R5323K021B

R5323x SERIES 150mA 2ch LDO REGULATOR NO.EA-089-0607 OUTLINE The R5323x Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply current, low dropout, and high ripple rejection. Each of these voltage regulator ICs consists of a voltage reference unit, an error amplifier, resistors for setting Output Voltage, a current limit circuit, and a chip enable circuit. These ICs perform with low dropout voltage due to built-in transistor with low ON resistance, and a chip enable function prolongs the battery life of each system. The line transient response and load transient response of the R5323x Series are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment. The output voltage of these ICs is internally fixed with high accuracy. Since the packages for these ICs are SOT-23-6, PLP1820-6 and WL-CSP-6 package, 2ch LDO regulators are included in each package, high density mounting of the ICs on boards is possible. FEATURES • • • • • • • • • • • • Low Supply Current ...................................................... Typ. 90µA (VR1, VR2) Standby Mode ............................................................... Typ. 0.1µA (VR1, VR2) Low Dropout Voltage..................................................... Typ. 0.22V (IOUT=150mA , Output Voltage Type) High Ripple Rejection ...............................Typ. 75dB(VOUT < 2.4V) , Typ. 70dB(VOUT < 2.5V) (f=1kHz) = = Typ. 65dB(VOUT < 2.4V) , Typ. 60dB(VOUT < 2.5V) (f=10kHz) = = Low Temperature-drift Coefficient of Output Voltage .... Typ. ±100ppm/°C Excellent Line Regulation ............................................. Typ.0.02%/V High Output Voltage Accuracy ...................................... ±2.0% Small Packages .......................................................... SOT-23-6, PLP1820-6, WL-CSP-6 Output Voltage ..............................................................Stepwise setting with a step of 0.1V in the range of 1.5V to 4.0V is possible Built-in chip enable circuit (A/B: active high) Built-in fold-back protection circuit ................................ Typ. 40mA (Current at short mode) Ceramic Capacitor is recommended. (1.0µF or more) APPLICATIONS • Power source for handheld communication equipment. • Power source for electrical appliances such as cameras, VCRs and camcorders. • Power source for battery-powered equipment. 1 R5323x BLOCK DIAGRAMS R5323xxxxA Error Amp. Vref Current Limit R1_1 R2_1 R1_2 Error Amp. Vref R2_2 Current Limit R5323xxxxB Error Amp. Vref Current Limit R1_1 R2_1 R1_2 Error Amp. Vref Current Limit R2_2 2 R5323x SELECTION GUIDE The output voltage, mask option, and the taping type for the ICs can be selected at the user's request. The selection can be made with designating the part number as shown below; R5323xxxxx-xx-x ←Part Number ↑ ↑↑ ↑ ↑ ab c d e Code Contents a b c d e Designation of Package Type: N : SOT-23-6 K : PLP1820-6 Z : WL-CSP-6 Setting combination of 2ch Output Voltage (VOUT) : Serial Number for Voltage Setting, Stepwise setting with a step of 0.1V in the range of 1.5V to 4.0V is possible for each channel. Designation of Mask Option: A version: without auto discharge function at OFF state. B version: with auto discharge function at OFF state. Designation of Taping Type: Ex. TR (refer to Taping Specifications; TR type is the standard direction.) Designation