RP509x Series
0.5A/1A PWM/VFM Step-down DC/DC Converter with Synchronous Rectifier
No. EA-362-180919
OUTLINE
The RP509x is a low supply current PWM/VFM step-down DC/DC converter with synchronous rectifier
featuring 0.5 A/1 A output current(1). Internally, a single converter consists of a reference voltage unit, an error
amplifier, a switching control circuit, a mode control circuit, a soft-start circuit, an undervoltage lockout (UVLO)
circuit, a thermal shutdown circuit, and switching transistors. The RP509x is employing synchronous
rectification for improving the efficiency of rectification by replacing diodes with built-in switching transistors.
Using synchronous rectification not only increases circuit performance but also allows a design to reduce parts
count. Output voltage controlling method is selectable between a PWM/VFM auto-switching control type and
a forced PWM control type, which further reduces noise than a normal PWM control under a light load, and
these types can be set by the MODE pin. Output voltage type is selectable between an internally fixed output
voltage type and an externally adjustable output voltage type. Protection circuits in the RP509x is current limit
circuit and thermal shutdown circuit. LX current limit value (Typ.) is selectable between 1.6 A and 1.0 A.
The RP509Z is available in WLCSP-6-P6 which achieves high-density mounting on boards. Using capacitor
of 0402-/1005-size (inch/mm) and inductor of 0603-/1608-size (inch/mm) as external parts help to save space
for devices. The RP509N is available in SOT-23-6.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
Input Voltage Range (Maximum Rating) ···························· 2.3 V to 5.5 V (6.5 V)
Output Voltage Range (Fixed Output Voltage Type) ············· 0.6 V to 3.3 V, settable in 0.1 V steps
(Adjustable Output Voltage Type) ······· 0.6 V to 5.5 V
Output Voltage Accuracy (Fixed Output Voltage Type) ·········· ±1.5% (VSET( 2) ≥ 1.2 V), ±18 mV (VSET < 1.2 V)
Feedback Voltage Accuracy (Adjustable Output Voltage Type) ···· ±9 mV (VFB = 0.6 V)
Output Voltage/Feedback Voltage Temperature Coefficient ···· ±100 ppm/°C
Selectable Oscillator Frequency ······································ Typ. 6.0 MHz
Oscillator Maximum Duty ··············································· Min. 100%
Built-in Driver ON Resistance (VIN = 3.6 V) ························· Typ. Pch. 0.175 Ω, Nch. 0.155 Ω (RP509Z)
Typ. Pch. 0.195 Ω, Nch. 0.175 Ω (RP509N)
Standby Current ··························································· Typ. 0 µA
UVLO Detector Threshold ·············································· Typ. 2.0 V
Soft-start Time ····························································· Typ. 0.15 ms
Inductor Current Limit Circuit··········································· Typ. 1.6 A/1.0 A, selectable Current Limit
Package ····························································· WLCSP-6-P6 ( 1.28 mm x 0.88 mm x 0.64 mm )
SOT-23-6 ( 2.9 mm x 2.8 mm x 1.1 mm )
(1)
(2)
This is an approximate value. The output current is dependent on conditions and external components.
VSET = Set Output Voltage
1
RP509x
No. EA-362-180919
APPLICATIONS
Portable Communication Equipment: Mobiles/Smartphones, Digital Cameras and Note-PCs
Li-ion Battery-used Equipment
SELECTION GUIDE
The set output voltage, the output voltage type, the auto-discharge function(1), and the LX current limit for the
ICs are user-selectable options.
Selection Guide
Product Name
RP509ZxxX$-E2-F
RP509NxxX$-TR-FE
Package
Quantity per Reel
Pb Free
Halogen Free
WLCSP-6-P6
5,000 pcs
Yes
Yes
SOT-23-6
3,000 pcs
Yes
Yes
xx: Specify the set output voltage (VSET)
Fixed Output Voltage Type: 06 to 33 (0.6 V to 3.3 V, 0.1 V steps)
The voltage in 0.05 V step is shown as follows.
1.05 V: RP509Z101B5
1.15 V: RP509N111x5
Adjustable Output Voltage Type: 00 only
X: Specify the LX Current Limit (ILXLIM)
Typ. 1.6 A: 1
Typ. 1.0 A: 2
$: Specify the version
Version Output Voltage Type
A
Fixed
B
C
Adjustable
D
(1)
2
Auto-discharge
No
Yes
No
Yes
Oscillator Frequency
VSET
0.6 V to 3.3 V
6.0 MHz
0.6 V to 5.5 V
Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active
mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor.
RP509x
No. EA-362-180919
BLOCK DIAGRAM
RP509ZxxXA/RP509ZxxXB, RP509NxxXA/RP509NxxXB (Fixed Output Voltage Type)
UVLO
MODE
Thermal
Protection
Hi Side
Current
Detector
Mode
Control
Slope
Generator
Vref
Soft
Start
VOUT
Amp.
On Time
Control
Switching
Control
LX
Comp.
Low Side
Current
Detector
CE
VIN
GND
Enable
Control
RP509xxxXA Block Diagram
UVLO
MODE
Thermal
Protection
Hi Side
Current
Detector
Mode
Control
Slope
Generator
Vref
VOUT
Soft
Start
Amp.
On Time
Control
Switching
Control
LX
Comp.
Low Side
Current
Detector
CE
VIN
GND
Enable
Control
RP509xxxXB Block Diagram
3
RP509x
No. EA-362-180919
RP509Z00XC/RP509Z00XD, RP509N00XC/RP509N00XD (Adjustable Output Voltage Type)
UVLO
MODE
Thermal
Protection
Hi Side
Current
Detector
Mode
Control
Slope
Generator
Vref
Soft
Start
VFB
Amp.
On Time
Control
Switching
Control
LX
Comp.
Low Side
Current
Detector
CE
VIN
GND
Enable
Control
RP509x00XC Block Diagram
UVLO
MODE
Thermal
Protection
Hi Side
Current
Detector
Mode
Control
Slope
Generator
Vref
VFB
Soft
Start
Amp.
