RP114x SERIES
300 mA LDO REGULATOR
No.EA-236-190130
OUTLINE
The RP114x is a CMOS-based voltage regulator IC with high output voltage accuracy, low supply current, low
dropout, and high ripple rejection. This IC consists of a voltage reference unit, an error amplifier, resistors for
setting output voltage, a short current limit circuit, a chip enable circuit, and so on. The RP114x features a
minimum input voltage from 1.4V and the output voltage, which can be set from 0.8V to 3.6V (in 0.1V step).
The output voltage of this IC is internally fixed. This IC perform with low dropout voltage due to built-in transistor
with low ON resistance. Low supply current and a chip enable function prolong the battery life of each system.
The ripple rejection, line transient response and load transient response of the RP114x is excellent, thus this
IC is very suitable for the power supply for hand-held communication equipment. Since the packages for this
IC are DFN(PLP)1010-4、DFN(PLP)1010-4B、SC-88A、SOT-23-5, therefore high density mounting of the IC
on boards is possible.
FEATURES
Supply Current ................................................................ Typ. 50µA
Standby Current ............................................................. Typ. 0.1µA
Input Voltage Range ....................................................... 1.4V to 5.25V
Output Voltage Range(1) ................................................. 0.8V to 3.6V (0.1V steps)
Output Voltage Accuracy ................................................ 1.0% (VSET>2.0V, Ta=25C)
Temperature-Drift Coefficient of Output Voltage............. Typ. 80ppm/C
Dropout Voltage .............................................................. Typ. 0.25V (IOUT=300mA, VSET=2.8V)
Ripple Rejection ............................................................. Typ. 75dB (f=1kHz)
Line Regulation ............................................................... Typ. 0.02%/V
●
Packages ꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏꞏ DFN(PLP)1010-4、DFN(PLP)1010-4B、
SC-88A、SOT-23-5
Built-in Fold Back Protection Circuit ............................... Typ. 60mA (Current at short mode)
Ceramic capacitors are recommended to be used with this IC ...... 1.0µF or more
APPLICATIONS
Power source for portable communication equipment.
Power source for electrical appliances such as cameras, VCRs and camcorders.
Power source for battery-powered equipment.
(1)
For other voltages, please refer to Product-specific Electrical Characteristics.
1
RP114x
No.EA-236-190130
SELECTION GUIDE
The set output voltage, the auto discharge function(1), and the package type for the ICs are user-selectable
options.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
DFN(PLP)1010-4
10,000 pcs
Yes
Yes
DFN(PLP)1010-4B
10,000 pcs
Yes
Yes
RP114Qxx2(y)-TR-FE
SC-88A
3,000 pcs
Yes
Yes
RP114Nxx1(y)-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
RP114Kxx1(y)-TR
RP114Kxx1(y)-TRB
xx : Specify the set output voltage within the range of 0.8 V (08) to 3.6 V (36) in 0.1 V step.
(y): If the output voltage includes the 3rd digit, indicate the digit of 0.01V.
Ex. If the output voltage is 1.25V, RP114K121∗5-TR
If the output voltage is 1.85V, RP114K181∗5-TR
: Specify a combination of the CE pin polarity and the auto-discharge function.
(B) “H” Active, without Auto-Discharge function
(D) “H” Active, with Auto-Discharge function
BLOCK DIAGRAMS
VDD
VOUT VDD
Vref
Vref
Current Limit
CE
2
Current Limit
GND CE
RP114xxxxB Block Diagram
(1)
VOUT
GND
RP114xxxxD Block Diagram
Auto-Discharge function quickly lowers the output voltage to 0V by releasing the electrical charge in the external
capacitor when the chip enable signal is switched from the active mode to the standby mode.
