R1240x Series
1.2 A, 30 V Step-Down DC/DC Converter
NO.EA-190-170609
OUTLINE
The R1240x is a CMOS-based Step-down DC/DC converter with internal Nch high side Tr. (0.35 Ω), which
can provide the maximum 1.2 A output current. The ICs consists of an Oscillator, a PWM control circuit, a
Reference Voltage unit, an Error amplifier, phase compensation circuits, a slope circuit, a soft-start circuit,
protection circuits, internal voltage regulators, and a switch for boot strap circuit. The ICs can make up a StepDown DC/DC Converter with the following external components: an inductor, resistors, a diode, and capacitors.
The R1240x is a current mode operating type DC/DC converter which does not require external current sense
resistor, and it works high speed response time, high efficiency and compatible with ceramic capacitors.
Oscillator frequency is internally set at 1.25 MHz.
As a protection function, it has cycle by cycle peak current limit function, short protection function, thermal
shutdown function and UVLO.
There are two types for short protection, A version has latch protection function with 2 ms delay time, and B
version has fold-back protection function that keep operating at short condition with lower operating frequency
and limiting the Lx current.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Operating Voltage
········································· 4.5 V to 30 V
Internal Nch MOSFET Driver ····························· Typ. RON = 0.35 Ω
Adjustable Output Voltage with External Resistor ··· 0.8 V to 15 V
Feedback Voltage············································ 0.8 V ±1.5%
Peak Current Limit Function ······························ Typ. 2.0 A
UVLO Function
Operating Frequency ······································· 1.25 MHz (Ver. B: 310 kHz, Fold-back Condition)
Short Protection for Output ································ Ver. A: Latch with 2 ms delay or Ver. B: Fold-back
Ceramic Capacitor Compatible
Stand-by Function ··········································· Typ. 0 µA
Package ························································ SOT-23-6W, DFN(PLP)2527-10
APPLICATIONS
•
•
•
•
Digital Home Appliances: Digital TVs, DVD Players
OA Equipment: Printers, Fax
Hand-held Communication Equipment, Cameras, VCRs, Camcorders
Battery-powered Equipment
1
R1240x
NO.EA-190-170609
SELECTION GUIDE
In the R1240x, the Package, type of short protection (Latch or Fold-back) can be selected at the user’s request.
Selection Guide
Product Name
R1240K003∗-TR
R1240N001∗-TR-FE
Package
Quantity per Reel
Pb Free
Halogen Free
DFN(PLP)2527-10
5,000 pcs
Yes
Yes
SOT-23-6W
3,000 pcs
Yes
Yes
∗: Designation of Optional Function at off state are options as follows.
(A) Latch Type protection
(B) Fold-back Type protection
BLOCK DIAGRAM
VIN
Thermal Shutdown
UVLO
CE
Regulator
Regulator
5V
BST
Shutdown
SETPULSE
Oscillator
(1250kHz/3
10kHz)
VFB
MAXDUTY
S
D
Lx
R
Reference
+
+
Soft Start
Circuit(0.4msec)
Current Slope
Circuit
0.8V
Limit Latch
Circuit (2msec)
(Ver.A only)
Peak Current
Limit Circuit
GND
R1240x Block Diagram
2
R1240x
NO.EA-190-170609
PIN DESCRIPTIONS
Top View
Bottom View
Top View
1
10
10
1
2
9
9
2
8
8
3
4
7
7
4
5
6
6
5
3
R1240K
DFN(PLP)2527-10 Pin Configuration
6
1
2
3
R1240N
5
4
SOT-23-6W Pin Configuration
R1240N001x Pin Description
Pin No.
Symbol
1
CE
2
VIN
3
Lx
4
BST
5
GND
6
VFB
Description
Chip Enable Pin, Active with ”H”
Power Supply Pin
Lx Switching Pin
Bootstrap Pin
Ground Pin
Feedback Pin
R1240K003x Pin Description
Pin No.