On Time
Control
Switching
Control
Enable
Control
RP509x00XD Block Diagram
4
LX
Comp.
Low Side
Current
Detector
CE
VIN
GND
RP509x
No. EA-362-180919
PIN DESCRIPTION
Top View
Bottom View
2
6
5
4
2
(mark side)
1
1
A
B
C
C
B
A
1
WLCSP-6 Pin Configurations
WLCSP-6 Pin Description
Pin No.
Symbol
A1
MODE
B1
C1
A2
B2
C2
LX
VOUT/VFB
VIN
CE
GND
2
3
SOT-23-6 Pin Configurations
Description
Mode Control Pin
(High: Forced PWM Control, Low: PWM/VFM Auto-switching Control)
Switching Pin
Output/Feedback Voltage Pin
Input Voltage Pin
Chip Enable Pin, Active-high
Ground Pin
SOT-23-6 Pin Description
Pin No.
Symbol
1
CE
2
GND
3
VIN
4
MODE
5
6
LX
VOUT/VFB
Description
Chip Enable Pin, Active-high
Ground Pin
Input Voltage Pin
Mode Control Pin
(High: Forced PWM Control, Low: PWM/VFM Auto-switching Control)
Switching Pin
Output/Feedback Voltage Pin
5
RP509x
No. EA-362-180919
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
VIN
VLX
VCE
VMODE
VOUT/VFB
ILX
PD
Tj
Tstg
(GND = 0 V)
Item
Rating
−0.3 to 6.5
−0.3 to VIN +0.3
−0.3 to 6.5
−0.3 to 6.5
−0.3 to 6.5
1.6
Unit
V
V
V
V
V
A
910
mW
892
mW
Junction Temperature
−40 to 125
C
Storage Temperature Range
−55 to 125
C
Input Voltage
LX Pin Voltage
CE Pin Voltage
MODE Pin Voltage
VOUT/VFB Pin Voltage
LX Pin Output Current
Power
Dissipation(1)
WLCSP6-P6
SOT-23-6
JEDEC STD. 51-9
Test Land Pattern
JEDEC STD. 51-7
Test Land Pattern
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the lifetime and safety for both device and system using the device in the field. The
functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol
VIN
Ta
Item
Input Voltage
Operating Temperature Range
Rating
2.3 to 5.5
−40 to 85
Unit
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
6
Refer to POWER DISSIPATION for detailed information.
RP509x
No. EA-362-180919
ELECTRICAL CHARACTERISTICS
Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified.
RP509Zxx1A/RP509Zxx1B, RP509Nxx1A/RP509Nxx1B Electrical Characterisitcs
Symbol
Item
Conditions
(Ta = 25°C)
Max. Unit
x 1.015
VSET< 1.2 V
+0.018
Output Voltage
Output Voltage Temperature
Coefficient
−40 C ≤ Ta ≤ 85 C
fOSC
Oscillator Frequency
VIN = VCE = 3.6 V, VSET = 1.8 V, “Closed
Loop Control”
IDD
Supply Current
VIN = VCE = VOUT = 3.6 V, VMODE = 0 V
VOUT/
Ta
Typ.
VSET ≥ 1.2 V x 0.985
VIN = VCE = 3.6 V (VSET ≤
2.6 V),
VIN =VCE =VSET +1 V
(VSET > 2.6 V)
VOUT
Min.
−0.018
ppm/
C
±100
4.8
6.0
V
7.2
MHz
A
15
Standby Current
VIN = 5.5 V,VCE = 0 V
0
5
A
ICEH
CE "High" Input Current
VIN = VCE = 5.5 V
−1
0
1
A
ICEL
CE "Low" Input Current
VIN = 5.5 V,VCE = 0 V
−1
0
1
A
ISTANDBY
IMODEH
MODE "High" Input Current
VIN = VMODE = 5.5 V, VCE = 0 V
−1
0
1
A
IMODEL
MODE "Low" Input Current
VIN = 5.5 V, VCE = VMODE = 0 V
−1
0
1
A
IVOUTH
VOUT "High" Input Current
VIN = VOUT = 5.5 V, VCE = 0 V
−1
0
1
A
IVOUTL
VOUT "Low" Input Current
VIN = 5.5 V, VCE = VOUT = 0 V
−1
0
1
A
RDISTR
On-resistance for Auto
Discharger(1)
VIN = 3.6 V, VCE = 0 V
ILXLEAKH
LX "High" Leakage Current
VIN = VLX = 5.5 V, VCE = 0 V
ILXLEAKL
40
−1
0
5
A
0
1
A
LX "Low" Leakage Current
VIN = 5.5 V, VCE = VLX = 0 V
−5
VCEH
CE ”High” Input Voltage
VIN = 5.5 V
1.0
VCEL
CE "Low" Input Voltage
VIN = 2.3 V
VMODEH
MODE "High" Input Voltage
VIN = VCE = 5.5 V
VMODEL
MODE "Low" Input Voltage
VIN = VCE = 2.3 V
RONP
On-resistance of Pch. transistor
RONN
On-resistance of Nch. transistor
Maxduty
RP509Z
RP509N
RP509Z
RP509N
Ω
V
0.4
1.0
V
0.4
0.175
Ω
0.195
Ω
VIN = 3.6 V,
ILX = −100 mA
0.155
Ω
0.175
Ω
Maximum Duty Cycle
100
%
Soft-start Time
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN =VCE = VSET + 1 V (VSET > 2.6 V)
ILXLIM
LX Current Limit
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN =VCE = VSET + 1 V (VSET > 2.6 V)
1200
1600
VIN = VCE, Falling
1.85
2.00
2.20
VIN = VCE, Rising
1.90
2.05
2.25
VUVLO2
TTSD
TTSR
UVLO Threshold Voltage
Thermal Shutdown Threshold
Temperature
V
VIN = 3.6 V,
ILX = −100 mA
tSTART
VUVLO1
V
150
300
s
mA
V
V
Tj, Rising
140
C
Tj, Falling
100
C
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1)
RP509xxx1B only
7
RP509x
No. EA-362-180919
Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified.
