RP504L331D-TR

RP504x Series 600 mA PWM/VFM Step-Down DC/DC Converter with Synchronous Rectifier NO.EA-259-170620 OUTLINE The RP504x is a low supply current CMOS-based PWM/VFM step-down DC/DC converter with synchronous rectifier featuring 600 mA*1 output current. Internally, a single converter consists of an oscillator, a reference voltage unit, an error amplifier, a switching control circuit, a mode control circuit (RP504xxx1A/D), a soft-start circuit, a Latch-type protection circuit, an under voltage lockout (UVLO) circuit a.nd switching transistors. The RP504x is employing synchronous rectification for improving the efficiency of rectification by replacing diodes with built-in switching transistors. Using synchronous rectification not only increases circuit performance but also allows a design to reduce parts count. Power controlling method can be selected from forced PWM control type or PWM/VFM auto switching control type by inputting a signal to the MODE pin. In low output current, forced PWM control switches at fixed frequency rate in order to reduce noise. Likewise, in low output current, PWM/VFM auto switching control automatically switches from PWM mode to VFM mode in order to achieve high efficiency. Output voltage is internally fixed type which allows output voltages that range from 0.8 V to 3.3 V in 0.1 V step. The output voltage accuracy is as high as ±1.5% or ±18 mV. Protection circuits included in the RP504x are overcurrent protection circuit and latch type protection circuit. Overcurrent protection circuit supervises the inductor peak current in each switching cycle, and if the current exceeds the LX current limit (ILXLIM), it turns off P-channel Tr. Latch type protection circuit latches the built-in driver to the OFF state and stops the operation of the step-down DC/DC converter if the overcurrent status continues or VOUT continues being the half of the setting voltage for equal or longer than protection delay time (tprot). To cancel the latch type protection circuit, select the standby mode or the active mode with the CE pin, or drop the power supply voltage below the UVLO detector threshold. The RP504x is offered in 6-pin DFN(PLP)1216-6F, 6-pin DFN1616-6B and 5-pin SOT-23-5 packages which achieve the smallest possible footprint solution on boards where area is limited. *1 This is an approximate value. The output current is dependent on conditions and external components. 1 RP504x NO.EA-259-170620 FEATURES • Supply Current ...................................................... Typ. 25 µA in VFM mode without any load • Standby Current .................................................... Max. 5 µA • Input Voltage Range ............................................. 2.3 V to 5.5 V (VOUT ≥ 1.0 V) • Output Voltage Range........................................... 0.8 V to 3.3 V in 0.1 V step • Output Voltage Accuracy....................................... ±1.5% (VOUT ≥ 1.2 V), ±18 mV (VOUT < 1.2 V) • Temperature-Drift Coefficient of Output Voltage ... Typ. ±40 ppm/°C • Oscillator Frequency ............................................. Typ. 2.25 MHz • Oscillator Maximum Duty Cycle ............................ Min. 100% • Built-in Driver ON Resistance ............................... Typ. Pch. 0.34 Ω, Nch. 0.43 Ω (VIN = 3.6 V) • UVLO Detector Threshold..................................... Typ. 2.0 V • Soft Start Time ...................................................... Typ. 0.15 ms • LX Current Limit ..................................................... Typ. 900 mA • Latch-type Protection Circuit ................................. Typ. 1.5 ms • Auto-discharge Function ....................................... Only for RP504xxxxD • Power Controlling Method ..................................... forced PWM control or PWM/VFM auto switching control • MODE Pin*1 ........................................................... “H”: forced PWM control, “L”: PWM/VFM auto switching control • Package .............................................................. DFN1616-6B, DFN(PLP)1216-6F, SOT-23-5 *1 *1 DFN(PLP)1216-6F, DFN1616-6B: forced PWM control by pulling MODE pin “H” or PWM/VFM auto switching control by pulling MODE pin “L” SOT-23-5: forced PWM control for RP504xxxxC and PWM/VFM auto switching control for RP504xxxxB APPLICATIONS • Power source for battery-powered equipment. • Power source for hand-held communication equipment, cameras, VCRs, camcorders. • Power source for HDD, portable equipment. 