RP131x SERIES
LOW ON RESISTANCE / LOW VOLTAGE 1A LDO
NO.EA-174-180711
OUTLINE
The RP131x Series are voltage-regulators with a built-in low ON-resistance transistor and output current is 1A
capability. These ICs are capable of the low input voltage (Min.1.6V) and also the minimum output voltage can be
set from 0.8V. (The output voltage is fixed in the IC.)
Each of these ICs consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage,
a chip enable circuit, current limit circuits for over-current and short, and a thermal-shutdown circuit.
A standby mode with ultra low supply current can be realized with the chip enable function.
The packages for these ICs are DFN1616-6B and DFN(PLP)1820-6 which are suitable for high density mounting
of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 with high power dissipation are also available.
FEATURES
Output Current ............................................................ Min. 1A
Supply Current ............................................................. Typ. 65A
Standby Current ......................................................... Typ. 0.15A
Input Voltage Range ................................................... 1.6V to 6.5V
Output Voltage Range .................................................. 0.8V to 5.5V (1)(0.1V steps)
Dropout Voltage............................................................ Typ. 0.5V (VOUT2.8V, IOUT1A)
Ripple Rejection ........................................................... Typ. 70dB (f1kHz, VOUT2.8V)
Output Voltage Accuracy .............................................. 1.0%
Temperature-Drift Coefficient of Output Voltage .......... Typ. 100ppm/C
Line Regulation ............................................................ Typ. 0.05%/V
Load Regulation ......................................................... Typ. 20mV at IOUT300mA, Typ. 80mV at IOUT1A
Packages ................................................................... DFN1616-6B, DFN(PLP)1820-6, SOT-89-5, HSOP-6J,
TO-252-5-P2
Built-in Inrush current limit circuit ............................... Typ. 500mA
Built-in Fold-Back Protection Circuit ........................... Typ. 250mA (Current at short mode)
Built-in Thermal Shutdown Circuit .............................. Thermal Shutdown Temperature ; Typ. 165C
Released Temperature ; Typ. 135C
Built-in Auto Discharge Function ................................ D version
Ceramic capacitors are recommended to be used with this IC .... 2.2F or more (VOUT≤3.6V)
4.7F or more (VOUT3.6V)
APPLICATIONS
(1)
Power source for battery-powered equipment.
Power source for portable communication equipment.
Power source for electrical appliances such as cameras, VCRs and camcorders.
Power source for Notebook PC.
Power source for home appliances.
For other voltages, please refer to MARK INFORMATIONS.
1
RP131x
NO.EA-174-180711
SELECTION GUIDE
The output voltage, auto discharge function, package for the ICs can be selected at the user’s request.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
RP131Lxx1-TR
DFN1616-6B
5,000 pcs
Yes
Yes
RP131Kxx1-TR
DFN(PLP)1820-6
5,000 pcs
Yes
Yes
RP131Hxx1-T1-FE
SOT-89-5
1,000 pcs
Yes
Yes
RP131Sxx1-E2-FE
HSOP-6J
1,000 pcs
Yes
Yes
RP131Jxx1-T1-FE
TO-252-5-P2
3,000 pcs
Yes
Yes
xx : The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V steps.
(For other voltages, please refer to MARK INFORMATIONS.)
: The auto discharge function at off state are options as follows.(1)
(B) without auto discharge function at off state
(D) with auto discharge function at off state
BLOCK DIAGRAMS
RP131xxx1B
VDD
RP131xxx1D
VOUT
VDD
Vref
Vref
Current Limit
Thermal Shutdown
CE
(1)
2
VOUT
Current Limit
Thermal Shutdown
GND
CE
GND
Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the active
mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor.
RP131x
NO.EA-174-180711
PIN DESCRIPTIONS
Top View
6
5
Top View
Bottom View
4
4
5
6
6
5
Bottom View
4
4
2
3
3
2
1
1
2
DFN1616-6B
5
1
2
6
2
1
1
5
3
3
DFN(PLP)1820-6
4
6
5
4
3
1
2
3
1
SOT-89-5
HSOP-6J
2
3
4
5
TO-252-5-P2
Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
RP131L (DFN1616-6B) Pin Description
Pin No.