RP114x
No.EA-236-190130
PIN DESCRIPTIONS
RP114K [DFN(PLP)1010-4]
Bottom View
Top View
4
RP114K [DFN(PLP)1010-4B]
3
3
4
Bottom View
Top View
4
3
3
1
2
2
1
1
2
RP114Q (SC-88A)
5
5
(mark side)
2
2
1
RP114N (SOT-23-5)
4
1
4
4
(mark side)
3
1
2
3
RP114K Pin Description [DFN(PLP)1010-4 / DFN(PLP)1010-4B]
Pin No
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE
4
VDD
Chip Enable Pin ("H" Active)
Input Pin
Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
RP114Q Pin Description (SC-88A)
Pin No
Symbol
Description
1
CE
Chip Enable Pin (“H” Active)
2
NC
No Connection
3
GND
Ground Pin
4
VOUT
Output Pin
5
VDD
Input Pin
3
RP114x
No.EA-236-190130
RP114N Pin Description (SOT-23-5)
4
Pin No
Symbol
Description
1
VDD
Input Pin
2
GND
Ground Pin
3
CE
Chip Enable Pin (“H” Active)
4
NC
No Connection
5
VOUT
Output Pin
RP114x
No.EA-236-190130
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
VIN
Input Voltage
6.0
V
VCE
Input Voltage (CE Pin)
6.0
V
VOUT
Output Voltage
0.3 to VIN0.3
V
IOUT
Output Current
400
mA
PD
Power Dissipation(1)
DFN(PLP)1010-4, JEDEC STD. 51
800
DFN(PLP)1010-4B, JEDEC STD. 51
800
SC-88A,
RICOH Evaluation Board
380
SOT-23-5, JEDEC STD. 51
660
mW
Tj
Junction Temperature Range
40 to 125
C
Tstg
Storage Temperature Range
55 to 125
C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings are not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol
Item
VIN
Input Voltage
Ta
Operating Temperature Range
Rating
1.4 to 5.25
Unit
(2)
−40 to 85
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended
operating conditions.
(1)
Refer to POWER DISSIPATION for detailed information.
If the input voltage exceeds the maximum value of 5.25 V for some reasons, the operational accumulated time
becomes up to 500 hours at 5.5V.
(2)
5
RP114x
No.EA-236-190130
ELECTRICAL CHARACTERISTICS
VIN = VSET(1)+1.0 V (VSET > 1.5 V)，VIN = 2.5 V (VSET ≤ 1.5V)，IOUT = 1 mA，CIN = COUT = 1.0 µF,
unless otherwise noted.
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
RP114xxxxB/D Electrical Characteristics
Symbol
Item
(Ta=25C)
Conditions
Ta = 25C
VOUT
Output Voltage
-40C ≤ Ta ≤ 85C
IOUT
Typ.
Max.
Unit
VSET > 2.0 V
0.99
1.01
V
VSET ≤ 2.0 V
-20
+20
mV
VSET > 2.0 V
0.97
1.03
V
VSET ≤ 2.0 V
-60
+60
mV
Output Current
VOUT/IOUT Load Regulation
Min.
300
1 mA ≤ IOUT ≤ 300 mA
mA
15
40
mV
VDIF
Dropout Voltage
ISS
Supply Current
IOUT = 0 mA
50
75
μA
Standby Current
VCE = 0 V
0.1
1.0
μA
0.02
0.10
%/V
Istandby
VOUT
/VIN
Line Regulation
Please refer to Product-specific Electrical Characteristics attached.
VSET + 0.5 V ≤ VIN ≤ 5.25 V
(VIN ≥ 1.4 V)
f=1kHz, Ripple 0.2 Vp-p,
RR
Ripple Rejection
VIN=VSET +1V, IOUT = 30 mA
75
dB
(When VSET ≤ 2.0 V, VIN = 3.0 V)
Output Voltage
VOUT/Ta Temperature
Coefficient
ISC
Short Current Limit
IPD
CE Pull-down Current
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
en
RLOW
-40C ≤ Ta ≤ 85C
80
VOUT = 0 V
60
0.3
ppm
/C
mA
0.6
1.0
μA
V
0.4
V
Output Noise
BW = 10 Hz to 100 kHz,
IOUT = 30 mA
75
μVrms
Low Output Nch. On
Resistance
(RP114xxxxD Only)
VIN = 4.0 V, VCE = 0 V
50
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25ºC) except for
Output Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
(1)
6
VSET: Set Output Voltage
RP114x
No.EA-236-190130
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
Dropout Voltage by Set Output Voltage
(Ta25C)
Dropout Voltage VDIF (V)
Set Output Voltage
VSET (V)
Typ.