Symbol
1
Lx
2
VIN
3
VIN
4
CE
5
TEST
6
GND
7
NC
8
VFB
9
NC
10
BST
Description
Lx Switching Pin
Power Supply Pin
Power Supply Pin
Chip Enable Pin, Active with ”H”
Test Pin (Open, do not connect to any line.)
Ground Pin
No Connection
Feedback Pin
No Connection
Bootstrap Pin
Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
3
R1240x
NO.EA-190-170609
ABSOLUTE MAXIMUM RATINGS
(GND = 0 V)
Absolute Maximum Ratings
Symbol
VIN
Item
Input Voltage
Rating
Unit
−0.3 to 32
V
VLX −0.3 to VLX +6
V
VBST
BST Pin Voltage
VLX
Lx Pin Voltage
−0.3 to VIN +0.3
V
ILX
Lx Pin Current
2
A
VCE
CE Pin input Voltage
−0.3 to VIN + 0.3
V
VFB
VFB Pin Voltage
−0.3 to 4
V
SOT-23-6W
PD
Power Dissipation*
Standard Land Pattern
430
Standard Land Pattern
DFN(PLP)2527-10 High Wattage Land
Pattern
910
mW
1400
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
∗ Refer to Power Dissipation for detailed information.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
Rating
Unit
VIN
Operating Input Voltage
4.5 to 30
V
Ta
Operating Temperature Range
−40 to 85
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And
the semiconductor devices may receive serious damage when they continue to operate over the recommended
operating conditions.
4
R1240x
NO.EA-190-170609
ELECTRICAL CHARACTERISTICS
(Otherwise notified, VIN = 12 V, Ta = 25ºC)
Conditions
Min.
Typ.
Max.
Unit
Electrical Characteristics
Symbol
Item
IIN
VIN Consumption Current
VIN = 30 V, VFB = 1.0 V
VUVLO1
UVLO Detect Voltage
Falling
VUVLO2
UVLO Released Voltage
Rising
VFB
VFB Voltage Tolerance
ΔVFB/ΔTa
VFB Voltage Temperature
Coefficient
fosc
Oscillator Frequency
VFLB
Fold-back Frequency
(Ver. B)
Maxduty
tmin
tdly
Delay Time for Latch
Protection (Ver. A)
Lx High Side Switch
ON Resistance
Lx High Side Switch
Leakage Current
Lx High Side Switch
Limited Current
ILIMLXH
1.0
mA
3.8
4.0
V
VUVLO1
+0.2
4.2
V
0.800
0.812
V
±150
−40ºC ≤ Ta ≤ 85ºC
1000
1250
ppm/ºC
1500
310
VFB < 0.56 V
75
85
VFB = 0.72 V
kHz
kHz
90
100
Minimum On Time
Soft-start Time
ILXHOFF
0.788
Oscillator Max. Duty Cycle
tss
RLXH
3.6
0.5
%
nsec
0.2
0.4
0.6
ms
1
2
4
ms
0.35
0
Ω
5
2.0
μA
A
VCEL
CE “L” Input Voltage
VCEH
CE “H” Input Voltage
1.6
IFB
VFB Input Current
−1.0
1.0
μA
ICEL
CE “L” Input Current
−1.0
1.0
μA
ICEH
CE “H” Input Current
−1.0
1.0
μA
TTSD
Thermal Shutdown Detect
Temperature
Hysteresis 30ºC
Standby Current
VIN = 30 V
Istandby
0.3
V
V
160
0
ºC
5
μA
5
R1240x
NO.EA-190-170609
OPERATING DESCRIPTIONS
OPERATION OF STEP-DOWN DC/DC CONVERTER AND OUTPUT CURRENT
The step-down DC/DC converter charges energy in the inductor (L) when the LX transistor turns on, and
discharges the energy from the inductor when LX transistor turns off and controls with less energy loss, so that
a lower output voltage (VOUT) than the input voltage (VIN) can be obtained. The operation of the step-down
DC/DC converter is explained in the following figures.
IL
i1
VIN
Nch Tr.