2 RP504x NO.EA-259-170620 SELECTION GUIDE The set output voltage, the package type, the MODE control pin function and the auto-discharge*1 function are user-selectable options. Product Name Package Quantity per Reel Pb Free Halogen Free RP504Kxx1$-E2 DFN(PLP)1216-6F 5,000 pcs Yes Yes RP504Lxx1$-TR DFN1616-6B 5,000 pcs Yes Yes RP504Nxx1$-TR-FE SOT-23-5 3,000 pcs Yes Yes xx: Specify the set output voltage (VSET) within the range of 0.8 V(08) to 3.3 V(33) in 0.1 V steps. Refer to the section of PACKAGE INFORMATION for detailed information. $: Specify the package type, the MODE control pin function and the auto-discharge function. $ A DFN1616-6B DFN(PLP)1216-6F MODE Control Pin Function Auto-discharge Function MODE Pin Power Controlling Method Yes “H”: forced PWM “L”: PWM/VFM auto switching control No B SOT-23-5 No PWM/VFM auto switching control No C SOT-23-5 No forced PWM control No Yes “H”: forced PWM control “L”: PWM/VFM auto switching control Yes D *1 Package DFN1616-6B DFN(PLP)1216-6F Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. *2 0.05 V step is also available as a custom code. 3 RP504x NO.EA-259-170620 BLOCK DIAGRAMS VIN CE CHIP ENABLE CURRENT RAMP COMPENSATION FEEDBACK OSCILLATOR VREF PWM SOFT START CURRENT PROTECTION Lx SWITCHING CONTROL UVLO VOUT MODE GND RP504xxxxA Block Diagram VIN CE CHIP ENABLE CURRENT FEEDBACK RAMP COMPENSATION OSCILLATOR VREF SOFT START PWM CURRENT PROTECTION SWITCHING CONTROL UVLO MODE GND RP504xxxxB Block Diagram 4 Lx VOUT RP504x NO.EA-259-170620 VIN CE CHIP ENABLE CURRENT FEEDBACK RAMP COMPENSATION OSCILLATOR VREF PWM SOFT START CURRENT PROTECTION Lx SWITCHING CONTROL UVLO VOUT MODE GND RP504xxxxC Block Diagram VIN CE CHIP ENABLE RAMP COMPENSATION CURRENT FEEDBACK OSCILLATOR VREF SOFT START PWM CURRENT PROTECTION LX SWITCHING CONTROL UVLO VOUT MODE GND RP504xxxxD Block Diagram 5 RP504x NO.EA-259-170620 PIN DESCRIPTION 6 5 4 6 5 4 5 4 ∗ 1 2 3 DFN(PLP)1216-6F Pin Configurations 1 2 3 DFN1616-6B Pin Configurations 1 2 3 SOT-23-5 Pin Configurations RP504Kxx1A, RP504Kxx1D: DFN(PLP)1216-6F Pin Description Pin No. Symbol Description 1 VIN Input Pin Mode Control Pin 2 MODE (“H”: forced PWM control, “L”: PWM/VFM auto switching control) 3 CE Chip Enable Pin (Active-high) 4 VOUT Output Pin 5 GND Ground Pin 6 LX LX Switching Pin RP504Lxx1A, RP504Lxx1D: DFN1616-6B Pin Description Pin No. Symbol Description 1 CE Chip Enable Pin (Active-high) Mode Control Pin 2 MODE (“H”: forced PWM control, “L”: PWM/VFM auto switching control) 3 VIN Input Pin 4 LX LX Switching Pin 5 GND Ground Pin 6 VOUT Output Pin ∗ The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board. If not, the tab can be left open. RP504Nxx1B, RP504Nxx1C: SOT-23-5 Pin Description Pin No. Symbol Description 1 VOUT Output Pin 2 GND Ground Pin 3 LX LX Switching Pin 4 VIN Input Pin 5 CE Chip Enable Pin (Active-high) 6 RP504x NO.EA-259-170620 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol Item *1 (GND = 0 V) Rating Unit −0.3 to 6.5 V −0.3 to VIN +0.3 V VIN VIN Input Voltage VLX LX Pin Voltage VCE CE Pin Input Voltage −0.3 to 6.5 V VMODE Mode Control Pin Voltage −0.3 to 6.5 V VOUT VOUT Pin Voltage −0.3 to 6.5 V 900 mA ILX LX Pin Output Current PD Power Dissipation (Standard Land Pattern)*1 DFN(PLP)1216-6F 385 DFN1616-6B 640 SOT-23-5 420 mW Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C Refer to POWER DISSIPATION for detailed information. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Item Rating VIN Operating Input Voltage Ta Operating Temperature Range Unit 2.3 to 5.5 (VOUT ≥ 1.0) V 2.3 to 4.5 (VOUT < 1.0) V −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 7 RP504x NO.EA-259-170620 ELECTRICAL CHARACTERISTICS RP504xxx1A, RP504xxx1D Electrical Characteristics Symbol Item Conditions Max. x0.985 x1.015 VOUT < 1.2 V −0.018 +0.018 VIN = VCE = 3.6 V or VSET +1 V Output Voltage Temperature Coefficient −40°C ≤ Ta ≤ 85°C fosc Oscillator Frequency VIN = VCE = 3.6 V or VSET +1 V IDD1 Supply Current 1 IDD2 Supply Current 2 VIN = VCE = VOUT = 5.5 V Istandby Standby Current VIN = 5.5 V, VCE = 0 V ICEH CE "H" Input Voltage VIN = VCE = 5.5 V ICEL CE "L" Input Voltage IMODEH IMODEL ∆VOUT/∆Ta Typ. VOUT ≥ 1.2 V Output Voltage VOUT (Ta = 25°C) Min. ±40 1.95 Unit V ppm/°C 2.25 2.55 MHz VIN = VCE = 5.5 V, VOUT = VSET × 0.8 400 800 µA VMODE = 0 V 25 40 VMODE = 5.5 V 400 800 0 5 µA −1 0 1 µA VIN = 5.5 V, VCE = 0 V −1 0 1 µA Mode "H" Input Current VIN = VMODE = 5.5 V −1 0 1 µA Mode "L" Input Current VIN = 5.5 V, VMODE = 0 V −1 0 1 µA µA IVOUTH VOUT "H" Input Current VIN = VOUT = 5.5 V, VCE = 0 V −1 0 1 µA IVOUTL VOUT "L" Input Current VIN = 5.5 V, VCE = VOUT = 0 V −1 0 1 µA ILXLEAKH LX Leakage Current "H" VIN = VLX = 5.5 V, VCE = 0 V −1 0 5 µA ILXLEAKL LX Leakage Current "L" VIN = 5.5 V, VCE = VLX = 0 V −5 0 1 µA VCEH CE "H" Input Voltage VIN = 5.5 V 1.0 VCEL CE "L" Input Voltage VIN = 2.3 V VMODEH Mode ”H” Input Voltage VIN = 5.5 V VMODEL Mode ”L” Input Voltage VIN = 2.3 V RLOW Nch On Resistance*2 VIN = 3.6 V, VCE = 0 V RONP On Resistance of Pch Tr. RONN On Resistance of Nch Tr. Maxduty *1 V 0.4 1.0 V V 0.4 V 30 Ω VIN = 3.6 V, ILX = −100 mA 0.34 Ω VIN = 3.6 V, ILX = −100 mA 0.43 Ω Oscillator Maximum Duty Cycle 100 % 150 310 µs tstart Soft-start Time VIN = VCE = 3.6 V or VSET +1 V ILXLIM Lx Current Limit VIN = VCE = 3.6 V or VSET +1 V 700 900 tprot Protection Delay Time VIN = VCE = 3.6 V or VSET +1 V 0.5 1.5 5 ms VUVLO1 UVLO Detector Threshold VIN = VCE 1.9 2.0 2.1 V VUVLO2 UVLO Released Voltage VIN = VCE 2.0 2.1 2.2 V mA All test items listed under ELECTRICAL CHARACTERISTICS are done under the pulse load condition (Tj ≈ Ta = 25°C) except Output Voltage Temperature Coefficient. Test circuit is "OPEN LOOP" and