RP604Z501B-E2-F

RP604x Series Ultra-low Quiescent Current (IQ = 0.3 µA), 300 mA, Buck-Boost DC/DC Converter No. EA-415-201216 OVERVIEW The RP604x is a buck-boost converter featuring a minimum supply current and a high efficiency at low-load. The device operates at the low operating quiescent current (IQ = 0.3 µA) to make the most of battery life for the battery driver operated intermittently. KEY BENEFITS ● The low supply current (IQ = 0.3 µA) can achieve making battery life longer and battery’s size-reduction. ● Wide range of input voltage (1.8 V to 5.5 V) can support for every battery from a coin-type battery to a USB port. ● Selectable package: WLCSP-20-P2 or DFN(PLP)2730-12 KEY SPECIFICATIONS • • • • • TYPICAL CHARACTERISTICS Input Voltage: 1.8 V to 5.5 V Output Voltage: 1.6 V to 5.2 V, 0.1 V step Output Voltage Accuracy: ±1.5% Maximum Output Current: 300 mA at Buck Built-in Driver On-resistance (RP604Z, VIN = 3.6 V): PMOS = Typ.0.12 Ω, NMOS = Typ. 0.12 Ω • • • Operating Quiescent Current (IQ ): 0.3 µA Standby Current: 0.01 µA Protection Features: UVLO, OVP, LX Peak Current, VOUT = 3.3 V and Thermal Shutdown PACKAGES OPTIONAL FUNCTIONS The auto-discharge function and the set output voltage (VSET) are user-selectable options. WLCSP-20-P2 1.71 x 2.315 x 0.40(1) mm (1) maximum dimension DFN(PLP)2730-12 2.70 x 3.00 x 0.6(1) mm (1) maximum dimension Product Name Auto-discharge Function RP604xxx1A Disable RP604xxx1B Enable VSET 1.6 V to 5.2 V (0.1 V step) APPLICATIONS • • • • Wearable Appliances: SmartWatch, SmartBand, Healthcare Li-ion/Coin Battery-used Equipment Low-power Wireless Communication Equipment: Bluetooth® Low Energy, ZigBee, WiSunm, ANT Low-power Devices for CPU, Memory, Sensor Device, Energy Harvesting 1 RP604x No. EA-415-201216 SELECTION GUIDE The set output voltage, the auto-discharge function(1) and the package are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free RP604Zxx1$-E2-F WLCSP−20−P2 5,000 pcs Yes Yes DFN(PLP)2730-12 5,000 pcs Yes Yes RP604Kxx1$-TR xx: Specify the set output voltage (VSET) within the range of 1.6 V (16) to 5.2 V (52) in 0.1 V steps. $: Specify the auto-discharge function. Version Auto-discharge Function VSET A B Disable Enable 1.6 V to 5.2 V BLOCK DIAGRAM PVIN BULX BOLX VOUT AVIN VFB PGND CE CE UVLO TSHUT Buck/Boost CTRL AGND RP604xxx1A/ RP604xxx1B Block Diagram (1) Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. 2 RP604x No. EA-415-201216 PIN DESCRIPTIONS Bottom View Top View 1 2 3 4 1 2 3 4 5 5 A B C D D C B A WLCSP-20-P2 Pin Configuration WLCSP-20-P2 Pin Description Pin No. Pin Name Description A5, B5, C5 VOUT Output Voltage Pin A4, B4, C4 BOLX Boost Switching Output Pin A3, B3, C3, D3 PGND Power GND Pin A2, B2, C2 BULX Buck Switching Output Pin A1, B1, C1 PVIN Power Input Voltage Pin D1 AVIN Analog Power Input Voltage Pin D2 CE D4 AGND D5 VFB Chip Enable Pin, Active-high Analog GND Pin Output Voltage Feedback Pin 3 RP604x No. EA-415-201216 Bottom View Top View 12 11 10 9 8 7 7 8 9 10 11 12 * 6 5 4 1 2 3 4 5 6 3 2 1 DFN(PLP)2730-12 Pin Configuration DFN(PLP)2730-12 Pin Description Pin No. Pin Name Description 1 AVIN 2 CE 3 PGND Power GND Pin 4 PGND Power GND Pin 5 AGND Analog GND Pin 6 VFB 7 VOUT Output Voltage Pin 8 BOLX Boost Switching Output Pin 9 PGND Power GND Pin 10 PGND Power GND Pin 11 BULX Buck Switching Output Pin 12 PVIN Power Input Voltage Pin Analog Power Input Voltage Pin Chip Enable Pin, Active-high Output Voltage Feedback Pin * The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane on the board but it is possible to leave the tab floating. 