RP509Z001C/RP509Z001D, RP509N001C/RP509N001D Electrical Characterisitcs
Symbol
VFB
VFB/
Ta
Item
Feedback Voltage
Conditions
VIN = VCE = 3.6 V
(Ta = 25°C)
Min.
Typ.
Max.
0.591 0.600
0.609
V
ppm/
C
Feedback Voltage
Temperature Coefficient
−40 C ≤ Ta ≤ 85 C
fOSC
Oscillator Frequency
VIN = VCE = 3.6 V, VSET = 1.8 V, “Closed
Loop Control”
IDD
Supply Current
VIN = VCE = VOUT = 3.6V, VMODE = 0V
15
Standby Current
VIN = 5.5 V,VCE = 0 V
0
5
A
ICEH
CE "High" Input Current
VIN = VCE = 5.5 V
−1
0
1
A
ICEL
CE "Low" Input Current
VIN = 5.5 V,VCE = 0 V
−1
0
1
A
IMODEH
MODE "High" Input Current
VIN = VMODE = 5.5 V, VCE = 0 V
−1
0
1
A
IMODEL
MODE "Low" Input Current
VIN = 5.5 V, VCE = VMODE = 0 V
−1
0
1
A
IVOUTH
VOUT "High" Input Current
VIN = VOUT = 5.5 V, VCE = 0 V
−1
0
1
A
IVOUTL
VOUT "Low" Input Current
VIN = 5.5 V, VCE = VOUT = 0 V
−1
0
1
A
RDISTR
On-resistance for Auto
Discharge(1)
VIN = 3.6 V, VCE = 0 V
ILXLEAKH
LX "High" Leakage Current
VIN = VLX = 5.5 V, VCE = 0 V
ILXLEAKL
ISTANDBY
±100
4.8
A
Ω
5
A
0
1
A
VIN = 5.5 V, VCE = VLX = 0 V
−5
VIN = 5.5 V
1.0
VCEL
CE "Low" Input Voltage
VIN = 2.3 V
VMODEH
MODE "High" Input Voltage
VIN = VCE = 5.5 V
VMODEL
MODE "Low" Input Voltage
VIN = VCE = 2.3 V
RONP
On-resistance of
Pch. Transistor
RP509Z
RONN
On-resistance of
Nch. Transistor
RP509Z
V
0.4
1.0
V
V
0.4
V
VIN = 3.6 V,
ILX = −100 mA
0.175
Ω
0.195
Ω
VIN = 3.6 V,
ILX = −100 mA
0.155
Ω
0.175
Ω
Maximum Duty Cycle
100
%
tSTART
Soft-start Time
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN =VCE = VSET + 1 V (VSET > 2.6 V)
ILXLIM
LX Current Limit
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN =VCE = VSET + 1 V (VSET > 2.6 V)
1200
1600
VIN = VCE, Falling
1.85
2.00
2.20
V
VIN = VCE, Rising
1.90
2.05
2.25
V
VUVLO1
VUVLO2
TTSD
UVLO Threshold Voltage
Thermal Shutdown Threshold
Temperature
Tj, Rising
150
300
RP509x001D only
s
mA
140
TTSR
Tj, Falling
100
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1)
MHz
0
CE "High" Input Voltage
RP509N
7.2
−1
LX "Low" Leakage Current
RP509N
6.0
40
VCEH
Maxduty
8
Unit
C
C
RP509x
No. EA-362-180919
Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified.
RP509Zxx2A/RP509Zxx2B, RP509Nxx2A/RP509Nxx2B Electrical Characterisitcs
Symbol
VOUT
VOUT/
Ta
Item
Output Voltage
Conditions
VIN = VCE = 3.6 V
VSET ≥ 1.2 V
(VSET ≤ 2.6 V),
VIN = VCE = VSET + 1 V
VSET < 1.2 V
(VSET > 2.6 V)
(Ta = 25°C)
Min.
Typ.
Max.
x 0.985
x 1.015
−0.018
+0.018
Unit
V
ppm/
C
Output Voltage Temperature
Coefficient
−40 C ≤ Ta ≤ 85 C
fOSC
Oscillator Frequency
VIN = VCE = 3.6 V, VSET = 1.8 V,
“Closed Loop Control”
IDD
Supply Current
VIN = VCE = VOUT = 3.6V, VMODE = 0V
15
Standby Current
VIN = 5.5 V,VCE = 0 V
0
5
A
ICEH
CE "High" Input Current
VIN = VCE = 5.5 V
−1
0
1
A
ICEL
CE "Low" Input Current
VIN = 5.5 V,VCE = 0 V
−1
0
1
A
IMODEH
MODE "High" Input Current
VIN = VMODE = 5.5 V, VCE = 0 V
−1
0
1
A
IMODEL
MODE "Low" Input Current
VIN = 5.5 V, VCE = VMODE = 0 V
−1
0
1
A
IVOUTH
VOUT "High" Input Current
VIN = VOUT = 5.5 V, VCE = 0 V
−1
0
1
A
IVOUTL
VOUT "Low" Input Current
VIN = 5.5 V, VCE = VOUT = 0 V
−1
0
1
A
RDISTR
On-resistance for Auto
Discharger(1)
VIN = 3.6 V, VCE = 0 V
ILXLEAKH
LX "High" Leakage Current
VIN = VLX = 5.5 V, VCE = 0 V
−1
0
5
A
ILXLEAKL
LX "Low" Leakage Current
VIN = 5.5 V, VCE = VLX = 0 V
−5
0
1
A
VCEH
CE "High" Input Voltage
VIN = 5.5 V
1.0
VCEL
CE "Low" Input Voltage
VIN = 2.3 V
VMODEH
MODE "High" Input Voltage
VIN = VCE = 5.5 V
VMODEL
MODE "Low" Input Voltage
VIN = VCE = 2.3 V
RONP
On-resistance of
Pch. transistor
RP509Z
RONN
On-resistance of
Nch. transistor
RP509Z
ISTANDBY
Maxduty
Soft-start Time
ILXLIM
LX Current Limit
VUVLO2
TTSD
TTSR
RP509N
UVLO Threshold Voltage
Thermal Shutdown Threshold
Temperature
4.8
6.0
7.2
40
Ω
V
1.0
VIN = 3.6 V,
ILX = −100 mA
Ω
0.195
Ω
0.155
Ω
0.175
Ω
%
150
600
V
0.175
100
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE = VSET + 1 V (VSET > 2.6 V)
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE = VSET + 1 V (VSET > 2.6 V)
V
V
0.4
VIN = 3.6 V,
ILX = −100 mA
MHz
A
0.4
Maximum Duty Cycle
tSTART
VUVLO1
RP509N
±100
300
1000
s
mA
VIN = VCE, Falling
1.85
2.00
2.20
V
VIN = VCE, Rising
1.90
2.05
2.25
V
Tj, Rising
140
C
Tj, Falling
100
C
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1)
RP509xxx2B only
9
RP509x
No. EA-362-180919
Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified.