AGND = PGND = 0 V unless otherwise specified. *1 Only for RP504xxx1A/B/C with no auto-discharge *2 Only for RP504xxx1D with auto-discharge 8 RP504x NO.EA-259-170620 RP504xxxxB, RP504xxxxC Electrical Characteristics Symbol Item Conditions Typ. Max. x0.985 x1.015 VOUT < 1.2 V −0.018 +0.018 VIN = VCE = 3.6 V or VSET +1 V Output Voltage Temperature Coefficient −40°C ≤ Ta ≤ 85°C fosc Oscillator Frequency VIN = VCE = 3.6 V or VSET +1 V IDD1 Supply Current 1 VIN = VCE = 5.5 V, VOUT = VSET × 0.8 IDD2 Supply Current 2 VIN = VCE = VOUT = 5.5 V Istandby Standby Current VIN = 5.5 V, VCE = 0 V ICEH CE "H" Input Voltage VIN = VCE = 5.5 V ICEL CE "L" Input Voltage IVOUTH IVOUTL ∆VOUT/∆Ta Min. VOUT ≥ 1.2 V Output Voltage VOUT (Ta = 25°C) ±40 1.95 Unit V ppm/°C 2.25 2.55 MHz 400 800 µA RP504xxx1B 25 40 RP504xxx1C 400 800 0 5 µA −1 0 1 µA VIN = 5.5 V, VCE = 0 V −1 0 1 µA VOUT "H" Input Current VIN = VOUT = 5.5 V, VCE = 0 V −1 0 1 µA VOUT "L" Input Current VIN = 5.5 V, VCE = VOUT = 0 V −1 0 1 µA ILXLEAKH LX Leakage Current "H" VIN = VLX = 5.5 V, VCE = 0 V −1 0 5 µA ILXLEAKL LX Leakage Current "L" VIN = 5.5 V, VCE = VLX = 0 V −5 0 1 µA VCEH CE "H" Input Voltage VIN = 5.5 V 1.0 VCEL CE "L" Input Voltage VIN =2.3 V RONP On Resistance of Pch Tr. VIN =3.6 V, ILX = −100 mA 0.34 Ω RONN On Resistance of Nch Tr. VIN =3.6 V, ILX = −100 mA 0.43 Ω Maxduty Oscillator Maximum Duty Cycle µA V 0.4 100 V % 150 310 µs tstart Soft-start Time VIN = VCE = 3.6 V or VSET +1 V ILXLIM LX Current Limit VIN = VCE = 3.6 V or VSET +1 V 700 900 tprot Protection Delay Time VIN = VCE = 3.6 V or VSET +1 V 0.5 1.5 5 ms VUVLO1 UVLO Detector Threshold VIN = VCE 1.9 2.0 2.1 V VUVLO2 UVLO Released Voltage VIN = VCE 2.0 2.1 2.2 V mA All test items listed under ELECTRICAL CHARACTERISTICS are done under the pulse load condition (Tj ≈ Ta = 25°C) except Output Voltage Temperature Coefficient. Test circuit is "OPEN LOOP" and AGND = PGND = 0 V unless otherwise specified. 9 RP504x NO.EA-259-170620 OPERATING DESCRIPTIONS OPERATION OF STEP-DOWN CONVERTER AND OUTPUT CURENT The step-down DC/DC converter charges energy in the inductor when LX Tr. turns “ON”, and discharges the energy from the inductor when LX Tr. turns “OFF” and operates with less energy loss, so that a lower output voltage (VOUT) than the input voltage (VIN) can be obtained. The operation of the step-down DC/DC converter is explained in the following figures. IL ILmax i1 VIN Pch Tr Nch Tr VOUT L ILmin topen i1 i2 i2 CL GND ton toff T＝1/fosc Figure 1. Basic Circuit Figure 2. Inductor Current (IL) flowing through Inductor Step1. P-channel Tr. turns “ON” and IL (i1) flows, L is charged with energy. At this moment, i1 increases from the minimum inductor current (ILmin), which is 0 A, and reaches the maximum inductor current (ILmax) in proportion to the on-time period (ton) of P-channel Tr. Step2. When P-channel Tr. turns “OFF”, L tries to maintain IL at ILmax, so L turns N-channel Tr. “ON” and IL (i2) flows into L. Step3. i2 decreases gradually and reaches ILmin after the open-time period (topen) of N-channel Tr., and then N-channel Tr. turns “OFF”. This is called discontinuous current mode. As the output current (IOUT) increases, the off-time period (toff) of P-channel Tr. runs out before IL reaches ILmin. The next cycle starts, and P-channel Tr. turns “ON” and N-channel Tr. turns “OFF”, which means IL starts increasing from ILmin. This is called continuous current mode. In the case of PWM mode, VOUT is maintained by controlling ton. During the PWM mode, the oscillator frequency (fosc) is constantly maintained. As shown in Figure 2, when the step-down DC/DC operation is constant, ILmin and ILmax during ton of P-channel Tr. would be the same as ILmin and ILmax during toff of the P-channel Tr. The current differential between ILmax and ILmin is described as ∆I. ∆I = ILmax − ILMIN = VOUT × topen / L = (VIN − VOUT) × ton / L ....................................... Equation 1 However, T = 1 / fosc = ton + toff Duty (%) = ton / T × 100 = ton × fosc × 100 topen ≤ toff In Equation 1, “VOUT × topen / L” shows the amount of current change in “OFF” state. Also, “(VIN − VOUT) × ton / L” shows the amount of current change at “ON” state. 10 RP504x NO.EA-259-170620 DISCONTINUOUS MODE AND CONTINUOUS MODE As illustrated in Figure 3, when IOUT is relatively small, topen < toff. In this case, the energy charged into L during ton will be completely discharged during toff, as a result, ILMIN = 0. This is called discontinuous mode. When IOUT is gradually increased, eventually topen = toff and when IOUT is increased further, eventually ILMIN > 0. This is called continuous mode. IL ILMAX IL ILMAX ILMIN ILMIN topen t ton ICONST t toff ton T = 1 / fosc Figure 3. Discontinuous Mode toff T = 1 / fosc Figure 4. Continuous Mode In the continuous mode, the solution of Equation 1 is described as tonc. tonc = T × VOUT / VIN ............................................................................................................... Equation 2 When ton < tonc, it indicates discontinuous mode, and when ton = tonc, it indicates continuous mode. 11 RP504x NO.EA-259-170620 TIMING CHART 1. Soft-start Time Starting-up with CE Pin The IC starts to operate when the CE pin voltage (VCE) exceeds the threshold voltage. The threshold voltage is preset between CE “H” input voltage (VCEH) and CE “L” input voltage (VCEL). After the start-up of the IC, soft-start circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in the IC gradually increases up to the specified value. CE Pin Input Voltage (VCE) IC Internal Reference Voltage (VREF) Lx Voltage (VLX) VCEH Threshold Level VCEL Soft-start Time Soft-start Circuit operation starts. IC operates with PWM mode during Soft-start time. Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Soft-start time starts when soft-start circuit is activated, and ends when the reference voltage reaches the specified voltage. Soft start time is not always equal to the turn-on speed of the step-down DC/DC converter. Please note that the turn-on speed could be affected by the power supply capacity, the output current, the inductance value and the COUT value. Starting-up with Power Supply After the power-on, when VIN exceeds the UVLO released voltage (VUVLO2), the IC starts to operate. Then, softstart circuit starts to operate and after a certain period of time, VREF gradually increases up to the specified value. Soft-start time starts when soft-start circuit is activated, and ends when VREF reaches the specified voltage. VSET VUVLO2 Input Voltage (VIN) VUVLO1 Soft-start Time IC Internal Reference Voltage (VREF) Lx Voltage (VLX) IC operates with PWM mode during Soft-start time. VSET Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Please note that the turn-on speed of VOUT could be affected by the power supply capacity, the output current, the inductance value, the COUT value and the turn-on speed of VIN determined by CIN. 12 RP504x NO.EA-259-170620 2. Under Voltage Lockout (UVLO) Circuit If VIN becomes lower than VSET, the step-down DC/DC converter stops the switching operation and ON duty becomes 100%, and then VOUT gradually drops according to VIN. If the VIN becomes lower than the UVLO detector threshold (VUVLO1), the UVLO circuit starts to operate, VREF stops, and P-channel and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance value and the load. To restart the operation, VIN needs to be higher than VUVLO2. The timing chart below shows the voltage shifts of VREF, VLX and VOUT when VIN value is varied. Input Voltage (VIN) VSET VUVLO2 VUVLO1 Soft-start Time IC Internal Reference Voltage (VREF) Lx Voltage (VLX) Output Voltage (VOUT) VSET Depending on Power Supply, Load Current, External Components Falling edge (operating) and rising edge (releasing) waveforms of VOUT could be affected by the initial voltage of COUT and the output current of VOUT. 13 RP504x NO.EA-259-170620 3. Overcurrent Protection Circuit, Latch Type Protection Circuit Overcurrent protection circuit supervises the inductor peak current (the peak current flowing through Pch Tr.) in each switching cycle, and if the current exceeds the LX current limit (ILXLIM), it turns off Pch Tr. ILXLIM of the RP504x is set to Typ.900 mA. Latch type protection circuit latches the built-in driver to the OFF state and stops the operation of the step-down DC/DC converter if the overcurrent status continues or VOUT continues being the half of the setting voltage for equal or longer than protection delay time (tprot). Please note that ILXLIM and tprot could be easily affected by self-heating or ambient environment. If the VIN drops dramatically or becomes unstable due to short-circuit, protection operation and tprot could be affected. Protection Delay Time (tprot) Lx Current Lx Current Limit (ILXlim) Pch Tr. Current Lx Voltage (VLX) To release the latch type protection circuit, restart the IC by inputting "L" signal to the CE pin, or restart the IC with power-on or make the supply voltage lower than VUVLO1. The timing chart below shows the voltage shift of VCE, VLX and VOUT when the IC status is changed by the following orders: VIN rising → stable operation → high load → CE reset → stable operation → VIN falling → VIN recovering (UVLO reset) → stable operation. (1)(2) If the large current flows through the circuit or if the IC goes into low VOUT condition due to short-circuit or other reasons, the latch type protection circuit latches the built-in driver to “OFF” state after tprot. Then, VLX becomes "L" and VOUT turns “OFF”. (3) The latch type protection circuit is released by CE reset, which puts the IC into "L" once with the CE pin and back into "H". (4) The latch type protection circuit is released by UVLO reset, which makes VIN lower than VUVLO1. (1) (3) (2) (4) SET Input Voltage UVLO Released VoltageV(V UVLO2) (VIN) UVLO Detector Threshold (VUVLO1) CE Pin Input Voltage (VCE) Lx Voltage (VLX) Output Voltage (VOUT) UVLO Reset VSET CE Reset Threshold Level Protection Delay Time VSET VSET Latch-type Protection Stable Operation Soft-start Time 14 Protection Delay Time Stable Operation Soft-start Time Latch-type Protection Stable Operation Soft-start