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R1170H331B-T1-FE

R1170H331B-T1-FE

  • 厂商:

    RICOH(理光)

  • 封装:

    SOT89-5

  • 描述:

    IC REG LINEAR 3.3V 800MA SOT89-5

  • 数据手册
  • 价格&库存
R1170H331B-T1-FE 数据手册
R1170x SERIES 800mA LDO REGULATOR NO.EA-084-111027 OUTLINE The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at short mode, a chip enable circuit, and thermal-shunt circuit. Output Voltage of R1170 is fixed in the IC. Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable improvement on the current regulators in terms of ripple rejection, input transient response, and load transient response. Maximum Output Current is large for its compact size. Thus, the R1170x Series are suitable for various power sources for portable appliances. Since the packages for these ICs are the SOT-89-5 package, HSON-6, or HSOP-6J, high density mounting of the ICs on boards is possible. FEATURES • • • • • • • • • • • • Supply Current ............................................................. Typ. 80μA Standby Current ........................................................... Typ. 0.1μA Output Current ............................................................. Min. 800mA (VIN=VOUT+1.0V) Dropout Voltage ........................................................... Typ. 0.12V (VOUT=3.0V, IOUT=300mA) Output Voltage Accuracy.............................................. ±2.0% Temperature-Drift Coefficient of Output Voltage .......... Typ.±100ppm/°C Line Regulation ............................................................ Typ. 0.05%/V Output Voltage ............................................................. 1.5V to 5.0V (0.1V steps) (For other voltages, please refer to MARK INFORMATIONS.) Packages ..................................................................... HSON-6, SOT-89-5, HSOP-6J Built-in Current Limit Circuit Built-in Thermal Shutdown Circuit Ceramic capacitors are recommended to be used with this IC APPLICATIONS • • • • Local Power source for Notebook PC. Local Power source for portable appliances, cameras, and videos. Local Power source for equipment of battery-use. Local Power source for home appliances. 1 R1170x BLOCK DIAGRAMS R1170xxx1A R1170Dxxx1B VDD VOUT VDD VOUT Vref Vref Current Limit Thermal Shutdown Current Limit Thermal Shutdown CE GND CE GND SELECTION GUIDE The output voltage, the chip-enable polarity, package for the ICs can be selected at the user’s request. Product Name Package Quantity per Reel Pb Free Halogen Free R1170Dxx1∗-TR-FE HSON-6 3,000 pcs Yes Yes R1170Hxx1∗-T1-FE SOT-89-5 1,000 pcs Yes Yes R1170Sxx1∗-E2-FE HSOP-6J 1,000 pcs Yes Yes xx : The output voltage can be designated in the range from 1.5V(15) to 5.0V(50) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.) ∗ : CE pin polarity are options as follows. (A) "L" active (B) "H" active 2 R1170x PIN CONFIGURATION • HSON-6 Top View 6 5 • SOT-89-5 Bottom View 4 4 5 5 • HSOP-6J 4 6 5 4 3 1 2 3 6 ∗ ∗ 1 2 ∗ 3 3 2 1 1 2 PIN DESCRIPTION • HSON-6 Pin No 1 2 Symbol Description VOUT *1 Voltage Regulator Output Pin VOUT *1 Voltage Regulator Output Pin Chip Enable Pin 3 CE or CE 4 GND 5 *1 Input Pin *1 Input Pin 6 VDD VDD Ground Pin ∗) Tab and tab suspension leads in the parts are GND