Max.
VSET0.8
0.560
0.720
VSET0.9
0.510
0.650
1.0 VSET < 1.2
0.460
0.590
1.2 VSET < 1.4
0.390
0.500
0.350
0.440
1.7 VSET < 2.1
0.300
0.390
2.1 VSET < 2.5
0.260
0.340
2.5 VSET < 3.0
0.250
0.300
3.0 VSET 3.6
0.220
0.290
1.4 VSET < 1.7
Condition
IOUT300mA
7
RP114x
No.EA-236-190130
Product-specific Electrical Characteristics
The specifications in
Product Name
RP114x081x
RP114x091x
RP114x101x
RP114x101x5
RP114x111x
RP114x111x5
RP114x121x
RP114x121x5
RP114x131x
RP114x131x5
RP114x141x
RP114x151x
RP114x161x
RP114x171x
RP114x171x5
RP114x181x
RP114x181x5
RP114x191x
RP114x201x
RP114x211x
RP114x221x
RP114x231x
RP114x241x
RP114x251x
RP114x261x
RP114x271x
RP114x281x
RP114x281x5
RP114x291x
RP114x301x
RP114x311x
RP114x321x
RP114x331x
RP114x341x
RP114x341x5
RP114x351x
RP114x361x
8
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
VOUT [V] (Ta = 25°C)
Min.
Typ.
Max.
0.780
0.800
0.820
0.880
0.900
0.920
0.980
1.000
1.020
1.030
1.050
1.070
1.080
1.100
1.120
1.130
1.150
1.170
1.180
1.200
1.220
1.230
1.250
1.270
1.280
1.300
1.320
1.330
1.350
1.370
1.380
1.400
1.420
1.480
1.500
1.520
1.580
1.600
1.620
1.680
1.700
1.720
1.730
1.750
1.770
1.780
1.800
1.820
1.830
1.850
1.870
1.880
1.900
1.920
1.980
2.000
2.020
2.079
2.100
2.121
2.178
2.200
2.222
2.277
2.300
2.323
2.376
2.400
2.424
2.475
2.500
2.525
2.574
2.600
2.626
2.673
2.700
2.727
2.772
2.800
2.828
2.822
2.850
2.879
2.871
2.900
2.929
2.970
3.000
3.030
3.069
3.100
3.131
3.168
3.200
3.232
3.267
3.300
3.333
3.366
3.400
3.434
3.416
3.450
3.485
3.465
3.500
3.535
3.564
3.600
3.636
VOUT [V] (−40°C ≤ Ta ≤ 85°C)
Min.
Typ.
Max.
0.740
0.800
0.860
0.840
0.900
0.960
0.940
1.000
1.060
0.990
1.050
1.110
1.040
1.100
1.160
1.090
1.150
1.210
1.140
1.200
1.260
1.190
1.250
1.310
1.240
1.300
1.360
1.290
1.350
1.410
1.340
1.400
1.460
1.440
1.500
1.560
1.540
1.600
1.660
1.640
1.700
1.760
1.690
1.750
1.810
1.740
1.800
1.860
1.790
1.850
1.910
1.840
1.900
1.960
1.940
2.000
2.060
2.037
2.100
2.163
2.134
2.200
2.266
2.231
2.300
2.369
2.328
2.400
2.472
2.425
2.500
2.575
2.522
2.600
2.678
2.619
2.700
2.781
2.716
2.800
2.884
2.765
2.850
2.936
2.813
2.900
2.987
2.910
3.000
3.090
3.007
3.100
3.193
3.104
3.200
3.296
3.201
3.300
3.399
3.298
3.400
3.502
3.347
3.450
3.554
3.395
3.500
3.605
3.492
3.600
3.708
VDIF [V]
Typ.
Max.
