RP515x Series
Ultra-low Power Consumption 300 mA Buck DC/DC Converter
with Battery Monitor
No.EA-505-190328
OVERVIEW
The RP515x is a buck DC/DC converter with a Battery Monitor (BM) featuring ultra-low current and lowvoltage resistance. The battery monitor divides the input voltage (VIN) into 1/3 or 1/4, and directly provides
the MCU’s built-in low voltage AD converter with buffered voltage without external circuits.
KEY BENEFITS
●
●
●
●
Ultra-low consumption current (IQ:0.3 μA ) with the VFM control for DC/DC (switching frequency: 1 MHz max.)
High efficiency under light load conditions
Reducing components and space by combining DC/DC and BM into a single chip
Suitable for coin batteries and USB ports due to its wide input voltage range from 1.8 V to 5.5 V
PACKAGES
KEY SPECIFICATIONS
DC/DC Section
● Supply Current: Typ. 0.3 μA
● Output Current: 300 mA
● Input Voltage Range: 1.8 V to 5.5 V
● Output Voltage Range : 1.0 V to 4.0 V
● Output Voltage Accuracy: ±1.5%
Battery Monitor Section
● Output Voltage: VIN /3 (RP515xxx3x)
VIN /4 (RP515xxx4x)
● Supply Current: Typ. 0.1 μA
TYPICAL APPLICATIONS
WLCSP-9-P2
DFN(PLP)2527-10
1.45 x 1.48 x 0.36 (mm)
2.7 x 2.5 x 0.6 (mm)
RP515x
MCU
CE1
Signal
L
LX
VOUT
PVIN
VIN
Buck (Step-down)
DC/DC Converter
VOUT
2.2 µH
VCC
PGND
COUT1
22 µF
AVIN
AGND
Battery Monitor
CE2
Signal
VBM
BM
CIN
ADC
COUT2
10 µF
0.1µF to 0.22 µF
C = Ceramic Capacitor
●
●
●
●
APPLICATIONS
Coin cell-used equipment and Li-ion battery-used equipment
Wearable devices such as SmartWatch, SmartBand and Health monitoring
Low Power RF Modules such as Bluetooth® LE, Zigbee, WiSun and ANT
Low Power CPU, Memory, Sensor device and Energy Harvester
1
RP515x
No.EA-505-190328
SELECTION GUIDE
The set output voltage for DC/DC, the division ratio of BM output voltage, the auto-discharge function (1) for
DC/DC and the packages are user-selectable options.
Selection Guide
Product Name
RP515Zxx#$-TR-F
RP515Kxx#$-TR
Package
Quantity per Reel
Pb Free
Halogen Free
WLCSP-9-P2
5,000 pcs
Yes
Yes
DFN(PLP)2527-10
5,000 pcs
Yes
Yes
xx: Specify the set output voltage for DC/DC (VSET).within the range from 1.0 V (10) to 4.0 V (40)
The voltage in 0.05 V step is shown as follows:
Ex. 1.25 V: RP515x12xx5
Refer to the Product-specific Electrical Characteristics for detailed information.
* Contact our sales representatives for other voltages.
#: Select the division ratio of BM output voltage
3: VIN /3
4: VIN /4
$: Select the auto-discharge option for DC/DC.
C: DC/DC auto-discharge is not included
D: DC/DC auto-discharge is included
(1)
2
Auto-discharge function quickly lowers the output voltage to 0 V by releasing the electrical charge accumulated in the
external capacitor, when the chip enable signal is switched from the active mode to the standby mode.
RP515x
No.EA-505-190328
BLOCK DIAGRAMS
High Side
Current
Detector
VOUT
PVIN
－
＋
Vref
CE1
LX
Soft Start
Enable
Control
AVIN
Switching
Control
Low Side
Current
Detector
PGND
AGND
UVLO
＋
BM
－
CE2
Enable
Control
RP515xxxxC Block Diagram: Without DC/DC auto-discharge function
High Side
Current
Detector
VOUT
PVIN
－
＋
Vref
CE1
LX
Soft Start
Enable
Control
AVIN
Switching
Control
Low Side
Current
Detector
PGND
AGND
UVLO
＋
BM
－
CE2
Enable
Control
RP515xxxxD Block Diagram: With DC/DC auto-discharge function
3
RP515x
No.EA-505-190328
PIN DESCRIPTIONS
Top View
Bottom View
3
3
2
2
1
1
A
B
C
C
B
A
RP515Z (WLCSP-9-P2) Pin Configuration
RP515Z Pin Description
4
Pin No.