Symbol
Pin Description
(1)
1
VOUT
Output Pin
2
VOUt
Output Pin
3
GND
Ground Pin
4
CE
5
VDD
Input Pin
6
VDD
Input Pin
Chip Enable Pin ("H" Active)
(1)
When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin.
3
RP131x
NO.EA-174-180711
RP131K (DFN(PLP)1820-6) Pin Description
Pin No.
Symbol
Pin Description
(1)
1
VOUT
Output Pin
2
VOUT
Output Pin
3
GND
Ground Pin
4
CE
5
VDD
Input Pin
6
VDD
Input Pin
Chip Enable Pin ("H" Active)
RP131H (SOT-89-5) Pin Description
Pin No.
Symbol
1
NC
2
GND
3
CE
4
VDD
5
VOUT
Pin Description
No Connection
Ground Pin
Chip Enable Pin ("H" Active)
Input Pin
Output Pin
RP131S (HSOP-6J) Pin Description
Pin No.
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin(2)
3
NC
No Connection
4
CE
Chip Enable Pin ("H" Active)
5
GND
Ground Pin
6
VDD
Input Pin
RP131J (TO-252-5-P2) Pin Description
Pin No.
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin(3)
3
GND
Ground Pin
4
CE
Chip Enable Pin ("H" Active)
5
VDD
Input Pin
(1)
When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin.
When you use this IC, please make sure be wired with 2pin and 5pin.
(3)
When you use this IC, please make sure be wired with 2pin and 3pin.
(2)
4
RP131x
NO.EA-174-180711
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
VIN
Input Voltage
VCE
Input Voltage (CE Pin)
VOUT
Output Voltage
PD
Power Dissipation
(1)
Rating
Unit
7.0
V
0.3 to 7.0
V
0.3 to VIN0.3
V
DFN1616-6B, JEDEC STD.51-7
2400
DFN(PLP)1820-6, JEDEC STD.51-7
2200
SOT-89-5, JEDEC STD.51-7
2600
HSOP-6J, JEDEC STD.51-7
2700
TO-252-5-P2, JEDEC STD.51-7
3800
mW
Tj
Junction Temperature Range
40 to 125
C
Tstg
Storage Temperature Range
55 to 125
C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages
and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol
VIN
Ta
Item
Input Voltage
Operating Temperature Range
Rating
1.6 to 6.5
−40 to 85
Unit
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
Refer to POWER DISSIPATION for detailed information.
5
RP131x
NO.EA-174-180711
ELECTRICAL CHARACTERISTICS
VINSet VOUT1V, IOUT1mA
The specification in
is checked and guaranteed by design engineering at −40C≤Ta≤85C, unless
otherwise noted.
RP131xxx1B/D
Symbol
(Ta 25C)
Item
Conditions
Ta 25C
VOUT
Output Voltage
40C ≤ Ta t≤ 85C
Max.
Unit
VOUT>1.5V
0.99
1.01
V
VOUT≤1.5V
15
15
mV
VOUT>1.5V
0.974
1.018
V
VOUT≤1.5V
40
27
mV
20
40
0.1mA ≤ IOUT ≤ 1A
80
120
65
90
A
VCE0V, VIN6.5V
0.15
0.60
A
Line Regulation
Set VOUT0.5V ≤ VIN ≤ 6.5V
However, VIN ≥ 1.6V
0.05
0.1
%/V
Ripple Rejection
f1kHz
Ripple 0.2Vp-p
IOUT100mA
Load Regulation
VDIF
Dropout Voltage
ISS
Supply Current
IOUT0mA (VIN6.5V)
Istandby
Standby Current
VOUT/
VIN
VIN
Input Voltage
ILIM
Output Current Limit
VOUT/
Ta
Typ.
0.1mA ≤ IOUT ≤ 300mA
VOUT/
IOUT
RR
Min.
mV
Refer to the following table
VOUT≤3.3V
70
dB
VOUT>3.3V
60
1.6
6.5
V
A
1
Output Voltage
Temperature Coefficient
40C≤Ta≤85C
100
ppm
/C
ISC
Short Current Limit
VOUT0V
250
mA
IPD
CE Pull-down Current
0.3
A
VCEH
CE Input Voltage "H"
VCEL
CE Input Voltage "L"
en
TTSD
TTSR
RLOW
Output Noise
Thermal Shutdown
Temperature
Thermal Shutdown
Released Temperature
Low Output Nch Tr. ON
Resistance (of D version)
V
1.0
0.4
V
BW10Hz to 100kHz, IOUT1mA
45
Vrms
Junction Temperature
165
C
Junction Temperature
135
C
VIN4.0V, VCE0V
30
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta = 25°C) except for Output
Noise, Ripple Rejection, Output Voltage Temperature Coefficient, Dropout Voltage at 1A Output Current and Thermal Shutdown
items.