level. (They are connected to the reverse side of the IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. The tab suspension leads should be open and do not connect to other wires or land patterns. ∗1) The VOUT pin and VDD pin must be wired each other when it is mounted on board. • SOT-89-5 Pin No Symbol Description 1 CE or CE 2 GND 3 NC No Connection 4 VDD Input Pin 5 VOUT Voltage Regulator Output Pin Chip Enable Pin Ground Pin 3 R1170x • HSOP-6J Pin No Symbol 1 VOUT 2 GND Description Voltage Regulator Output Pin *1 Ground Pin 3 CE or CE Chip Enable Pin 4 NC No Connection 5 GND 6 VDD *1 Ground Pin Input Pin ∗1) The GND pin must be wired together when it is mounted on board. ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit 7.0 V VIN Input Voltage VCE Input Voltage ( CE or CE Input Pin) −0.3 to VIN+0.3 V VOUT Output Voltage −0.3 to VIN+0.3 V PD Power Dissipation (HSON-6)* 900 Power Dissipation (SOT-89-5)* 900 Power Dissipation (HSOP-6J)* 1700 mW Topt Operating Temperature −40 to 85 °C Tstg Storage Temperature −55 to 125 °C ∗) For Power Dissipation, please refer to PACKAGE INFORMATION. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 4 R1170x ELECTRICAL CHARACTERISTICS • R1170xxxxA Symbol Topt=25°C Item Conditions Min. Typ. Max. Unit 6.0 V VIN Input Voltage ISS Supply Current VIN−VOUT=1.0V, VCE=GND 80 160 μA Standby Current VIN=VCE=6.0V 0.1 1.0 μA VOUT Output voltage VIN−VOUT=1.0V IOUT=100mA ×1.02 V ΔVOUT/ ΔIOUT Load regulation VIN−VOUT=1.0V 1mA < = IOUT < = 300mA 30 100 mV VOUT=1.5V 0.35 0.45 VOUT=1.6V 0.30 0.35 VOUT=1.7V 0.25 0.30 Istandby VDIF ΔVOUT/ ΔVIN RR ΔVOUT/ ΔTopt Dropout Voltage Line regulation Ripple Rejection IOUT=300mA ×0.98 1.8V < = VOUT < = 2.0V 0.20 0.25 2.1V < = VOUT < = 2.4V 0.15 0.20 2.5V < = VOUT < = 5.0V 0.12 0.18 0.05 0.30 IOUT=100mA VOUT+0.5V < = VIN < = 6.0V < 1.5V < V OUT 4.7V: = = f=1kHz, VIN−VOUT=1.0V Ripple 0.5Vp-p 4.8V < = VOUT < = 5.0V: f=1kHz, VIN=5.7V Ripple 0.5Vp-p dB 50 IOUT=10mA, VIN−VOUT=1.0V −40°C < = Topt < = 85°C ILIM Output Current VIN−VOUT=1.0V ISC Short Current Limit VOUT=0V RPU Pull-up resistancefor CE pin 1.25 VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" TTSR Thermal Shutdown Junction Temperature Detector Threshold Temperature Thermal Shutdown Junction Temperature Released Temperature %/V 50 Output Voltage Temperature Coefficient TTSD V ppm/ °C ±100 800 mA 40 2.50 mA 5.00 MΩ 1.50 VIN V 0 0.25 V 150 °C 120 °C 5 R1170x • R1170xxxxB Symbol Item Conditions Min. Typ. Max. Unit 6.0 V VIN Input voltage ISS Supply Current VIN−VOUT=1.0V,VCE=VIN 80 160 μA Standby Current VIN=6.0V,VCE=GND 0.1 1.0 μA Reference Voltage for Adjustable Voltage Regulator VIN−VOUT=1.0V IOUT=100mA ×1.02 V Load regulation VIN−VOUT=1.0V 1mA < = IOUT < = 300mA 30 100 mV VOUT=1.5V 0.35 0.45 VOUT=1.6V 0.30 0.35 VOUT=1.7V 0.25 0.30 Istandby VOUT ΔVOUT/ ΔIOUT VDIF ΔVOUT/ ΔVIN RR ΔVOUT/ ΔTopt Dropout Voltage Line regulation Ripple Rejection IOUT=300mA ×0.98 1.8V < = VOUT < = 2.0V 0.20 0.25 2.1V < = VOUT < = 2.4V 0.15 0.20 2.5V < = VOUT < = 5.0V 0.12 0.18 0.05 0.30 IOUT=100mA VOUT+0.5V < = VIN < = 6.0V 1.5V < = VOUT < = 4.7V: f=1kHz, VIN−VOUT=1.0V Ripple 0.5Vp-p 4.8V < = VOUT < = 5.0V: f=1kHz, VIN=5.7V Ripple 0.5Vp-p dB 50 IOUT=10mA, VIN−VOUT=1.0V −40°C < = Topt < = 85°C ILIM Output Current VIN−VOUT=1.0V ISC Short Current Limit VOUT=0V RPD Pull-down resistance for CE pin 1.25 VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" TTSR Thermal Shutdown Junction Temperature Detector Threshold Temperature Thermal Shutdown Junction Temperature Released Temperature %/V 50 Output Voltage Temperature Coefficient TTSD 6 Topt=25°C ppm/ °C ±100 800 mA 40 2.50 mA 5.00 MΩ 1.5 VIN V 0 0.25 V 150 °C 120 °C R1170x TEST CIRCUITS CE VOUT VDD IN CE OUT IN 10μF R1170xxx1B SERIES 10μF 10μF GND GND Standard Test Circuit Supply Current Test Circuit CE IN OUT ISS IOUT 10μF R1170xxx1B SERIES VOUT VDD CE VOUT VDD R1170xxx1B SERIES OUT VOUT VDD IN IOUT 10μF R1170xxx1B SERIES OUT 10μF 10μF P.G. I1 GND Test Circuit for Ripple Rejection, Input Transient Response I2 GND Test Circuit for Load Transient Response 7 R1170x Technical Notes on External Components and Typical Application Phase Compensation In these ICs, phase compensation is made with the output capacitor for securing stable operation even if the load current is varied. For this purpose, use as much as 10µF Capacitor as CL. If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable. Evaluate your circuit with considering frequency characteristics. Further, refer to the Typical Characteristics No. 12. Mounting on PCB Make VDD and GND lines sufficient. If their impedance is high, a current flows, the noise picked up or unstable operation may result. Further use as much as 10µF capacitor between VDD pin and GND pin as close as possible. Set an Output capacitor between VOUT pin and GND pin for phase compensation as close as possible. (Refer to the example of typical application) CE IN VDD R1170xxx1B VOUT OUT CL CI GND CI=10μF(Ceramic), CL=10μF(Ceramic) Example of the typical application of R1170xxxxB 8 R1170x TYPICAL CHARACTERISTICS 1) Output Voltage vs. Output Current (Topt=25°C) R1170x151B R1170x301B 3.5 VIN=5V VIN=2.5V 1.6 Output Voltage VOUT(V) Output Voltage VOUT(V) 1.8 1.4 1.2 VIN=2V 1 0.8 0.6 VIN=3.5V 0.4 0.2 0 3 VIN=4V 2.5 VIN=3.5V 2 1.5 1 0.5 0 0 250 500 750 1000 1250 1500 0 Output Current IOUT(mA) 250 500 750 1000 1250 1500 Output Current IOUT(mA) R1170x501B Output Voltage VOUT(V) 6 5 VIN=6V 4 VIN=5.5V 3 2 1 0 0 250 500 750 1000 1250 1500 Output Current IOUT(mA) 2) Output Voltage vs. Input Voltage (Topt=25°C) R1170x151B R1170x201B 2.2 1.6 IOUT=1mA Output Voltage VOUT(V) Output Voltage VOUT(V) 1.7 IOUT=10mA 1.5 1.4 IOUT=100mA 1.3 IOUT=300mA 1.2 1.1 2.1 IOUT=10mA 2 IOUT=1mA 1.9 1.8 IOUT=100mA 1.7 IOUT=300mA 1.6 1.5 1.4 1 2 3 4 Input Voltage VIN(V) 5 6 1 2 3 4 5 6 Input Voltage VIN(V) 9 R1170x R1170x301B R1170x401B 4.2 3.1 IOUT=10mA IOUT=1mA Output Voltage VOUT(V) Output Voltage VOUT(V) 3.2 3.0 2.9 2.8 IOUT=100mA 2.7 IOUT=300mA 2.6 3 4 5 4.0 3.9 3.8 IOUT=100mA 3.7 IOUT=300mA 3.6 3.5 3.4 3.5 2.5 2 4.1 IOUT=1mA IOUT=10mA 6 Input Voltage VIN(V) 4 4.5 5 5.5 6 Input Voltage VIN(V) R1170x501B Output Voltage VOUT(V) 5.2 IOUT=1mA 5.0 IOUT=10mA IOUT=100mA 4.8 4.6 IOUT=300mA 4.4 4.2 4.0 3.8 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN(V) 3) Dropout Voltage vs. Output Current R1170x151B R1170x201B 0.8 0.7 25°C 0.6 0.5 85°C 0.4 -40°C 0.3 0.2 0.1 0 0.7 0.6 25°C 0.5 85°C 0.4 0.3 -40°C 