R1501S090B-E2-FE

R1501x SERIES 1A LDO REGULATOR (Operating Voltage up to 24V) NO.EA-184-160801 OUTLINE The R1501x series are CMOS-based positive voltage regulator (VR) ICs. The R1501xxxxB has features of high input voltage operating, 1A output current drive, and low supply current. A DMOS transistor is used for the driver, high voltage operating and low on resistance (0.6Ω at VOUT=10V) device is realized. A standard regulator circuit with a current limit circuit and a thermal shutdown circuit are built in the R1501x series. As the operating temperature range is from -40°C to 105°C and maximum input voltage is up to 24V, the R1501x series are suitable for the constant voltage source for digital home appliances and car accessories. The regulator output voltage is fixed in the R1501x. Output voltage accuracy is ±2.0% and output voltage range is from 3.0V to 12.0V with a step of 0.1V, and from 12.5V to 18.0V with a step of 0.5V. The chip enable pin realizes ultra low supply current standby mode. Since the packages for these ICs are the HSOP-6J for high density mounting of the ICs on boards, and the TO252-5-P2. ∗) The DMOS (Double Diffused MOS) transistor adopted by R1501x is characterized by a double diffusion structure which comprises a low density n-type (channel) diffused layer and a high density p-type (sources) diffused layer from the edge of the gate electrode. The R1501x series possess outstanding properties of high operating voltage and low on-resistance, which have been achieved by the channel length scaled down to submicron dimensions and decreased thickness of the gate oxide film. FEATURES • • • • • • • • • • • • • • Supply Current ............................................................. Typ. 70µA Standby Current ........................................................... Typ. 0.1µA Output Current.............................................................. Min. 1A Input Voltage Range ................................................... 3.0V to 24.0V Ripple Rejection ......................................................... Typ. 60dB (VSET=5.0V) Output Voltage Range .................................................. 3.0V to 12.0V (0.1V steps) 12.5V to 18.0V (0.5V steps) (For other voltages, please refer to MARK INFORMATIONS.) Output Voltage Accuracy .............................................. ±2% Temperature-Drift Coefficient of Output Voltage .......... Typ. ±100ppm/°C Line Regulation ............................................................ Typ. 0.05%/V Packages...................................................................... HSOP-6J, TO-252-5-P2 Operating Temperature range ...................................... −40°C to 105°C Built-in Current Limit Circuit Built-in Fold-Back Circuit Built-in Thermal Shutdown Circuit APPLICATIONS • • • • Power source for home appliances such as refrigerators, rice cookers, electric water warmers, etc. Power source for car audio equipment, car navigation system, ETC system, etc. Power source for notebook PCs, digital TVs, cordless phones, and private LAN system, etc. Power source for office equipment machines such as copiers, printers, facsimiles, scanners, projectors, etc. 1 R1501x NO.EA-184-160801 BLOCK