RP509Z002C/RP509Z002D, RP509N002C/RP509N002D Electrical Characterisitcs
Symbol
VFB
Item
Conditions
(Ta = 25°C)
Min.
Typ.
Max.
Unit
0.591
0.600
0.609
V
Feedback Voltage
VIN = VCE = 3.6 V
Feedback Voltage
Temperature Coefficient
−40 C ≤ Ta ≤ 85 C
fOSC
Oscillator Frequency
VIN = VCE = 3.6 V, VSET = 1.8 V, “Closed
Loop Control”
IDD
Supply Current
VIN = VCE = VOUT = 3.6V, VMODE =0V
15
Standby Current
VIN = 5.5 V,VCE = 0 V
0
5
A
ICEH
CE "High" Input Current
VIN = VCE = 5.5 V
−1
0
1
A
ICEL
CE "Low" Input Current
VIN = 5.5 V,VCE = 0 V
−1
0
1
A
IMODEH
MODE "High" Input Current
VIN = VMODE = 5.5 V, VCE = 0 V
−1
0
1
A
IMODEL
MODE "Low" Input Current
VIN = 5.5 V, VCE = VMODE = 0 V
−1
0
1
A
IVOUTH
VOUT "High" Input Current
VIN = VOUT = 5.5 V, VCE = 0 V
−1
0
1
A
IVOUTL
VOUT "Low" Input Current
VIN = 5.5 V, VCE = VOUT = 0 V
−1
0
1
A
RDISTR
On-resistance for Auto
Discharge(1)
VIN = 3.6 V, VCE = 0 V
ILXLEAKH
LX "High" Leakage Current
VIN = VLX = 5.5 V, VCE = 0 V
−1
0
5
A
ILXLEAKL
LX "Low" Leakage Current
VIN = 5.5 V, VCE = VLX = 0 V
−5
0
1
A
VCEH
CE "High" Input Voltage
VIN = 5.5 V
1.0
VCEL
CE "Low" Input Voltage
VIN = 2.3 V
VMODEH
MODE "High" Input Voltage
VIN = VCE = 5.5 V
VMODEL
MODE "Low" Input Voltage
VIN = VCE = 2.3 V
RONP
On-resistance of
Pch. Transistor
RP509Z
RONN
On-resistance of
Nch. Transistor
VFB/
Ta
ISTANDBY
Maxduty
RP509N
RP509Z
RP509N
ppm/
C
±100
4.8
6.0
7.2
A
40
Ω
V
0.4
1.0
V
V
0.4
V
VIN = 3.6 V,
ILX = −100 mA
0.175
Ω
0.195
Ω
VIN = 3.6 V,
ILX = −100 mA
0.155
Ω
0.175
Ω
Maximum Duty Cycle
100
%
tSTART
Soft-start Time
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE = VSET + 1 V (VSET > 2.6 V)
ILXLIM
LX Current Limit
VIN = VCE = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE = VSET +1 V (VSET > 2.6 V)
600
1000
VIN = VCE, Falling
1.85
2.00
2.20
V
VIN = VCE, Rising
1.90
2.05
2.25
V
VUVLO1
VUVLO2
TTSD
UVLO Threshold Voltage
Thermal Shutdown Threshold
Temperature
Tj, Rising
150
300
RP509x002D only
10
s
mA
140
TTSR
Tj, Falling
100
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1)
MHz
C
C
RP509x
No. EA-362-180919
Electrical Characteristics by Different Output Voltage
RP509ZxxXA/RP509ZxxXB, RP509NxxXA/RP509NxxXB (Fixed Output Voltage Type)
VOUT [V]
Product Name
Min.
Typ.
R P5 09 x0 6XA
R P5 09 x0 6XB
0.582
0.600
R P5 09 x0 7XA
R P5 09 x0 7XB
0.682
0.700
R P5 09 x0 8XA
R P5 09 x0 8XB
0.782
0.800
R P5 09 x0 9XA
R P5 09 x0 9XB
0.882
0.900
R P5 09 x1 0XA
R P5 09 x1 0XB
0.982
1.000
R P5 09 x11XA
R P5 09 x11XB
1.082
1.100
R P5 09 x1 2XA
R P5 09 x1 2XB
1.182
1.200
R P5 09 x1 3XA
R P5 09 x1 3XB
1.281
1.300
R P5 09 x1 4XA
R P5 09 x1 4XB
1.379
1.400
R P5 09 x1 5XA
R P5 09 x1 5XB
1.478
1.500
R P5 09 x1 6XA
R P5 09 x1 6XB
1.576
1.600
R P5 09 x1 7XA
R P5 09 x1 7XB
1.675
1.700
R P5 09 x1 8XA
R P5 09 x1 8XB
1.773
1.800
R P5 09 x1 9XA
R P5 09 x1 9XB
1.872
1.900
R P5 09 x2 0XA
R P5 09 x2 0XB
1.970
2.000
R P5 09 x2 1XA
R P5 09 x2 1XB
2.069
2.100
R P5 09 x2 2XA
R P5 09 x2 2XB
2.167
2.200
R P5 09 x2 3XA
R P5 09 x2 3XB
2.266
2.300
R P5 09 x2 4XA
R P5 09 x2 4XB
2.364
2.400
R P5 09 x2 5XA
R P5 09 x2 5XB
2.463
2.500
R P5 09 x2 6XA
R P5 09 x2 6XB
2.561
2.600
R P5 09 x2 7XA
R P5 09 x2 7XB
2.660
2.700
R P5 09 x2 8XA
R P5 09 x2 8XB
2.758
2.800
R P5 09 x2 9XA
R P5 09 x2 9XB
2.857
2.900
R P5 09 x3 0XA
R P5 09 x3 0XB
2.955
3.000
R P5 09 x3 1XA
R P5 09 x3 1XB
3.054
3.100
R P5 09 x3 2XA
R P5 09 x3 2XB
3.152
3.200
R P5 09 x3 3X A
R P5 09 x3 3X B
3.251
3.300
－
R P5 09Z 101 B5
1.032
1.050
R P5 09N111 A5
R P5 09N111 B5
1.132
1.150
－
R P50 9Z11 2 B5
1.132
1.150
(Ta = 25°C)
Max.