Diode
VOUT
L
i2
ILmax
ILmin
topen
COUT
GND
ton
toff
T=1/fosc
Basic Circuit
Step1.
Inductor Current flowing through Inductor
The Nch transistor turns on and the inductor current (i1) flows, L is charged with energy. At this
moment, i1 increases from the minimum inductor current (ILmin), which is 0 A, and reaches the
maximum inductor current (ILmax) in proportion to the on-time period (ton) of the Nch transistor.
Step2.
When the Nch transistor turns off, L tries to maintain IL at ILmax, so L turns the diode on and the inductor
current (i2) flows into L.
Step3.
i2 decreases gradually and reaches ILmin after the open-time period (topen) of the Nch transistor,
and then the diode turns off. This is called discontinuous current mode.
As the output current (IOUT) increases, the off-time period (toff) of the Nch transistor runs out before
IL reaches ILmin. The next cycle starts, and the Nch transistor turns on and the diode turns off, which
means IL starts increasing from ILmin. This is called continuous current mode.
In the case of PWM mode, VOUT is maintained by controlling ton. During PWM mode, the oscillator frequency
(fosc) is being maintained constant.
6
R1240x
NO.EA-190-170609
APPLICATION INFORMATION
TYPICAL APPLICATION CIRCUIT
VIN
CSPD
470pF
VIN
R1
3.75kΩ CIN
10µF
VFB
BST
LX
RBST
51Ω
CBST
0.1µF
L
4.7µH
VOUT
3.3V
COUT
10µF
R2
1.2kΩ
GND
CE
"H"active
5.1kΩ
(optional)
R1240x Typical Application Circuit
External Parts
CIN
10 µF, KTS500B106M55N0T00 (Nippon Chemi-Con)
COUT
10 µF, GRM31CR71E106K (Murata)
CBST
0.1 µF, GRM21BB11H104KA01L (Murata)
L
4.7 µH, SLF7045T-4R7M2R0-PF (TDK)
D
CMS11 (Toshiba)
7
R1240x
NO.EA-190-170609
OUTPUT CURRENT AND SELECTION OF EXTERNAL COMPONENTS
The following equations explain the relationship between output current and peripheral components.
Ripple Current P-P value is described as IRP, ON resistance of switch is described as RONP, forward drop
voltage is described as VF, and DC resistance of inductor is described as RL.
First, when the switch is turned on, the following equation is satisfied.
VIN = VOUT + (RONH + RL) × IOUT + L × IRP / ton ································································· Equation 1
Second, when the switch is turned off, the diode is turned on, the following equation is satisfied.
L × IRP / toff = VF + VOUT + RL × IOUT ·············································································· Equation 2
Put Equation 2 into Equation 1 to solve the ON duty of the switch (DON = ton / (toff + ton)):
DON = (VOUT + VF + RL × IOUT) / (VIN + VF − RONH × IOUT) ····················································· Equation 3
Ripple Current is described as follows:
IRP = (VIN − VOUT − RONH × IOUT − RL × IOUT) × DON / fosc / L ················································ Equation 4
Peak current that flows through L and the switch is described as follows:
ILmax = IOUT + IRP / 2 ································································································ Equation 5
Notes: Please consider ILmax when setting conditions of input and output, as well as selecting the external
components. The above calculation formulas are based on the ideal operation of the ICs in continuous mode.
8
R1240x
NO.EA-190-170609
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed its voltage, current or power ratings.
When designing a peripheral circuit, please be fully aware of the following points. (Refer to our PCB layout for
detailed information).
•
External components must be connected as close as possible to the ICs and make wiring as short as
possible. Especially, the capacitor connected in between VIN and GND pin must be wiring the shortest.
The operating may be unstable due to the change of the electric potential of internal ICs by the switching
current when the impedance of the power supply line and GND line is high. Make the power supply and
GND lines sufficient. It is also necessary to give careful consideration to design the wiring of the power
supply, GND, Lx, VOUT and the inductor because of the large current by the function of switching is
flowing into them. Besides, the wiring between the resistance (R1), which set the output voltage, and the
•
wiring of the inductor must separate from the load wiring.