of composition of plating: −F : Lead free plating (SOT-23-5,WL-CSP-6) None : Au plating (PLP1820-6) PIN CONFIGURATION SOT-23-6 6 5 4 PLP1820-6 Top View 6 5 4 WLCSP-6 Bottom View 4 5 6 CE1 6 1 VOUT1 CE1 GND (mark side) CE2 GND VOUT2 5 2 VDD VOUT1 VDD CE2 4 3 VOUT2 1 2 3 1 2 3 3 2 1 3 R5323x PIN DESCRIPTIONS • SOT-23-6 Pin No. Symbol Description PLP1820-6 Pin No. Symbol Description 1 2 3 4 5 6 VOUT1 VDD VOUT2 CE2 GND CE1 Output Pin 1 Input Pin Output Pin 2 Chip Enable Pin 2 Ground Pin Chip Enable Pin 1 1 2 3 4 5 6 VOUT2 VDD VOUT1 GND CE1 CE2 Output Pin 2 Input Pin Output Pin 1 Ground Pin Chip Enable Pin 1 Chip Enable Pin 2 • * Tab in the parts have GND level. (They are connected to the reverse side of this IC.) Do not connect to other wires or land patterns. WLCSP-6 Pin No. Symbol Description 1 2 3 4 5 6 VOUT1 VDD VOUT2 CE2 GND CE1 Output Pin 1 Input Pin Output Pin 2 Chip Enable Pin 2 Ground Pin Chip Enable Pin 1 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN VCE VOUT IOUT1 IOUT2 PD Topt Tstg Input Voltage Input Voltage (CE Pin) Output Voltage Output Current 1 Output Current 2 Power Dissipation (SOT-23-6)*1 Power Dissipation (PLP1820-6) *1 Power Dissipation (WL-CSP-6) Operating Temperature Range Storage Temperature Range 6.5 6.5 −0.3 to VIN + 0.3 V V V mA mA mW °C °C 200 200 420 880 633 −40 to 85 −55 to 125 ∗1 For Power Dissipation, please refer to PACKAGE INFORMATION to be described. 4 R5323x ELECTRICAL CHARACTERISTICS • R5323xxxxA/B Topt=25°C Symbol Item Conditions Min. Typ. Max. Unit VOUT IOUT ∆VOUT/∆IOUT Output voltage Output Current Load regulation Dropout Voltage Supply Current Supply Current(Standby) Line regulation VIN=Set VOUT+1V 1mA < IOUT < 30mA = = VIN−VOUT = 1.0V VIN=Set VOUT+1V 1mA < IOUT < 150mA = = VIN=Set VOUT+1V VIN=Set VOUT+1V VCE=GND Set VOUT+0.5V IOUT=30mA < = VOUT ×0.98 150 15 VOUT ×1.02 V mA 40 mV VDIF ISS Istandby ∆VOUT/∆VIN Refer to the Electrical Characteristics by Output Voltage 90 0.1 VIN < = 120 1.0 0.10 µA µA 6.0V 0.02 75 %/V RR Ripple Rejection Ripple 0.5Vp−p VIN=Set VOUT+1V IOUT=30mA (In case that VOUT < 1.7V, = VIN=Set VOUT+1.2V) 2.0 IOUT=30mA −40°C < Topt = VOUT=0V 0.7 1.5 0.0 BW=10Hz to 100kHz VCE=0V < = ∗Note1 ∗Note2 65 dB VIN ∆VOUT/ ∆Topt Input Voltage Output Voltage Temperature Coefficient Short Current Limit Pull-down resistance for CE pin 6.0 ±100 V ppm /°C mA 85°C Ilim RPD VCEH VCEL en RLOW 40 2.0 8.0 6.0 0.3 30 60 MΩ V V µVrms Ω CE Input Voltage “H” CE Input Voltage “L” Output Noise Low Output Nch Tr. ON Resistance (of B version) ∗Note1: f=1kHz, 70dB as to VOUT > 2.5V Output type. = ∗Note2: f=10kHz, 60dB as to VOUT > 2.5V Output type. = 5 R5323x • Electrical Characteristics by Output Voltage Output Voltage VOUT (V) Dropout Voltage VDIF (V) Condition Typ. Max. VOUT=1.5 VOUT=1.6 VOUT=1.7 1.8V 2.1V 2.8V < = < = < = 0.38 0.35 2.0V 2.7V 4.0V IOUT=150mA 0.33 0.32 0.28 0.22 0.70 0.65 0.60 0.55 0.50 0.35 VOUT VOUT VOUT < = < = < = TYPICAL APPLIATION IN C1 VOUT2 CE2 R5323x Series VDD GND CE1 VOUT1 OUT2 C3 OUT1 C2 (External Components) Ceramic Capacitor Type C1,C2,C3 Recommended Ceramic capacitor for Output: GRM219R61A105K (Murata) General Example of External Components Ceramic Capacitors: C1608X5R0J105K (TDK) GRM188R60J105K (Murata) 6 R5323x TEST CIRCUIT CE2 VOUT2 R5323x Series VDD GND C3 VOUT2 V IOUT2 ISS A C2 VOUT1 IOUT1 