DIAGRAMS R1501xxxxB Thermal Shutdown Circuit VDD VOUT Vref Short Protection Current Limit CE GND SELECTION GUIDE The output voltage, package, etc. for the ICs can be selected at the user’s request. Product Name Package Quantity per Reel Pb Free Halogen Free R1501SxxxB-E2-FE HSOP-6J 1,000 pcs Yes Yes R1501JxxxB-T1-FE TO-252-5-P2 3,000 pcs Yes Yes xxx : The output voltage can be designated in the range from 3.0V(030) to 12.0V(120) in 0.1V steps and 12.5V(125) to 18.0V(180) in 0.5V steps. (For other voltages, please refer to MARK INFORMATIONS.) 2 R1501x NO.EA-184-160801 PIN CONFIGURATIONS • HSOP-6J 6 5 4 1 2 3 • TO-252-5-P2 1 2 3 4 5 PIN DESCRIPTIONS • HSOP-6J Pin No Symbol Pin Description 1 VDD 2 GND* Ground Pin 3 GND* Ground Pin 4 CE 5 GND* Ground Pin 6 VOUT Output Pin Input Pin Chip Enable Pin ("H" Active) ∗) No.2, No.3 and No.5 pins must be wired short each other and connected to the GND plane when it is mounted on board. • TO-252-5-P2 Pin No Symbol Pin Description 1 VDD 2 GND* Ground Pin 3 GND* Ground Pin 4 CE Chip Enable Pin ("H" Active) 5 VOUT Output Pin Input Pin ∗) No.2 and No.3 pins must be wired short each other and connected to the GND plane when it is mounted on board. 3 R1501x NO.EA-184-160801 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit −0.3 to 36 V VIN Input Voltage VCE Input Voltage (CE Pin) −0.3 to VIN + 0.3 < = 36 V VOUT Output Voltage −0.3 to VIN + 0.3 < = 36 V PD Topt Tj Tstg Power Dissipation (HSOP-6J)* 1700 Power Dissipation (TO-252-5-P2)* 1900 mW Operating Temperature Range −40 to 105 °C Operating Junction Temperature Range −40 to 125 °C Storage Temperature Range −55 to 125 °C ∗) For Power Dissipation, please refer to PACKAGE INFORMATION. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS) All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 4 R1501x NO.EA-184-160801 ELECTRICAL CHARACTERISTICS • R1501xxxxB VIN=VSET+1.0V, VCE=VIN, unless otherwise noted. The specification in is checked and guaranteed by design engineering at −40°C < = Topt < = 105°C. Topt=25°C Symbol VIN Item Conditions Min. Input Voltage Topt=25°C Typ. Max. Unit 3 24 V ×0.98 ×1.02 V ×0.965 ×1.035 V VOUT Output Voltage IOUT=1mA ISS Supply Current VIN=24V, IOUT=0A 70 160 µA Standby Current VIN=24V, VCE=0V 0.1 1.0 µA 0.1mA < = IOUT < = 200mA 25 60 mV 0.1mA < = IOUT < = 1A 125 300 mV 0.05 0.1 %/V Istandby ∆VOUT/∆IOUT Load Regulation ∆VOUT/∆VIN Line Regulation VSET+1V −40°C < = VIN < = IOUT=200mA VDIF Dropout Voltage IOUT=1A ∗guaranteed by design engineering ∆VOUT/∆Topt Output Voltage IOUT=1mA Temperature Coefficient −40°C < = Topt < = < = Topt < = 105°C ∗guaranteed by design engineering 24V, IOUT=10mA 3.0V < = VSET < 5.0V 0.135 0.225 5.0V < = VSET < 9.0V 0.115 0.180 9.0V < = VSET < 12.0V 0.095 0.155 12.0V < = VSET 0.090 0.140 3.0V < = VSET < 5.0V 0.675 1.125 5.0V < = VSET < 9.0V 0.575 0.900 < = 18.0V 9.0V < = VSET < 12.0V 0.475 0.775 12.0V < = VSET 0.450 0.700 < = 18.0V V ppm /°C ±100 105°C V ILIM Output Current ISC Short Current Limit VOUT=0V RR Ripple Rejection f=1kHz, Ripple 0.5Vp-p, IOUT=100mA, VIN=VSET+2V VCEH CE Input Voltage "H" 2.0 VIN V VCEL CE Input Voltage "L" 0 0.5 V TTSD TTSR Thermal Shutdown Temperature Thermal Shutdown Released Temperature A 1 65 VSET 