The ceramic capacitors have low ESR (Equivalent Series Resistance) type are recommended for the
ICs. The recommendation of CIN capacitor between VIN and GND is more than 10 µF, and COUT
capacitor is more than 10 µF in the case VOUT ≥ 1.8 V or more than 20 µF in the case 1.8 V > VOUT.
•
Please check the bias dependence and the temperature variations of the ceramic capacitors.
Normally, please select the inductor value in the range between 4.7 µH and 10µH in the case of VOUT ≥
5 V, 4.7 µH in the case of 5 V > VOUT ≥ 1.8 V and 2.2 µH in the case of 1.8 V > VOUT. The internal phase
compensation of this IC is designed with the above-mentioned inductor value and COUT ceramic
capacitor value. When the inductor value is small, there is a possibility to trigger the over-current
protection circuit by the peak switching current. As the peak switching current might reach to the limited
•
•
•
value when the load current increase a lot.
Please note; the over-current protection circuit is influenced by the temperature shift caused by
operation of the IC.
For the diode, please use the Schottky diode, which parasitic capacitance is small as possible, as, there
is a possibility that the operating of IC becomes unstable by the large switching current.
Output voltage is set by VOUT = VFB × (R1 + R2) / R2. If the values of R1 and R2 are large, the impedance
of VFB pin increases, and pickup the noise may result. The recommendation value range of R2 is
approximately between 1.2 kΩ to 16 kΩ. If the operation may be unstable, reduce the impedance of VFB
pin.
9
R1240x
NO.EA-190-170609
Recommended Value for Each Output Voltage
VOUT (V)
0.8
1
1.2
1.3
1.5
1.8~6
6~15
R1 (kΩ)
0
R2 (kΩ)
open
1.20
1.20
1.20
1.20
1.20
1.20
CSPD (pF)
open
3300
2200
1500
470
470
330
COUT (µF)
22 × 2
10 × 2
10 × 2
10 × 2
10 × 2
10
10
L (µH)
2.2
2.2
2.2
2.2
2.2
4.7
10.0 (4.7)
= (VOUT / 0.8 - 1) × 1.2
Recommended External Components
Symbol
Condition
CIN
COUT
VOUT > 10 V
10 V > VOUT > 1.8 V
VOUT < 1.8 V
Parts Name
MFR
10 µF/ 50 V
10 µF/ 50 V
10 µF/ 50 V
UMK325BJ106MM-P
CGA6P3X7S1H106K
KTS500B106M55N0T00
TAIYO YUDEN
TDK
Nippon Chemi-Con
10 µF/ 50 V
10 µF/ 50 V
10 µF/ 50 V
10 µF/ 25 V
22 µF/ 10 V
UMK325BJ106MM-P
CGA6P3X7S1H106K
KTS500B106M55N0T00
GRM31CR71E106K
GRM31CR71A226M
NOTE: The value of COUT
depends on the setting output
voltage.
GRM21BB11H104KA01L
TAIYO YUDEN
TDK
Nippon Chemi-Con
Murata
Murata
SLF6045T-100M1R6-3PF
SLF7045T-4R7M2R0-PF
VLCF4020T-2R2N1R7
TDK
TDK
TDK
CBST
0.1 µF/ 50 V
RBST
51.0 Ω
L
40 V/ 2.0 A
10 µH
4.7 µH
2.2 µH
D
30 V/ 2.0 A
40 V/ 2.0 A
0.32 V
0.49 V
RCE
10
Value
Murata
CMS06
TOSHIBA
CMS11
TOSHIBA
NOTE: Diode depends on the
input voltage and output
Current.
The diode is connected between the CE pin and the VIN pin as the ESD protection element.
If there is the possibility that the voltage of the CE pin becomes higher than the voltage of the
VIN pin, it is recommended to connect the 5 kΩ resistance with the CE pin for preventing a
large current flows into the VIN pin from the CE pin.