CE2 VOUT2 R5323x Series VDD GND C3 C1 CE1 VOUT1 V C1 CE1 VOUT1 C2 Fig.1 Standard test Circuit Fig.2 Supply Current Test Circuit CE2 VOUT2 R5323x Series VDD GND Pulse Generator C3 IOUT2 CE2 VOUT2 R5323x Series VDD GND C3 IOUT2a IOUT2b IOUT1b IOUT1a C2 PG CE1 VOUT1 C1 CE1 VOUT1 C2 IOUT1 Fig.3 Ripple Rejection, Line Transient Response Test Circuit Fig.4 Load Transient Response Test Circuit 7 R5323x TYPICAL CHARACTERISTICS 1) Output Voltage vs. Output Current (Topt=25°C) 1.5V (VR1) 1.6 VIN=3.5V 1.6 1.5V (VR2) VIN=3.5V VIN=1.8V VIN=2.0V VIN=2.5V Output Voltage VOUT(V) Output Voltage VOUT(V) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 100 200 300 400 VIN=1.8V VIN=2.0V VIN=2.5V 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 100 200 300 400 Output Current IOUT(mA) Output Current IOUT(mA) 2.8V (VR1) 3 3 2.8V (VR2) Output Voltage VOUT(V) Output Voltage VOUT(V) 2.5 VIN=3.1V 2 1.5 1 0.5 0 0 100 200 300 400 VIN=4.8V 2.5 VIN=3.1V 2 1.5 1 0.5 0 0 100 200 300 400 VIN=4.8V Output Current IOUT(mA) Output Current IOUT(mA) 4.0V (VR1) 5 VIN=6.0V 5 4.0V (VR2) VIN=6.0V Output Voltage VOUT(V) 4 VIN=4.3V 3 2 1 0 0 100 200 300 400 Output Voltage VOUT(V) 4 VIN=4.3V 3 2 1 0 0 100 200 300 400 Output Current IOUT(mA) Output Current IOUT(mA) 8 R5323x 2) Output Voltage vs. Input Voltage (Topt=25°C) 1.5V (VR1) 1.6 1.5V (VR2) 1.6 Output Voltage VOUT(V) Output Voltage VOUT(V) 1.5 1.4 1.3 1.2 1.1 1 1 2 3 4 5 6 1mA 30mA 50mA 1.5 1.4 1.3 1.2 1.1 1 1 2 3 4 5 6 1mA 30mA 50mA Input Voltage VIN(V) Input Voltage VIN(V) 2.8V (VR1) 2.9 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2 1 2 3 4 5 6 1mA 30mA 50mA 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2 1 2 2.8V (VR2) Output Voltage VOUT(V) Output Voltage VOUT(V) 1mA 30mA 50mA 3 4 5 6 Input Voltage VIN(V) Input Voltage VIN(V) 4.0V (VR1) 4.2 4.0V (VR2) 4.2 Output Voltage VOUT(V) Output Voltage VOUT(V) 4 3.8 3.6 3.4 3.2 3 1 2 3 4 5 6 1mA 30mA 50mA 4 3.8 3.6 3.4 3.2 3 1 2 3 4 5 6 1mA 30mA 50mA Input Voltage VIN(V) Input Voltage VIN(V) 9 R5323x 3) Dropout Voltage vs. Temperature 1.5V (VR1) 0.6 0.6 1.5V (VR2) Dropout Voltage VDIF(V) 0.5 0.4 0.3 0.2 0.1 0 Topt= 85°C 25°C -40°C Dropout Voltage VDIF(V) 0.5 0.4 0.3 0.2 0.1 0 0 25 Topt= 85°C 25°C -40°C 50 75 100 125 150 0 25 50 75 100 125 150 Output Current IOUT(mA) Output Current IOUT(mA) 2.8V (VR1) 0.4 0.4 2.8V (VR2) Dropout Voltage VDIF(V) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 25 50 75 100 125 150 Topt= 85°C 25°C -40°C Dropout Voltage VDIF(V) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 25 Topt= 85°C 25°C -40°C 50 75 100 125 150 Output Current IOUT(mA) Output Current IOUT(mA) 4.0V (VR1) 0.4 0.4 4.0V (VR2) Dropout Voltage VDIF(V) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 25 50 75 100 125 150 Topt= 85°C 25°C -40°C Dropout Voltage VDIF(V) 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 25 Topt= 85°C 25°C -40°C 50 75 100 125 150 Output Current IOUT(mA) Output Current IOUT(mA) 10 R5323x 4) Output Voltage vs. Temperature 1.5V (VR1) 1.54 VIN=2.5V, IOUT=30mA 1.54 1.5V (VR2) VIN=2.5V, IOUT=30mA Output Voltage VOUT(V) 1.52 1.51 1.50 1.49 1.48 1.47 1.46 -50 -25 0 25 50 75 100 Output Voltage VOUT(V) 1.53 1.53 1.52 1.51 1.50 1.49 1.48 1.47 1.46 -50 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 2.8V (VR1) 2.86 VIN=3.8V, IOUT=30mA 2.8V (VR2) 2.86 