6
RP131x
NO.EA-174-180711
The specification in
otherwise noted.
is checked and guaranteed by design engineering at −40C ≤ Ta ≤ 85C, unless
Dropout Voltage
Output Voltage
VOUT (V)
(Ta 25°C)
Dropout Voltage VDIF (V)
Typ.
Max.
Typ.
Max.
0.8 ≤ VOUT < 0.9
0.600
0.780
1.100
1.650
0.9 ≤ VOUT < 1.0
0.550
0.690
1.050
1.500
1.0 ≤ VOUT < 1.1
0.450
0.610
1.000
1.450
0.340
0.540
0.930
1.420
0.290
0.500
0.900
1.380
1.5 ≤ VOUT < 2.6
0.230
0.310
0.700
1.100
2.6 ≤ VOUT < 3.3
0.150
0.180
0.500
0.750
3.3 ≤ VOUT ≤ 5.5
0.140
0.170
0.450
0.650
1.1 ≤ VOUT < 1.2
1.2 ≤ VOUT < 1.5
Condition
IOUT300mA
Condition
IOUT1A
7
RP131x
NO.EA-174-180711
APPLICATION INFORMATION
Typical Application Circuits
VOUT
VDD VOUT
RP131x
Series
CIN
CE
COUT
GND
CE Control
Recommendation value of the external capacitors
Capacitors
VOUT
VOUT ≤ 3.6V
VOUT > 3.6V
CIN
COUT
CIN
COUT
Kyocera 2.2F (size:1005)
Kyocera 2.2F (size:1608)
Kyocera 2.2F (size:1608)
Kyocera 4.7F (size:1608)
[CM05X5R225M06AB]
[CM105X5R225K06AB]
[CM105X5R225K06AB]
[CM105X5R475M06AB]
Technical Notes on the External Components
When using this IC, consider following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance).
If a tantalum capacitor is used, and its ESR of COUT is large, the loop oscillation may result. Because of this,
select COUT carefully considering its frequency characteristics.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor CIN between VDD and GND pin with a capacitance value as "Recommendation value of the
external capacitors" above or more, and as close as possible to the pins.
Set external components, especially the output capacitor COUT, as close as possible to the ICs, and make wiring
as short as possible.
8
RP131x
NO.EA-174-180711
TEST CIRCUITS
VDD VOUT
RP131x
Series
CIN
CE
COUT
V
VOUT
IOUT
GND
CE Control
Basic Test Circuit
VOUT
VDD VOUT
A
RP131x
Series
CIN
ISS
CE
COUT
GND
CE Control
Test Circuit for Supply Current
Pulse
Generator
VDD VOUT
RP131x
Series
P.G.