R1240x
NO.EA-190-170609
THE NOTE OF LAYOUT PATTERN
1. The wire of Power line (VIN, GND) should be broad to minimize the parasitic inductance.
The Bypass capacitor must be connected as close as possible in between VIN – GND
2. The wire between Lx pin and the inductor as short as possible to minimize the parasitic inductance
(This Evaluation Board is designed for the product evaluation board. Therefore large inductors or diodes
can be set and the large space of Lx area has been secured.)
3. The ripple current flows through the output capacitor. If the GND side of the output capacitor is connected
very close to GND pin of the IC, the noise might have a bad impact on the IC. Therefore, the GND side of
the output capacitor is better to connect to the outside of the GND of the CIN, or connect to the GND plain
layer.
4. R1, R2, Cspd and Rspd should be mounted on the position as close as possible to the FB pin, and away
from the inductor and BST pin.
5. The feed-back must be made as close as possible from the Output capacitor (COUT)
11
R1240x
NO.EA-190-170609
PCB LAYOUT
Evaluation board of R1240N001x
TOP VIEW
BOTTOM VIEW
Evaluation board of R1240K003x
TOP VIEW
12
BOTTOM VIEW
R1240x
NO.EA-190-170609
TYPICAL CHARACTERISTICS
1) Output Voltage VS. Output Current
R1240x00Xx
(VOUT=3.3V_VIN=12V)
3.5
(VOUT=5.0V_VIN=12V)
5.3
3.45
Output Voltage (V)
Output Voltage (V)
R1240x00Xx
3.4
3.35
3.3
3.25
3.2
3.15
5.2
5.1
5
4.9
4.8
4.7
4.6
3.1
10
100
1000
Output Current (mA)
10
10000
2) Output Voltage VS. Input Voltage
R1240x00Xx
Output Voltage(V)
Output Voltage(V)
3.4
3.35
3.3
IOUT=1mA
IOUT=100mA
IOUT=500mA
IOUT=1200mA
3.2
3.15
(Ta=25°C VOUT=5.0V)
5.3
3.45
3.25
3.1
5.2
5.1
5
4.9
IOUT=1mA
IOUT=100mA
IOUT=500mA
IOUT=1200mA
4.8
4.7
4.6
4 6 8 10 12 14 16 18 20 22 24 26 28 30
12 14 16 18 20 22 24 26 28 30
Input Voltage(V)
Input Voltage(V)
R1240x00Xx
(VOUT=3.3V_VIN=12V)
Efficiency η(%)
Efficiency η(%)
3) Efficiency VS. output Current
R1240x00Xx
100
90
80
70
60
50
40
30
20
10
0
10
100
1000
Output Current IOUT(mA)
10000
R1240x00Xx
(Ta=25°C VOUT=3.3V)
3.5
100
1000
Output Current (mA)
10000
(VOUT=5.0V_VIN=12V)
100
90
80
70
60
50
40
30
20
10
0
10
100
1000
10000
Output Current IOUT(mA)
13
R1240x
NO.EA-190-170609
5) Oscillator Frequency VS. Temperature
R1240x00Xx
(VIN=12V)
0.802
0.800
0.798
0.796
0.794
0.792
0.790
0.788
0.786
0.784
0.782
-50
-25
0
25
50
Ta (°C)
75
100
6) Maxduty VS. Temperature
R1240x00Xx
1300
1250
1200
1150
1100
-50
85
84
83
82
81
80
-50
-25
0
25
50
Ta (°C)
-25
0
25
50
Ta (°C)
75
100
7) Fold-Back Frequency VS. Temperature
R1240x00XB
Fold-Back Frequency (kHz)
Max Duty Maxduty(%)
1350
(VIN=12V)
86
14
(VIN=12V)
1400
Oscillator Frequency (kHz)
FB Voltage (V)
4) FB Voltage VS. Temperature
R1240x00Xx
75
100
(VIN=12V)
330
320
310
300
290
280
270
-50
-25
0
25
50
Ta (°C)
75
100
POWER DISSIPATION
SOT-23-6W
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Standard Test Land Pattern
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions
40 mm × 40 mm × 1.6 mm
Top Side: Approx. 50%
Copper Ratio
Bottom Side: Approx. 50%
Through-holes
φ 0.5 mm × 44 pcs
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Standard Test Land Pattern
Power Dissipation
430 mW
Thermal Resistance
θja = (125 − 25°C) / 0.43 W = 233°C/W
Power Dissipation PD (mW)
600
500
430
Standard Test Land Pattern
400
300
200
100
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
IC Mount Area (mm)
Measurement Board Pattern
i
PACKAGE DIMENSIONS
SOT-23-6W
Ver. A
SOT-23-6W Package Dimensions (Unit: mm)
i
POWER DISSIPATION
DFN(PLP)2527-10
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are
used in this measurement.