VIN=3.8V, IOUT=30mA Output Voltage VOUT(V) 2.84 2.82 2.80 2.78 2.76 2.74 -50 Output Voltage VOUT(V) 2.84 2.82 2.80 2.78 2.76 2.74 -50 -25 0 25 50 75 100 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 4.0V (VR1) 4.08 VIN=5.0V, IOUT=30mA 4.08 4.0V (VR2) VIN=5.0V, IOUT=30mA Output Voltage VOUT(V) 4.04 4.02 4.00 3.98 3.96 3.94 3.92 -50 -25 0 25 50 75 100 Output Voltage VOUT(V) 4.06 4.06 4.04 4.02 4.00 3.98 3.96 3.94 3.92 -50 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 11 R5323x 5) Supply Current vs. Input Voltage (Topt=25°C) 1.5V 100 100 2.8V Supply Current ISS(µA) 80 60 40 20 0 0 1 2 3 4 5 6 Supply Current ISS(µA) 80 60 40 20 0 0 1 2 3 4 5 6 VR1 VR2 VR1 VR2 Input Voltage VIN(V) Input Voltage VIN(V) 4.0V 100 Supply Current ISS(µA) 80 60 40 20 0 0 1 2 3 4 5 6 VR1 VR2 Input Voltage VIN(V) 6) Supply Current vs. Temperature 1.5V (VR1) 100 VIN=2.5V 100 1.5V (VR2) VIN=2.5V Supply Current ISS(µA) 80 60 40 20 0 -50 Supply Current ISS(µA) 0 80 60 40 20 0 -50 -25 25 50 75 100 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 12 R5323x 2.8V (VR1) 100 VIN=3.8V 100 2.8V (VR2) VIN=3.8V Supply Current ISS(µA) 80 60 40 20 0 -50 Supply Current ISS(µA) 0 80 60 40 20 0 -50 -25 25 50 75 100 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 4.0V (VR1) 100 VIN=5.0V 100 4.0V (VR2) VIN=5.0V Supply Current ISS(µA) 80 60 40 20 0 -50 Supply Current ISS(µA) 0 80 60 40 20 0 -50 -25 25 50 75 100 -25 0 25 50 75 100 Temperature Topt(°C) Temperature Topt(°C) 7) Dropout Voltage vs. Set Output Voltage (Topt=25°C) VR1 0.6 0.6 VR2 Dropout Voltage VDIF(V) 10mA 30mA 50mA 150mA 10mA 30mA 50mA 150mA Dropout Voltage VDIF(V) 0.5 0.4 0.3 0.2 0.1 0 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 1 2 3 4 Set Output Voltage Vreg(V) Set Output Voltage Vreg(V) 13 R5323x 8) Ripple Rejection vs. Frequency (Topt=25°C) 1.5V (VR1) 90 VIN=2.5V+0.5Vp-p, COUT=Ceramic 1.0µF 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 1.5V (VR2) VIN=2.5V+0.5Vp-p, COUT=Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) Ripple Rejection RR(dB) Frequency f(kHz) 1.5V (VR1) 90 VIN=2.5V+0.5Vp-p, COUT=Ceramic 2.2µF 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 80 70 60 50 40 30 20 10 0 0.1 1.5V (VR2) VIN=2.5V+0.5Vp-p, COUT=Ceramic 2.2µF Ripple Rejection RR(dB) Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Frequency f(kHz) Frequency f(kHz) 2.8V (VR1) 90 VIN=3.8V+0.5Vp-p, COUT=Ceramic 1.0µF 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 80 70 60 50 40 30 20 10 0 0.1 2.8V (VR2) VIN=3.8V+0.5Vp-p, COUT=Ceramic 1.0µF Ripple Rejection RR(dB) Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Frequency f(kHz) Frequency f(kHz) 14 R5323x 2.8V (VR1) 90 VIN=3.8V+0.5Vp-p, COUT=Ceramic 2.2µF 2.8V (VR2) 90 VIN=3.8V+0.5Vp-p, COUT=Ceramic 2.2µF 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Ripple Rejection RR(dB) 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Ripple Rejection RR(dB) 80 Frequency f(kHz) Frequency f(kHz) 4.0V (VR1) 90 VIN=5.0V+0.5Vp-p, COUT=Ceramic 1.0µF 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 80 70 60 50 40 30 20 10 0 0.1 4.0V (VR2) VIN=5.0V+0.5Vp-p, COUT=Ceramic 1.0µF Ripple Rejection RR(dB) Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Frequency f(kHz) Frequency f(kHz) 4.0V (VR1) 90 VIN=5.0V+0.5Vp-p, COUT=Ceramic 2.2µF 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 