0.560
0.720
0.510
0.650
0.460
0.590
0.390
0.500
0.350
0.440
0.300
0.390
0.260
0.340
0.250
0.300
0.220
0.290
RP114x
No.EA-236-190130
TEST CIRCUITS
VDD VOUT
RP114x
Series
C1
CE
V
C2
↓
VOUT
IOUT
GND
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 1. Basic Test Circuit
VDD VOUT
A
ISS
RP114x
Series
C1
CE
VOUT
C2
GND
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 2. Test Circuit for Supply Current
Pulse
Generator
VDD VOUT
RP114x
Series
P.G.
CE
C2
↓
IOUT
GND
C2 = Ceramic 1.0μF
Figure 3. Test Circuit for Ripple Rejection
VOUT
VDD VOUT
C1
RP114x
Series
CE
C2
GND
↓ IOUTa
↓
IOUTb
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 4. Test Circuit for Load Transient Response
9
RP114x
No.EA-236-190130
TECHNICAL NOTES ON EXTERNAL COMPONENTS
When using these ICs, consider the following points:
Phase Compensation
In this IC, phase compensation is made for securing stable operation even if the load current is varied. For this
purpose, use a capacitor C2 with 1.0µF or more and good ESR (Equivalent Series Resistance).
(Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for
phase compensation, the operation might be unstable. Because of this, test this IC with as same external
components as ones to be used on the PCB.)
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 1.0µF or more between VDD and GND pins, and
as close as possible to the pins.
Set external components, especially the output capacitor C2, as close as possible to the IC, and make wiring
as short as possible.
Typical Application Circuit
VOUT
VDD VOUT
C1
1.0 µF
CE Control
10
RP114x
Series
CE
GND
C2
1.0 µF
RP114x
No.EA-236-190130
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions
when the white noise level is under 40µV (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band: 10Hz to 2MHz
Temperature
: 40C to 85C
C1, C2
: 1.0µF
RP114x08xx
RP114x25xx
VIN=1.4V to 5.25V
100
VIN=2.5V to 5.25V
100
Topt=85°C
Ta
Topt=85°C
Ta
10
Topt=-40°C
Ta
1
ESR (Ω)
ESR (Ω)
10
0.1
Topt=-40°C
Ta
1
0.1
0.01
0.01
0
50
100
150
200
250
300
Output Current IOUT (mA)
0
50
100
150
200
250
300
Output Current IOUT (mA)
RP114x36xx
VIN=3.6V to 5.25V
100
Topt=85°C
Ta
ESR (Ω)
10
Topt=-40°C
Ta
1
0.1
0.01
0
50
100 150 200 250
Output Current IOUT (mA)
300
11
RP114x
No.EA-236-190130
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (C11.0F, C21.0F, Ta25C)
RP114x08xx
0.7
Output Voltage VOUT (V)
0.8
Output Voltage VOUT (V)
RP114x25xx
3.0
0.9
VIN=1.8V
VIN=2.8V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.25V
0.6
0.5
0.4
0.3
0.2
0.1
2.5
VIN=3.5V
2.0
VIN=4.2V
1.5
VIN=5.0V
VIN=5.25V
1.0
0.5
0
0
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
100 200 300 400 500 600 700
Output Current IOUT (mA)
RP114x36xx
4.0
Output Voltage VOUT (V)
3.5
3.0
VIN=4.6V
2.5
VIN=5.0V
2.0
VIN=5.25V
1.5
1.0
0.5
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
2) Output Voltage vs. Input Voltage (C11.0F, C21.0F, Ta25C)
RP114x08xx
0.8
0.7
0.6
0.5
0.4
IOUT=1mA
0.3
IOUT=30mA
0.2
IOUT=50mA
0.1
0
2.5
2.0
1.5
IOUT=1mA
IOUT=30mA
1.0
IOUT=50mA
0.5
0
0
12
RP114x25xx
3.0
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.9
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
RP114x
No.EA-236-190130
RP114x36xx
Output Voltage VOUT (V)
4.0
3.5
3.0
2.5
2.0
1.5
IOUT=1mA
1.0
IOUT=30mA
IOUT=50mA
0.5
0
0
1
2