4 RP604x No. EA-415-201216 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings (GND = 0 V) Symbol VIN Parameter A/PVIN Pin Voltage Rating Unit −0.3 to 6.5 V VBULX BULX Pin Voltage −0.3 to VIN + 0.3 V VBOLX BOLX Pin Voltage −0.3 to VOUT + 0.3 V VCE CE Pin Voltage −0.3 to 6.5 V VOUT VOUT Pin Voltage −0.3 to 6.5 V VFB VFB Pin Voltage −0.3 to 6.5 V ILX BULX/BOLX Pin Output Current 900 mA PD Power Dissipation(1) WLCSP-20-P2 JEDEC STD. 51-9 1490 mW DFN(PLP)2730-12 JEDEC STD. 51-7 3100 mW Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Parameter Rating Unit VIN Input Voltage 1.8 to 5.5 V Ta Operating Temperature Range −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information. 5 RP604x No. EA-415-201216 ELECTRICAL CHARACTERISTICS The specifications surrounded by RP604Z/K Electrical Characteristics Symbol Parameter VOUT Output Voltage IQ Operating Quiescent Current are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C. (Ta = 25°C) Test Conditions/Comments VIN = VCE = 3.6 V VIN = VCE = VOUT = 3.6 V, VSET = 3.3V at rest Min. Typ. Max. Unit x 0.985 x 1.015 V µA 0.3 0.01 1 µA −0.025 0 0.025 µA VIN = 5.5 V, VCE = 0 V −0.025 0 0.025 µA VFB Pin Input Current, High VIN = VFB = 5.5 V, VCE = 0 V −0.025 0 0.025 µA IVOUTL VFB Pin Input Current, Low VIN = 5.5 V, VCE = VFB = 0 V −0.025 0 0.025 µA VOVP OVP Threshold Voltage VIN = 3.6 V, rising (detection) VIN = 3.6 V, falling (release) 6.0 5.5 V V RDISN Auto-discharge NMOS On-resistance(1) VIN = 3.6 V, VCE = 0 V 100 Ω VCEH CE Pin Input Voltage, High VIN = 5.5 V VCEL CE Pin Input Voltage, Low VIN = 2.0 V ISTANDBY Standby Current VIN = 5.5 V, VCE = 0 V ICEH CE Pin Input Current, High VIN = VCE = 5.5 V ICEL CE Pin Input Current, Low IVOUTH RONP RONN 1.0 V 0.4 V RP604Z VIN = 3.6 V, ILX = −100 mA 0.12 Ω RP604K VIN = 3.6 V, ILX = −100 mA 0.15 Ω RP604Z VIN = 3.6 V, ILX = −100 mA 0.12 Ω RP604K VIN = 3.6 V, ILX = −100 mA 0.15 Ω 140 100 20 °C °C ms mA PMOS On-resistance NMOS On-resistance TTSD TTSR Thermal Shutdown Threshold Temperature tSTART Soft-start Time Tj, rising (detection) Tj, falling (release) VIN = VCE = 3.6 V ILXLIM LX Current Limit VIN = VCE = 3.6 V 600 900 VIN = VCE, falling (detection) 1.40 1.50 1.65 V VIN = VCE, rising (release) 1.55 1.65 1.80 V VUVLOF VUVLOR UVLO Threshold Voltage All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C). Unless otherwise noted, the test runs with “Open-loop Control” (GND = 0 V). (1) 6 RP604xxx1B only RP604x No. EA-415-201216 THEORY OF OPERATION Soft-start Time Starting-up with CE Pin The IC starts to operate when the CE pin voltage (VCE) exceeds the threshold voltage. The threshold voltage is preset between CE “H” input voltage (VCEH) and CE “L” input voltage (VCEL). After the start-up of the IC, softstart circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in the IC gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises accompanying VREF’s increase. Soft-start time (tSTART) starts when soft-start circuit is activated, and ends when the reference voltage reaches the specified voltage. Soft start time is not always equal to the turn-on speed of the DC/DC converter. Note that the turn-on speed could be affected by the power supply capacity, the output current, the inductance value and the COUT value. VCEH Threshold Level CE Pin Input Voltage VCEL Soft-start Time (VCE) IC Internal Reference Voltage (VREF) Lx Voltage Soft-start Circuit operation starts. (VLX) Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Timing Chart: Starting-up with CE Pin Starting-up with Power Supply After the power-on, when VIN exceeds the UVLO released voltage (VUVLOR), the IC starts to operate. Then, soft-start circuit starts to operate and after a certain period of time, VREF gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises accompanying VREF’s increase. Soft-start time starts when soft-start circuit is activated, and ends when VREF reaches the specified voltage. Note that the turn-on speed of VOUT could be affected by the power supply capacity, the output current, the inductance value, the COUT value and the turn-on speed of VIN determined by CIN. Input Voltage VSET VUVLOR VUVLOF (VIN) Soft-start