN = 2.8V
IOUT = 30mA
-25
0
25
50
Temperature Topt (°C)
75
2.90
-50
100
-25
R1121N401B
100
VIN = 6.0V
IOUT = 30mA
5.10
4.08
5.08
4.06
5.06
Output Voltage VOUT (V)
Output Voltage VOUT (V)
75
R1121N501B
VIN = 5.0V
IOUT = 30mA
4.10
4.04
4.02
4.00
3.98
3.96
3.94
5.04
5.02
5.00
4.98
4.96
4.94
4.92
3.92
3.90
-50
0
25
50
Temperature Topt (°C)
-25
0
25
50
Temperature Topt (°C)
75
4.90
-50
100
-25
0
25
50
Temperature Topt (°C)
75
100
5) Supply Current vs. Input Voltage
R1121N181B
R1121N301B
Topt = 25°C
60
60
50
50
Supply Current I ISS (μA)
Supply Current I ISS (μA)
Topt = 25°C
40
30
20
10
30
20
10
10
0
1.0
40
2.0
4.0
5.0
6.0
3.0
Input Voltage VIN (V)
7.0
8.0
0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage VIN (V)
7.0
8.0
R1121N
R1121N401B
R1121N501B
Topt = 25°C
60
60
50
50
Supply Current ISS (μA)
Supply Current ISS (μA)
Topt = 25°C
40
30
20
10
0
1.0
40
30
20
10
2.0
4.0
5.0
6.0
3.0
Intput Voltage VIN (V)
7.0
0
1.0
8.0
2.0
3.0
4.0
5.0
6.0
Intput Voltage VIN (V)
7.0
8.0
6) Supply Current vs. Temperature
R1121N181B
R1121N301B
VIN = 2.8V
50
50
45
45
Supply Current ISS (μA)
Supply Current ISS (μA)
VIN = 2.8V
40
35
30
25
20
-50
40
35
30
25
0
50
Temperature Topt (°C)
20
-50
100
R1121N401B
VIN = 6.0V
50
50
45
45
Supply Current ISS (μA)
Supply Current ISS (μA)
100
R1121N501B
VIN = 5.0V
40
35
30
25
20
-50
0
50
Temperature Topt (°C)
40
35
30
25
0
50
Temperature Topt (°C)
100
20
-50
0
50
Temperature Topt (°C)
100
11
R1121N
7) Dropout Voltage vs. Set Output Voltage
R1121Nxx1B
Topt = 25
1.0
Dropout Voltage VDIF (V)
0.9
IOUT
IOUT
IOUT
IOUT
IOUT
0.8
0.7
0.6
=
=
=
=
=
150mA
100mA
50mA
30mA
10mA
0.5
0.4
0.3
0.2
0.1
0.0
1.0
2.0
3.0
4.0
Set Output Voltage Vreg (V)
5.0
8) Ripple Rejection vs. Frequency
R1121N181B
R1121N181B
VIN = 2.8VDC + 0.5Vp-p
COUT = tantal 2.2μF
VIN = 2.8VDC + 0.5Vp-p
COUT = tantal 1.0μF
80
80
70
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
70
60
50
40
IOUT = 1mA
30
IOUT = 30mA
20
IOUT = 50mA
10
60
50
40
IOUT= 1mA
30
IOUT = 30mA
20
IOUT = 50mA
10
0
0
0.1
1
10
Frequency f (kHz)
0.1
100
1
R1121N301B
VIN = 4.0VDC + 0.5Vp-p
COUT = tantal 2.2μF
80
80
70
Ripple Rejection RR (dB)
70
Ripple Rejection RR (dB)
100
R1121N301B
VIN = 4.0VDC + 0.5Vp-p
COUT = tantal 1.0μF
60
50
40
IOUT = 1mA
30
IOUT = 30mA
20
IOUT = 50mA
10
60
50
40
IOUT = 1mA
30
IOUT = 30mA
20
IOUT = 50mA
10
0
0
0.1
12
10
Frequency f (kHz)
1
10
Frequency f (kHz)
100
0.1
1
10
Frequency f (kHz)
100
R1121N
R1121N401B
R1121N401B
VIN = 5.0VDC + 0.5Vp-p
COUT = tantal 2.2μF
80
80
70
70
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
VIN = 5.0VDC + 0.5Vp-p
COUT = tantal 1.0μF
60
50
IOUT= 1mA
40
30
IOUT = 30mA
20
IOUT = 50mA
10
60
50
40
IOUT = 1mA
30
IOUT = 30mA
20
IOUT = 50mA
10
0
0
0.1
1
10
Frequency f (kHz)
0.1
100
1
10
100
Frequency f (kHz)
9) Ripple Rejection vs. Input Voltage (DC bias)
R1121N301B
R1121N301B
IOUT = 10mA
COUT = 2.2μF
IOUT = 1mA
COUT = 2.2μF
80
80
70
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
70
60
50
40
f = 400Hz
30
20
f = 1kHz
10
f = 10kHz
60
50
40
f = 400Hz
30
20
f = 1kHz
10
f = 10kHz
0
0
3.1
3.2
3.3
3.4
Input Voltage VIN (V)
3.5
3.1
3.2
3.3
3.4
Input Voltage VIN (V)
3.5
R1121N301B
IOUT = 50mA
COUT = 2.2μF
80
f = 400Hz
Ripple Rejection RR (dB)
70
f = 1kHz
60
50
f = 10kHz
40
30
20
10
0
3.1
3.2
3.3
3.4
3.5
Input Voltage VIN (V)
13
R1121N
10) LineTransient Response
R1121N301B
IOUT=30mA
tr=tf=5 μs
COUT=Tantalum 1.0μF
OUtput Voltage VOUT (V)
3.3
5
Input Voltage
4
3.2
3.1
3
Output Voltage
3.0
2
2.9
1
Input Voltage VIN (V)
6
3.4
0
2.8
0
20
40
60
TIme t (μs)
80
100
120
R1121N301B
IOUT=30mA
tr=tf=5 μs
COUT=Tantalum 2.2μF
Output Voltage VOUT (V)
3.3
5
Input Voltage
4
3.2
3.1
3
Output Voltage
3.0
2
2.9
1
Input Voltage VIN (V)
6
3.4
0
2.8
0
20
40
60
Time t (μs)
80
100
120
R1121N301B
IOUT=30mA
tr=tf=5 μs
COUT=Tantalum 6.8μF
Output Voltage VOUT (V)
3.3
5