Symbol
Description
A1
AVIN
Input Pin for Analog Power Supply (also for Battery Monitor)
B1
PVIN
Input Pin for Power Supply
C1
LX
A2
CE1
DC/DC Enable Pin (Active-high)
B2
CE2
Battery Monitor Enable Pin (Active-high)
C2
PGND
A3
BM
B3
VOUT
DC/DC Output Pin
C3
AGND
Analog Ground Pin
Switching Pin
Power Ground Pin
Battery Monitor Output Pin
RP515x
No.EA-505-190328
Bottom View
Top View
10
9
8
7
6
6
7
8
9
10
(1)
1
2
3
4
5
5
4
3
2
1
1
RP515K [DFN(PLP)2570-10] Pin Configuration
RP515K Pin Description
(1)
Pin No.
Symbol
Description
1
VOUT
DC/DC Output Pin
2
AGND
Analog Ground Pin
3
PGND
Power Ground Pin
4
LX
Switching Pin
5
LX
Switching Pin
6
PVIN
Input Pin for Power Supply
7
AVIN
Input Pin for Analog Power Supply (also for Battery Monitor)
8
CE1
DC/DC Enable Pin (Active-high)
9
CE2
Battery Monitor Enable Pin (Active-high)
10
BM
Battery Monitor Output Pin
The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to
the ground plane on the board, but it is possible to leave the tab floating.
5
RP515x
No.EA-505-190328
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
Rating
Unit
Input Voltage for AVIN and PVIN Pins
−0.3 to 6.5
V
VCE1
CE1 Pin Voltage
−0.3 to 6.5
V
VCE2
CE2 Pin Voltage
−0.3 to 6.5
V
VOUT
Output Pin Voltage
−0.3 to VIN + 0.3
V
VBM
BM Pin Voltage
−0.3 to VIN + 0.3
V
ILX
LX Pin Output Current
650
mA
PD
Power Dissipation (1)
(JEDEC STD. 51)
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
VIN
Parameter
WLCSP-9-P2
1090
DFN(PLP)2527-10
2500
mW
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the life time and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Parameter
Rating
RP515xxx3x
1.8 to 5.5
RP515xxx4x
2.4 to 5.5
VIN
Input Voltage
Ta
Operating Temperature
−40 to 85
Unit
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
6
Refer to POWEWR DISSIPATION for detailed information.
RP515x
No.EA-505-190328
ELECTRICAL CHARACTERISTICS
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP515x Electrical Characteristics: DC/DC Section
Symbol
VOUT
IQ
Parameter
(Ta = 25C)
Condition
Min.
Typ.
VIN = VCE1 = 3.6 V
VSET ≥ 1.2 V x 0.985
(VSET ≤ 2.6 V),
VIN = VCE1 = VSET +1 V
VSET < 1.2 V −0.018
(VSET > 2.6 V)
Output voltage
Operating quiescent current
ISTANDBY Standby current
Max.
