R1560x Series
60 V 100 mA Ultra-low Power Voltage Regulator
No. EA-395-190606
OVERVIEW
The R1560x is a CMOS-based ultra-low power voltage regulator featuring 60 V input voltage and 100 mA
output current. The device includes a short current limit circuit, an overcurrent protection circuit and a thermal
shutdown. These features make the R1560x an ideal constant voltage power source for electrical appliances.
KEY BENEFITS
Supply current is as low as Typ. 3.0 μA, which can reduce current consumption at a system stop.
The input voltage range is as wide as 5.5 V to 60 V, and the output voltage accuracy is as high as ±0.8%.
High heat dissipation and space-saving HSOP-6J and TO-252-5-P2 packages.
SELECTION GUIDE
KEY SPECIFICATIONS
Input Voltage Range (Max. Rating): 5.5 V to 60 V (80 V)
Product Name
Package
Supply Current: Typ. 3.0 µA
R1560Sxx1B-E2-FE
HSOP-6J
Dropout Voltage: Typ. 1.5 V
R1560Jxx1B-T1-FE
TO-252-5-P2
Operating Temperature Range: −40°C to 105°C
(IOUT = 100 mA, VOUT = 5.0 V)
Output Voltage Accuracy: ±0.8% (Ta = 25°C)
xx: Set Output Voltage (VSET)
Temp. Coefficient of Output Voltage: Typ. ±100 ppm/°C
1.8 V (18) / 2.5 V (25) / 2.8 V (28) / 3.0 V (30) / 3.3 V
Line Regulation: Typ. 0.01%/V (6 V ≤ VIN ≤ 60 V)
(33) / 3.4 V (34) / 5.0 V (50) / 7.0 V (70) / 8.0 V (80) /
Short-circuit Current Limiting: limits to Typ. 50 mA
9.0 V (90) / 10.0 V (A0) / 12.0 V (C0) / 14.0 V (E0)
Overcurrent Protection: triggers at Typ. 150 mA
Thermal Shutdown: triggers at Typ.165°C
TYPICAL APPLICATIONS
+48V/24V
PACKAGES
VDD
CIN
R1560x
CE Control
CE
VOUT
GND
COUT
5.0V/3.3V/1.8V
VDD
MCU
GND
HSOP-6J
5.02 x 6.0 x 1.5 (mm)
TO-252-5-P2
6.6 x 9.9 x 2.3 (mm)
APPLICATIONS
Refrigerators, Rice Cookers and Electric Kettles
Laptop PCs, Digital TVs, Telephones and Home LAN System
1
R1560x
No. EA-395-190606
SELECTION GUIDE
The output voltage and the package type are user-selectable options.
Selection Guide
Product Name
R1560Sxx1B-E2-FE
Package
Quantity per Reel
Pb Free
Halogen Free
HSOP-6J
1,000 pcs
Yes
Yes
R1560Jxx1B-T1-FE
TO-252-5-P2
3,000 pcs
Yes
Yes
xx: Set Output Voltage (VSET)
1.8 V (18) / 2.5 V (25) / 2.8 V (28) / 3.0 V (30) / 3.3 V (33) / 3.4 V (34) / 5.0 V (50) /
7.0 V (70) / 8.0 V (80) / 9.0 V (90) / 10.0 V (A0) / 12.0 V (C0) / 14.0 V (E0)
BLOCK DIAGRAM
Thermal Shutdown
Circuit
VDD
VOUT
Vref
Short
Current Limit
Protection
CE
GND
R1560x Block Diagram
2
R1560x
No. EA-395-190606
PIN DESCRIPTIONS
6
5
4
1
2
3
1
HSOP-6J Pin Configuration
HSOP-6J Pin Description
Pin No.
Pin Name
2
3
4
5
TO-252-5-P2 Pin Configuration
Description
1
VOUT
Output Pin
2
GND(1)
Ground Pin
3
CE
Chip Enable Pin, Active-high
4
(1)
GND
Ground Pin
5
GND(1)
Ground Pin
6
VDD
Input Pin
TO-252-5-P2 Pin Description
Pin No.
Pin Name
Description
1
VDD
Input Pin
2
NC
3
GND
Ground Pin
4
VOUT
Output Pin
5
CE
No Connection
Chip Enable Pin, Active-high
Pin Equivalent Circuit Diagrams
Driver
CE
IOUT
VOUT
VOUT Pin Equivalent Circuit Diagram
(1)
CE Pin Equivalent Circuit Diagram
The GND pins are connected to each other on the board.