Time RP504x NO.EA-259-170620 APPLICATION INFORMATION TYPICAL APPLICATION CIRCUIT Control VOUT CE RP504N GND Load VIN VIN LX COUT 4.7µF L 2.2µH CIN 2.2µF RP504N Typical Application Circuit: MODE Pin not included Control VOUT CE RP504L/K Control MODE *1 GND Load VIN VIN LX L 2.2µH CIN 2.2µF COUT 4.7µF RP504K/L Typical Application Circuit: MODE Pin included *1 MODE = “H”: forced PWM control, MODE = “L”: PWM/VFM auto switching control Recommended Components Symbol Capacitance Type 2.2 µF CIN 2.2 µF x 2 Manufacturer C1608JB0J225K(TDK) Ceramic Capacitor 4.7 µF COUT 4.7 µF Ceramic Capacitor L 2.2 µH Inductor C1005JB0J225K (TDK) JMK105BJ225MV (Taiyo Yuden) C1005X5R0J475M (TDK) JMK105BJ475MV (Taiyo Yuden) C1608JB0J475K (TDK) GRM188B30J475KE18 (Murata) MIPSZ2520D2R2 (FDK) MIPS2520D2R2 (FDK) MLP2520S2R2M (TDK) VLS252010T-2R2M (TDK) 15 RP504x NO.EA-259-170620 OUTPUT CURRENT AND SELECTION OF EXTERNAL COMPONENTS The following equations explain the relationship between output current and peripheral components used in the diagrams in TYPICAL APPLICATIONS. Ripple Current P-P value is described as IRP, ON resistance of P-channel Tr. is described as RONP, ON resistance of N-channel Tr. is described as RONN, and DC resistor of the inductor is described as RL. VIN = VOUT + (RONP + RL) × IOUT + L × IRP / ton .............................................................. Equation 3 Second, when P-channel Tr. is “OFF” (N-channel Tr. Is “ON”), the following equation is satisfied. L × IRP / toff = RONN × IOUT + VOUT + RL × IOUT ............................................................... Equation 4 Put Equation 4 into Equation 3 to solve ON duty of P-channel Tr. (DON = ton / (toff + ton)): DON = (VOUT + RONN × IOUT + RL × IOUT) / (VIN + RONN × IOUT − RONP × IOUT) ................... Equation 5 Ripple Current is described as follows: IRP = (VIN − VOUT − RONP × IOUT − RL × IOUT) × DON / fosc / L ......................................... Equation 6 Peak current that flows through L, and LX Tr. is described as follows: ILXMAX = IOUT + IRP / 2 .................................................................................................... Equation 7 Consider ILXMAX when setting conditions of input and output, as well as selecting the external components. The above calculation formulas are based on the ideal operation of the ICS in continuous mode. 16 RP504x NO.EA-259-170620 TECHNICAL NOTES The performance of power supply circuits using this IC largely depends on the peripheral circuits. Please be very careful when setting the peripheral parts. When designing the peripheral circuits of each part, PCB patterns, and this IC, please do not exceed the rated values (Voltage, Current, Power). • Ensure the VIN and GND lines are sufficiently robust. A large switching current flows through the GND lines, the VDD line, the VOUT line, an inductor, and LX. If their impedance is too high, noise pickup or unstable operation may result. Set the external components as close as possible to the IC and minimize the wiring between the components and the IC, especially between a capacitor (CIN) and the VIN pin. The wiring between • • VOUT and load and between L and VOUT should be separated. Choose a low ESR ceramic capacitor. The capacitance of CIN should be more than or equal to 2.2 µF. The capacitance of a capacitor (COUT) should be between 4.7 µF to 10 µF. The Inductance value should be set within the range of 2.2 µH to 4.7 µH. However, the inductance value is limited by output voltage. Refer to the table below. The phase compensation of this IC is designed according to the COUT and L values. Choose an inductor that has small DC resistance, has enough allowable current and is hard to cause magnetic saturation. If the inductance value of an inductor is extremely small, the peak current of LX may increase. The increased LX peak current reaches “LX limit current” to trigger overcurrent • protection circuit even if the load current is less than 600 mA. Overcurrent protection circuit, Latch-type protection circuit may be affected by self-heating and heat radiation environment. PCB LAYOUT RP504Nxx1B/C (PKG: SOT-23-5) typical board layout Topside Backside 17 RP504x NO.EA-259-170620 RP504Lxx1A/D (PKG: DFN1616-6B) typical board layout Topside Backside RP505Kxx1A/D (PKG: DFN(PLP)1216-6F) typical board layout Topside 18 Backside RP504x NO.EA-259-170620 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current RP504x VOUT = 0.8 V RP504x MODE = “L”PWM/VFM Auto Switching Control MODE = “H” Forced PWM Control 0.820 0.815 VIN=3.6V 0.810 VIN=4.5V 0.805 0.800 0.795 0.790 0.785 Output Voltage V OUT (V) Output Voltage V OUT (V) 0.820 0.780 0.01 0.815 VIN=3.6V 0.810 VIN=4.5V 0.805 0.800 0.795 0.790 0.785 0.780 0.1 1 10 100 0 100 Output Current IOUT (mA) RP504x VOUT = 1.2 V 1.210 VIN=5.0V 1.205 1.200 1.195 1.190 1.185 Output Voltage V OUT (V) Output Voltage V OUT (V) 1.215 1.180 1.215 VIN=3.6V 1.210 VIN=5.0V 1.205 1.200 1.195 1.190 1.185 1.180 0.1 1 10 Output Current IOUT (mA) RP504x 100 0 VOUT = 1.8 V 100 200 300 400 500 Output Current IOUT (mA) RP504x