6.0V 60 VSET > 6.0V 50 < = mA dB Junction Temperature 160 °C Junction Temperature 135 °C All of unit are tested and specified under load conditions such that Topt=25°C except for Output Voltage Temperature Coefficient, Ripple Rejection, Thermal Shutdown Temperature, Thermal Shutdown Released Temperature, Load Regulation at 0.1mA < = IOUT < = 1A, Dropout Voltage at IOUT=1A. 5 R1501x NO.EA-184-160801 TYPICAL APPLICATION VDD C1 VOUT R1501x Series CE VOUT C2 GND C1=Ceramic 0.47µF C2=Ceramic 10µF (External Components) C2: Ceramic 10µF MURATA: GRM32DB31E106K (size: 3225) TECHNICAL NOTES When using these ICs, consider the following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with good frequency characteristics and ESR (Equivalent Series Resistance). If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable. Evaluate your circuit with considering frequency characteristics. Depending on the capacitor size, manufacturer, and part number, the bias characteristics and temperature characteristics are different. Evaluate the circuit with actual using capacitors. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor C1 with a capacitance value as much as 0.47µF or more between VDD and GND pin, and as close as possible to the pins. Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring as short as possible. No.2 pin, No.3 pin and No.5 pin of HSOP-6J package must be wired to the GND plane when it is mounted on board. No.2 pin and No.3 pin of TO-252-5-P2 package must be wired to the GND plane when it is mounted on board. 6 R1501x NO.EA-184-160801 TYPICAL APPLICATION FOR PREVENTING IC DESTRUCTION D1 VDD C1 VOUT R1501x Series CE VOUT C2 D2 GND C1: 0.47µF or more (preventing for unstable operation) C2: 10µF or more (preventing for unstable operation) D1: If VOUT pin could be higher than VIN pin, D1 is necessary. D2: If VOUT pin could be lower than GND pin, SBD is necessary. Note: Do not force the voltage to VOUT pin. 7 R1501x NO.EA-184-160801 TEST CIRCUITS VDD VOUT R1501x Series C1 CE C2 V IOUT VOUT GND C1=Ceramic 0.47µF C2=Ceramic 10µF Basic Test Circuit VDD A ISS C1 VOUT VOUT R1501x Series CE C2 GND C1=Ceramic 0.47µF C2=Ceramic 10µF Test Circuit for Supply Current Pulse Generator VDD P.G. VOUT R1501x Series CE C2 IOUT GND C2=Ceramic 10µF Test Circuit for Ripple Rejection, Input Transient Response 8 R1501x NO.EA-184-160801 VDD R1501x Series C1 CE VOUT VOUT C2 GND IOUTa IOUTb C1=Ceramic 0.47µF C2=Ceramic 10µF Test Circuit for Load Transient Response VDD VOUT R1501x Series C1 CE P.G. Pulse Generator C2 IOUT GND ∗ CE pin Input Waveform 0V Set VOUT+1.0V C1=Ceramic 0.47µF C2=Ceramic 10µF Test Circuit for Turn On Speed with CE pin 9 R1501x NO.EA-184-160801 TYPICAL CHARACTERISTICS ∗Topt=25°C, unless otherwise noted. 