Measurement Conditions
High Wattage Land Pattern
Standard Land Pattern
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions
35 mm × 90 mm × 0.8 mm
40 mm × 40 mm × 1.6 mm
Copper Ratio
Copper Foil Thickness
Through-holes
Outer Layers (First and Fourth Layers): Approx.15%
Top Side: Approx. 50%
Inner Layers (Second and Third Layers): Approx.15%
Bottom Side: Approx. 50%
Outer Layers (First and Fourth Layers): Approx. 35 µm
Top Side: Approx. 35 µm
Inner Layers (Second and Third Layers): Approx. 18 µm
Bottom Side: Approx. 35 µm
φ 0.3 mm × 9 holes
(connecting outer and inner layers to a package tab)
φ 0.5 mm × 10 holes
(connecting pins)
φ 0.54 mm × 30 holes
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
High Wattage Land Pattern
Standard Land Pattern
Power Dissipation
1400 mW (Tjmax = 125°C)
910 mW (Tjmax = 125°C)
Thermal Resistance
θja = (125 − 25°C) / 1.4 W = 71°C/W
θjc = (125 − 25°C) / 0.91 W = 110°C/W
1500 1400
High Wattage Land Pattern
Standard Land Pattern
910
1000
High Wattage
500
0
40
40
Power Dissipation (mW)
2000
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Standard
IC Mount Area (mm)
Measurement Board Pattern
i
DFN(PLP)2527-10
PACKAGE DIMENSIONS
Ver. A
A
0.20±0.1
2.70
B
6
0.05 M
AB
10
0.05
0.25±0.1
X4
0.25±0.1
1.5±0.1
2.50
2.3±0.1
φ 0.5±0.05
S
0.05 S
5
0.50
0.30±0.1
1
0.10nom.
0.05min.
0.6max.
INDEX
DFN(PLP)2527-10 Package Dimensions
∗ The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the
ground plane on the board, or otherwise be left floating.
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
Sales & Support Offices
Ricoh Electronic Devices Co., Ltd.
Shin-Yokohama Office (International Sales)
2-3, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa, 222-8530, Japan
Phone: +81-50-3814-7687 Fax: +81-45-474-0074
Ricoh Americas Holdings, Inc.
675 Campbell Technology Parkway, Suite 200 Campbell, CA 95008, U.S.A.
Phone: +1-408-610-3105
Ricoh Europe (Netherlands) B.V.
Semiconductor Support Centre
Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands
Phone: +31-20-5474-309
Ricoh International B.V. - German Branch
Semiconductor Sales and Support Centre
Oberrather Strasse 6, 40472 Düsseldorf, Germany
Phone: +49-211-6546-0
Ricoh Electronic Devices Korea Co., Ltd.
3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea
Phone: +82-2-2135-5700 Fax: +82-2-2051-5713
Ricoh Electronic Devices Shanghai Co., Ltd.
Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203,
People's Republic of China
Phone: +86-21-5027-3200 Fax: +86-21-5027-3299
Ricoh Electronic Devices Shanghai Co., Ltd.
Shenzhen Branch
1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District,
Shenzhen, China
Phone: +86-755-8348-7600 Ext 225
Ricoh Electronic Devices Co., Ltd.
Taipei office
Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan (R.O.C.)
Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623