3
R1560x
No. EA-395-190606
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
−0.3 to 80
V
90
V
−0.3 to 80
V
VIN
Input Voltage
VIN
Peak Inrush Voltage
VCE
CE Pin Input Voltage
VOUT
Output Voltage
−0.3 to VIN + 0.3 ≤ 80
V
IOUT
Output Current
150
mA
PD
Power
Dissipation(2)
Tj
Junction Temperature
−40 to 125
°C
Storage Temperature Range
−55 to 125
°C
Tstg
(1)
HSOP-6J
JEDEC STD.51-7
2700
TO-252-5-P2
JEDEC STD.51-7
3800
mW
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the life time and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Parameter
VIN
Input Voltage
Ta
Operating Temperature Range
Rating
Unit
5.5 to 60
V
−40 to 105
°C
RECOMMENDED OPERATING CONDITONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
Duration: 200 ms or less
to POWER DISSIPATION for detailed information.
(2) Refer
4
R1560x
No. EA-395-190606
ELECTRICAL CHARACTERISTICS
CIN = 0.1 μF / COUT = 0.1 μF, unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 105°C.
R1560x Electrical Characteristics
Symbol
ISS
Parameter
Supply Current
Istandby Standby Current
VOUT
Output Voltage
(Ta = 25°C)
Test Conditions/Comments
VIN = 14 V
VCE = 14 V
IOUT = 0 mA
VIN = 18 V
VCE = 18 V
IOUT = 0 mA
VSET ≤ 5.0 V
VSET > 5.0 V
VIN = 60 V, VCE = 0 V
VSET ≤ 5.0 V Ta = 25°C
VIN = 14 V
IOUT = 1 mA −40°C ≤ Ta ≤ 105°C
VSET > 5.0 V Ta = 25°C
VIN = 18 V
IOUT = 1 mA −40°C ≤ Ta ≤ 105°C
VIN = 8 V (VSET ≤ 5.0 V)
VIN = VSET + 3 V (VSET > 5.0 V)
1 mA ≤ IOUT ≤ 100 mA
6 V ≤ VIN ≤ 60 V
VSET ≤ 5.0 V
IOUT = 1 mA
VSET+1 V ≤ VIN ≤ 60 V
VSET > 5.0 V
IOUT = 1 mA
Load Regulation
VOUT
/VIN
Line Regulation
VDIF
Dropout Voltage
ILIM
Output Current Limit
ISC
Short-circuit Current
VCEH
CE Input Voltage “H”
VIN = 8.0 V (VSET ≤ 5.0 V)
VIN = VSET + 3 V (VSET > 5.0 V)
VIN = 8.0 V (VSET ≤ 5.0 V)
VIN = VSET + 3 V (VSET > 5.0 V)
VOUT = 0 V
VIN = 60 V
VCEL
CE Input Voltage “L”
VIN = 60 V
CE Pull-down Current
VIN = 60 V, VCE = 3 V
TTSD
TTSR
Thermal Shutdown
Temperature
Thermal Shutdown
Release Temperature (1)
Typ.
Max.
3.0
8.0
Unit
μA
VOUT
/IOUT
IPD
Min.
IOUT = 100 mA
3.5
12
0.1
2.0
0.992
1.008
0.985
1.015
0.988
1.012
0.980
1.020
μA
V
Refer to Voltage-specific
Electrical Characteristics
−0.02
0.01
0.02
−0.06
0.03
0.06
%/V
Refer to Voltage-specific
Electrical Characteristics
100
150
250
mA
20
50
75
mA
3.0
60
V
0
0.3
V
0.8
μA
0.4
Junction Temperature
150
165
°C
Junction Temperature
125
135
°C
All parameters are tested under the pulse load condition (Tj ≈ Ta = 25C).
(1) If
the VDD and CE pins are turned on at the same time when Ta > 125°C, the thermal shutdown can be activated.
5
R1560x
No. EA-395-190606
R1560x Product-specific Electrical Characteristics
VOUT (V)
VOUT (V)
Product
(−40°C ≤ Ta ≤ 105°C)
(Ta = 25°C)
Name
Min.
Typ.
Max.
Min.
Typ.
Max.
6
(Ta = 25°C)
VOUT/IOUT (mV)
Min.
Typ.
Max.
VDIF (V)
Typ.
Max.
