R1171S331B-E2-FE

R1171x SERIES 2.0A/1.5A LDO REGULATOR NO. EA-125-111027 OUTLINE The R1171x Series are CMOS-based positive voltage regulator ICs. The R1171x Series have features of low dropout voltage, high output voltage accuracy, low consumption current. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at short mode, a chip enable circuit, and thermal shutdown circuit. The output voltage of R1171 is fixed in the IC. Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make low dropout voltage and chip enable function prolongs the battery life. These regulators are remarkable improvement on the current regulators in terms of input transient response, and load transient response. Thus, the R1171x Series are suitable for various power sources. Since the packages for these ICs are high wattage HSOP-6J package, TO-252-5-P1, high density mounting of the ICs on boards is possible. FEATURES • Supply Current ............................................................. Typ. 130μA • Standby Current ........................................................... Typ. 0.1μA • Output Current ............................................................. Min. 1.5A (VIN=VOUT+1.0V, R1171Sxx1A/B) Min. 2.0A (VIN=VOUT+1.0V, R1171Jxx1C/D) • Input Voltage ................................................................ 2.1V to 6.0V • Output Voltage ............................................................. 1.5V to 5.0V (0.1V steps) (R1171Sxx1A/B) 1.8V to 5.0V (0.1V steps) (R1171Jxx1C/D) (For other voltages, please refer to MARK INFORMATIONS.) • Output Voltage Accuracy.............................................. ± 2.0% • Dropout Voltage ........................................................... Typ. 0.09V (VOUT=3.0V, IOUT=300mA) • Temperature-drift Coefficient of Output Voltage........... Typ. ± 100ppm/°C • Line Regulation ............................................................ Typ. 0.05%/V • Packages ..................................................................... HSOP-6J, TO-252-5-P1 • Built-in Current Limit Circuit • Built-in Thermal Shutdown Circuit • Ceramic capacitor for phase compensation ................ CIN=COUT=Ceramic 10μF (VOUT = 1.8V) APPLICATIONS • • • • Local Power source for Notebook PC. Local Power source for portable appliances, cameras, and videos. Local Power source for equipment of battery-use. Local Power source for home appliances. 1 R1171x BLOCK DIAGRAMS R1171xxx1A/C R1171xxx1B/D VDD VOUT VDD GND Vref VOUT GND Vref Current Limit Thermal Shutdown Current Limit Thermal Shutdown CE GND CE GND SELECTION GUIDE The output voltage, chip enable polarity, package for the ICs can be selected at the user’s request. Product Name R1171Sxx1∗-E2-FE R1171Jyy1$-T1-F Package Quantity per Reel Pb Free Halogen Free HSOP-6J 1,000 pcs Yes Yes TO-252-5-P1 3,000 pcs Yes No xx : The output voltage can be designated in the range from 1.5V(15) to 5.0V(50) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.) yy : The output voltage can be designated in the range from 1.8V(18) to 5.0V(50) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.) ∗ : CE pin polarity are options as follows. (A) "L" active (B) "H" active $ : CE pin polarity are options as follows. (C) "L" active (D) "H" active 2 R1171x PIN CONFIGURATIONS 6 z HSOP-6J 4 5 1 2 z TO-252-5-P1 3 1 2 3 4 5 PIN DESCRIPTIONS • • HSOP-6J Pin No Symbol Pin Description 1 VOUT Output Pin 2 GND Ground Pin 3 CE or CE Chip Enable Pin 4 NC No Connection 5 GND 6 VDD Ground Pin Input Pin TO-252-5-P1 Pin No Symbol Pin Description 1 VOUT 2 CE or CE 3 GND Ground Pin 4 GND Ground Pin 5 VDD Output Pin Chip Enable Pin Input Pin ∗) No.3 and No.4 pins must be wired short each other and connected to the GND plane when it is mounted on board. 3 R1171x ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit 7.0 V VIN Input Voltage VCE Input Voltage ( CE or CE Input Pin) −0.3 to VIN+0.3 V VOUT Output Voltage −0.3 to VIN+0.3 V PD Power Dissipation (HSOP-6J)∗1 1700 ∗1 Power Dissipation (TO-252-5-P1) mW 1900 Topt Operating Temperature −40 to 85 °C Tstg Storage Temperature −55 to 125 °C ∗) For Power Dissipation, please refer to PACKAGE INFORMATION. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 4 R1171x ELECTRICAL CHARACTERISTICS • R1171Sxx1A Topt=25°C Symbol VOUT ΔVOUT/ ΔIOUT VDIF Item Conditions Min. Output Voltage VIN−VOUT=1.0V, IOUT=200mA ×0.98 Load Regulation VIN−VOUT=1.0V 1mA < = IOUT < = 300mA IOUT=300mA Dropout Voltage Typ. Max. Unit ×1.02 V 10 60 mV 1.5 < = VOUT