R1190x SERIES
1A VOLTAGE REGULATOR (Operating Voltage up to 16V)
NO.EA-183-161011
OUTLINE
The R1190x series are a low supply current voltage regulator with high output voltage accuracy. The maximum
operating voltage is 16V and the output current is 1A. Each of these ICs consists of a voltage reference unit, an
error amplifier, a resistor-net for voltage setting, as a short current protection, a peak current protection, a thermal
shutdown, an inrush current limit and a chip enable circuit. The wide input voltage range (Max. 16V). Additionally,
the output voltage is fixed internally, in the range from 2.0V to 12.0V by the 0.1V steps. The supply current of
R1190x series is excellent (Typ. 150µA) moreover R1190x series has the standby mode (Typ. 0.1µA) by the chip
enable function.
Since the package for these ICs are TO-252-5-P2, SOT-89-5 and HSOP-6J with high power dissipation, high
density mounting of the ICs on boards is possible.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
Input Voltage Range ............................................. 3.5V to 16V
Supply Current ...................................................... Typ. 150µA
Standby Current .................................................... Typ. 0.1µA
Output Voltage Range ........................................... 2.0V to 12.0V (0.1V steps)
(For other voltages, please refer to MARK INFORMATIONS.)
Output Voltage Accuracy....................................... ±1.5%
Temperature-Drift Coefficient of Output Voltage ... Typ. ±100ppm/°C
Dropout Voltage .................................................... Typ. 1.1V (IOUT=1A, VOUT=5V)
Output Current ...................................................... Min. 1A (3.3V ≤ VOUT ≤ 12.0V)
Line Regulation ..................................................... Typ. 0.02%/V
Packages .............................................................. SOT-89-5, HSOP-6J, TO-252-5-P2
Built-in Fold Back Protection Circuit ..................... Typ.300mA (Current at short mode)
Built-in Thermal Shutdown Circuit
Built-in Inrush Current Limit Circuit ....................... The Delay Pin for setting Inrush Current Limit Time
APPLICATIONS
• Power source for digital home appliances.
• Power source for audio visual equipments.
1
R1190x
BLOCK DIAGRAMS
R1190xxxxD
R1190xxxxB
Thermal Shutdown
Thermal Shutdown
VDD
VOUT VDD
Vref
Short
Protection
VOUT
Vref
Inrush
Current
Limit
Peak
Current
Protection
CE
Short
Protection
Inrush
Current
Limit
Peak
Current
Protection
GND CE
GND
DELAY
DELAY
SELECTION GUIDE
The output voltage, auto discharge function, package for the ICs can be selected at the user’s request.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
R1190Hxxx∗-T1-FE
SOT-89-5
1,000 pcs
Yes
Yes
R1190Sxxx∗-E2-FE
HSOP-6J
1,000 pcs
Yes
Yes
R1190Jxxx∗-T1-FE
TO-252-5-P2
3,000 pcs
Yes
Yes
xxx : The output voltage can be designated in the range of 2.0V(020) to 12.0V(120) in 0.1V steps.
(For other voltages, please refer to MARK INFORMATIONS.)
∗
2
: The auto discharge function at off state are options as follows.
(B) without auto discharge function at off state
(D) with auto discharge function at off state
R1190x
PIN CONFIGURATIONS
• SOT-89-5
5
1
• HSOP-6J
6
5
4
1
2
3
• TO-252-5-P2
4
2
3
1
2
3
4
5
PIN DESCRIPTIONS
•
SOT-89-5
Pin No.
Symbol
Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE
4
DELAY
5
VDD
Chip Enable Pin ("H" Active)
Delay Pin (for setting Inrush Current Limit Time)
Input Pin
• HSOP-6J
Pin No.
Symbol
Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE
4
DELAY
5
GND
6
VDD
Chip Enable Pin ("H" Active)
Delay Pin (for setting Inrush Current Limit Time)
Ground Pin
Input Pin
• TO-252-5-P2
Pin No.