Unit
x 1.015
V
+0.018
VIN = VCE1 = VOUT = 5.5 V,
VSET = 1.8 V at rest
0.3
VIN = 5.5 V, VCE1 = 0 V
0.01
1
A
A
ICE1H
CE1 pin input current, high
VIN = VCE1 = 5.5 V
−0.025
0
0.025
A
ICE1L
CE1 pin input current, low
VIN = 5.5 V, VCE1 = 0 V
−0.025
0
0.025
A
IVOUTH
VOUT pin input current, high(1)
VIN = VOUT = 5.5 V, VCE1 = 0 V
−0.025
0
0.025
A
IVOUTL
VOUT pin input current, low
VIN = 5.5 V, VCE1 = VOUT = 0 V
−0.025
0
0.025
A
RDISN
Auto-discharge NMOS
on-resistance (2)
VIN = 3.6 V, VCE1 = 0 V
VCE1H
CE1 pin input voltage, high
1.8 V ≤ VIN ≤ 5.5 V
VCE1L
CE1 pin input voltage, low
1.8 V ≤ VIN ≤ 5.5 V
RONP
PMOS
on-resistance
RONN
NMOS
on-resistance
tSTART
Soft-start time
VIN = VCE1 = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE1 = VSET + 1 V (VSET > 2.6 V)
ILXLIM
LX current limit
VIN = VCE1 = 3.6 V (VSET ≤ 2.6 V),
VIN = VCE1 = VSET + 1 V (VSET > 2.6 V)
VUVLOF
VUVLOR
RP515Z
RP515K
RP515Z
RP515K
Undervoltage lockout
(UVLO) threshold voltage
60
Ω
1.0
V
0.4
0.15
VIN = 3.6 V, ILX = −100 mA
Ω
0.19
0.15
VIN = 3.6 V, ILX = −100 mA
V
Ω
0.19
10
ms
300
580
mA
VIN = VCE1, falling
1.40
1.50
1.65
V
VIN = VCE1, rising
1.55
1.65
1.80
V
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1)
(2)
RP515xxxxC only
RP515xxxxD only
7
RP515x
No.EA-505-190328
ELECTRICAL CHARACTERISTICS (Continued)
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP515x Electrical Characteristics: Battery Monitor Section
Symbol
Parameter
Condition
RP515xxx3x
VIN = 5.5 V,
−10
μA ≤ IBM ≤ 10 μA
RP515xxx4x
VBM
Output voltage
IBM
Output current
VIN = 5.5 V
ISSBM
Supply current
VIN = VCE2 =5.5 V,
IBM = 0 μA
VCE2H
CE2 pin input voltage, high
1.8 V ≤ VIN ≤ 5.5 V
VCE2L
CE2 pin input voltage, low
1.8 V ≤ VIN ≤ 5.5 V
Auto-discharge
NMOS on-resistance
VIN = 4.0 V, VCE2 = 0 V
RDISNBM
(Ta = 25C)
Min.
Typ.
Max.
VIN/3-30
VIN/3
VIN/3+30
VIN/4-30
VIN/4
VIN/4+30
−10
10
0.1
mV
µA
µA
V
1.0
0.4
50
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
8
Unit
V
Ω
RP515x
No.EA-505-190328
ELECTRICAL CHARACTERISTICS (Continued)
Product-specific Electrical Characteristics
RP515xxxxx
Product name
RP515x10xx
RP515x12xx
RP515x15xx
RP515x18xx
RP515x24xx
RP515x25xx
RP515x28xx
RP515x30xx
RP515x31xx
RP515x33xx
RP515x36xx
RP515x40xx
(Ta = 25°C)
Min.
0.9820
1.1820
1.4775
1.7730
2.3640
2.4625
2.7580
2.9550
3.0535
3.2505
3.5460
3.9400
VOUT [V]
Typ.
1.00
1.20
1.50
1.80
2.40
2.50
2.80
3.00
3.10
3.30
3.60
4.00
Max.
1.0180
1.2180
1.5225
1.8270
2.4360
2.5375
2.8420
3.0450
3.1465
3.3495
3.6540
4.0600
9
RP515x
No.EA-505-190328
TYPICAL APPLICATION CIRCUIT
RP515x
MCU
CE1
Signal
LX
VOUT
PVIN
VIN
Buck (Step-down)
DC/DC Converter
L
VOUT
2.2 µH
VCC
PGND
COUT1
22 µF
AVIN
AGND
Battery Monitor
CE2
Signal
BM
CIN
COUT2
0.1µF to 0.22 µF
10 µF
C = Ceramic Capacitor
RP515x Typical Application Circuit
10
VBM
ADC
RP515x
No.EA-505-190328
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on the peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a
rated power. When designing a peripheral circuit, please be fully aware of the following points.
・When an intermediate voltage other than VIN and GND is input to the CE1 pin or/and CE2 pin, a supply
current may be increased with a through current of a logic circuit in the IC. The CE pin is neither pulled up
nor pulled down, therefore the operation is not stable at open.