3
4
5
Input Voltage VIN (V)
3) Supply Current vs. Input Voltage (C11.0F, C21.0F, Ta25C)
RP114x25xx
70
70
60
60
Supply Current ISS (µA)
Supply Current ISS (µA)
RP114x08xx
50
40
30
20
10
50
40
30
20
10
0
0
0
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
RP114x36xx
Supply Current ISS (µA)
70
60
50
40
30
20
10
0
0
1
2
3
4
Input Voltage VIN (V)
5
13
RP114x
No.EA-236-190130
4) Output Voltage vs. Temperature (C11.0F, C21.0F, IOUT1mA)
RP114x08xx
RP114x25xx
VIN=1.8V
0.83
0.82
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.85
0.84
0.81
0.80
0.79
0.78
0.77
0.76
0.75
-50
-25
0
25
50
75
Temperature Topt
Ta ((°C)
C)
RP114x36xx
Output Voltage VOUT (V)
3.65
3.64
2.55
2.54
2.53
VIN=3.5V
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
-50
100
-25
0
25
50
75
Temperature Topt
Ta ((°C)
C)
100
VIN=4.6V
3.63
3.62
3.61
3.60
3.59
3.58
3.57
3.56
3.55
-50
-25
0
25
50
75
Temperature Topt
Ta ((°C)
C)
100
5) Supply Current vs. Temperature (C11.0F, C21.0F, IOUT0mA)
RP114x08xx
60
50
40
30
20
10
0
60
50
40
30
20
10
0
-50
14
VIN=3.5V
70
Supply Current ISS (μA)
Supply Current ISS (μA)
70
RP114x25xx
VIN=1.8V
-25
0
25
50
75
Ta ((°C)
C)
Temperature Topt
100
-50
-25
0
25
50
Ta ((°C)
C)
Temperature Topt
75
100
RP114x
No.EA-236-190130
RP114x36xx
VIN=4.6V
Supply Current ISS (μA)
70
60
50
40
30
20
10
0
-50
-25
0
25
50
75
100
Temperature Topt
Ta ((°C)
C)
6) Dropout Voltage vs. Output Current (C11.0F, C21.0F)
RP114x08xx
RP114x25xx
300
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
600
500
400
300
-40°C
25°C
85°C
200
100
250
200
150
100
-40°C
25°C
85°C
50
0
0
0
50
100
150
200
250
300
Output Current IOUT (mA)
0
50
100
150
200
250
300
Output Current IOUT (mA)
RP114x36xx
Dropout Voltage VDIF (mV)
250
200
150
100
-40°C
25°C
85°C
50
0
0
50
100
150
200
250
300
Output Current IOUT (mA)
15
RP114x
No.EA-236-190130
7) Dropout Voltage vs. Set Output Voltage (C11.0F, C21.0F, Ta25C)
Dropout Voltage VDIF (mV)
600
IOUT=30mA
500
IOUT=100mA
400
IOUT=300mA
300
200
100
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Set Output Voltage VREG (V)
8) Dropout Voltage vs. Temperature (C1none, C21.0F)
RP114x08xx
RP114x25xx
300
600
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
50mA
150mA
300mA
500
400
300
200
100
0
-25
0
25
50
75
Temperature Topt
Ta ((°C)
C)
100
150
100
50
250
200
50mA
150mA
300mA
150
100
50
0
-50
-25
0
25
50
Temperature Topt
Ta (°C)
(C)
75
-50
-25
0
25
50
Temperature Topt
Ta ((°C)
C)
RP114x36xx
Dropout Voltage VDIF (mV)
50mA
150mA
300mA
200
0
-50
16
250
100
75
100
RP114x
No.EA-236-190130
9) Ripple Rejection vs. Input Voltage (C1none, C21.0F, Ripple0.2Vp-p, Ta25C)
Ripple Rejection RR (dB)
100
90
IOUT=1mA
80
70
60
50
40
1kHz
30
20
10kHz
100kHz
10
0
2.5
3.0
RP114x25xx
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
IOUT=30mA
100
Ripple Rejection RR (dB)
RP114x25xx
90
80
70
60
50
40
30
20
1kHz
10kHz
100kHz
10
0
2.5
5.5
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
5.5
10) Ripple Rejection vs. Frequency (C1none, C21.0F, Ta25C)
RP114x08xx
80
70
60
50
40
30
20
10
0
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
RP114x36xx
Ripple Rejection RR (dB)
100
90
80
70
60
50
40
30
20
10
0
RP114x25xx
100
90
80
70
60
50
40
30
20
10
0
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
100
90
VIN=3.0V
1000
VIN=3.5V