Symbol
Description
1
DELAY
2
VDD
3
GND
Ground Pin
4
VOUT
Output Pin
5
CE
Chip Enable Pin ("H" Active)
Delay Pin (for setting Inrush Current Limit Time)
Input Pin
3
R1190x
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
−0.3 to 18
V
VIN
Input Voltage
VCE
Input Voltage (CE Pin)
−0.3 to VIN+0.3 ≤ 18
V
VOUT
Output Voltage
−0.3 to VIN+0.3 ≤ 18
V
PD
Power Dissipation (SOT-89-5) ∗
900
Power Dissipation (HSOP-6J) ∗
1700
Power Dissipation (TO-252-5-P2) ∗
1900
mW
Topt
Operating Temperature Range
−40 to 85
°C
Tstg
Storage Temperature Range
−55 to 125
°C
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
(ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
4
R1190x
ELECTRICAL CHARACTERISTICS
VIN=VCE=Set VOUT+2.0V, CIN=COUT=4.7µF, IOUT=1mA, unless otherwise noted.
The specification in
is checked and guaranteed by design engineering at −40°C ≤ Topt ≤ 85°C.
•
R1190x
Symbol
VOUT
Topt=25°C
Item
Output Voltage
Conditions
IOUT=1mA
Min.
Typ.
Max.
Topt=25°C
×0.985
×1.015
−40°C ≤ Topt ≤ 85°C
×0.973
×1.027
Unit
V
∆VOUT/∆IOUT
Load Regulation
Refer to the following table
VDIF
Dropout Voltage
Refer to the following table
ISS
Supply Current
IOUT=0mA
150
220
µA
Istandby
Standby Current
(CE Off State)
VIN=16V
VCE=0V
0.1
1.0
µA
∆VOUT/∆VIN
Line Regulation
VOUT+0.5V (Min.3.5V) ≤ VIN ≤ 16V
IOUT=1mA
0.02
0.10
%/V
RR
Ripple Rejection
f=1kHz, IOUT=100mA
VIN
Input Voltage
∆VOUT
/∆Topt
Output Voltage
Temperature Coefficient
ILIM
Output Current
ISC
Short Current Limit
60
3.5
IOUT=1mA, −40°C ≤ Topt ≤ 85°C
dB
16
V
ppm
/°C
±100
Refer to the following table
VOUT=0V
300
mA
VCEH
CE Input Voltage "H"
1.6
VIN
V
VCEL
CE Input Voltage "L"
0
0.6
V
TTSD
Thermal Shutdown
Temperature
Junction Temperature
150
°C
TTSR
Thermal Shutdown
Released Temperature
Junction Temperature
130
°C
RLOW
Low Output Nch Tr.
ON Resistance
(of D version)
VIN=5.0V
VCE=0V
VOUT=0.3V
150
Ω
All of units are tested and specified under pulse load conditions such that Tj≈Topt=25°C except for Ripple
Rejection, Output Voltage Temperature Coefficient, Thermal Shutdown, Load Regulation at 600mA (2.0V ≤ VOUT
< 2.5V) and at 700mA (2.5V≤ VOUT < 3.3V) and at 1000mA (3.3V ≤ VOUT ≤ 12.0V), Dropout Voltage at 600mA
(2.0V ≤ VOUT < 2.5V) and at 700mA (2.5V ≤ VOUT < 3.3V) and at 1000mA (3.3V ≤ VOUT ≤ 12.0V).
5
R1190x
The specification in
•
is checked and guaranteed by design engineering at −40°C ≤ Topt ≤ 85°C.
Output Current by Output Voltage
Output Current ILIM (mA)
Output Voltage VOUT
Condition
Min.
2.0V ≤ VOUT < 2.5V
600
2.5V ≤ VOUT < 3.3V
VIN=VOUT+2.3V
700
3.3V ≤ VOUT ≤ 12.0V
•
1000
Load Regulation by Output Voltage
Topt=25°C
Load Regulation ∆VOUT/∆IOUT (mV)
Output Voltage VOUT
Condition
2.0V ≤ VOUT < 5.0V
5.0V ≤ VOUT ≤ 12.0V
Max.