11
RP515x
No.EA-505-190328
THEORY OF OPERATION
DC/DC Section
Soft-start Time
Starting-up with CE1 Pin
The IC starts to operate when the CE1 pin voltage (VCE1) exceeds the threshold voltage. The threshold voltage
is preset between CE1 “High” input voltage (VCE1H) and CE1 “Low” input voltage (VCE1L). After the start-up of
the IC, soft-start circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in
the IC gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage,
and after that the output voltage rises as VREF increases. Soft-start time (tSTART) indicates the period from the
time soft-start circuit gets activated to the time VREF reaches the specified voltage. tSTART is not always equal
to the turn-on speed of the DC/DC converter. Note that the turn-on speed could be affected by the power
supply capacity, the output current (IOUT), the inductance and the output capacitor value (COUT1).
VCE1H
Threshold Level
CE1 Pin Input Voltage
VCE1L
(VCE1)
Soft-start Time
IC Internal Reference Voltage
(VREF)
Lx Voltage
Soft-start Circuit
operation starts.
(VLX)
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with CE1 Pin
Starting-up with Power Supply
After the power-on, when VIN exceeds the UVLO release voltage (VUVLOR), the IC starts to operate. Then, softstart circuit starts to operate and after a certain period of time, VREF gradually increases up to the specified
value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises as VREF
increases. The turn-on speed of VOUT could be affected by following conditions:
1. The VIN turn-on speed determined by the power supply to the IC and the CIN
2. The output capacitor value (COUT1) and the output current (IOUT)
Input Voltage
(VIN)
VSET
VUVLOR
VUVLOF
Soft-start Time
IC Internal Reference Voltage
(VREF)
Lx Voltage
(VLX)
VOUT
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with Power Supply
12
RP515x
No.EA-505-190328
Undervoltage Lockout (UVLO) Circuit
When VIN becomes lower than VSET, the buck DC/DC converter stops its switching operation and ON duty
becomes 100%, then VOUT gradually falls according to VIN. When the VIN drops below the UVLO detector
threshold (VUVLOF), the UVLO operates, VREF stops, and PMOS and NMOS built-in switch transistors turn “OFF”.
As a result, VOUT drops according to the COUT1 capacitance value and IOUT. As for RP515xxx1D, the discharge
transistor for COUT1 discharges after it turns on.
To restart the operation, VIN needs to exceed VUVLOR. The timing chart below shows the voltage shifts of VREF,
VLX and VOUT when VIN value is varied.
Note: Falling edge (operating) and rising edge (releasing) waveforms of VOUT could be affected by the initial
voltage of COUT1 and the output current of VOUT.
VIN
VSET
VUVLOR
VUVLOF
tSTART
VREF
VLX
VOUT
VOUT
Depending on Power Supply,
Load Current, External Components
Timing Chart with Variations in Input Voltage (VIN)
13
RP515x
No.EA-505-190328
Operation of Buck DC/DC Converter and Output Current
The buck DC/DC converter charges energy in the inductor while LX transistor turns “ON”, and discharges the
energy from the inductor when LX transistor turns “OFF”. This inductor reduces the energy loss to provide the
lower output voltage (VOUT) than the input voltage (VIN). The operation of the buck DC/DC converter is shown
in the following figures.
IL
i1
VIN
PMOS Tr.
NMOS Tr.
VOUT
L
ILMAX
ILMIN
i1
i2
i2
tOPEN
COUT
GND
Basic Circuit
tON
tOFF
Inductor Current (IL) flowing through Inductor (L)
Step1.
When the PMOS transistor turns “ON”, IL (i1) flows through the L to charge COUT and provide IOUT. At
this moment, i1 increases from the minimum inductor current (ILMIN) of 0 A to reach the maximum
inductor current (ILMAX) in proportion to the on-time period (tON) of PMOS transistor.
Step2.
When PMOS transistor turns “OFF”, L turns NMOS transistor “ON” to maintain IL at ILMAX and IL (i2)
flows into L.
Step3.
IL = i2 decreases gradually and reaches ILMIN after the open-time period (tOPEN) of NMOS transistor
and NMOS transistor turns “OFF”. This is called discontinuous current mode.