MODE = “L”PWM/VFM Auto Switching Control 600 VOUT = 1.8 V MODE = “H” Forced PWM Control 1.830 VIN=3.6V VIN=5.0V 1.810 1.800 1.790 Output Voltage V OUT (V) 1.830 Output Voltage V OUT (V) VOUT = 1.2 V 1.220 VIN=3.6V VIN=3.6V 1.820 VIN=5.0V 1.810 1.800 1.790 1.780 1.780 0.01 600 MODE = “H” Forced PWM Control 1.220 1.820 200 300 400 500 Output Current IOUT (mA) RP504x MODE = “L”PWM/VFM Auto Switching Control 0.01 VOUT = 0.8 V 0.1 1 10 Output Current IOUT (mA) 100 0 100 200 300 400 500 600 Output Current IOUT (mA) 19 RP504x NO.EA-259-170620 RP504x VOUT = 3.3 V MODE = “L”PWM/VFM Auto Switching Control RP504x VOUT = 3.3 V MODE = “H” Forced PWM Control 3.320 VIN=4.3V 3.310 VIN=5.0V 3.300 3.290 3.280 VIN=4.3V Output Voltage V OUT (V) Output Voltage V OUT (V) 3.320 3.310 VIN=5.0V 3.300 3.290 3.280 3.270 3.270 0.01 0.1 1 10 Output Current IOUT (mA) 0 100 100 200 300 400 500 600 Output Current IOUT (mA) 2) Output Voltage vs. Input Voltage RP504x VOUT = 1.2 V MODE = “H” Forced PWM Control 0.820 1.220 0.815 1.215 Output Voltage V OUT (V) Output Voltage V OUT (V) RP504x VOUT = 0.8 V MODE = “H” Forced PWM Control 0.810 0.805 0.800 IOUT=1mA 0.795 IOUT=50mA 0.790 IOUT=250mA 0.785 0.780 1.210 1.205 1.200 1.195 1.190 2.5 3 3.5 4 Input Voltage VIN(V) 4.5 2 RP504x VOUT = 1.8 V MODE = “H” Forced PWM Control Output Voltage V OUT (V) Output Voltage V OUT (V) 1.82 1.81 1.8 IOUT=1mA 1.79 IOUT=50mA IOUT=250mA 1.78 1.77 2.5 3 3.5 4 4.5 Input Voltage VIN(V) 5 5.5 2.5 3 3.5 4 4.5 Input Voltage VIN(V) 5 5.5 RP504x VOUT = 3.3 V MODE = “H” Forced PWM Control 1.83 20 IOUT=250mA 1.185 1.180 2 2 IOUT=1mA IOUT=50mA 3.35 3.34 3.33 3.32 3.31 3.3 3.29 3.28 3.27 3.26 3.25 IOUT=1mA IOUT=50mA IOUT=250mA 3.5 4 4.5 Input Voltage VIN(V) 5 5.5 RP504x NO.EA-259-170620 3) Output Voltage vs. Temperature Output Voltage V OUT (V) 1.830 1.820 VIN=3.6V 1.810 1.800 1.790 1.780 1.770 -50 -25 0 25 50 75 Temperature Ta(°C) 100 4) Efficiency vs. Output Current RP504x VOUT = 0.8 V 100 Efficiency (%) 80 100 VIN=4.5V, VMODE=0V 90 VIN=3.6V, VMODE=0V 70 60 50 VIN=VMODE=4.5V 40 30 VIN=VMODE=3.6V 20 VIN=3.6V, VMODE=0V 70 60 50 40 VIN=VMODE=5.0V 30 VIN=VMODE=3.6V 10 0.1 1 10 100 Output Current IOUT (mA) 0 0.01 1000 VOUT = 1.8 V VIN=5.0V, VMODE=0V 100 VIN=3.6V, VMODE=0V 90 80 70 60 50 40 VIN=VMODE=5.0V 30 20 VIN=VMODE=3.6V 10 0 0.01 0.1 1 10 100 1000 Output Current IOUT (mA) 0.1 1 10 100 Output Current IOUT (mA) RP504x Efficiency (%) RP504x Efficiency (%) VIN=5.0V, VMODE=0V 20 10 0 0.01 VOUT = 1.2 V 80 Efficiency (%) 90 RP504x 1000 VOUT = 3.3 V VIN=5.0V, VMODE=0V 100 VIN=4.3V, VMODE=0V 90 80 70 60 50 VIN=VMODE=4.3V 40 30 20 VIN=VMODE=3.6V 10 0 0.01 0.1 1 10 100 1000 Output Current IOUT (mA) 21 RP504x NO.EA-259-170620 5) Supply Current vs. Temperature 6) Supply Current vs. Input Voltage RP504x VOUT = 1.8 V (VIN = 5.5 V) MODE = “L”PWM/VFM Auto Switching Control RP504x VOUT = 1.8 V MODE = “L”PWM/VFM Auto Switching Control 40 Closed Loop 35 Supply Current (µA) Supply Current (µA) 40 Open Loop 30 25 20 15 10 35 Closed Loop 30 Open Loop 25 20 15 10 -50 -25 0 25 50 Temperature Ta(°C) 75 100 2 2.5 3 3.5 4 4.5 Input Voltage VIN (V) 5 5.5 7) Output Voltage Waveform RP504x VOUT = 0.8 V (VIN = 3.6 V) MODE = “L”PWM/VFM Auto Switching Control RP504x VOUT = 0.8 V (VIN = 3.6 V) MODE = “H” Forced PWM Control 0 5 10 Time t (µs) 15 20 Output Voltage IL 100 50 0 -50 -100 0 RP504x VOUT = 1.2V (VIN = 3.6 V) MODE = “L”PWM/VFM Auto Switching Control 0 22 5 10 Time t (µs) 15 20 0.04 0.03 0.02 0.01 0.00 -0.01 Output Ripple Voltage (AC) Vripple (V) 300 200 100 0 -100 2 3 4 5 6 7 Time t (µs) 8 9 10 IOUT=10mA Inductor Current IL (mA) Output Ripple Voltage (AC) Vripple (V) Output Voltage IL 1 RP504x VOUT = 1.2 V (VIN = 3.6 V) MODE = “H” Forced PWM Control IOUT=10mA 0.04 0.03 0.02 0.01 0.00 -0.01 Inductor Current IL (mA) 300 200 100 0 -100 0.04 0.03 0.02 0.01 0.00 -0.01 Output Voltage Inductor Current IL (mA) IL Output Ripple Voltage (AC) Vripple (V) Output Voltage IOUT=10mA Inductor Current IL (mA) Output Ripple Voltage (AC) Vripple (V) IOUT=10mA 0.04 0.03 0.02 0.01 0.00 -0.01 IL 100 50 0 -50 -100 0 1 2 3 4 5 6 7 Time t (µs) 8 9 10 RP504x NO.EA-259-170620 VOUT = 1.8 V (VIN = 3.6 V) RP504x MODE = “L”PWM/VFM Auto Switching Control MODE = “H” Forced PWM Control IL 300 200 100 0 -100 0 5 RP504x 10 Time t (µs) 15 IOUT=10mA 0.04 0.03 0.02 0.01 0.00 -0.01 Output Voltage IL 100 50 0 -50 -100 0 20 VOUT = 3.3 V (VIN = 5.0 V) 1 2 3 4 5 6 7 Time t (µs) RP504x MODE = “L”PWM/VFM Auto Switching Control 8 9 10 VOUT = 3.3 V (VIN = 5.0 V) MODE = “H” Forced PWM Control IL 300 200 100 0 -100 0 5 10 Time t (µs) 15 IOUT=10mA Output Ripple Voltage (AC) Vripple (V) Output Ripple Voltage (AC) Vripple (V) Output Voltage Inductor Current IL (mA) IOUT=10mA 0.04 0.03 0.02 0.01 0.00 -0.01 0.04 0.03 0.02 0.01 0.00 -0.01 Output Voltage IL 200 150 100 50 0 -50 -100 0 20 8) Frequency vs. Temperature Inductor Current IL (mA) Inductor Current IL (mA) Output Ripple Voltage (AC) Vripple (V) Output Voltage Output Ripple Voltage (AC) Vripple (V) IOUT=10mA 0.04 0.03 0.02 0.01 0.00 -0.01 VOUT = 1.8 V (VIN = 3.6 V) 1 2 3 4 5 6 7 