0.618
0.718
0.818
0.918
1.018
1.118
1.218
1.319
1.421
1.522
1.624
1.725
1.827
1.928
2.030
2.131
2.233
2.334
2.436
2.537
2.639
2.740
2.842
2.943
3.045
3.146
3.248
3.349
1.068
1.168
1.168
11
RP509x
No. EA-362-180919
OPERATING DESCRIPTIONS
Soft-start Time
Starting-up with CE Pin
The IC starts to operate when the CE pin voltage (VCE) exceeds the threshold voltage. The threshold voltage
is preset between CE “H” input voltage (VCEH) and CE “Low” input voltage (VCEL).
After the start-of the start-up of the IC, soft-start circuit starts to operate. Then, after a certain period of time,
the reference voltage (VREF) in the IC gradually increases up to the specified value.
Notes: Soft start time (tSTART)(1) is not always equal to the turn-on speed of the step-down DC/DC converter.
Please note that the turn-on speed could be affected by the power supply capacity, the output current, the
inductance value and the COUT value.
CE Pin Input Voltage
(VCE)
IC Internal Reference Voltage
(VREF)
LX Voltage
(VLX)
VCEH
Threshold Level
VCEL
Soft-start Time (tSTART)
Soft-start Circuit
operation starts.
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart when Starting-up with CE Pin
Starting-up with Power Supply
After the power-on, when VIN exceeds the UVLO released voltage (VUVLO2), the IC starts to operate. Then, softstart circuit starts to operate and after a certain period of time, VREF gradually increases up to the specified
value.
Notes: Please note that the turn-on speed of VOUT could be affected by the power supply capacity, the output
current, the inductance value, the COUT value and the turn-on speed of VIN determined by CIN.
VUVLO2
Input Voltage
(VIN)
Soft-start Time (tSTART)
IC Internal Reference Voltage
(VREF)
LX Voltage
(VLX)
VSET
Output Voltage
(VOUT)
Depending on Power Supply, Load Current,
External Components
Timing Chart when Starting-up with Power Supply
(1)
Soft-start time (tSTART) indicates the duration until the reference voltage (VREF) reaches the specified voltage after softstart circuit’s activation.
12
RP509x
No. EA-362-180919
Undervoltage Lockout (UVLO) Circuit
If VIN becomes lower than VSET, the step-down DC/DC converter stops the switching operation and ON duty
becomes 100%, and then VOUT gradually drops according to VIN.
If the VIN drops more and becomes lower than the UVLO detector threshold (VUVLO1), the UVLO circuit starts
to operate, VREF stops, and Pch. and Nch. built-in switch transistors turn “OFF”. As a result, VOUT drops
according to the COUT capacitance value and the load.
To restart the operation, VIN needs to be higher than VUVLO2. The timing chart below shows the voltage shifts
of VREF, VLX and VOUT when VIN value is varied.
Notes: Falling edge (operating) and rising edge (releasing) waveforms of VOUT could be affected by the initial
voltage of COUT and the output current of VOUT.
Input Voltage
(VIN)
VSET
VUVLO2
VUVLO1
Soft-start Time (tSTART)
IC Internal Reference Voltage
(VREF)
LX Voltage
(VLX)
Output Voltage
(VOUT)
VSET
Depending on Power Supply, Load Current,
External Components
Timing Chart with Variations in Input Voltage (VIN)
13
RP509x
No. EA-362-180919
Current Limit Circuit
Current limit circuit supervises the inductor peak current (the peak current flowing through Pch. Tr.) in each
switching cycle, and if the current exceeds the LX current limit (ILXLIM), it turns off Pch. Tr. ILXLIM of the RP509x
is set to Typ.1.6 A or Typ.1.0 A.
Notes: ILXLIM could be easily affected by self-heating or ambient environment. If the VIN drops dramatically or
becomes unstable due to short-circuit, protection operation could be affected.
Over Current Protection
LX Current Limit
(ILXLIM)
LX Current
Pch. Tr. Current
LX Voltage
(VLX)
Over-Current Protection Operation
14
RP509x
No. EA-362-180919
Operation of Step-down DC/DC Converter and Output Current
The step-down DC/DC converter charges energy in the inductor when LX Tr. turns “ON”, and discharges the
energy from the inductor when LX Tr. turns “OFF” and controls with less energy loss, so that a lower output
voltage (VOUT) than the input voltage (VIN) can be obtained. The operation of the step-down DC/DC converter
is explained in the following figures.
IL
i1
VIN
VOUT
L
Pch. Tr
Nch. Tr
i2
ILMAX
ILMIN
i1
i2
tOPEN
CL
GND
tOFF
tON
T＝1/fOSC
Basic Circuit
Inductor Current (IL) flowing through Inductor (L)
Step1. Pch. Tr. turns “ON” and IL (i1) flows, L is charged with energy. At this moment, i1 increases from the
minimum inductor current (ILMIN), which is 0 A, and reaches the maximum inductor current (ILMAX) in
proportion to the on-time period (tON) of Pch. Tr.