Time IC Internal Reference Voltage (VREF) Lx Voltage (VLX) VOUT Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Timing Chart: Starting-up with Power Supply 7 RP604x No. EA-415-201216 Undervoltage Lockout (UVLO) Circuit If the VIN becomes lower than the UVLO detector threshold (VUVLOF), the UVLO circuit starts to operate, VREF stops, and P-channel and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance value and the load. To restart the operation, VIN needs to be higher than VUVLOR. Overvoltage Protection (OVP) Circuit If the VOUT becomes higher than the OVP detector threshold (VOVP), the OVP circuit starts to operate, P-channel and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance value and the load. Overcurrent Protection Circuit Overcurrent protection circuit supervises the inductor peak current (the peak current flowing through Pch Tr (SW1) in each switching cycle, and if the current exceeds the BULX current limit (ILXLIM), it turns off Pch Tr (SW1). ILXLIM of the RP604x is set to Typ. 0.9 A. BULX PVIN BOLX L SW1 SW2 SW4 VOUT SW3 PGND Simplified Diagram of Output Switches 8 RP604x No. EA-415-201216 VFM Mode The VFM (Variable Frequency Modulation) mode is adopted as a switching method to achieve a high efficiency under light load conditions. A switching frequency varies depending on values of input voltage (VIN), output voltage (VOUT), and output current (IOUT). Check the actual characteristics to avoid the switching noise. A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the upper-limit reference voltage (VREFH), a constant voltage is output by a hysteresis control which stops the switching. In order to operate within the rated characteristic of inductor and avoid the deteriorated band frequency of DC superimposed characteristics, when the inductor current (IL) exceeds LX current limit (ILXLIM), the operation shifts to off-cycle. And when IL drops below the valley current limit (ILXVAL), the operation shifts to on-cycle. VOUT　 VREFH　 VOUT　 VREFL　 ILXLIM　 VREFH　 VREFL　 ILXLIM　 I L　 I L　 0 0 No Load Light Load VREFH　 VREFH　 VOUT　 VOUT　 VREFL　 ILXLIM　 VREFL　 ILXLIM　 I L　 I L　 ILXVAL　 0 Medium Load ILXVAL　 0 Heavy Load 9 RP604x No. EA-415-201216 APPLICATION INFORMATION BULX L Control CE BOLX PVIN CIN RP604x AVIN VFB GND PGND RP604x Typical Application Circuit Recommended External Components Symbol CIN COUT L 10 Load VOUT Description 10 µF or more, Ceramic Capacitor 22 µF, Ceramic Capacitor 2.2 µH, Inductor COUT RP604x No. EA-415-201216 TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points. Refer to PCB Layout below. • Use ceramic capacitors with a low equivalent series resistance (ESR), considering the bias characteristics and input/ output voltage. • When the built-in switches are turned off, the inductor may generate a spike-shaped high voltage. Use the high-breakdown voltage capacitor (COUT) which output voltage is 1.5 times or more than the set output voltage. • Use an inductor that has a low DC resistance, has an enough tolerable current and is less likely to cause magnetic saturation. If the inductance value is extremely small, the peak current of LX may increase. When the peak current of LX reaches to the LX limit current (ILXLIM), overcurrent protection circuit starts to operate. When selecting the inductor, consider the peak current of LX pin (ILXMAX). • When an intermediate voltage other than VIN or GND is input to the CE pin, a supply current may be increased with a through current of a logic circuit in the IC. The CE pin is neither pulled up nor pulled down, therefore an operation is not stable at open. 11 RP604x No. EA-415-201216 PCB Layout RP604Z (Package: WLCSP-20-P2) PCB Layout Topside Backside RP604K (Package: DFN(PLP)2730-12) PCB Layout Topside 12 Backside RP604x No. EA-415-201216 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Current vs. Efficiency