As to the continuous current mode, the output current (IOUT) increases and the off-time period (tOFF)
of PMOS transistor ends before IL reaches ILMIN. In the next cycle, PMOS transistor turns “ON” and
NMOS transistor turns “OFF”, then IL increases from IL =ILMIN > 0.
When the buck DC/DC operation is constant, ILMIN and ILMAX during ton of PMOS transistor would be same as
during tOFF of PMOS transistor. The difference of the current between ILMAX and ILMIN represents I as shown
in the following equation 1.
I = ILMAX − ILMIN = VOUT tOPEN / L = (VIN − VOUT) tON / L .......................................................................... (1)
14
RP515x
No.EA-505-190328
VFM Mode
The VFM (Variable Frequency Modulation) mode is adopted as a switching method to achieve a high efficiency
under light load conditions. A switching frequency varies depending on values of input voltage (VIN), output
voltage (VOUT), and output current (IOUT). Check the actual characteristics to avoid the switching noise.
A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the
upper-limit reference voltage (VREFH), a constant voltage is output by a hysteresis control which stops the
switching.
In order to operate within the rated characteristic of inductor and avoid the deteriorated band frequency of
DC superimposed characteristics, when the inductor current (IL) exceeds LX current limit (ILXLIM), the
operation shifts to off-cycle. And when IL drops below the valley current limit (ILXVAL), the operation shift to
on-cycle.
No Load
Light Load
Medium Load
Heavy Load
15
RP515x
No.EA-505-190328
Battery Monitor Section
Timing Chart of Typical Application Circuit
VIN
VCE2
tW
tW
VBM
ADC
Sampling
RP515x Timing Chart of Typical Application Circuit
The RP515x can monitor the battery voltage by connecting BM pin with ADC input pin in MCU. The RP515x
allows the CE2 pin to control the battery monitor's start and stop according to the sampling cycle from the ADC,
reducing the power consumption of the entire system.
During the battery voltage monitoring, waiting time is needed, preferable tw>=10ms, for the CE2 pin to gain
stable VBM.
16
RP515x
No.EA-505-190328
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1.00
0.90
Vin=3.6V
0.80
Vin=5.5V
0.70
2) Standby Current vs Temperature
0.20
StandbyCurrent ISTANDBY[uA]
QuiescentCurrent IQ[uA]
1) Quiescent Current vs Temperature
0.60
0.50
0.40
0.30
0.20
0.10
0.00
0.18
Vin=3.6V
0.16
Vin=5.5V
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
-50
-25
0
25
50
Temperature Ta[℃]
75
100
-50
-25
0
25
50
Temperature Ta[℃]
75
100
1.980
10.0
1.944
8.0
1.908
6.0
1.872
4.0
1.836
2.0
1.800
0.0
1.764
-2.0
1.728
-4.0
1.692
-6.0
1.656
-8.0
1.620
Vout_%
OutputVoltage VOUT [V]
3) Output Voltage vs Temperature
RP515x181x, VIN=3.6V
-10.0
-50
-25
0
25
50
75
Temperature Ta[℃]
4) Efficiency vs Output Current
RP515x121x, Ta=25°C
100
RP515x181x, Ta=25°C
17
RP515x
No.EA-505-190328
RP515x331x, Ta=25°C
5) Output Voltage vs Output Current
RP515x121x, Ta=25°C
RP515x331x, Ta=25°C
18
RP515x181x, Ta=25°C
RP515x
No.EA-505-190328
6) Ripple Voltage vs Output Current
RP515x121x, Ta=25°C
RP515x181x, Ta=25°C
RP515x331x, Ta=25°C
7) Switching Frequency vs Output Current
RP515x121x, Ta=25°C
RP515x181x, Ta=25°C
19
RP515x
No.EA-505-190328
RP515x331x, Ta=25°C
8) Load Transient Response
RP515x181x, VIN=3.6V, Ta=25°C
IOUT=10uA->100mA
IOUT=10uA->100mA->10uA
20
IOUT=100mA->10uA
RP515x
No.EA-505-190328
9) Soft Start Time
RP515x181x, Ta=25°C
VIN=VCE1=0V->3.6V, ⊿t=10μs
VIN=3.6V, VCE1=0V->3.6V, ⊿t=10μs
IOUT=300mA
VIN=VCE1=0V->3.6V, ⊿t=10μs
VIN=3.6V, VCE1=0V->3.6V, ⊿t=10μs