Step2. When Pch. Tr. turns “OFF”, L tries to maintain IL at ILMAX, so L turns Nch Tr. “ON” and IL (i2) flows into L.
Step3. i2 decreases gradually and reaches ILMIN after the open-time period (tOPEN) of Nch. Tr., and then Nch.
Tr. turns “OFF”. This is called discontinuous current mode.
As the output current (IOUT) increases, the off-time period (tOFF) of Pch. Tr. runs out before IL reaches
ILMIN. The next cycle starts, and Pch. Tr. turns “ON” and Nch. Tr. turns “OFF”, which means IL starts
increasing from ILMIN. This is called continuous current mode.
In PWM mode, VOUT is maintained by controlling ton. The oscillator frequency (fOSC) is maintained constant
during PWM mode.
When the step-down DC/DC operation is constant, ILMIN and ILMAX during ton of Pch. Tr. would be same as
during tOFF of Pch. Tr. The current differential between ILMAX and ILMIN is described as I, as the following
equation 1.
I = ILMAX − ILMIN = VOUT tOPEN / L = (VIN − VOUT) tON / L ·················································· Equation 1
The above equation is predicated on the following requirements.
T = 1 / fOSC = tON + tOFF
duty (%) = tON / T 100 = tON fOSC 100
tOPEN ≤ tOFF
In Equation 1, “VOUT tOPEN / L” shows the amount of current change in "OFF" state. Also, “(VIN − VOUT) tON /
L” shows the amount of current change at "ON" state.
15
RP509x
No. EA-362-180919
Discontinuous Mode and Continuous Mode
As illustrated in Figure A., when IOUT is relatively small, tOPEN < tOFF. In this case, the energy charged into L
during tON will be completely discharged during tOFF, as a result, ILMIN = 0. This is called discontinuous mode.
When IOUT is gradually increased, eventually tOPEN = tOFF and when IOUT is increased further, eventually ILMIN >
0 as illustrated in Figure B. This is called continuous mode.
IL
ILMAX
IL
ILMAX
ILMIN
ILMIN
tOPEN
t
ICONST
tOFF
tON
tON
T=1/fOSC
Figure A. Discontinuous Mode
t
tOFF
T=1/fOSC
Figure B. Continuous Mode
In the continuous mode, the solution of Equation 1 is described as tONC.
tONC = T VOUT / VIN ···································································································· Equation 2
When tON < tONC, it is discontinuous mode, and when tON = tONC, it is continuous mode.
16
RP509x
No. EA-362-180919
Forced PWM Mode and VFM Mode
Output voltage controlling method is selectable between a forced PWM control type and a PWM/VFM autoswitching control type, and can be set by the MODE pin. The forced PWM control switches at fixed frequency
rate in order to reduce noise in low output current. The PWM/VFM auto-switching control automatically
switches from PWM mode to VFM mode in order to achieve high efficiency in low output current.
Forced PWM Mode
By setting the MODE pin to “H”, the IC switches the frequency at the fixed rate to reduce noise even when the
output load is light. Therefore, when IOUT is ∆IL/2 or less, ILMIN becomes less than “0”. That is, the accumulated
electricity in CL is discharged through the IC side while IL is increasing from ILMIN to “0” during ton, and also
while IL is decreasing from “0” to ILMIN during tOFF.
VFM Mode
By setting the MODE pin to “Low”, in low output current, the IC automatically switches into VFM mode in order
to achieve high efficiency. In VFM mode, ton is determined depending on VIN and VOUT.
ILMAX
IL
ILMAX
IL
ΔIL
IOUT
0
0
ILMIN
ILMIN
t
tON
tOFF
t
tON
tOFF
T=1/fOSC
Forced PWM Mode
VFM Mode
17
RP509x
No. EA-362-180919
APPLICATION INFORMATION
Typical Application Circuits
MODE = High: Forced PWM Control, MODE = Low: PWM/VFM Auto-switching Control
VIN
VIN
VOUT
LX
L
RP509xxxXA/B
MODE
CIN
VOUT
COUT
GND
CE
RP509xxxXA/RP509xxxXB (Fixed Output Voltage Type)
MODE = High: Forced PWM Control, MODE = Low: PWM/VFM Auto-switching Control
VIN
VIN
RP509x00XC/D
CIN
MODE
VOUT
LX
L
R1
C1
VFB
COUT
R2
CE
GND
RP509x00XC/RP509x00XD ( Adjustable Output Voltage Type)
Recommended External Components
Symbol
CIN
COUT
L
18
Descriptions
4.7 μF and more, Ceramic Capacitor,
See the table of “Input Voltage vs. Capacitance” in the following page.
10 µF, Ceramic Capacitor,
See the table of “Set Output Voltage (VSET) vs. Capacitance” in the following page.
0.47 µH to 0.56 µH,
See the table of “Inductance Range vs. PWM Frequency” in the following page.