CE
CE Control
COUT
IOUT
GND
Test Circuit for Ripple Rejection
VOUT
VDD VOUT
RP131x
Series
CIN
CE
COUT
GND
CE Control
IOUTa
IOUTb
Test Circuit for Load Transient Response
9
RP131x
NO.EA-174-180711
TYPICAL CHARACTERISTICS
Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (Ta 25C)
RP131x081x
RP131x151x
1.6
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.9
0.8
0.7
0.6
0.5
0.4
VIN=1.4V
VIN=1.6V
VIN=2.0V
VIN=2.5V
VIN=2.8V
0.3
0.2
0.1
0
0
0.5
1.0
1.5
Output Current IOUT (A)
1.4
1.2
VIN=2.0V
VIN=2.5V
VIN=3.5V
1.0
0.8
0.6
0.4
0.2
0
0
2.0
0.5
1.0
1.5
Output Current IOUT (A)
RP131x331x
RP131x501x
Output Voltage VOUT (V)
Output Voltage VOUT (V)
3.5
3.0
2.5
VIN=3.6V
VIN=4.3V
VIN=5.0V
2.0
1.5
1.0
0.5
0
0
2.0
0.5
1.0
1.5
Output Current IOUT (A)
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VIN=5.3V
VIN=6.0V
0
2.0
0.5
1.0
1.5
Output Current IOUT (A)
2.0
2) Output Voltage vs. Input Voltage (Ta25C)
IOUT=1mA
IOUT=50mA
IOUT=100mA
IOUT=300mA
1.5
1.2
0.9
IOUT=1mA
IOUT=50mA
IOUT=100mA
IOUT=300mA
0.6
0.3
0
0
10
RP131x151x
1.8
Output Voltage VOUT (V)
Output Voltage VOUT (V)
RP131x081x
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
2
3
4
5
Input Voltage VIN (V)
6
0
1
2
3
4
5
Input Voltage VIN (V)
6
RP131x
NO.EA-174-180711
RP131x331x
RP131x501x
6
3.0
2.5
2.0
1.5
IOUT=1mA
IOUT=50mA
IOUT=100mA
IOUT=300mA
1.0
0.5
Output Voltage VOUT (V)
Output Voltage VOUT (V)
3.5
0
5
4
3
IOUT=1mA
IOUT=50mA
IOUT=100mA
IOUT=300mA
2
1
0
0
1
2
3
4
5
Input Voltage VIN (V)
6
0
1
2
3
4
5
Input Voltage VIN (V)
6
3) Supply Current vs. Input Voltage (Ta25C)
RP131x151x
70
60
60
Supply Current ISS (μA)
Supply Current ISS (μA)
RP131x081x
70
50
40
30
20
10
0
50
40
30
20
10
0
0
1
2
3
4
5
Input Voltage VIN (V)
6
0
1
6
RP131x501x
70
70
60
60
Supply Current ISS (μA)
Supply Current ISS (μA)
RP131x331x
2
3
4
5
Input Voltage VIN (V)
50
40
30
20
10
0
50
40
30
20
10
0
0
1
2
3
4
5
Input Voltage VIN (V)
6
0
1
2
3
4
5
Input Voltage VIN (V)
6
11
RP131x
NO.EA-174-180711
4) Output Voltage vs. Temperature
RP131x281x
0.83
1.53
0.82
1.52
Output Voltage VOUT (V)
Output Voltage VOUT (V)
RP131x081x
0.81
0.80
0.79
0.78
0.77
0.76
-40 -25
0
25
50
Temperature Topt (°C)
1.51
1.50
1.49
1.48
1.47
1.46
-40 -25
75 85
5.06
3.34
5.04
3.32
3.30
3.28
3.26
3.24
3.22
3.20
-40 -25
0
25
50
Temperature Topt (°C)
75 85
RP131x501x
3.36
Output Voltage VOUT (V)
Output Voltage VOUT (V)
RP131x331x
0
25
50
Temperature Topt (°C)
5.02
5.00
4.98
4.96
4.94
4.92
4.90
-40 -25
75 85
0
25
50
Temperature Topt (°C)
75 85
5) Supply Current vs. Temperature
80
80
70
60
50
40
30
20
10
0
-40 -25
12
RP131x151x
90
Supply Current ISS (μA)
Supply Current ISS (μA)
RP131x081x
90
0
25
50
Temperature Topt (°C)
75 85
70
60
50
40
30
20
10
0
-40 -25
0
25
50
Temperature Topt (°C)
75 85
RP131x
NO.EA-174-180711
RP131x501x
90
90
80
80
Supply Current ISS (μA)
Supply Current ISS (μA)
RP131x331x
70
60
50
40
30
20
10
0
-40 -25
0
25
50
Temperature Topt (°C)
70
60
50
40
30
20
10
0
-40 -25
75 85
0
25
50
Temperature Topt (°C)
75 85
6) Dropout Voltage vs. Output Current
RP131x081x
RP131x151x
1.4
1.2
1.0
1.4
85°C
25°C
- 40°C
0.8
0.6
0.4
0.2
Dropout Voltage VDIF (V)
Dropout Voltage VDIF (V)
1.6
0
1.2
1.0
0.8
0.6
0.4
0.2
0
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
RP131x331x