20
60
40
100
2.0V ≤ VOUT < 2.5V
VIN=VOUT+2.3V, 1mA ≤ IOUT ≤ 600mA
80
180
2.5V ≤ VOUT < 3.3V
VIN=VOUT+2.3V, 1mA ≤ IOUT ≤ 700mA
90
200
120
230
130
250
3.3V ≤ VOUT < 5.0V
5.0V ≤ VOUT ≤ 12.0V
•
VIN=VOUT+2.3V, 1mA ≤ IOUT ≤ 200mA
Typ.
VIN=VOUT+2.3V, 1mA ≤ IOUT ≤ 1A
Dropout Voltage by Output Voltage
Output Voltage
VOUT
Topt=25°C
Dropout Voltage VDIF (V)
Condition
Typ.
Max.
2.0V
1.5
2.1V
1.4
2.2V
1.3
2.3V
1.2
2.4V
1.1
2.5V
1.0
2.6V
2.7V
Condition
Typ.
Max.
IOUT=600mA
1.6
2.2
IOUT=700mA
1.5
2.15
1.6
2.3
1.4
2.1
1.1
1.85
0.8
1.30
0.9
IOUT=200mA
0.8
2.8V ≤ VOUT < 3.1V
0.7
3.1V ≤ VOUT < 3.3V
0.4
0.7
3.3V ≤ VOUT < 4.0V
0.3
0.53
4.0V ≤ VOUT < 5.0V
0.25
0.42
5.0V ≤ VOUT < 9.0V
0.19
0.31
9.0V ≤ VOUT ≤ 12.0V
0.1
0.18
IOUT=1A
All of units are tested and specified under pulse load conditions such that Tj≈Topt=25°C except for Ripple
Rejection, Output Voltage Temperature Coefficient, Thermal Shutdown, Load Regulation at 600mA (2.0V ≤ VOUT
< 2.5V) and at 700mA (2.5V≤ VOUT < 3.3V) and at 1000mA (3.3V ≤ VOUT ≤ 12.0V), Dropout Voltage at 600mA
(2.0V ≤ VOUT < 2.5V) and at 700mA (2.5V ≤ VOUT < 3.3V) and at 1000mA (3.3V ≤ VOUT ≤ 12.0V).
6
R1190x
TYPICAL APPLICATION
VDD
VOUT
R1190x
Series
C1
CE
C2
GND
DELAY
CD
(External Components)
C1, C2: Ceramic Capacitor 4.7µF
VOUT
DELAY pin is OPEN when CD pin is not used.
Nippon Chemi-con Corporation
KTD500B475M43A0T00
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance).
(Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for
phase compensation, the operation might be unstable. Because of this, test these ICs with as same external
components as ones to be used on the PCB.)
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor with a capacitance value as much as 4.7µF or more between VDD and GND pin, and as close
as possible to the pins.
Set external components, especially the output capacitor, as close as possible to the ICs, and make wiring as
short as possible. (Refer to the TYPICAL APPLICATION diagram above.)
Thermal Shutdown
There is the built-in thermal-shutdown function in R1190x series. It discontinues operation of the IC when the
junction temperature becomes over 150°C (Typ.) and IC re-operates when the junction temperature under 130°C.
If the temperature increasing keeps the IC repeats ON and OFF operating. The output becomes the pulse
condition.
Chip Enable Circuit
For the output voltage stability, please do not use the intermediate electric potential (the voltage value between
VCEH and VCEL) that causes the supply current increasing and the unstable of output voltage.
7
R1190x
Inrush-Current Limit Function
R1190x Series has the function to limit the inrush-current, it limited approximately 0.3A when the voltage
regulator is turn ON. It is also possible to set time of the rush-current limitation by connecting capacitor with
DELAY pin. The rush-current time (tD) and the value of capacitor (CD(F)) is calculatable by the following formula;
tD=(0.000198+(3.79×107×CD))×VIN
The inrush-current is limited even if the capacitor is not connected with the DELAY pin. In this case, the time is
calculated as CD=0 by the formula above.
Though, if the value of time is insufficient for controlling the inrush-current, please connect the capacitor with
DELAY pin. The DELAY pin is used as OPEN when the capacitor is not used. Please use the DELAY pin as
OPEN when the capacitor is not used.