with Different Input Voltages RP604Z331x 2) Output Current vs. Output Voltage with Different Input Voltages RP604Z331x 3) Temperature vs. Standby Current RP604Z331x,VIN = 5.5 V 13 RP604x No. EA-415-201216 4) Input Voltage vs. Output Current RP604Z161x, IOUT = (IIN = 300 mA) RP604Z521x, IOUT = (IIN = 300 mA) 5) Output Ripple vs. Output Current RP604Z331x 14 RP604Z331x, IOUT = (IIN = 300 mA) RP604x No. EA-415-201216 6) Input Voltage vs. Output Voltage RP604Z331X, IOUT = 1 mA 7) Starting-up/ Shutting-down Waveform with CE Pin RP604Z331x, IOUT = 0 mA 8) VOUT Waveform RP604Z331x, VIN = 3.6 V, IOUT = 10 mA RP604Z331X, IOUT = 100 mA RP604Z331x, IOUT = 0 mA RP604Z331x, VIN = 3.6 V, IOUT = 100 mA 15 RP604x No. EA-415-201216 9) Load Transient Response RP604Z331x, VIN = 3.6 V, IOUT = 0.01 mA ←→ 100 mA 10) Input Transient Response RP604Z331x, VIN = 2.5 V ←→ 4.5 V, IOUT = 1 mA 11) Temperature vs. Supply Current 16 RP604Z331x, VIN = 2.5 V ←→ 4.5 V, IOUT = 100 mA POWER DISSIPATION WLCSP-20-P2 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-9. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm Copper Ratio Outer Layers (First and Fourth Layers): 60% Inner Layers (Second and Third Layers): 100% (Ta = 25°C, Tjmax = 125°C) Measurement Result Item Measurement Result Power Dissipation 1490 mW Thermal Resistance (ja) ja = 67 °C/W ja: Junction-to-Ambient Thermal Resistance 101.5 114.5 Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS WLCSP-20-P2 Ver. A WLCSP-20-P2 Package Dimensions (Unit: mm) i Visual Inspection Criteria WLCSP VI-160823 No. 1 Inspection Items Package chipping 2 Si surface chipping 3 No bump Marking miss 4 Inspection Criteria Figure A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected And, Package chipping to Si surface and to bump is rejected. A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected But, even if A≥0.2mm, B≤0.1mm is acceptable. No bump is rejected. To reject incorrect marking, such as another product name marking or 5 6 7 No marking Reverse direction of marking Defective marking 8 Scratch 9 Stain and Foreign material another lot No. marking. To reject no marking on the package. To reject reverse direction of marking character. To reject unreadable marking. (Microscope: X15/ White LED/ Viewed from vertical direction) To reject unreadable marking character by scratch. (Microscope: X15/ White LED/ Viewed from vertical direction) To reject unreadable marking character by stain and foreign material. (Microscope: X15/ White LED/ Viewed from vertical direction) i POWER DISSIPATION DFN(PLP)2730-12 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 23 pcs (Ta = 25°C, Tjmax = 125°C) Measurement Result Item Measurement Result Power Dissipation 3100 mW Thermal Resistance (ja) ja = 32°C/W Thermal Characterization Parameter (ψjt) ψjt = 8°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS DFN(PLP)2730-12 Ver. A 7 2.700.05  0.50.05 6 0.250.05  0.575±0.025 INDEX 12 C 0.05 0.250.05 B 1.700.05 3.000.05 2.700.05 A 1 0.50 0.250.05 0.05 M AB Bottom View S 0.05 S DFN(PLP)2730-12 Package Dimensions (Unit: mm) * ∗The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane on the board but it is possible to leave the tab floating. i 1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to Ricoh sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of Ricoh. 3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein. 4. The technical information described in this document shows typical characteristics of and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under Ricoh's or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting to use AOI. 11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or the technical information. Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since April 1, 2012. Official website https://www.n-redc.co.jp/en/ Contact us https://www.n-redc.co.jp/en/buy/