RP131x501x
1.0
1.4
85°C
25°C
- 40°C
0.8
0.6
0.4
0.2
0
Dropout Voltage VDIF (V)
Dropout Voltage VDIF (V)
1.4
1.2
85°C
25°C
- 40°C
1.2
1.0
85°C
25°C
- 40°C
0.8
0.6
0.4
0.2
0
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
13
RP131x
NO.EA-174-180711
Dropout Voltage VDIF (V)
7) Dropout Voltage vs. Set Output Voltage
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.5
IOUT=1A
IOUT=800mA
IOUT=600mA
IOUT=400mA
IOUT=200mA
IOUT=100mA
IOUT=50mA
IOUT=10mA
IOUT=1mA
IOUT=0mA
1.5
2.5
3.5
4.5
Set Output Voltage VREG (V)
5.5
8) Ripple Rejection vs. Input Bias Voltage (C1none, C2Ceramic 1.0F, Ripple0.2Vp-p, Ta25C)
RP131x331x
RP131x331x
IOUT=30mA
80
80
70
70
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
IOUT=1mA
60
50
40
30
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
20
10
0
3.0
3.5
4.0 4.5 5.0 5.5 6.0
Input Voltage VIN (V)
60
50
40
30
10
0
3.0
6.5
RP131x331x
70
80
14
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
90
60
50
40
30
0
3.0
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
3.5
4.0 4.5 5.0 5.5 6.0
Input Voltage VIN (V)
6.5
IOUT=1mA
80
10
3.5
RP131x501x
IOUT=50mA
20
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
20
4.0 4.5 5.0 5.5 6.0
Input Voltage VIN (V)
6.5
70
60
50
40
30
20
10
0
4.5
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
5.0
5.5
6.0
Input Voltage VIN (V)
6.5
RP131x
NO.EA-174-180711
RP131x501x
RP131x501x
IOUT=100mA
90
80
80
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
IOUT=10mA
90
70
60
50
40
30
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
20
10
0
4.5
5.0
5.5
6.0
Input Voltage VIN (V)
70
60
50
40
30
10
0
4.5
6.5
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
20
5.0
5.5
6.0
Input Voltage VIN (V)
6.5
9) Ripple Rejection vs. Frequency (C1none, C2Ceramic 4.7F, Ta25C)
100
90
80
70
60
50
40
30
20
10
0
0.1
RP131x151x
VIN=1.8VDC+0.2Vp-p
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
RP131x081x
IOUT=1mA
IOUT=30mA
IOUT=100mA
1
10
100
Frequency f (kHz)
1000
100
90
80
70
60
50
40
30
20
10
0
0.1
VIN=2.5VDC+0.2Vp-p
IOUT=1mA
IOUT=30mA
IOUT=100mA
1
100
90
80
70
60
50
40
30
20
10
0
0.1
IOUT=1mA
IOUT=30mA
IOUT=100mA
1
10
100
Frequency f (kHz)
1000
RP131x501x
VIN=4.3VDC+0.2Vp-p
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
RP131x331x
10
100
Frequency f (kHz)
1000
100
90
80
70
60
50
40
30
20
10
0
0.1
VIN=6.0VDC+0.2Vp-p
IOUT=1mA
IOUT=30mA
IOUT=100mA
1
10
100
Frequency f (kHz)
1000
15
RP131x
NO.EA-174-180711
10) Input Transient Response (IOUT100mA, trtf5s, C1none, Ta25C)
RP131x081x
RP131x151x
C2=Ceramic2.2μF
C2=Ceramic2.2μF
2
1
0.81
Output Voltage
0.80
0.79
3
Input Voltage
2
1.51
Output Voltage
1.50
1.49
0 10 20 30 40 50 60 70 80 90
Time t (μs)
0 10 20 30 40 50 60 70 80 90
Time t (μs)
RP131x331x
RP131x501x
C2=Ceramic2.2μF
C2=Ceramic4.7μF
3.31
Output Voltage
3.30
Input Voltage
6
5
5.005
Output Voltage
5.000
Input Voltage VIN (V)
4
Output Voltage VOUT (V)
5
Input Voltage
7
Input Voltage VIN (V)
6
Output Voltage VOUT (V)
Input Voltage VIN (V)
Input Voltage
Output Voltage VOUT (V)
4
Input Voltage VIN (V)
Output Voltage VOUT (V)
3
4.995
3.29
0 10 20 30 40 50 60 70 80 90
Time t (μs)
0 10 20 30 40 50 60 70 80 90
Time t (μs)
11) Load Transient Response (trtf0.5s, C1Ceramic 2.2F, VINVOUT+1.0V, Topt25C)
RP131x081x