Input Voltage
4
3.2
3
3.1
Output Voltage
3.0
2
2.9
1
0
2.8
0
14
20
40
60
Time t (μs)
80
100
120
Input Voltage VIN (V)
6
3.4
R1121N
11) Load Transient Response
R1121N301B
VIN=4V
CIN=Tantalum 1μF
COUT=Tantalum 1.0μF
Output Voltage VOUT (V)
3.3
100
Output Current
50
3.2
0
3.1
Output Voltage
3.0
-50
2.9
-100
Output Current IOUT (mA)
150
3.4
-150
2.8
0
2
4
6
8
10
12
Time t (μs)
14
16
18
20
R1121N301B
VIN=4V
CIN=Tantalum 1μF
COUT=Tantalum 2.2μF
Output Voltage VOUT (V)
3.3
100
Output Current
50
3.2
0
3.1
Output Voltage
3.0
-50
2.9
-100
Output Current IOUT (mA)
150
3.4
-150
2.8
0
2
4
6
8
10
12
Time t (μs)
14
16
18
20
R1121N301B
VIN=4V
CIN=Tantalum 1μF
COUT=Tantalum 6.8μF
Output Voltage VOUT (V)
3.3
100
Output Current
50
3.2
0
3.1
Output Voltage
3.0
-50
2.9
-100
Output Current IOUT (mA)
150
3.4
-150
2.8
0
2
4
6
8
10
12
Time t (μs)
14
16
18
20
15
R1121N
TECHNICAL NOTES
When using these ICs, be sure to consider the following points:
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, be sure to use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series
Resistance) in the range described as follows:
4 CE
1
Vout
R1121N301B
3 Vin
Vin
2
GND
Ceramic
Capacitor
Spectrum
S.A. Analyzer
ESR
Iout
Ceramic Capacitor
1μF
Measuring Circuit for white noise; R1121N301B
The relationship between IOUT (output current) and ESR of output capacitor is shown in the graphs below. The
conditions when the white noise level is under 40mV (Avg.) are indicated by the hatched area in the graph.
(note: When the additional ceramic capacitors are connected to the output pin with output capacitor for phase
compensation, the operation might be unstable. Because of this, test these ICs with as the same external
components as the ones to be used on the PCB.)
(1)
VIN=4V
(2)
Frequency Band: 10Hz to 1MHz
(3)
Temperature: 25°C
R1121N301B
R1121N301B
Ceramic 2.2μF
Ceramic 1.0μF
100.0
10.0
10.0
ESR (Ω)
ESR (Ω)
100.0
1.0
1.0
0.1
0
50
100
Output Current IOUT (mA)
16
150
0.1
0
50
100
Output Current IOUT (mA)
150
R1121N
·Make VDD and GND lines sufficient. If their impedance is high, noise pick up or incorrect operation may result.
·Connect the capacitor with a capacitance of 1μF or more between VDD and GND as close as possible.
·Set external components, especially the output capacitor, as close as possible to the ICs and make wiring as
short as possible.
TYPICAL APPLICATION
CE
CE
IN
Cap.
VDD
R1121Nxx1A VOUT
GND
OUT
Cap.
IN
Cap.
VDD
R1121Nxx1B VOUT
GND
OUT
Cap.
17
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
Sales & Support Offices
Ricoh Electronic Devices Co., Ltd.
Shin-Yokohama Office (International Sales)
2-3, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa, 222-8530, Japan
Phone: +81-50-3814-7687 Fax: +81-45-474-0074
Ricoh Americas Holdings, Inc.
675 Campbell Technology Parkway, Suite 200 Campbell, CA 95008, U.S.A.
Phone: +1-408-610-3105
Ricoh Europe (Netherlands) B.V.
Semiconductor Support Centre
Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands
Phone: +31-20-5474-309
Ricoh International B.V. - German Branch
Semiconductor Sales and Support Centre
Oberrather Strasse 6, 40472 Düsseldorf, Germany
Phone: +49-211-6546-0
Ricoh Electronic Devices Korea Co., Ltd.
3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea
Phone: +82-2-2135-5700 Fax: +82-2-2051-5713
Ricoh Electronic Devices Shanghai Co., Ltd.
Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203,
People's Republic of China
Phone: +86-21-5027-3200 Fax: +86-21-5027-3299
Ricoh Electronic Devices Shanghai Co., Ltd.
Shenzhen Branch
1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District,
Shenzhen, China
Phone: +86-755-8348-7600 Ext 225
Ricoh Electronic Devices Co., Ltd.
Taipei office
Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan (R.O.C.)
Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623