80 70 60 50 40 30 20 10 0 0.1 4.0V (VR2) VIN=5.0V+0.5Vp-p, COUT=Ceramic 2.2µF Ripple Rejection RR(dB) Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA 1 10 100 Frequency f(kHz) Frequency f(kHz) 15 R5323x 9) Ripple Rejection vs. Input Voltage (DC bias) COUT = Ceramic 1.0µF (Topt=25°C) 2.8V (VR1) 100 IOUT=1mA 100 90 80 70 60 50 40 30 20 10 0 2.9 3 3.1 f=1kHz f=10kHz f=100kHz 3.2 3.3 90 80 70 60 50 40 30 20 10 0 2.9 3 3.1 f=1kHz f=10kHz f=100kHz 3.2 3.3 2.8V (VR2) IOUT=1mA Ripple Rejection RR(dB) Input Voltage VIN(V) Ripple Rejection RR(dB) Input Voltage VIN(V) 2.8V (VR1) 100 IOUT=30mA 100 90 80 70 60 50 40 30 20 10 0 2.9 3 3.1 f=1kHz f=10kHz f=100kHz 3.2 3.3 90 80 70 60 50 40 30 20 10 0 2.9 2.8V (VR2) IOUT=30mA Ripple Rejection RR(dB) Ripple Rejection RR(dB) f=1kHz f=10kHz f=100kHz 3 3.1 3.2 3.3 Input Voltage VIN(V) Input Voltage VIN(V) 2.8V (VR1) 100 IOUT=50mA 100 90 80 70 60 50 40 30 20 10 0 2.9 3 3.1 f=1kHz f=10kHz f=100kHz 3.2 3.3 90 80 70 60 50 40 30 20 10 0 2.9 2.8V (VR2) IOUT=50mA Ripple Rejection RR(dB) Ripple Rejection RR(dB) f=1kHz f=10kHz f=100kHz 3 3.1 3.2 3.3 Input Voltage VIN(V) Input Voltage VIN(V) 16 R5323x 10) Input Transient Response R5323N001x(2.8V, VR1) IOUT=30mA, tr=tf=5µs, COUT=Ceramic 1.0µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) R5323N001x(2.8V, VR1) Topt=25°C, COUT=Ceramic 2.2µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) R5323N001x(2.8V, VR1) Topt=25°C, COUT=Ceramic 4.4µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) Input Voltage VIN(V) Input Voltage VIN(V) Input Voltage VIN(V) 17 R5323x R5323N001x(2.8V, VR2) Topt=25°C, COUT=Ceramic 1.0µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) R5323N001x(2.8V, VR2) Topt=25°C, COUT=Ceramic 2.2µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) R5323N001x(2.8V, VR2) Topt=25°C, COUT=Ceramic 4.4µF 2.85 6 5 VIN 2.83 2.82 2.81 2.80 2.79 0 10 20 30 40 50 60 70 80 90 100 VOUT 4 3 2 1 0 Output Voltage VOUT(V) 2.84 Time T(µs) 18 Input Voltage VIN(V) Input Voltage VIN(V) Input Voltage VIN(V) R5323x 11) Load Transient Response 2.8V (VR1) CIN=Ceramic 1.0µF, COUT=Ceramic 1.0µF IOUT1 150 100 50 2.85 2.80 2.75 2.85 2.80 2.75 0 5 10 VOUT1 0 2.8V (VR2) CIN=Ceramic 1.0µF, COUT=Ceramic 1.0µF IOUT2 150 50 2.85 2.80 2.75 2.85 2.80 2.75 0 5 10 15 20 VOUT1 IOUT1=30mA 0 100 Output Current IOUT1(mA) VOUT2 IOUT2=30mA 15 20 VOUT2 Time T(µs) Time T(µs) 3.00 CIN=Ceramic 1.0µF, COUT=Ceramic 4.4µF IOUT1 2.8V (VR1) 150 3.00 CIN=Ceramic 1.0µF, COUT=Ceramic 1.0µF IOUT2 2.8V (VR2) 150 50 Output Current IOUT1(mA) 2.90 2.85 2.80 2.75 2.70 2.85 2.80 2.75 2.70 VOUT2 IOUT2=30mA 0 5 10 15 20 VOUT1 50 0 2.90 2.85 2.80 2.75 2.70 2.85 2.80 2.75 2.70 VOUT2 VOUT1 IOUT1=30mA 0 0 5 10 15 20 Time T(µs) Time T(µs) 3.00 CIN=Ceramic 1.0µF, COUT=Ceramic 2.2µF IOUT2 2.8V (VR2) 150 3.00 CIN=Ceramic 1.0µF, COUT=Ceramic 4.4µF IOUT2 2.8V (VR2) 150 50 Output Current IOUT2(mA) 2.90 2.85 2.80 2.75 2.70 2.85 2.80 2.75 2.70 VOUT2 VOUT1 IOUT1=30mA 50 0 2.90 2.85 2.80 2.75 2.70 2.85 2.80 2.75 2.70 VOUT2 VOUT1 IOUT1=30mA 0 0 5 10 15 20 0 5 10 15 20 Time T(µs) Time T(µs) Output Current IOUT2(mA) Output Voltage VOUT(V) Output Voltage VOUT(V) 2.95 100 2.95 100 Output Current IOUT2(mA) Output Voltage VOUT(V) Output Voltage VOUT(V) 2.95 100 2.95 100 Output Current IOUT2(mA) Output Voltage VOUT(V) Output Voltage