RP509x
No. EA-362-180919
Input Voltage vs. Capacitance
Size
VIN [V]
[mm]
1005
Up to 4.5
CIN
[μF]
4.7
10
Rated Voltage
[V]
6.3
6.3
4.7
6.3
10
6.3
10
6.3
4.7
6.3
10
6.3
1608
1005
Up to 5.5
1608
Model
JMK105BBJ475MV (Taiyo Yuden)
C1005X5R0J106M050BC (TDK)
GRM188R60J475ME84 (Murata)
GRM188R60J475ME19 (Murata)
C1608X5R0J475M080AB (TDK)
JMK107BJ475MA (Taiyo Yuden)
GRM188R60J106ME47 (Murata)
C1608X5R0J106M080AB (TDK)
JMK107ABJ106MA (Taiyo Yuden)
C1005X5R0J106M050BC (TDK)
GRM188R60J475ME84 (Murata)
GRM188R60J475ME19 (Murata)
JMK107BJ475MA (Taiyo Yuden)
GRM188R60J106ME47 (Murata)
C1608X5R0J106M080AB (TDK)
JMK107ABJ106MA (Taiyo Yuden)
Set Output Voltage (VSET) vs. Capacitance
Version
VSET [V]
COUT
[μF]
Rated
Voltage
[V]
10
4
10
6.3
10
6.3
10
4
10
6.3
1608
10
6.3
1608
10
6.3
Size
[mm]
1005
0.6 to 1.8
RP509xxxXA
RP509xxxXB
or
RP509x00XC
RP509x00XD
1608
1005
1.9 to 3.3
RP509x00XC
RP509x00XD
3.4 to 4.5
Model
GRM155R60G106ME44 (Murata)
C1005X5R0G106M050BB (TDK)
AMK105CBJ106MV (Taiyo Yuden)
C1005X5R0J106M050BC (TDK)
GRM188R60J106ME47 (Murata)
C1608X5R0J106M080AB (TDK)
JMK107ABJ106MA (Taiyo Yuden)
GRM155R60G106ME44(Murata)
C1005X5R0G106M050BB (TDK)
AMK105CBJ106MV (Taiyo Yuden)
C1005X5R0J106M050BC (TDK)
GRM188R60J106ME47 (Murata)
C1608X5R0J106M080AB (TDK)
JMK107ABJ106MA (Taiyo Yuden)
GRM188R60J106ME47 (Murata)
C1608X5R0J106M080AB (TDK)
JMK107ABJ106MA (Taiyo Yuden)
19
RP509x
No. EA-362-180919
Inductance Range vs. PWM Frequency
PWM
Size Height(Max)
L
Version
Frequency
[mm]
[mm]
[μH]
[MHz]
1608
RP509xxxXA
RP509xxxXB
or
RP509x00XC
RP509x00XD
0.95
0.47
1.0
0.5
0.56
0.47
0.54
0.47
0.47
0.47
6.0
2012
Rdc (Typ)
[mΩ]
Model
110
90
60
65
70
65
60
48
75
MDT1608-CHR47M (TOKO)
MDT1608-CRR47M (TOKO)
MIPSZ2012D0R5 (FDK)
MDT2012-CRR56N (TOKO)
MLP2012HR47MT (TDK)
MLP2012HR54MT (TDK)
CKP2012NR47M-T (Taiyo Yuden)
BRL2012TR47M6 (Taiyo Yuden)
LQM21PNR47MG0 (Murata)
Precautions for the Selection of External Parts
Choose a low ESR ceramic capacitor. The capacitance of CIN between VIN and GND should be more than
or equal to 4.7 µF. The capacitance of a ceramic capacitor (COUT) should be 10 µF. Also, choose the
capacitor with consideration for bias characteristics and input/output voltages. See the above tables of
“Input Voltage vs. Capacitance” and “Set Output Voltage vs. Capacitance”.
The phase compensation of this device is designed according to the COUT and L values. The inductance
range of an inductor should be between 0.47µH to 0.56 µH in order to gain stability. See the above table of
“Inductance Range vs. PWM Frequency”.
Choose an inductor that has small DC resistance, has enough permissible current and is hard to cause
magnetic saturation. If the inductance value of the inductor becomes extremely small under the load
conditions, the peak current of LX may increase along with the load current. As a result, over current
protection circuit may start to operate when the peak current of LX reaches to LX limit current. Therefore,
choose an inductor with consideration for the value of ILXMAX. See the following page of “Calculation
Conditions of LX Pin Maximum Output Current (ILXMAX)”.
As for the adjustable output voltage type (RP509x00XC/RP509x00XD), the set output voltage (VSET) can
be arbitrarily set by changing the vales of R1 and R2 using the following equation: VSET = VFB (R1 + R2) /
R2
Refer to the following table for the recommended values for R1, R2 and C1.
Set Output Voltage (VSET) vs. R1/R2/C1 (Adjustable Output Voltage Type)
R1 [kΩ]
R2 [kΩ]
VSET [V]
0 .6
0
220
0 . 6 < VSET ≤ 0.9
220
0 . 9 < VSET ≤ 1 .8
220
1 . 8 < VSET ≤ 2.1
150
R1 = (VSET / VFB -1 ) x R2
2 . 1 < VSET ≤ 2 .4
100
2 . 4 < VSET ≤ 2.7
68
2 . 7 < VSET ≤ 3.0
47
3 . 0 < VSET ≤ V I N
47
20
C1 [pF]
Open
47
33
10
10
10
10
6.8
RP509x
No. EA-362-180919
Calculation Conditions of LX Pin Maximum Output Current (ILXMAX)
The following equations explain the relationship to determine ILXMAX at the ideal operation of the ICs in
continuous mode.
Ripple Current P-P value is described as IRP, ON resistance of Pch. Tr. is described as RONP, ON resistance of
Nch. Tr. is described as RONN, and DC resistor of the inductor is described as RL.
First, when Pch. Tr. is “ON”, Equation 1 is satisfied.
VIN = VOUT + (RONP + RL) IOUT + L IRP / tON ·································································· Equation 1
Second, when Pch. Tr. is "OFF" (Nch. Tr. is "ON"), Equation 2 is satisfied.
L IRP / tOFF = RONN IOUT + VOUT + RL IOUT ·································································· Equation 2
Put Equation 2 into Equation 1 to solve ON duty of Pch. Tr. (DON = tON / (tOFF + tON)):
DON = (VOUT + RONN IOUT + RL IOUT) / (VIN + RONN IOUT − RONP IOUT) ······························· Equation 3
Ripple Current is described as follows:
IRP = (VIN − VOUT − RONP IOUT − RL IOUT) DON / fOSC / L ················································· Equation 4
Peak current that flows through L, and LX Tr. is described as follows:
ILXMAX = IOUT + IRP / 2 ································································································· Equation 5
21
RP509x
No. EA-362-180919
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed its rated voltage, rated current or
rated power. When designing a peripheral circuit, please be fully aware of the following points.
Set the external components as close as possible to the IC and minimize the wiring between the
components and the IC. Especially, place a capacitor (CIN) as close as possible to the VIN pin and GND.