Time t (µs) 8 Inductor Current IL (mA) RP504x 9 10 9) Frequency vs. Input Voltage 2.5 2.5 Frequency fosc (MHz) Frequency fosc (MHz) -40°C VIN=3.6V 2.4 2.3 2.2 2.1 2 2.4 25°C 85°C 2.3 2.2 2.1 2 -50 -25 0 25 50 Temperature Ta (°C) 75 100 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage VIN (V) 23 RP504x NO.EA-259-170620 10) Soft Start Time vs. Temperature Soft Start Time tstart (µs) 220 210 200 190 180 170 -50 -25 0 25 50 75 Temperature Ta(°C) 100 11) UVLO Detector Threshold / Released Voltage vs. Temperature UVLO Detector Threshold Voltage UVLO Released Voltage 2.3 UVLO Voltage V UVLO2 (V) UVLO Voltage V UVLO1 (V) 2.3 2.2 2.1 2.0 2.2 2.1 2.0 1.9 1.9 -50 -25 0 25 50 Temperature Ta(°C) 75 -50 100 -25 0 25 50 75 Temperature Ta(°C) 100 12) CE Input Voltage vs. Temperature CE “H” Input Voltage (VIN = 5.5 V) CE “H” Input Voltage (VIN = 2.3 V) (V) 1 CE 0.9 CE Input Voltage V CE Input Voltage V CE (V) 1 0.8 0.7 0.6 0.5 0.8 0.7 0.6 0.5 0.4 0.4 -50 24 0.9 -25 0 25 50 Temperature Ta(°C) 75 100 -50 -25 0 25 50 Temperature Ta(°C) 75 100 RP504x NO.EA-259-170620 13) LX Current Limit vs. Temperature LX Current Limit llim (mA) 1000 950 900 850 800 -50 -25 0 25 50 75 Temperature Ta(°C) 100 0.60 ON(Ω) 0.60 15) Pch Tr. ON Resistance vs. Temperature 0.50 0.50 Pch Tr.ONResistance R Nch Tr.ONResistance R ON(Ω) 14) Nch Tr. ON Resistance vs. Temperature 0.40 0.30 0.20 0.10 0 -50 -25 0 25 50 75 Temperature Ta(°C) 0.40 0.30 0.20 0.10 0 100 -50 -25 0 25 50 75 Temperature Ta(°C) 100 16) Load Transient Response RP504x081x (VIN = 3.6 V) RP504x081x (VIN = 3.6 V) 0.90 0.80 0.70 Output Voltage 0.60 200 200 0 0 Output Current 300mA-->1mA 1.00 0.90 0.80 Output Voltage 0.70 Output Current IOUT (mA) 1.00 400 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “L”PWM/VFM Auto Switching Control 400 Output Current IOUT (mA) Output Voltage VOUT (V) MODE = “L”PWM/VFM Auto Switching Control 0.60 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) -100 0 100 200 300 400 500 600 700 800 900 Time t (µs) 25 RP504x NO.EA-259-170620 RP504x081x (VIN = 3.6 V) RP504x081x (VIN = 3.6 V) 400 200 200 0 1.00 0.90 0.80 1.00 0.90 0.80 Output Voltage 0.70 0.60 0.60 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) 600 400 400 200 0 1.00 0.90 0.80 Output Voltage 0.70 Output Voltage VOUT (V) Output Current 200mA-->500mA 600 200 Output Current 500mA-->200mA 1.00 0.90 0.80 Output Voltage 0.70 0.60 0.60 -10 0 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) RP504x121x (VIN = 3.6 V) 1.20 1.15 Output Voltage 1.10 200 200 0 0 Output Current 300mA-->1mA 1.30 1.25 1.20 Output Voltage 1.15 1.10 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) 26 400 Output Voltage VOUT (V) 1.25 MODE = “L”PWM/VFM Auto Switching Control 400 Output Current IOUT (mA) Output Voltage VOUT (V) 1.30 10 20 30 40 50 60 70 80 90 Time t (µs) RP504x121x (VIN = 3.6 V) MODE = “L”PWM/VFM Auto Switching Control Output Current 1mA-->300mA 0 Output Current IOUT (mA) RP504x081x (VIN = 3.6 V) Output Current IOUT (mA) Output Voltage VOUT (V) RP504x081x (VIN = 3.6 V) -100 0 100 200 300 400 500 600 700 800 900 Time t (µs) Output Current IOUT (mA) 0.70 Output Voltage 0 Output Current 300mA-->1mA Output Current IOUT (mA) 400 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “H” Forced PWM Control Output Current IOUT (mA) Output Voltage VOUT (V) MODE = “H” Forced PWM Control RP504x NO.EA-259-170620 RP504x121x (VIN = 3.6 V) RP504x121x (VIN = 3.6 V) 400 200 200 0 1.30 1.25 1.20 Output Voltage 1.15 Output Current 300mA-->1mA 1.30 1.25 1.20 Output Voltage 1.15 1.10 1.10 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) 600 400 400 200 0 1.30 1.25 1.20 200 Output Current 500mA-->200mA 1.30 1.25 1.20 Output Voltage 1.15 1.10 1.10 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) RP504x181x (VIN = 3.6 V) RP504x181x (VIN = 3.6 V) MODE = “L”PWM/VFM Auto Switching Control 1.90 1.85 1.80 Output Voltage 1.70 400 200 200 0 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “L”PWM/VFM Auto Switching Control 400 Output Current IOUT (mA) Output Voltage VOUT (V) 0 0 Output Current 300mA-->1mA 1.90 1.85 1.80 1.75 Output Current IOUT (mA) 1.15 Output Voltage Output Voltage VOUT (V) Output Current 200mA-->500mA 600 Output Current IOUT (mA) RP504x121x (VIN = 3.6 V) Output Current IOUT (mA) Output Voltage VOUT (V) RP504x121x (VIN = 3.6 V) 1.75 0 Output Current IOUT (mA) 400 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “H” Forced PWM Control Output Current IOUT (mA) Output Voltage VOUT (V) MODE = “H” Forced PWM Control Output Voltage 1.70 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) -100 0 100 200 300 400 500 600 700 800 900 Time t (µs) 27 RP504x NO.EA-259-170620 RP504x181x (VIN = 3.6 V) RP504x181x (VIN = 3.6 V) 400 200 200 0 1.90 1.85 1.80 Output Voltage 1.75 1.70 0 Output Current 300mA-->1mA 1.90 1.85 1.80 Output Voltage 1.75 1.70 1.65 1.65 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) RP504x181x (VIN = 3.6 V) RP504x181x (VIN = 3.6 V) 600 1.85 1.80 1.75 Output Voltage 1.70 200 1.90 1.80 Output Voltage 1.75 1.70 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) RP504x331x (VIN = 5.0 V) MODE = “L”PWM/VFM Auto Switching Control 3.50 3.40 3.30 Output Voltage 3.10 400 200 200 0 Output Voltage VOUT (V) Output Current 1mA-->300mA RP504x331x (VIN = 5.0 V) MODE = “L”PWM/VFM Auto Switching Control 400 Output Current IOUT (mA) Output Voltage VOUT (V) 0 1.85 1.65 1.65 0 Output Current 300mA-->1mA 3.50 3.40 3.30 Output Voltage 3.20 3.10 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) 28 400 -100 0 100 200 300 400 500 600 700 800 900 Time t (µs) Output Current IOUT (mA) 0 1.90 Output Current 500mA-->200mA Output Current IOUT (mA) 200 Output Voltage VOUT (V) 400 Output Current 200mA-->500mA Output Current IOUT (mA) Output Voltage VOUT (V) 600 3.20 Output Current IOUT (mA) 400 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “H” Forced PWM Control Output Current IOUT (mA) Output Voltage VOUT (V) MODE = “H” Forced PWM Control RP504x NO.EA-259-170620 RP504x331x (VIN = 5.0 V) RP504x331x (VIN = 5.0 V) 400 200 200 0 3.50 3.40 3.30 Output Voltage 3.20 3.10 3.50 3.40 3.30 Output Voltage 3.20 3.10 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) RP504x331x (VIN = 5.0 V) 400 400 200 0 3.50 3.40 3.30 Output Voltage 3.20 3.10 Output Voltage VOUT (V) 600 Output Current IOUT (mA) Output Current 200mA-->500mA 600 200 Output Current 500mA-->200mA 0 3.50 3.40 3.30 Output Voltage 3.20 Output Current IOUT (mA) RP504x331x (VIN = 5.0 V) Output Voltage VOUT (V) 0 Output Current 300mA-->1mA Output Current IOUT (mA) 400 Output Voltage VOUT (V) Output Current 1mA-->300mA MODE = “H” Forced PWM Control Output Current IOUT (mA) Output Voltage VOUT (V) MODE = “H” Forced PWM Control 3.10 -10 0 10 20 30 40 50 60 70 80 90 -10 0 10 20 30 40 50 60 70 80 90 Time t (µs) Time t (µs) 17) Mode Switching Waveform RP504x (VOUT = 1.2 V, IOUT = 1 mA) RP504x (VOUT = 1.2 V, IOUT = 1 mA) MODE = “L” --> MODE = “H” MODE = “H" --> MODE = “L” 1.30 1.25 1.20 1.15 -100 Output Voltage 0 100 200 Time t (µs) 300 400 0 Mode Input Voltage 1.30 1.25 1.20 Output Voltage 1.15 -200 0 200 400 600 Mode Input Voltage VMODE (V) 0 Output Voltage VOUT (V) Mode Input Voltage 5 Mode Input Voltage VMODE (V) Output Voltage VOUT (V) 5 800 Time t (µs) 29 RP504x NO.EA-259-170620 RP504x (VOUT = 1.8 V, IOUT = 1 mA) RP504x (VOUT = 1.8 V, IOUT = 1 mA) MODE = "L" --> MODE = "H" MODE = "H" --> MODE = "L" 1.85 1.80 Output Voltage 0 100 200 Time t (µs) 300 400 0 Mode Input Voltage 1.90 1.85 1.80 Output Voltage 1.75 -200 0 200 400 Time t (µs) 600 800 Mode Input Voltage VMODE (V) 1.90 1.75 -100 30 0 Output Voltage VOUT (V) Mode Input Voltage 5 Mode Input Voltage VMODE (V) Output Voltage VOUT (V) 5 POWER DISSIPATION DFN(PLP)1216-6F Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm × 40 mm × 1.6 mm Top Side: Approx. 50% Copper Ratio Bottom Side: Approx. 50% φ 0.3 mm × 26 pcs Through-holes Measurement Result (Ta = 25°C, Tjmax = 125°C) Standard Test Land Pattern Power Dissipation 385 mW θja = (125 − 25°C) / 0.385 W = 260°C/W Thermal Resistance θjc = 30°C/W 40 600 500 Standard Test Land Pattern 385 400 300 40 Power Dissipation PD (mW) 700 200 100 0 0 25 50 75 85 100 125 Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature IC Mount Area (mm) Measurement Board Pattern i PACKAGE DIMENSIONS DFN(PLP)1216-6F Ver. A DFN(PLP)1216-6F Package Dimensions (Unit: mm) i POWER DISSIPATION DFN1616-6B Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm × 40 mm × 1.6 mm Top Side: Approx. 50% Copper Ratio Bottom Side: Approx. 50% φ 0.5 mm × 32 pcs Through-holes Measurement Result (Ta = 25°C, Tjmax = 125°C) Standard Test Land Pattern Power Dissipation 640 mW θja = (125 − 25°C) / 0.64 W = 156°C/W θjc = 23 °C/W 40 700 640 600 Standard Test Land Pattern 500 400 40 Power Dissipation PD (mW) Thermal Resistance 300 200 100 Measurement Board Pattern 0 0 25 50 75 85 100 125 150 Ambient Temperature (°C) IC Mount Area (mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS DFN1616-6B Ver. A 1.30±0.05 (3X0.15) B 0.70±0.05 X4 1.60 0.05 4 6 ∗ 0.25±0.05 1.60 A INDEX 0.4max. 0.1±0.05 3 0.5 0.20±0.05 1 0.05 M AB Bottom View S 0.05 S DFN1616-6B Package Dimensions (Unit: mm) * ∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane pin on the board but it is possible to leave the tab floating. i POWER DISSIPATION SOT-23-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Double-Sided Board) Board Dimensions 40 mm x 40 mm x 1.6 mm Copper Ratio Top Side: Approx.50% Bottom Side: Approx. 50% Through-holes φ 0.5 mm x 44 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Standard Test Land Pattern Free Air Power Dissipation 420 mW 250 mW Thermal Resistance θja = (125 − 25°C) / 0.42 W = 238°C/W 400°C/W 40 500 Standard Test Land Pattern 420 400 300 Free Air 250 40 Power Dissipation (mW) 600 200 100 0 0 25 50 75 85 100 125 150 Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature IC Mount Area (mm) Measurement Board Pattern i SOT-23-5 PACKAGE DIMENSIONS Ver. A 2.9±0.2 1.1±0.1 1.9±0.2 0.8±0.1 (0.95) 4 1 2 0～0.1 0.2min. +0.2 1.6-0.1 5 2.8±0.3 (0.95) 3 0.4±0.1 +0.1 0.15-0.05 SOT-23-5 Package Dimensions i 1. 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