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
1000
VIN=4.6V
1mA
30mA
150mA
0.1
1
10
100
1000
Frequency f (kHz)
17
RP114x
No.EA-236-190130
11) Input Transient Response (IOUT30mA, trtf5s, Ta25C
4.5
2.0
1.5
Input Voltage
1.8V2.8V
0.815
1.0
0.810
0.805
Output Voltage
0.800
0.795
Output Voltage VOUT (V)
5.0
2.5
Input Voltage
3.5V4.5V
2.505
3.0
2.500
2.495
2.490
Output Voltage
2.485
0.790
4.0
3.5
Input Voltage VIN (V)
RP114x25xx
3.0
Input Voltage VIN (V)
Output Voltage VOUT (V)
RP114x08xx
2.480
0
20
40
60
80
100
0
20
40
Time t (µs)
60
80
100
Time t (µs)
6.0
5.5
5.0
4.5
4.0
Input Voltage
4.6V5.6V
3.610
3.605
3.600
3.595
3.590
Output Voltage
0
20
40
60
80
Input Voltage VIN (V)
Output Voltage VOUT (V)
RP114x36xx
100
Time t (µs)
12) Load Transient Response (C11.0F, C21.0F, trtf0.5s, Ta25C
Output Current
50mA100mA
0.84
0.82
0.80
0
Output Voltage
0.78
0.76
0.74
Output Voltage VOUT (V)
200
VIN=3.5V
200
150
100
50
Output Current
50mA100mA
2.54
2.52
2.50
2.48
2.46
0
Output Voltage
2.44
100
200
300
Time t (µs)
400
500
0
100
200
300
Time t (µs)
400
500
Output Current IOUT (mA)
RP114x25xx
150
100
50
0
18
VIN=1.8V
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x08xx
RP114x
VIN=4.6V
Output Current
50mA100mA
Output Voltage
200
300
Time t (µs)
Output Voltage VOUT (V)
RP114x08xx
500
RP114x25xx
VIN=1.8V
450
300
150
0
Output Current
1mA300mA
1.0
0.9
0.8
Output Voltage
0.7
0.6
0.5
0
100
200
300
Time t (µs)
RP114x36xx
Output Voltage VOUT (V)
400
400
VIN=4.6V
Output Current
1mA300mA
3.8
3.7
3.6
3.5
3.4
3.3
450
300
150
0
Output Voltage
0
100
200
300
Time t (µs)
400
Output Current
1mA300mA
2.7
2.6
2.5
2.4
2.3
2.2
450
300
150
0
Output Voltage
0
500
VIN=3.5V
100
200
300
Time t (µs)
400
500
500
19
Output Current IOUT (mA)
100
Output Voltage VOUT (V)
0
Output Current IOUT (mA)
3.62
3.60
3.58
3.56
3.54
200
150
100
50
0
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x36xx
Output Current IOUT (mA)
No.EA-236-190130
RP114x
No.EA-236-190130
RP114x25xx VIN=3.5V
CE Input Voltage
3
6
2
4
1
0
0.8
0.6
Output Voltage
0.4
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.2
0.0
0
40
80
Time t (µs)
120
Output Voltgage VOUT (V)
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xx
2
CE Input Voltage
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
0
Output Voltage
1
CE Input Voltage VCE (V)
13) Turn On Speed with CE pin (C11.0F, C21.0F, Ta25C
0
0
160
40
80
Time t (µs)
120
160
RP114x36xx
4
CE Input Voltage
2
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
6
0
3
Output Voltage
2
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
VIN=4.6V
0
0
40
80
Time t (µs)
120
160
14) Turn Off Speed with CE pin (B version) (C11.0F, C21.0F, Ta25C
CE Input Voltage
1
0
0.8
IOUT=0mA
0.6
0.4
Output Voltage
0.2
VIN=3.5V
4
2
CE Input Voltage
0
4
IOUT=0mA
3
2
Output Voltage
1
0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
6
0
2
4
6 8 10 12 14 16 18
Time t (ms)
CE Input Voltage VCE (V)
3
2
0.0
20
RP114x25xB
Output Voltgage VOUT (V)
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xB
RP114x
No.EA-236-190130
RP114x36xB
6
4
CE Input Voltage
2
0
4
IOUT=0mA
3
2
Output Voltage
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
VIN=4.6V
0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
15) Turn Off Speed with CE pin (D version) (C11.0F, C21.0F, Ta25C
2