Ensure the VIN and GND lines are sufficiently robust. If their impedance is too high, noise pickup or unstable
operation may result.
The VIN line, the GND line, the VOUT line, an inductor, and LX should make special considerations for the
large switching current flows.
The wiring between the VOUT pin and an inductor (L) (RP509xxxXA/RP509xxxXB) or between a resistor
for setting output voltage (R1) and L (RP509x00XC/RP509x00XD) should be separated from the wiring
between L and Load.
Over current protection circuit may be affected by self-heating or power dissipation environment.
For any setting type of output voltage, the input/output voltage ratio must meet the following requirement to
achieve a stable VFM mode at light load when the MODE pin is “Low” (at PWM/VFM Auto Switching):
VOUT / VIN < 0.7
VMODE = Low, PWM/VFM Auto Switching
Input Voltage VIN (V)
5.5
Adjustable Output
4.7
Voltage Type
Fixed Output
Voltage Type
3.9
3.1
2.3
0.6
1.2
1.8
2.4
3.0
3.6
4.2
Output Voltage VOUT (V)
Available Voltage Area with Stable VFM Mode
22
RP509x
No. EA-362-180919
PCB LAYOUT
Fixed Output Voltage Type (RP509ZxxXA/B)
Top Layer
Bottom Layer
Adjustable Output Voltage Type (RP509Z00XC/D)
Top Layer
Bottom Layer
23
RP509x
No. EA-362-180919
Adjustable Output Voltage Type (RP509N00XC/D)
Top Layer
24
Bottom Layer
RP509x
No. EA-362-180919
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Efficiency vs. Output Current (RP509Z)
VOUT = 1.0 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.2 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 3.3 V (Fixed Output Voltage Type)
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
L = MIPSZ2012D0R5
25
RP509x
No. EA-362-180919
Efficiency vs. Output Current (RP509N)
VOUT = 1.0 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.2 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 3.3 V (Fixed Output Voltage Type)
VMODE = "L" PWM/VFM Auto Switching
L = MIPSZ2012D0R5
VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
L = MIPSZ2012D0R5
26
RP509x
No. EA-362-180919
Small Mount Solution (RP509Z)
VOUT = 1.0 V
VMODE = "L" PWM/VFM Auto Switching
L = MDT1608-CRR47M
VOUT = 1.2 V
VMODE = "L" PWM/VFM Auto Switching
L = MDT1608-CRR47M
VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
L = MDT1608-CRR47M
VOUT = 3.3 V (Fixed Output Voltage Type)
VMODE = "L" PWM/VFM Auto Switching
L = MDT1608-CRR47M
VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
L = MDT1608-CRR47M
27
RP509x
No. EA-362-180919
2) Output Voltage vs. Output Current (RP509Z)
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
Output Voltage vs. Output Current (RP509N)
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
3) Oscillator Frequency vs. Input Voltage
IOUT = 1.0 mA
VMODE = "L" PWM/VFM Auto Switching
28
IOUT = 1.0 mA
VMODE = "H" Forced PWM Mode
RP509x
No. EA-362-180919
IOUT = 500 mA
VMODE = "H" Forced PWM Mode
4) Load Transient Response Waveform
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 1.0 -> 500 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 500 -> 1.0 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 1.0 -> 500 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 500 -> 1.0 mA
29
RP509x
No. EA-362-180919
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 300 -> 600 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 600 -> 300 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 300 -> 600 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 600 -> 300 mA
5) Mode Switching Waveform
VIN = 3.6 V, VOUT = 1.8 V
IOUT = 1.0 mA
VMODE = "L" -> "H"
30
VIN = 3.6 V, VOUT = 1.8 V
IOUT = 1.0 mA
VMODE = "H" -> "L"
RP509x
No. EA-362-180919
6) Output Voltage Waveform
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 1.0 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 1.0 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "L" PWM/VFM Auto Switching
IOUT = 500 mA
VIN = 3.6 V, VOUT = 1.8 V
VMODE = "H" Forced PWM Mode
IOUT = 500 mA
31
POWER DISSIPATION
WLCSP-6-P6
Ver. C
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-9.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layers (First and Fourth Layers): 60%
Inner Layers (Second and Third Layers): 100%
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
910 mW
Thermal Resistance (θja)
θja = 109°C/W
θja: Junction-to-Ambient Thermal Resistance
1200
114.5
910
800
600
101.5
Power Dissipation (mW)
1000
400
200
0
0
25
50
75 85
100
125
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
WLCSP-6-P6
Ver. B
WLCSP-6-P6 Package Dimensions (Unit: mm)
i
VISUAL INSPECTION CRITERIA
WLCSP
VI-160823
No.
1
Inspection Items
Package chipping
2
Si surface chipping
3
No bump
Marking miss
4
Inspection Criteria
Figure
A0.2mm is rejected
B0.2mm is rejected
C0.2mm is rejected
And, Package chipping to Si surface
and to bump is rejected.
A0.2mm is rejected
B0.2mm is rejected
C0.2mm is rejected
But, even if A0.2mm, B0.1mm is
acceptable.
No bump is rejected.
To reject incorrect marking, such as
another product name marking or
5
6
7
No marking
Reverse direction of
marking
Defective marking
8
Scratch
9
Stain and Foreign
material
another lot No. marking.
To reject no marking on the package.
To reject reverse direction of marking
character.
To reject unreadable marking.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by scratch.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by stain and foreign material.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
i
POWER DISSIPATION
SOT-23-6-D
Ver. B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ 0.3 mm × 7 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
892 mW
Thermal Resistance (θja)
θja = 112°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
800
Power Dissipation PD (mW)
700
892
600
500
400
300
200
100
0
0
25
50
75 85
100
125
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
SOT-23-6
Ver. A
2.9±0.2
+0.2
1.1-0.1
1.9±0.2
4
1
2
0 to 0.1
0.2MIN.
5
+0.2
1.6-0.1
6
0.8±0.1
(0.95)
2.8±0.3
(0.95)
3
+0.1
0.4-0.2
+0.1
0.15-0.05
Unit : mm
SOT-23-6 Package Dimensions
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
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