VOUT(V) 19 R5323x 12) Minimum Operating Voltage 1.5V Minimum Operating Voltage Range 2.3 2.2 2.1 VDD(V) 2 1.9 1.8 1.7 1.6 1.5 0 75 150 VDD VIN(MIN) Output Current IOUT(mA) TECHNICAL NOTES When using these ICs, consider the following points: In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, be sure to use a 1.0µF or more capacitance COUT with good frequency characteristics and ESR (Equivalent Series Resistance) of which is in the range described as follows: The relations between IOUT (Output Current) and ESR of Output Capacitor are shown in the typical characteristics above. The conditions when the white noise level is under 40µV (Avg.) are marked as the hatched area in the graph. Test these ICs with as same external components as ones to be used on the PCB. ⋅ Make VDD and GND lines sufficient. When their impedance is high, the noise pick-up or incorrect operation may ⋅ Connect the capacitor with a capacitance of 1µF or more between VDD and GND as close as possible. ⋅ Set external components, especially Output Capacitor, as close as possible to the ICs and make wiring as short as possible. result. 20 R5323x ESR vs. Output Current R5323N/K 1.5V (VR1) 100 Topt=25°C, CIN=COUT=Ceramic 1.0µF, VIN=25V, f=10Hz to 2MHz(BW=30Hz) 100 R5323N/K 1.5V (VR2) Topt=25°C, CIN=COUT=Ceramic 1.0µF, VIN=25V, f=10Hz to 2MHz(BW=30Hz) 10 10 ESR(Ω) 1 ESR(Ω) 0 50 100 150 1 0.1 0.1 0.01 0.01 0 50 100 150 Output Current IOUT(mA) Output Current IOUT(mA) R5323N/K 2.8V (VR1) 100 CIN=COUT=Ceramic 1.0µF, VIN=2.5V, f=10Hz to 2MHz(BW=30Hz) 100 R5323N/K 2.8V (VR2) CIN=COUT=Ceramic 1.0µF, VIN=2.5V, f=10Hz to 2MHz(BW=30Hz) 10 10 ESR(Ω) 1 ESR(Ω) 0 50 100 150 1 0.1 0.1 0.01 0.01 0 50 100 150 Output Current IOUT(mA) Output Current IOUT(mA) 100 CIN=Ceramic 1.0µF, COUT=Ceramic 1.0µF R5323Z 1.5V (VR1/VR2) 100 CIN=Ceramic 1.0µF, COUT=Ceramic 1.0µF R5323Z 2.8V (VR1/VR2) 10 10 ESR(Ω) 1 ESR(Ω) 0 50 100 150 1 0.1 0.1 0.01 0.01 0 50 100 150 Output Current IOUT(mA) Output Current IOUT(mA) 21 PACKAGE INFORMATION PE-SOT-23-6-0510 • SOT-23-6 (SC-74) Unit: mm PACKAGE DIMENSIONS 2.9±0.2 1.9±0.2 (0.95) (0.95) +0.2 1.1 −0.1 0.8±0.1 4 6 5 +0.2 1.6 −0.1 2.8±0.3 0 to 0.1 1 2 0.2 MIN. +0.1 0.4−0.2 +0.1 0.15 −0.05 TAPING SPECIFICATION 0.3±0.1 +0.1 φ1.5 0 4.0±0.1 2.0±0.05 1 2.0MAX. 2 3 4.0±0.1 3.3 ∅1.1±0.1 TR User Direction of Feed TAPING REEL DIMENSIONS (1reel=3000pcs) 11.4±1.0 9.0±0.3 21±0.8 0 180 −1.5 2±0.5 13±0.2 +1 60 0 3.2 8.0±0.3 6 5 4 3.5±0.05 1.75±0.1 PACKAGE INFORMATION PE-SOT-23-6-0510 POWER DISSIPATION (SOT-23-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Board Material Board Dimensions Copper Ratio Through-hole Measurement Result (Topt=25°C,Tjmax=125°C) Mounting on Board (Wind velocity=0m/s) Glass cloth epoxy plactic (Double sided) 40mm × 40mm × 1.6mm Top side : Approx. 50% , Back side : Approx. 50% φ0.5mm × 44pcs Standard Land Pattern Power Dissipation Thermal Resistance 600 Free Air 250mW 400°C/W 420mW θja=(125−25°C)/0.42W=263°C/W Power Dissipation PD(mW) 500 420 400 300 On Board 40 100 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 150 Power Dissipation 40 200 Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 0.7 MAX. 1.0 0.95 0.95 1.9 2.4 (Unit: mm) PACKAGE INFORMATION PE-PLP1820-6-0611 • PLP1820-6 1.6±0.1 Unit: mm PACKAGE DIMENSIONS 1.80 A B 4 0.20±0.1 0.05 M AB 6 0.05 1.0±0.1 2.00 INDEX 3 0.6Max. 0.5 0.1NOM. 1 0.3±0.1 Bottom View Attention: Tabs or Tab suspension leads in the parts have VDD or GND level.