1) Output Voltage vs. Output Current (C1=Ceramic 0.47µF, C2=Ceramic 10µF) R1501x030B R1501x050B R1501x090B R1501x180B 2) Output Voltage vs. Input Voltage (C1=Ceramic 0.47µF, C2=Ceramic 10µF) R1501x030B 10 R1501x050B R1501x NO.EA-184-160801 R1501x090B R1501x180B 3) Supply Current vs. Input Voltage (C1=Ceramic 0.47µF, C2=Ceramic 10µF) R1501x030B R1501x050B R1501x090B R1501x180B 11 R1501x NO.EA-184-160801 4) Output Voltage vs. Temperature (C1=Ceramic 0.47µF, C2=Ceramic 10µF, IOUT=1mA) R1501x030B R1501x050B R1501x090B R1501x180B 5) Supply Current vs. Temperature (C1=Ceramic 0.47µF, C2=Ceramic 10µF, IOUT=0mA) R1501x030B 12 R1501x050B R1501x NO.EA-184-160801 R1501x090B R1501x180B 6) Dropout Voltage vs. Output Current (C1=Ceramic 0.47µF, C2=Ceramic 10µF) R1501x030B R1501x050B R1501x090B R1501x180B 13 R1501x NO.EA-184-160801 7) Dropout Voltage vs. Set Output Voltage (C1=Ceramic 0.47µF, C2=Ceramic 10µF) 8) Ripple Rejection vs. Input Bias Voltage (C1=none, C2=Ceramic 10µF, IOUT=100mA) 14 R1501x030B R1501x030B R1501x050B R1501x050B R1501x NO.EA-184-160801 R1501x090B R1501x090B R1501x180B R1501x180B 9) Ripple Rejection vs. Frequency (C1=none, C2=Ceramic 10µF, Ripple=0.5Vp-p) R1501x030B R1501x050B 15 R1501x NO.EA-184-160801 R1501x090B R1501x180B 10) Input Transient Response (C1=none, C2=Ceramic 10µF, IOUT=100mA, tr=tf=10µs) 16 R1501x030B R1501x050B R1501x090B R1501x180B R1501x NO.EA-184-160801 11) Load Transient Response (C1=Ceramic 0.47µF, C2=Ceramic 10µF, tr=tf=0.5µs) R1501x030B R1501x050B R1501x090B R1501x180B 12) Turn On Speed with CE pin (C1=Ceramic 0.47µF, C2=Ceramic 10µF, tr=tf=0.5µs) R1501x030B R1501x030B 17 R1501x NO.EA-184-160801 18 R1501x050B R1501x050B R1501x090B R1501x090B R1501x180B R1501x180B R1501x NO.EA-184-160801 13) Turn Off Speed with CE (C1=Ceramic 0.47µF, C2=Ceramic 10µF, IOUT=500mA, tr=tf=0.5µs) R1501x030B R1501x050B R1501x090B R1501x180B 19 R1501x NO.EA-184-160801 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under the specified certain level are marked as the hatched area in the graph. Measurement conditions Input Voltage : VOUT +1V to 24V Frequency Band : 10Hz to 1MHz Temperature : −40°C to 105°C Capacitor : C1=Ceramic 0.47µF C2=Ceramic 10µF R1501x030B Noise level < = 40µVrms R1501x050B Noise level < = 50µVrms 20 R1501x030B Noise level < = 40µVrms R1501x050B Noise level < = 50µVrms R1501x NO.EA-184-160801 R1501x090B Noise level < = 120µVrms R1501x180B Noise level < = 220µVrms R1501x090B Noise level < = 120µVrms R1501x180B Noise level < = 220µVrms 21 R1501x NO.EA-184-160801 PACKAGE INFORMATION Power Dissipation (TO-252-5-P2) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below. * Measurement conditions Standard Land Pattern Environment Ultra High Wattage Land Pattern Mounting on board (Wind velocity 0m/s) Board Material Glass cloth epoxy plastic (Double layers) Glass cloth epoxy plastic (Four-layers) Board Dimensions 50mm x 50mm x 1.6mm 76.2mm x 114.3mm x 0.8mm Copper Ratio Top side: Approx. 50%, Back side: Approx. 50% Top, Back side:50mmSquare Approx. 96%, 2nd, 3rd: 50mmSquare Approx. 100% Through - hole φ 0.5mm x 24pcs φ 0.4mm x 30pcs * Measurement Results (Ta= 25°C, Tjmax=125°C) Standard Land Pattern Ultra High Wattage Land Pattern 1900mW 3800mW θja=(125-25°C)/1.9W= 53°C/W θja= (125-25°C)/3.8W = 26°C/W θjc= 17°C/W θjc= 7°C/W Power Dissipation Thermal Resistance 4800 5000 50 40 Power Dissipation PD (mW) 4000 2000 50 2350 50 3800 3000 114.3 1900 1000 On 0 76.2 50 On Board (Ultra High Wattage Land Pattern) 0 25 Board 50 75 100 125 150 105 Ambient Temperature (°C) Standard Power Dissipation Ultra High Wattage Measurement Board Pattern IC Mount Area (Unit: mm) The above graph shows the Power Dissipation of