R1560x181B
1.7856
1.80
1.8144 1.7730
1.80
1.8270
3.7
4.0
R1560x251B
2.4800
2.50
2.5200 2.4625
2.50
2.5375
3.0
3.6
R1560x281B
2.7776
2.80
2.8224 2.7580
2.80
2.8420
2.7
3.6
R1560x301B
2.9760
3.00
3.0240 2.9550
3.00
3.0450
2.5
3.6
R1560x331B
3.2736
3.30
3.3264 3.2505
3.30
3.3495
2.2
3.0
R1560x341B
3.3728
3.40
3.4272 3.3490
3.40
3.4510
2.1
3.0
R1560x501B
4.9600
5.00
5.0400 4.9250
5.00
5.0750
1.5
3.0
R1560x701B
6.9160
7.00
7.0840
6.8600
7.00
7.1400
1.5
3.0
R1560x801B
7.9040
8.00
8.0960
7.8400
8.00
8.1600
1.5
3.0
R1560x901B
8.8920
9.00
9.1080
8.8200
9.00
9.1800
1.5
3.0
R1560xA01B
9.8800
10.00
10.120
9.8000
10.0
10.200
1.5
3.0
R1560xC01B
11.856
12.00
12.144
11.760
12.0
12.240
1.5
3.0
R1560xE01B
13.832
14.00
14.168
13.720
14.0
14.280
1.5
3.0
-300
-600
30
60
300
600
R1560x
No. EA-395-190606
THEORY OF OPERATION
Thermal Shutdown
If the junction temperature increases above 165°C (Typ.), the operation of the regulator would stop. And if the
junction temperature decreases below 135°C (Typ.), the operation of the regulator would restart. Unless the
causes of temperature rising are removed, the regulator repeats turning on and off and the output waveform
becomes a pulse shape.
APPLICATION INFORMATION
VDD
R1560x
CIN
CE
CE Control
VOUT
VOUT
COUT
GND
CIN = Ceramic 0.1 µF
COUT = Ceramic 0.1 µF
R1560x Typical Applications
Equivalent Series Resistance vs. Output Current
It is recommended that a ceramic type capacitor be used for this device. However, other types of capacitors
having lower ESR can also be used. The relation between the output current (IOUT) and the ESR of output
capacitor is shown below.
VDD
VOUT
R1560xxxxB
C1
CE
GND
C2
IOUT
ESR
C1 = Ceramic 0.1 μF, C2 = Ceramic 0.1 μF
Measurement Conditions
Frequency Band: 10 Hz to 2 MHz
Measurement Temperature: −40°C to 105°C
Capacitor: C1 = Ceramic 0.1 µF, C2 = Ceramic 0.1 µF
ESR: 0 to 100 Ω
VOUT: 1.8 V, 5.0 V
It is confirmed that the output noise level is less than the specified value (40 µVrms) under the measurement
conditions above.
7
R1560x
No. EA-395-190606
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed its rated voltage, rated current or
rated power. When designing a peripheral circuit, please be fully aware of the following points.
Phase Compensation
A phase compensation is provided to secure stable operation even when the load current is varied. For this
purpose, use a 0.1-µF or more output capacitor (COUT) with good frequency characteristics and proper ESR
(Equivalent Series Resistance). In case of using a tantalum type capacitor with a large ESR, the output might
become unstable. Evaluate your circuit including consideration of frequency characteristics. Connect a 0.1µF or more input capacitor (CIN) between the VDD and GND pins with shortest-distance wiring.
PCB Layout
As for the HSOP-6J package, ensure that the GND pins (Pin No. 2, 4 and 5) are connected to each other and
the ground plane.
Operating the Device below the Minimum Operating Voltage
Operating the device below the recommended operating voltage range can make the output voltage unstable
and make the output voltage higher than the set output voltage (VSET) of the device.
In the case of turning on the VIN and CE pins at the same time, both pins must be turned on using a 100-V/ms
or more slew rate in order to prevent the unstable operation upon start-up. In the case of turning on the VIN
pin using a 100-V/ms or less slew rate, the CE pin must be turned on after the supply voltage becomes 5.5 V
or more.
In the case of turning off the VIN and CE pins at the same time, both pins must be turned off using a steep
slew rate, -100 V/ms or higher in order to prevent the unstable operation. In the case of turning off the VIN pin
using a slow rate, lower than -100 V/ms, the CE pin must be turned off before the supply voltage decreases to
5.5 V.
Transient Response
An output ceramic capacitor of COUT = 0.1 μF prevents R1560x series from phase oscillation to ensure the IC’s
stable operation. However, variation in input voltage and load current would lead to an unstable output voltage
which fails to meet the requirements of the system. Especially, in a high output version: VSET > 5 V, this results
in slow response of the IC and a great variation in output. To avoid this problem, use a ceramic capacitor of
COUT = 10 μF or more to minimize variation in output. Place the capacitor as close as possible to and outside
of the IC when the electrolytic capacitor is used as an output line element.