(They are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns. 0.05 TAPING SPECIFICATION 0.25±0.1 1.5 +0.1 0 4.0±0.1 2.0±0.05 3.5±0.05 1.75±0.1 2.4 1.1±0.1 2.2 1.1Max. 4.0±0.1 TR User Direction of Feed TAPING REEL DIMENSIONS (1reel=5000pcs) (R5323K,R5325K : 1reel=3000pcs) REUSE REEL (EIAJ-RRM-08Bc) 11.4±1.0 9.0±0.3 21±0.8 ∅60 +1 0 0 ∅180 −1.5 2±0.5 ∅13±0.2 8.0±0.3 0.25±0.1 0.25±0.1 ×4 PACKAGE INFORMATION PE-PLP1820-6-0611 POWER DISSIPATION (PLP1820-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Board Material Board Dimensions Copper Ratio Through-hole Measurement Result (Topt=25°C,Tjmax=125°C) Mounting on Board (Wind velocity=0m/s) Glass cloth epoxy plactic (Double sided) 40mm × 40mm × 1.6mm Top side : Approx. 50% , Back side : Approx. 50% φ0.54mm × 30pcs Standard Land Pattern Power Dissipation Thermal Resistance 1200 880mW θja=(125−25°C)/0.88W=114°C/W Power Dissipation PD(mW) 1000 800 600 400 200 0 0 On Board 880 40 25 50 75 85 100 Ambient Temperature (°C) 125 150 Power Dissipation 40 Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 0.5 0.5 0.75 0.45 1.00 1.60 0.35 0.25 (Unit: mm) PACKAGE INFORMATION PE-WLCSP-6-P1-0606 • WLCSP-6-P1 Unit: mm PACKAGE DIMENSIONS 1.29 A X4 0.05 0.79 0.5 0.40±0.02 B 0.5 0.5 INDEX 0.10 S ∅0.16±0.03 Bottom View ∅0.05 M S AB 0.06 S S TAPING SPECIFICATION(TR: Standard Type) 0.18±0.1 +0.1 ∅1.5 0 4.0±0.1 2.0±0.05 0.08±0.03 0.88 1.38 Dummy Pocket 1.2MAX. ∅0.5±0.1 4.0±0.1 0.7 0.95 User Direction of Feed TAPING REEL DIMENSIONS (1reel=3000pcs) 11.4±1.0 9.0±0.3 21±0.8 0 180 –1.5 2±0.5 13±0.2 +1 60 0 2.0 8.0±0.3 2.0±0.05 3.5±0.05 1.0 1.75±0.1 PACKAGE INFORMATION PE-WLCSP-6-P1-0606 POWER DISSIPATION (WLCSP-6-P1) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Board Material Board Dimensions Copper Ratio Through-hole Measurement Result (Topt=25°C,Tjmax=125°C) Mounting on Board (Wind velocity=0m/s) Glass cloth epoxy plactic (Double sided) 40mm × 40mm × 1.6mm Top side : Approx. 50% , Back side : Approx. 50% − Standard Land Pattern Power Dissipation Thermal Resistance 633 600 633mW θja=(125−25°C)/0.633W=158°C/W 40 Power Dissipation PD(mW) On Board 500 400 300 200 100 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 150 40 Measurement Board Pattern Power Dissipation IC Mount Area (Unit : mm) PACKAGE INFORMATION PE-WLCSP-6-P1-0606 RECOMMENDED LAND PATTERN (WLCSP) Solder Mask (resist) Copper Pad Substrate NSMD SMD （Unit : mm） NSMD and SMD Pad Definition Pad definition NSMD (Non-Solder Mask defined) SMD (Solder Mask defined) * * * * Copper Pad 0.20mm Min. 0.30mm Solder Mask Opening Min. 0.30mm 0.20mm Pad layout and size can be modified by customers material, equipment, method. Please adjust pad layout according to your conditions. Recommended Stencil Aperture Size....