CE Input Voltage
1
0
0.8
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.6
0.4
0.2
Output Voltage
6
4
CE Input Voltage
2
0
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
1
Output Voltage
0 100 200 300 400 500 600 700 800
0 100 200 300 400 500 600 700 800
Time t (µs)
VIN=4.6V
6
4
CE Input Voltage
2
0
4
IOUT=0mA
IOUT=30mA
3
IOUT=300mA
Time t (µs)
2
Output Voltage
CE Input Voltage VCE (V)
RP114x36xD
Output Voltgage VOUT (V)
VIN=3.5V
0
0.0
1
Output Voltgage VOUT (V)
3
CE Input Voltage VCE (V)
RP114x25xD
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xD
0
0 100 200 300 400 500 600 700 800
Time t (µs)
21
POWER DISSIPATION
DFN(PLP)1010-4
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.2 mm × 11 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
800 mW
θja = 125°C/W
ψjt = 58°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1200
1000
Power Dissipation (mW)
1000
800
800
600
400
200
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
DFN(PLP)1010-4
Ver. B
DFN(PLP)1010-4 Package Dimensions
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
POWER DISSIPATION
DFN(PLP)1010-4B
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.2 mm ×11 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
Measurement Result
800 mW
θja = 125°C/W
ψjt = 58°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1200
1000
Power Dissipation (mW)
1000
800
800
600
400
200
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
DFN(PLP)1010-4B
Ver. A
0.65
B
3
0.25±0.05
1.00
0.05
0.07±0.05
X4
C0.18
0.05±0.05
∗
0.48±0.05
DETAIL : “A”
45°
0.04
“A”
2
1
0.25±0.05
0.48±0.05
0.045
0.05 M S AB
0.03min
0.6max
INDEX
4
C0.10
A
1.00
S
0.05 S
DFN (PLP) 1010-4B Package Dimensions (Unit: mm)
*
∗ The tab on the bottom of the package is a substrate potential (GND). It is recommended that this tab be connected to
the ground plane on the board but it is possible to leave the tab floating.
i
POWER DISSIPATION
SC-88A
Ver. B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Item
RICOH Evaluation Board
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions
40 mm × 40 mm × 1.6 mm
Top Side: Approx. 50%
Copper Ratio
Bottom Side: Approx. 50%
φ 0.5 mm × 44 pcs
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
RICOH Evaluation Board
Item
Power Dissipation
380 mW
Thermal Resistance (θja)
θja = 263°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 75°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
600
40
475
400
380
300
40
Power Dissipation (mW)
500
200
100
0
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
SC-88A
Ver. A
SC-88A Package Dimensions
i
POWER DISSIPATION
SOT-23-5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Board Material
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 7 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (θja)
θja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1000
900
830
Power Dissipation (mW)
800
700
600
660
500
400
300
200
100
0
0
25
50
75 85 100 125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
SOT-23-5
PACKAGE DIMENSIONS
Ver. A
2.9±0.2
1.1±0.1
1.9±0.2
0.8±0.1
(0.95)
4
1
2
0～0.1
0.2min.
+0.2
1.6-0.1
5
2.8±0.3
(0.95)
3
0.4±0.1
+0.1
0.15-0.05
SOT-23-5 Package Dimensions
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
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