the package based on Tjmax=125°C and Tjmax=150°C. Operating the IC in the shaded area in the graph might have an influence its lifetime. Operating time must be within the time limit described in the table below, in case of operating in the shaded area. Operating Time 13,000 hours 22 Estimated years (Operating four hours/day) 9 years R1501x NO.EA-184-160801 Package Dimensions (TO-252-5-P2) 6.60±0.20 0.50±0.10 0.10 +0.26 (0°～8°) 1.52 -0.13 (6.20) 0.50±0.10 2.30±0.20 5 (1.00) (1.00) 1.10±0.20 9.90±0.30 (0～0.127) S 1 6.10±0.20 C0.60 5.34±0.20 0.50±0.10 0.12 M 1.27 (3.56) (5.04) (4.06) 2.70±0.20 ＊) The tab on the bottom of the ＊ R0.325 (1.50) (4.19) R0.225 package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. (Unit : mm) Mark Specification (TO-252-5-P2) ①②③④⑤⑥ ：Product Code … Refer to the R1501J Series Mark Specification Table. ：Blank ⑦⑧ ⑨⑩ ：Lot Number … Alphanumeric Serial Number 23 R1501x NO.EA-184-160801 R1501J Series Mark Specification (PKG: TO-252-5-P2) Product Name R1501J030B R1501J031B R1501J032B R1501J033B R1501J034B R1501J035B R1501J036B R1501J037B R1501J038B R1501J039B R1501J040B R1501J041B R1501J042B R1501J043B R1501J044B R1501J045B R1501J046B R1501J047B R1501J048B R1501J049B R1501J050B R1501J051B R1501J052B R1501J053B R1501J054B R1501J055B R1501J056B R1501J057B R1501J058B R1501J059B R1501J060B R1501J061B R1501J062B R1501J063B R1501J064B R1501J065B R1501J066B R1501J067B R1501J068B R1501J069B R1501J070B R1501J071B R1501J072B R1501J073B R1501J074B R1501J075B R1501J076B R1501J077B R1501J078B R1501J079B 24  A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 3 3 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 6 6 6 6 6 6 6 6 6 6 7 7 7 7 7 7 7 7 7 7 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B Product Name R1501J080B R1501J081B R1501J082B R1501J083B R1501J084B R1501J085B R1501J086B R1501J087B R1501J088B R1501J089B R1501J090B R1501J091B R1501J092B R1501J093B R1501J094B R1501J095B R1501J096B R1501J097B R1501J098B R1501J099B R1501J100B R1501J101B R1501J102B R1501J103B R1501J104B R1501J105B R1501J106B R1501J107B R1501J108B R1501J109B R1501J110B R1501J111B R1501J112B R1501J113B R1501J114B R1501J115B R1501J116B R1501J117B R1501J118B R1501J119B R1501J120B R1501J125B R1501J130B R1501J135B R1501J140B R1501J145B R1501J150B R1501J155B R1501J160B R1501J165B R1501J170B R1501J175B R1501J180B  A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 8 8 8 8 8 8 8 8 8 8 9 9 9 9 9 9 9 9 9 9 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 0 5 0 5 0 5 0 5 0 5 0 5 0 B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B R1501x NO.EA-184-160801 Power Dissipation (HSOP-6J) The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Environment Board Material Board Dimensions Copper Ratio Through-holes Ultra-high Wattage Land Pattern Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-layer Board) 76.2 mm × 114.3 mm × 0.8 mm 96% Standard Land Pattern Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Double-sided Board) 50 mm × 50 mm × 1.6 mm 50% φ 0.3 mm × 28 pcs φ 0.5 mm × 24 pcs (Ta = 25°C, Tjmax = 125°C) Measurement Result Power Dissipation Thermal Resistance Ultra-high Wattage Land Pattern Standard Land Pattern 2700 mW 1700 mW 37°C/W 59°C/W 3500 3500 