RP131x151x
C2=Ceramic2.2μF
C2=Ceramic2.2μF
50
0.81
0.80
0.79
Output Voltage
0.78
70
50
1.52
1.50
1.48
Output Voltage
1.46
0 20 40 60 80 100 120 140 160 180
Time t (μs)
16
90
Output Current
50mA
100mA
0 20 40 60 80 100 120 140 160 180
Time t (μs)
Output Current IOUT (mA)
70
Output Voltage VOUT (V)
90
Output Current
50mA
100mA
110
Output Current IOUT (mA)
Output Voltage VOUT (V)
110
RP131x
NO.EA-174-180711
RP131x331x
RP131x501x
50
5.02
5.01
5.00
4.99
4.98
Output Voltage
4.97
0 20 40 60 80 100 120 140 160 180
Time t (μs)
0 20 40 60 80 100 120 140 160 180
Time t (μs)
RP131x081x
RP131x151x
C2=Ceramic2.2μF
C2=Ceramic2.2μF
0
0.82
0.80
Output Voltage
Output Voltage VOUT (V)
20
Output Current IOUT (mA)
Output Voltage VOUT (V)
Output Current
0mA
30mA
Output Current
0mA
30mA
0
1.52
1.50
1.48
Output Voltage
1.46
0.76
0 20 40 60 80 100 120 140 160 180
Time t (μs)
0 20 40 60 80 100 120 140 160 180
Time t (μs)
RP131x331x
RP131x501x
C2=Ceramic4.7μF
C2=Ceramic4.7μF
40
20
0
3.32
3.30
Output Voltage
3.26
Output Voltage VOUT (V)
Output Current
0mA
30mA
Output Current IOUT (mA)
Output Voltage VOUT (V)
40
3.28
20
Output Current IOUT (mA)
40
40
0.78
70
Output Current IOUT (mA)
Output Voltage
Output Current
50mA
100mA
90
Output Current
0mA
30mA
20
0
5.01
5.00
4.99
4.98
Output Voltage
Output Current IOUT (mA)
3.33
3.32
3.31
3.30
3.29
3.28
3.27
110
Output Voltage VOUT (V)
Output Current
50mA
100mA
C2=Ceramic4.7μF
110
90
70
50
Output Current IOUT (mA)
Output Voltage VOUT (V)
C2=Ceramic4.7μF
4.97
0 20 40 60 80 100 120 140 160 180
Time t (μs)
0 20 40 60 80 100 120 140 160 180
Time t (μs)
17
RP131x
NO.EA-174-180711
RP131x081x
RP131x151x
C2=Ceramic2.2μF
C2=Ceramic2.2μF
0
1.0
0.8
Output Voltage
0.4
200
0
1.7
1.5
1.3
Output Voltage
1.1
0 20 40 60 80 100 120 140 160 180
Time t (μs)
0 20 40 60 80 100 120 140 160 180
Time t (μs)
RP131x331x
RP131x501x
C2=Ceramic4.7μF
C2=Ceramic4.7μF
600
200
0
3.5
3.3
3.1
2.9
Output Voltage
Output Voltage VOUT (V)
400
Output Current
100mA
500mA
Output Current IOUT (mA)
Output Voltage VOUT (V)
600
2.7
400
Output Current
100mA
500mA
200
0
5.2
5.0
4.8
Output Voltage
Output Current IOUT (mA)
0.6
400
Output Current
100mA
500mA
Output Current IOUT (mA)
200
Output Voltage VOUT (V)
400
Output Current
100mA
500mA
600
Output Current IOUT (mA)
Output Voltage VOUT (V)
600
4.6
0 20 40 60 80 100 120 140 160 180
Time t (μs)
0 20 40 60 80 100 120 140 160 180
Time t (μs)
12) Turn On Speed with CE pin (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C)
RP131x081x
RP131x501x
0
Output Voltage
0.8
IOUT=0mA
IOUT=100mA
3
0
6
Output Voltage
4
2
IOUT=0mA
IOUT=100mA
0
0
0 50 100 150 200 250 300 350 400 450
Time t (μs)
18
6
0 50 100 150 200 250 300 350 400 450
Time t (μs)
CE Input Voltage VCE (V)
2
1
0.4
9
CE Input Voltage
Output Voltage VOUT (V)
CE Input Voltage
VIN=6.0V
3
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
VIN=1.8V
RP131x
NO.EA-174-180711
13) Turn Off Speed with CE pin (D Version) (C1Ceramic 2.2F, C2Ceramic 4.7F, Ta25C)
RP131x501D
1
0
Output Voltage
IOUT=0mA
IOUT=100mA
0.4
Output Voltage VOUT (V)
2
CE Input Voltage
0.8
VIN=6.0V
3
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
VIN=1.8V
0
9
6
CE Input Voltage
3
0
6
Output Voltage
4
IOUT=0mA
IOUT=100mA
2