ø0.3mm Since lead free WL-CSP components are not compatible with the tin/lead solder process, you shall not mount lead free WL-CSP components using the tin/lead solder paste. MARK INFORMATION ME-R5323N-0610 R5323N SERIES MARK SPECIFICATION • SOT-23-6 (SC-74) 1 3 1 2 3 4 , , 2 4 : Product Code (refer to Part Number vs. Product Code) : Lot Number • Part Number vs. Product Code Part Number R5323N001B R5323N002B R5323N003B R5323N004B R5323N005B R5323N006B R5323N007B R5323N008B R5323N009B R5323N010B R5323N011B R5323N012B R5323N013B R5323N014B R5323N015B R5323N016B R5323N017B R5323N018B R5323N019B R5323N020B R5323N021B R5323N022B R5323N023B R5323N024B R5323N025B R5323N026B R5323N027B R5323N028B R5323N029B Product Code 1 2 Part Number R5323N030B R5323N031B R5323N032B R5323N033B R5323N034B R5323N035B R5323N036B R5323N037B R5323N038B R5323N039B R5323N040B R5323N041B R5323N042B R5323N043B R5323N044B Product Code 1 2 Part Number R5323N001A R5323N002A R5323N003A R5323N013A R5323N019A R5323N020A R5323N023A R5323N024A R5323N030A Product Code 1 2 N N N N N N N N N N U N N N N N N N N N N N N U U N N U N 0 1 2 3 4 5 6 7 8 B 6 W T D E F G H K M N P R D E X U F V N U U U U U U U U U U U U U U Z 0 1 2 3 4 5 7 8 9 A B C H J U N N N N N N N N G 9 A C J L Q S Y MARK INFORMATION ME-R5323K-0610 R5323K SERIES MARK SPECIFICATION • PLP1820-6 1 5 1 2 3 to , 6 4 : Product Code (refer to Part Number vs. Product Code) : Lot Number 4 5 6 • Part Number vs. Product Code Product Code 1 2 3 4 Part Number R5323K001B R5323K002B R5323K003B R5323K004B R5323K005B R5323K006B R5323K007B R5323K008B R5323K009B R5323K010B R5323K011B R5323K012B R5323K013B R5323K014B R5323K015B R5323K016B R5323K017B R5323K018B R5323K019B R5323K020B R5323K021B R5323K022B R5323K023B R5323K024B R5323K025B R5323K026B R5323K027B R5323K028B R5323K029B Part Number R5323K030B R5323K031B R5323K032B R5323K033B R5323K034B R5323K035B R5323K036B R5323K037B R5323K038B R5323K039B R5323K040B R5323K041B R5323K042B R5323K043B R5323K044B Product Code 1 2 3 4 Part Number R5323K001A R5323K002A R5323K003A R5323K013A R5323K019A R5323K020A R5323K023A R5323K024A R5323K030A Product Code 1 2 3 4 C C C C C C C C C C C C C C C C C C C C C C C C C C C C C 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 4 3 2 1 1 1 1 1 2 2 2 2 2 4 4 3 2 5 3 1 2 3 4 5 6 7 8 9 2 1 1 8 4 5 6 7 8 0 2 3 4 6 8 9 2 9 0 0 C C C C C C C C C C C C C C C 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 3 3 3 3 3 3 4 4 4 4 4 4 4 5 5 4 5 6 7 8 9 0 2 3 4 5 6 7 2 3 C C C C C C C C C 0 0 0 0 0 0 0 0 0 5 1 1 1 1 2 2 2 3 1 0 1 3 9 1 5 7 3 MARK INFORMATION ME-R5323Z-0505 R5323Z SERIES MARK SPECIFICATION • WLCSP-6-P1 1 : G (Fixed) , 3 1 2 3 2 : Lot Number • Product Code vs. Marking Product Code 1 Part Number R5323Z001A R5323Z002A R5323Z003A R5323Z004A R5323Z005A R5323Z006A R5323Z007A R5323Z008A R5323Z009A R5323Z010A R5323Z011A R5323Z012A R5323Z013A R5323Z014A R5323Z015A R5323Z016A R5323Z017A R5323Z018A R5323Z019A R5323Z020A Part Number R5323Z021A R5323Z022A R5323Z023A R5323Z024A R5323Z025A R5323Z026A R5323Z027A R5323Z028A R5323Z029A R5323Z030A R5323Z031A R5323Z032A R5323Z033A R5323Z034A R5323Z035A R5323Z036A R5323Z037A R5323Z038A R5323Z039A R5323Z040A R5323Z041A Product Code 1 Part Number R5323Z001B R5323Z002B R5323Z003B R5323Z004B R5323Z005B R5323Z006B R5323Z007B R5323Z008B R5323Z009B R5323Z010B R5323Z011B R5323Z012B R5323Z013B R5323Z014B R5323Z015B R5323Z016B R5323Z017B R5323Z018B R5323Z019B R5323Z020B Product Code 1 Part Number R5323Z021B R5323Z022B R5323Z023B R5323Z024B R5323Z025B R5323Z026B R5323Z027B R5323Z028B R5323Z029B R5323Z030B R5323Z031B R5323Z032B R5323Z033B R5323Z034B R5323Z035B R5323Z036B R5323Z037B R5323Z038B R5323Z039B R5323Z040B R5323Z041B Product Code 1 G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G