10) BM Supply Current vs Temperature (COUT2 = Ceramic 0.1µF, VIN=3.6V)
RP515xxx3x
RP515xxx4x
21
RP515x
No.EA-505-190328
11) BM Supply Current vs Input Voltage (COUT2 = Ceramic 0.1µF, Ta = 25°C)
RP515xxx3x
RP515xxx4x
12) BM Output Voltage vs Input Voltage (COUT2 = Ceramic 0.1µF, VIN=3.6V)
RP515xxx3x
RP515xxx4x
13) BM Output Voltage vs Temperature (COUT2 = Ceramic 0.1µF, Ta = 25°C)
RP515xxx3x
RP515xxx4x
22
RP515x
No.EA-505-190328
14) BM CE2 Rising / Falling ( COUT2 = Ceramic 0.1µF, 0.22µF, Ta = 25°C)
RP515xxx4x, VIN=3.6V, VCE2 = 0V 3.6V
RP515xxx3x, VIN=3.6V, VCE2 = 0V 3.6V
RP515xxx3x, VIN=5.5V, VCE2 = 0V 5.5V
RP515xxx4x, VIN=5.5V, VCE2 = 0V 5.5V
23
RP515x
No.EA-505-190328
Test Circuit
RP515x
CE1
Signal
LX
VOUT
Buck (Step-down)
DC/DC Converter
PVIN
VIN
L
VOUT
2.2 µH
PGND
COUT1
22 µF
AVIN
AGND
Battery Monitor
CE2
Signal
BM
CIN
VBM
COUT2
10 µF
0.1µF to 0.22 µF
C = Ceramic Capacitor
Test Circuit of Typical Characteristics
Measurement Components of Typical Characteristics
24
Symbol
Capacitance
Manufacture
Parts number
CIN
COUT1
COUT2
L
10μF
22μF
0.1μF
2.2μH
Murata
TAIYO YUDEN
Murata
TOKO
GRM155R60J106ME44
JMK107BBJ226MA-T
GRM155R61A104KA01D
DFE201610P-2R2M
POWER DISSIPATION
WLCSP-9-P2
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-9.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layer (First Layer): 60%
Inner Layers (Second and Third Layers): 100%
Outer Layer (Fourth Layer): 60%
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
1090 mW
Thermal Resistance (ja)
ja = 91°C/W
ja: Junction-to-Ambient Thermal Resistance
1200
1090
Power Dissipation (mW)
1000
800
600
400
200
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
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PACKAGE DIMENSIONS
WLCSP-9-P2
Ver. A
WLCSP-9-P2 Package Dimensions (Unit: mm)
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VISUAL INSPECTION CRITERIA
WLCSP
VI-160823
No.
1
Inspection Items
Package chipping
2
Si surface chipping
3
No bump
Marking miss
4
Inspection Criteria
Figure
A0.2mm is rejected
B0.2mm is rejected
C0.2mm is rejected
And, Package chipping to Si surface
and to bump is rejected.
A0.2mm is rejected
B0.2mm is rejected
C0.2mm is rejected
But, even if A0.2mm, B0.1mm is
acceptable.
No bump is rejected.
To reject incorrect marking, such as
another product name marking or
5
6
7
No marking
Reverse direction of
marking
Defective marking
8
Scratch
9
Stain and Foreign
material
another lot No. marking.
To reject no marking on the package.
To reject reverse direction of marking
character.
To reject unreadable marking.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by scratch.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by stain and foreign material.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
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POWER DISSIPATION
DFN(PLP)2527-10
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 30 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
2500 mW
Thermal Resistance (ja)
ja = 39°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 11°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
3000
2500
Power Dissipation (mW)
2500
2000
1500
1000
500
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
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PACKAGE DIMENSIONS
DFN(PLP)2527-10
Ver. B
DFN(PLP)2527-10 Package Dimensions (mm)
*
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that
this tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
Halogen Free
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
https://www.e-devices.ricoh.co.jp/en/
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