CE Input Voltage VCE (V)
RP131x081D
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time t (ms)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time t (ms)
14) Inrush Current at turning on (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C)
RP131x501x
VIN=6.5V
8
3.0
600
7
CE Input Voltage
2.5
500
2.0
400
1.5
300
Output Voltage
1.0
200
100
0.5
Inrush Current
0
0 40 80 120 160 200 240 280 320
Time t (μs)
0
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
700
Inrush Current (mA)
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
VIN=2.3V
3.5
CE Input Voltage
6
Output Voltage
800
700
600
5
500
4
400
3
300
2
Inrush Current
100
1
0
200
Inrush Current (mA)
RP131x081x
0
0 40 80 120 160 200 240 280 320
Time t (μs)
15) Minimum Operating Voltage
Input Voltage VIN (V)
RP131x081x
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
Hatched area is available
for 0.8V output.
0
200
400
600
800
Output Current IOUT (mA)
1000
19
RP131x
NO.EA-174-180711
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40V (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band : 10Hz to 3MHz
Temperature
: 40C to 85C
C1
: 2.2F (Kyocera, CM05X5R225M04AD)
C2
: 2.2F (Kyocera, CM105X5R225K06AE)
4.7F (Kyocera, CM105X5R475M06AB)
RP131x081x
RP131x151x
VIN=1.6V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
VIN=1.6V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
100
100
Topt=85°C
Topt=85°C
10
Topt=-40°C
ESR (Ω)
ESR (Ω)
10
1
0.1
1
0.1
0.01
0.01
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
RP131x331x
RP131x501x
VIN=3.3V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
VIN=5.0V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 4.7μF
100
100
Topt=85°C
Topt=85°C
Topt=-40°C
10
ESR (Ω)
ESR (Ω)
10
1
0.1
Topt=-40°C
1
0.1
0.01
0.01
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
改 訂 履 歴
20
Topt=-40°C
0 100 200 300 400 500 600 700 800 900 1000
Output Current IOUT (mA)
POWER DISSIPATION
DFN1616-6B
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
I 0.2 mm × 15 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
2400 mW
Thermal Resistance (Tja)
Tja = 41°C/W
Thermal Characterization Parameter (ȥjt)
ȥjt = 11°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
4000
Power Dissipation (mW)
3500
3000
2500
2400
2000
1500
1000
500
0
㻜
㻞㻡
㻡㻜
㻣㻡 85
㻝㻜㻜
㻝㻞㻡
㻝㻡㻜
Ambient Temperature (rC)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
DFN1616-6B
PACKAGE DIMENSIONS
Ver. A
1.30r0.05
(3X0.15)
B
0.70r0.05
X4
1.60
0.05
4
6
0.25r0.05
1.60
A
INDEX
0.4max.
0.1r0.05
3
0.5
0.20r0.05
1
0.05 M AB
Bottom View
S
0.05 S
DFN1616-6B Package Dimensions (Unit: mm)
*
The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane pin on the board but it is possible to leave the tab floating.
i
POWER DISSIPATION
DFN(PLP)1820-6
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
I 0.2 mm × 34 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (Tja)
Thermal Characterization Parameter (ȥjt)
2200 mW
Tja = 45°C/W
ȥMW °C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation (mW)
3000
2700
2500
2700
27
700
00
2000
2200
1500
1000
500
0
㻜
㻞㻡
㻡㻜
㻣㻡 85 㻝㻜㻜
㻝㻞㻡
㻝㻡㻜
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
DFN(PLP)1820-6
Ver. A
1.6r0.1
A
1.80
0.20r0.1
B
5
4
6
2.00
1.0r0.1
ͤ
INDEX
0.6MAX.