8
R1560x
No. EA-395-190606
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (Ta = 25°C)
R1560x181B
R1560x501B
R1560xE01B
9
R1560x
No. EA-395-190606
2) Output Voltage vs. Input Voltage (Ta = 25°C)
R1560x181B
R1560x501B
R1560xE01B
3) Supply Current vs. Temperature
R1560x181B
10
R1560x501B
R1560x
No. EA-395-190606
R1560xE01B
4) Output Voltage vs. Temperature (IOUT = 1 mA)
R1560x181B
R1560x501B
R1560xE01B
11
R1560x
No. EA-395-190606
5) Supply Current vs. Input Voltage
R1560x181B
R1560x501B
R1560xE01B
6) Dropout Voltage vs. Output Current
R1560x181B
12
R1560x501B
R1560x
No. EA-395-190606
R1560xE01B
7) Ripple Rejection vs. Input Bias Voltage (Ta = 25°C, VRIPPLE = ± 0.2 V)
R1560x181B
R1560x501B
COUT = 0.1 µF
COUT = 0.1 µF
COUT = 10 µF
R1560xE01B
13
R1560x
No. EA-395-190606
8) Ripple Rejection vs. Frequency (Ta = 25°C)
R1560x181B
VIN = 14 V ± 0.2 V ripple, COUT = 0.1 µF
R1560x501B
VIN = 14 V ± 0.2 V ripple, COUT = 0.1 µF
R1560xE01B
VIN = 18 V ± 0.2 V ripple, COUT = 10 µF
9) Input Transient Response (Ta = 25°C, IOUT = 1 mA)
R1560x181B
14
R1560x501B
R1560x
No. EA-395-190606
R1560xE01B
10) Load Dump (Ta = 25°C, IOUT = 1 mA)
R1560x181B
R1560x501B
R1560xE01B
15
R1560x
No. EA-395-190606
11) Load Transient Response (Ta = 25°C, IOUT = 1 mA ↔ 20 mA )
R1560x181B
R1560x181B
VIN = 14 V, IOUT = 1 mA → 20 mA
VIN = 14 V, IOUT = 20 mA → 1 mA
R1560x501B
VIN = 14 V, IOUT = 1 mA → 20 mA
R1560x501B
VIN = 14 V, IOUT = 20 mA → 1 mA
R1560xE01B
VIN = 18 V, IOUT = 1 mA → 20 mA
R1560xE01B
VIN = 18 V, IOUT = 20 mA → 1 mA
16
R1560x
No. EA-395-190606
12) CE Start-up (Ta = 25°C)
R1560x181B
VIN = 14 V, COUT = 0.1 µF
R1560x181B
VIN = 14 V, COUT = 10 µF
R1560x501B
VIN = 14 V, COUT = 0.1 µF
R1560x501B
VIN = 14 V, COUT = 10 µF
R1560xE01B
VIN = 18 V, COUT = 10 µF
17
POWER DISSIPATION
HSOP-6J
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 28 pcs
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Item
Measurement Result
Power Dissipation
2700 mW
Thermal Resistance (ja)
ja = 37°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 7°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
3000
2700
Power Dissipation PD (mW)
2500
2000
1500
1000
500
0
0
25
50
75
100 105
125
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
HSOP-6J
PACKAGE DIMENSIONS
Ver. A
HSOP-6J Package Dimensions
i
POWER DISSIPATION
TO-252-5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 21 pcs
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Item
Measurement Result
Power Dissipation
3800 mW
Thermal Resistance (ja)
ja = 26°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 7°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
4500
4000
3800
Power Dissipation PD (mW)
3500
3000
2500
2000
1500
1000
500
0
0
25
50
75
100
105
125
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
TO-252-5-P2
Ver. A
TO-252-5-P2 Package Dimensions
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer
to our sales representatives for the latest information thereon.
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consent of our company.
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taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
our company's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and
reliability, for example, in a highly specific application where the failure or misoperation of the product could result in
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transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
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are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
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characteristics in the evaluation stage.
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characteristics of the products under operation or storage.
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of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use
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the technical information.
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