0.2 0.1 0 0 100 200 300 400 500 600 700 800 Output Current IOUT(mA) 10 Dropout Voltage VDIF(V) Dropout Voltage VDIF(V) 0.8 0 100 200 300 400 500 600 700 800 Output Current IOUT(mA) R1170x R1170x401B 0.45 0.45 0.40 0.40 25°C 0.35 0.30 85°C 0.25 0.20 -40°C 0.15 0.10 0.05 Dropout Voltage VDIF(V) Dropout Voltage VDIF(V) R1170x301B 0.50 0.00 0.35 25°C 0.30 0.25 85°C 0.20 0.15 -40°C 0.10 0.05 0.00 0 100 200 300 400 500 600 700 800 0 Output Current IOUT(mA) 100 200 300 400 500 600 700 800 Output Current IOUT(mA) R1170x501B Dropout Voltage VDIF(V) 0.35 0.30 25°C 0.25 85°C 0.20 0.15 -40°C 0.10 0.05 0.00 0 100 200 300 400 500 600 700 800 Output Current IOUT(mA) 4) Output Voltage vs. Temperature R1170x151B 1.60 1.58 1.55 1.53 1.50 1.48 1.45 1.43 1.40 -50 -25 0 25 50 Temperature Topt(°C) 75 100 VIN=3V, IOUT=10mA 2.10 Output Voltage VOUT(V) Output Voltage VOUT(V) R1170x201B VIN=2.5V, IOUT=10mA 2.08 2.05 2.03 2.00 1.98 1.95 1.93 1.90 -50 -25 0 25 50 75 100 Temperature Topt(°C) 11 R1170x R1170x301B 3.20 VIN=5V, IOUT=10mA 4.20 3.15 Output Voltage VOUT(V) Output Voltage VOUT(V) R1170x401B VIN=4V, IOUT=10mA 3.10 3.05 3.00 2.95 2.90 2.85 2.80 -50 -25 0 25 50 75 4.15 4.10 4.05 4.00 3.95 3.90 3.85 3.80 -50 100 -25 Temperature Topt(°C) 0 25 50 75 100 5 6 Temperature Topt(°C) R1170x501B VIN=6V, IOUT=10mA Output Voltage VOUT(V) 5.20 5.15 5.10 5.05 5.00 4.95 4.90 4.85 4.80 -50 -25 0 25 50 75 100 Temperature Topt(°C) 5) Supply Current vs. Input Voltage (Topt=25°C) R1170x201B 120 100 100 Supply Current ISS(μA) Supply Current ISS(μA) R1170x151B 120 80 60 40 20 0 60 40 20 0 0 1 2 3 4 Input Voltage VIN(V) 12 80 5 6 0 1 2 3 4 Input Voltage VIN(V) R1170x R1170x401B 120 100 100 Supply Current ISS(μA) Supply Current ISS(μA) R1170x301B 120 80 60 40 20 0 80 60 40 20 0 0 1 2 3 4 5 6 0 1 Input Voltage VIN(V) 2 3 4 5 6 Input Voltage VIN(V) R1170x501B Supply Current ISS(μA) 120 100 80 60 40 20 0 0 1 2 3 4 5 6 Input Voltage VIN(V) 6) Supply Current vs. Temperature R1170x151B R1170x201B VIN=2.5V 140 120 100 80 60 40 20 -50 -25 0 25 50 Temperature Topt(°C) 75 100 VIN=3V 160 Supply Current ISS(μA) Supply Current ISS(μA) 160 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100 Temperature Topt(°C) 13 R1170x R1170x301B R1170x401B VIN=4V 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100 Temperature Topt(°C) VIN=6V Supply Current ISS(μA) 140 120 100 80 60 40 20 -50 -25 0 25 50 75 100 Temperature Topt(°C) 7) Dropout Voltage vs. Set Output Voltage (Topt=25°C) R1170x 0.7 Droput Voltage VDIF(V) IOUT=400mA 0.6 0.5 IOUT=600mA IOUT=800mA 0.4 0.3 0.2 IOUT=100mA 0.1 0.0 1 2 3 4 Set Output Voltage VSET(V) 14 140 120 100 80 60 40 20 -50 -25 0 25 50 Temperature Topt(°C) R1170x501B 160 VIN=5V 160 Supply Current ISS(μA) Supply Current ISS(μA) 160 5 75 100 R1170x 8) Ripple Rejection vs. Frequency R1170x151B 70 60 50 40 30 20 10 0 0.01 80 Ripple Rejection RR(dB) Ripple Rejection RR(dB) 80 R1170x201B VIN=2.5V+0.5Vp-p, IOUT=100mA 0.1 1 10 70 60 50 40 30 20 10 0 0.01 100 Ripple Frequency f (kHz) 80 Ripple Rejection RR(dB) Ripple Rejection RR(dB) 60 50 40 30 20 10 0.1 1 1 10 100 R1170x401B VIN=4V+0.5Vp-p, IOUT=100mA 70 0 0.01 0.1 Ripple Frequency f (kHz) R1170x301B 80 VIN=3V+0.5Vp-p, IOUT=100mA 10 100 Ripple Frequency f (kHz) VIN=5V+0.5Vp-p, IOUT=100mA 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 Ripple Frequency f (kHz) R1170x501B Ripple Rejection RR(dB) 80 VIN=5.75+0.5Vp-p, IOUT=100mA 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 Ripple Frequency f (kHz) 15 R1170x 9) Ripple Rejection vs. Input Voltage R1170x301B 60 f=400Hz 50 f=1kHz 40 30 IOUT=10mA, COUT=10μF 60 Ripple Rejection RR(dB) Ripple Rejection RR(dB) R1170x301B IOUT=1mA, COUT=10μF f=10kHz 20 10 0 f=400Hz 50 f=1kHz 40 30 f=10kHz 20 10 0 3 3.2 3.4 3.6 3 3.2 Input Voltage VIN(V) 3.4 3.6 Input Voltage VIN(V) R1170x301B IOUT=100mA, COUT=10μF Ripple Rejection RR(dB) 60 f=400Hz 50 f=1kHz 40 30 f=10kHz 20 10 0 3 3.2 3.4 3.6 Input Voltage VIN(V) 10) Input Transient Response (Topt=25°C) R1170x151B tr=tf=10μs, IOUT=100mA, COUT=Ceramic 10μF 4 1.75 3.5 1.7 Input Voltage 1.65 2.5 1.6 2 1.55 Output Voltage 1.5 1.5 1 1.45 0.5 1.4 0 20 40 60 80 100 Time T(μs) 16 3 120 140 160 180 0 200 Input Voltage VIN(V) Output Voltage VOUT(V) 1.8 R1170x R1170x301B tr=tf=10μs, IOUT=100mA, COUT=Ceramic 10μF 6 5 3.3 Input Voltage 3.2 4 3.1 3 Output Voltage 3.0 2 2.9 1 2.8 0 20 40 60 80 100 120 140 160 180 Input Voltage VIN(V) Output Voltage VOUT(V) 3.4 0 200 Time T(μs) R1170x301B 6 3.3 5 Input Voltage 3.2 4 3 3.1 Output Voltage 3.0 2 2.9 1 2.8 0 20 40 60 80 100 120 140 160 180 Input Voltage VIN(V) Output Voltage VOUT(V) tr=tf=10μs, IOUT=100mA, COUT=Ceramic 4.7μF 3.4 0 200 Time T(μs) R1170x501B tr=tf=10μs, IOUT=100mA, COUT=Ceramic 10μF 6.5 5.15 6.0 Input Voltage 5.5 5.10 5.05 5.0 Output Voltage 5.00 4.5 4.95 4.0 4.90 0 20 40 60 80 100 120 140 160 180 Input Voltage VIN(V) Output Voltage VOUT(V) 5.20 3.5 200 Time T(μs) 17 R1170x R1170x501B tr=tf=10μs, IOUT=100mA, COUT=Ceramic 4.7μF 6.5 6.0 5.15 Input Voltage 5.10 5.5 5.05 5.0 Output Voltage 5.00 4.5 4.95 4.0 4.90 0 20 40 60 80 100 120 140 160 180 Input Voltage VIN(V) Output Voltage VOUT(V) 5.20 3.5 200 Time T(μs) 11) Load Transient Response (Topt=25°C) R1170x151B 2.0 120 1.9 100 80 1.8 Output Current 60 1.7 1.6 40 Output Voltage 1.5 20 1.4 0 20 40 60 80 100 120 140 160 180 Output Current IOUT(mA) Output Voltage VOUT(V) tr=tf=3μs, CIN=Ceramic 10μF, VIN=2.5V, COUT=Ceramic 10μF 0 200 Time T(μs) R1170x301B 3.5 120 3.4 100 3.3 80 Output Current 3.2 60 3.1 40 Output Voltage 20 3.0 2.9 0 20 40 60 80 100 Time T(μs) 18 120 140 160 180 0 200 Output Current IOUT(mA) Output Voltage VOUT(V) tr=tf=3μs, CIN=Ceramic 10μF, VIN=4V, COUT=Ceramic 10μF R1170x R1170x301B 3.5 120 3.4 100 3.3 80 Output Current 3.2 60 3.1 40 Output Voltage 3.0 20 2.9 0 20 40 60 80 100 120 140 160 180 Output Current IOUT(mA) Output Voltage VOUT(V) tr=tf=3μs, CIN=Ceramic 10μF, VIN=4V, COUT=Ceramic 4.7μF 0 200 Time T(μs) R1170x501B tr=tf=3μs, CIN=Ceramic 10μF, COUT=Ceramic 10μF 150 5.15 100 Output Current 5.10 50 0 5.05 Output Voltage 5.00 4.95 Output Current IOUT(mA) Output Voltage VOUT(V) 5.20 4.90 0 20 40 60 80 100 120 140 160 180 200 Time T(μs) R1170x501B tr=tf=3μs, CIN=Ceramic 10μF, COUT=Ceramic 4.7μF 150 100 5.15 Output Current 5.10 50 5.05 0 Output Voltage 5.00 4.95 Output Current IOUT(mA) Output Voltage VOUT(V) 5.20 4.90 0 20 40 60 80 100 120 140 160 180 200 Time T(μs) 19 R1170x 12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10μF) VOUT