3
0.05 S
0.05min
S
0.25r0.1 0.25r0.1
X4
0.05
0.05 M AB
0.5
2
1
0.1NOM.
0.3r0.1
Bottom View
DFN(PLP)1820-6 Package Dimensions (Unit: mm)
*
The tab on the bottom of the package is substrate level (GN'). It is recommended that the tab be connected to the
ground plane on the board, or otherwise be left floating.
i
627
PACKAGE DIMENSIONS
Ver. A
4.5±0.1
1.5±0.1
0.4±0.3
2
5
4.35±0.1
ȭ1.0
1
4
4
2.5±0.1
1.00±0.2
5
0.4±0.1
0.3±0.2
0.42±0.1
0.1 S
3
0.4±0.1
3
2
1
0.3±0.2
1.6±0.2
S
0.42±0.1
0.42±0.1
0.47±0.1
1.5±0.1
1.5±0.1
627 Package Dimensions
i
POWER DISSIPATION
SOT-89-5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
I 0.3 mm × 13 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (Tja)
Thermal Characterization Parameter (ȥjt)
2600 mW
Tja = 38°C/W
ȥjt = 13°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
4000
Power Dissipation (mW)
3500
3200
3000
2200
22
2
220
200
00
2500
2600
2000
1500
1000
500
0
㻜
㻞㻡
㻡㻜
㻣㻡 85 㻝㻜㻜
㻝㻞㻡
㻝㻡㻜
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
POWER DISSIPATION
HSOP-6J
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
I 0.3 mm × 28 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (Tja)
Thermal Characterization Parameter (ȥjt)
2700 mW
Tja = 37°C/W
ȥjt = 7°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
4000
3400
Power Dissipation (mW)
3500
3000
2500
2700
2000
1500
1000
500
0
㻜
㻞㻡
㻡㻜
㻣㻡 85 㻝㻜㻜
㻝㻞㻡
㻝㻡㻜
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
+623-
PACKAGE DIMENSIONS
Ver. A
+623- Package Dimensions
i
POWER DISSIPATION
T2--5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Board Dimensions
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
I 0.3 mm × 21 pcs
Copper Ratio
Through-holes
Measurement Result
Item
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Power Dissipation
Thermal Resistance (Tja)
3800 mW
Tja = 26°C/W
Thermal Characterization Parameter (ȥjt)
ȥjt = 7°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
4800
Power Dissipation (mW)
5000
4000
3800
3000
2000
1000
0
㻜
㻞㻡
㻡㻜
㻣㻡 85
㻝㻜㻜
㻝㻞㻡
㻝㻡㻜
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
723
Ver. A
723 Package Dimensions
The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended thatthis
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
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production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
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the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
Sales & Support Offices
Ricoh Electronic Devices Co., Ltd.
Shin-Yokohama Office (International Sales)
2-3, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa, 222-8530, Japan
Phone: +81-50-3814-7687 Fax: +81-45-474-0074
Ricoh Americas Holdings, Inc.
675 Campbell Technology Parkway, Suite 200 Campbell, CA 95008, U.S.A.
Phone: +1-408-610-3105
Ricoh Europe (Netherlands) B.V.
Semiconductor Support Centre
Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands
Phone: +31-20-5474-309
Ricoh International B.V. - German Branch
Semiconductor Sales and Support Centre
Oberrather Strasse 6, 40472 Düsseldorf, Germany
Phone: +49-211-6546-0
Ricoh Electronic Devices Korea Co., Ltd.
3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea
Phone: +82-2-2135-5700 Fax: +82-2-2051-5713
Ricoh Electronic Devices Shanghai Co., Ltd.
Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203,
People's Republic of China
Phone: +86-21-5027-3200 Fax: +86-21-5027-3299
Ricoh Electronic Devices Shanghai Co., Ltd.
Shenzhen Branch
1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District,
Shenzhen, China
Phone: +86-755-8348-7600 Ext 225
Ricoh Electronic Devices Co., Ltd.
Taipei office
Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan
Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623