3250 3400 2750 3250 On Board Ultra-high Wattage Land Pattern 3000 2750 Power Dissipation PD (mW) 3000 Power Dissipation PD (mW) Free Air 540 mW 185°C/W 2700 2500 2500 2100 2250 2250 2000 2000 On Board Standard Land Pattern 1750 1750 1500 1500 1700 1250 1250 1000 1000 750 500 500 250 250 0 0 0 25 50 100 105 125 75 150 670 750 Free Air 540 0 25 50 75 100 105 125 150 Ambient Temperature (°C) Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature 76.2 50 50 40 20 40 20 114.3 50 The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Ultra-high Wattage Standard Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years IC Mount Area (mm) Measurement Board Pattern 25 R1501x NO.EA-184-160801 Package Dimensions (HSOP-6J) 5.02±0.3 4 0.60±0.2 3.9±0.2 5 6.0±0.3 6 1 2 3 3.81 +0.10 0.2-0.05 1.67±0.1 0.4±0.1 0.10 0.12 M 0.15±0.1 1.5±0.1 0.605TYP. Unit: mm Mark Specification (HSOP-6J) ：Product Code … Refer to the R1501S Series Mark Specification Table. ：Lot Number … Alphanumeric Serial Number   26 R1501x NO.EA-184-160801 R1501S Series Mark Specification (PKG: HSOP-6J) Product Name R1501S030B R1501S031B R1501S032B R1501S033B R1501S034B R1501S035B R1501S036B R1501S037B R1501S038B R1501S039B R1501S040B R1501S041B R1501S042B R1501S043B R1501S044B R1501S045B R1501S046B R1501S047B R1501S048B R1501S049B R1501S050B R1501S051B R1501S052B R1501S053B R1501S054B R1501S055B R1501S056B R1501S057B R1501S058B R1501S059B R1501S060B R1501S061B R1501S062B R1501S063B R1501S064B R1501S065B R1501S066B R1501S067B R1501S068B R1501S069B R1501S070B R1501S071B R1501S072B R1501S073B R1501S074B R1501S075B R1501S076B R1501S077B R1501S078B R1501S079B  H 0 3 0 H 0 3 1 H 0 3 2 H 0 3 3 H 0 3 4 H 0 3 5 H 0 3 6 H 0 3 7 H 0 3 8 H 0 3 9 H 0 4 0 H 0 4 1 H 0 4 2 H 0 4 3 H 0 4 4 H 0 4 5 H 0 4 6 H 0 4 7 H 0 4 8 H 0 4 9 H 0 5 0 H 0 5 1 H 0 5 2 H 0 5 3 H 0 5 4 H 0 5 5 H 0 5 6 H 0 5 7 H 0 5 8 H 0 5 9 H 0 6 0 H 0 6 1 H 0 6 2 H 0 6 3 H 0 6 4 H 0 6 5 H 0 6 6 H 0 6 7 H 0 6 8 H 0 6 9 H 0 7 0 H 0 7 1 H 0 7 2 H 0 7 3 H 0 7 4 H 0 7 5 H 0 7 6 H 0 7 7 H 0 7 8 H 0 7 9 Product Name R1501S080B R1501S081B R1501S082B R1501S083B R1501S084B R1501S085B R1501S086B R1501S087B R1501S088B R1501S089B R1501S090B R1501S091B R1501S092B R1501S093B R1501S094B R1501S095B R1501S096B R1501S097B R1501S098B R1501S099B R1501S100B R1501S101B R1501S102B R1501S103B R1501S104B R1501S105B R1501S106B R1501S107B R1501S108B R1501S109B R1501S110B R1501S111B R1501S112B R1501S113B R1501S114B R1501S115B R1501S116B R1501S117B R1501S118B R1501S119B R1501S120B R1501S125B R1501S130B R1501S135B R1501S140B R1501S145B R1501S150B R1501S155B R1501S160B R1501S165B R1501S170B R1501S175B R1501S180B  H 0 8 0 H 0 8 1 H 0 8 2 H 0 8 3 H 0 8 4 H 0 8 5 H 0 8 6 H 0 8 7 H 0 8 8 H 0 8 9 H 0 9 0 H 0 9 1 H 0 9 2 H 0 9 3 H 0 9 4 H 0 9 5 H 0 9 6 H 0 9 7 H 0 9 8 H 0 9 9 H 1 0 0 H 1 0 1 H 1 0 2 H 1 0 3 H 1 0 4 H 1 0 5 H 1 0 6 H 1 0 7 H 1 0 8 H 1 0 9 H 1 1 0 H 1 1 1 H 1 1 2 H 1 1 3 H 1 1 4 H 1 1 5 H 1 1 6 H 1 1 7 H 1 1 8 H 1 1 9 H 1 2 0 H 1 2 5 H 1 3 0 H 1 3 5 H 1 4 0 H 1 4 5 H 1 5 0 H 1 5 5 H 1 6 0 H 1 6 5 H 1 7 0 H 1 7 5 H 1 8 0 27 1. 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In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. 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