CE Ceramic Capacitor R1170xxxxB VIN VIN S.A. Spectrum Analyzer GND ESR Ceramic Capacitor IOUT As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type capacitor can be used with this IC. For your reference, noise level is tested with the circuit as shown above, and if the noise level is 40μV or less than 40μV, the ESR values are plotted as stable area. Upper limit is described in the next four graphs, or ESR vs. Output Current. (Hatched area is the stable area.) R1170x151B R1170x151B COUT=Ceramic 10μF 100 COUT=Ceramic 4.7μF 100 f=400Hz f=1kHz ESR(Ω) 10 ESR(Ω) 10 f=10kHz 1 1 0.1 0.1 0 200 400 600 800 0 Output Current IOUT(mA) R1170x301B 600 800 COUT=Ceramic 4.7μF 100 ESR(Ω) 10 ESR(Ω) 10 1 1 0.1 0.1 0 200 400 600 Output Current IOUT(mA) 20 400 R1170x301B COUT=Ceramic 10μF 100 200 Output Current IOUT(mA) 800 0 200 400 600 Output Current IOUT(mA) 800 R1170x R1170x501B R1170x501B COUT=Ceramic 10μF 100 10 ESR(Ω) 10 ESR(Ω) COUT=Ceramic 4.7μF 100 1 0.1 1 0.1 0.01 0.01 0 100 200 300 400 500 600 700 800 Output Current IOUT(mA) 0 100 200 300 400 500 600 700 800 Output Current IOUT(mA) 21 1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to Ricoh sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of Ricoh. 3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein. 4. The technical information described in this document shows typical characteristics of and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under Ricoh's or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting to use AOI. 11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or the technical information. Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since April 1, 2012. https://www.e-devices.ricoh.co.jp/en/ Sales & Support Offices Ricoh Electronic Devices Co., Ltd. Shin-Yokohama Office (International Sales) 2-3, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa, 222-8530, Japan Phone: +81-50-3814-7687 Fax: +81-45-474-0074 Ricoh Americas Holdings, Inc. 675 Campbell Technology Parkway, Suite 200 Campbell, CA 95008, U.S.A. Phone: +1-408-610-3105 Ricoh Europe (Netherlands) B.V. Semiconductor Support Centre Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands Phone: +31-20-5474-309 Ricoh International B.V. - German Branch Semiconductor Sales and Support Centre Oberrather Strasse 6, 40472 Düsseldorf, Germany Phone: +49-211-6546-0 Ricoh Electronic Devices Korea Co., Ltd. 3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea Phone: +82-2-2135-5700 Fax: +82-2-2051-5713 Ricoh Electronic Devices Shanghai Co., Ltd. Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203, People's Republic of China Phone: +86-21-5027-3200 Fax: +86-21-5027-3299 Ricoh Electronic Devices Shanghai Co., Ltd. Shenzhen Branch 1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District, Shenzhen, China Phone: +86-755-8348-7600 Ext 225 Ricoh Electronic Devices Co., Ltd. Taipei office Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan (R.O.C.) Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623
R1170H331B-T1-FE 价格&库存

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R1170H331B-T1-FE
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    • 174+1.63387

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