Auto-Discharge Function
R1190xxxxD series has the auto-discharge function. When "L" signal is put into the Chip-enable pin (CE), the
switch between VOUT and GND is turned ON and the charge at capacitor is discharge rapidly by the auto-discharge
function.
8
R1190x
TEST CIRCUITS
VDD
VOUT
R1190x
Series
C2
C1
VIN
CE
GND
DELAY
V
VOUT
IOUT
Basic Test Circuit
VDD
VOUT
R1190x
Series
A
C2
C1
CE
GND
DELAY
VIN
Test Circuit for Supply Current
VDD
R1190x
Series
Pulse
Generator
P.G.
VOUT
CE
C2
GND
DELAY
IOUT
Test Circuit for Ripple Rejection
9
R1190x
VDD
VOUT
VOUT
R1190x
Series
VIN
C2
C1
CE
GND
DELAY
IOUTa
Test Circuit for Load Transient Response
10
IOUTb
R1190x
TYPICAL CHARACTERISTIC
1) Output Voltage vs. Output Current (C1=C2=4.7µF, Topt=25°C)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
11
R1190x
2) Output Voltage vs. Input Voltage (C1=C2=4.7µF, Topt=25°C)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
12
R1190x
3) Supply Current vs. Input Voltage (C1=C2=4.7µF, Topt=25°C)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
13
R1190x
4) Output Voltage vs. Temperature (C1=C2=4.7µF, IOUT=1mA)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
14
R1190x
5) Supply Current vs. Temperature (C1=C2=4.7µF)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
15
R1190x
6) Dropout Voltage vs. Output Current (C1=C2=4.7µF)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x120x
16
R1190x
7) Dropout Voltage vs. Set Output Voltage (C1=C2=4.7µF, Topt=25°C)
8) Ripple Rejection vs. Input Voltage (C1=none, C2=4.7µF, IOUT=100mA, Ripple=0.2Vp-p, Topt=25°C)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
17
R1190x
R1190x120x
9) Ripple Rejection vs. Frequency (C1=none, C2=4.7µF, Ripple=0.2Vp-p, Topt=25°C)
18
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x
R1190x120x
10) Input Transient Response (C1=none, C2=4.7µF, IOUT=1mA, tr=tf=0.5µs)
R1190x020x
R1190x033x
R1190x050x
R1190x090x
19
R1190x
R1190x120x
11) Load Transient Response (C1=C2=4.7µF, tr=tf=0.5µs)
20
R1190x020x
R1190x033x
R1190x050x
R1190x090x
R1190x
R1190x120x
12) Turn On Speed with CE Pin (IOUT=1mA, C1=C2=4.7µF, tr=tf=0.5µs)
R1190x020x
R1190x050x
R1190x090x
R1190x120x
21
R1190x
13) Turn Off Speed with CE Pin (D Version) (IOUT=1mA, C1=C2=4.7µF, tr=tf=0.5µs)
R1190x020x
R1190x050x
R1190x090x
R1190x120x
14) Inrush Current at Turn On (VIN=7.0V, C1=C2=4.7µF, CD=none, tr=tf=0.5µs )
22
R1190x
15) Inrush Current Limit vs. CD Capacitance (C1=C2=4.7µF)
R1190x050x
16) Inrush Current Limit Delay Time vs. Input Voltage (C1=C2=4.7µF)
R1190x050x
17) Thermal Shutdown vs. Temperature (C1=C2=4.7µF)
R1190x050x
23
R1190x
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40µVrms (Avg.) are marked as the hatched area in the
graph.
Measurement conditions
• Frequency Band : 10Hz to 1MHz
• Temperature
: −40°C to 85°C
• Hatched Area
: Noise level is under 40µVrms (Avg.)
: 4.7µF (KTD500B475M43A0T00)
• CIN
: 4.7µF (KTD500B475M43A0T00)
• COUT
: 10.0µF (FK22Y5V1H106Z)
24
R1190x020x
R1190x020x
R1190x033x
R1190x033x
R1190x
25
R1190x
26
R1190x050x
R1190x050x
R1190x090x
R1190x090x
R1190x120x
R1190x120x
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
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