RP605Z334A-E2-F

RP605x Series 300mA Ultra-low Power Buck Boost DC/DC Converter with Battery Monitor No. EA-516-210611 OVERVIEW RP605x is an ultra-low power DC/DC converter with a Battery Monitor (BM). The battery monitor divides the input voltage (VIN) into 1/3 or 1/4 and directly provides the buffered voltage to a low-voltage AD converter in MCU, it monitors the remaining quantity of the battery. KEY BENEFITS ● Long-time operation of battery powered equipment and downsizing of battery due to the ultra-low consumption current (IQ = 0.3 µA). ● Reducing components and saving space by combining DC/DC and BM into a single chip. ● Suitable for coin batteries and USB ports due to its wide input voltage range from 1.8 V to 5.5 V PACKAGES (unit: mm) KEY SPECIFICATIONS DC/DC Section ● Supply Current: Typ. 0.3 μA ● Output Current: 300 mA ● Input Voltage Range: 1.8 V to 5.5 V ● Output Voltage Range: 1.6 V to 5.2 V ● Output Voltage Accuracy: ±1.5% Battery Monitor Section ● Output Voltage: VIN/3 (RP605xxx3x) VIN/4 (RP605xxx4x) ● Supply Current: Typ. 0.1 μA WLCSP-20-P3 DFN(PLP)2730-12 2.315 x 1.71 x 0.36 3.00 x 2.70 x 0.6 • TYPICAL APPLICATIONS RP605x Signal VIN CE1 BULX PVIN BOLX VFB Buck-Boost DC/DC Converter MCU L 2.2µH VOUT VOUT VCC PGND COUT1 AVIN Signal CIN　　 ≥ 10µF CE2 AGND Battery Monitor BM 22µF VBM ADC COUT2 0.1µF to 0.22µF APPLICATIONS • • • • Devices with Coin Cell Battery and Lithium Ion Battery Wearable devises including Smart watch, Smart band, and Health monitor Low power RF Modules including: Bluetooth® LE, Zigbee, WiSun and ANT Low power CPUs, Memory, Sensor device and Energy harvester 1 RP605x No. EA-516-210611 SELECTION GUIDE The DC/DC set output voltage, the division ratio of BM output, the DC/DC auto-discharge function (1), and the package are user-selectable options. Selection Guide Product Name RP605Zxx#$-E2-F RP605Kxx#$-TR Package Quantity per Reel Pb Free Halogen Free WLCSP-20-P3 5,000 pcs Yes Yes DFN(PLP)2730-12 5,000 pcs Yes Yes xx: Specify the DC/DC set output voltage (VSET) Fixed output voltage type: 1.6 V (16) to 5.2 V (52) in 0.1 V step Refer to the Product-specific Electrical Characteristics for detail information #: Specify the division ratio of BM output 3：VIN/3 4：VIN/4 $: Specify the DC/DC auto-discharge option. A: DC/DC auto-discharge is not included B: DC/DC auto-discharge is included (1) Auto-discharge function quickly lowers the output voltage to 0 V by releasing the electrical charge accumulated in the external capacitor when the chip enable signal is switched from the active mode to the standby mode. 2 RP605x No. EA-516-210611 BLOCK DIAGRAMS PVIN BULX BOLX VOUT OVP PGND Switching Control (Buck/Boost) CE1 VFB CE Enable Control TSHUT AVIN AGND UVLO + BM CE2 Enable Control RP605xxxxA Block Diagram: DC/DC auto-discharge is not included PVIN BULX BOLX VOUT OVP PGND Switching Control (Buck/Boost) CE1 VFB CE Enable Control TSHUT AVIN AGND UVLO + BM CE2 Enable Control RP605xxxxB Block Diagram: DC/DC auto-discharge is included 3 RP605x No. EA-516-210611 PIN DESCRIPTIONS Top View Bottom View RP605Z (WLCSP-20-P3) Pin Configuration RP605Z Pin Description Pin No. Symbol Description A5, B5 VOUT DC/DC Output Pin A4, B4, C4 BOLX Boost Switching Output LX Pin A3, B3, C3 PGND Power Ground Pin A2, B2, C2 BULX Buck Switching Output LX Pin A1, B1, C1 PVIN Power Source Input Pin C5 VFB Feedback Pin D1 AVIN Analog Power Supply Pin D2 CE1 DC/DC Enable Pin (Active-high) D3 AGND D4 CE2 Battery Monitor Enable Pin (Active-high) D5 BM Battery Monitor Output Pin Analog Ground Pin 4 RP605x No. EA-516-210611 Top View Bottom View 12 11 10 9 8 7 7 8 9 10 11 12 * 1 2 3 4 5 6 6 5 4 3 2 1 RP605K [DFN(PLP)2730-12] Pin Configuration RP605K Pin Description Pin No. Symbol Description 1 AVIN Analog Power Supply Pin 2 CE1 DC/DC Enable Pin (Active-high) 3 AGND 4 CE2 Battery Monitor Enable Pin (Active-high) 5 BM Battery Monitor Output Pin 6 VFB Feedback Pin 7 VOUT DC/DC Output Pin 8 BOLX Boost Switching Output LX Pin 9 PGND Power Ground Pin 10 PGND Power Ground Pin 11 BULX Buck Switching Output LX Pin 12 PVIN Power Source Input Pin Analog Ground Pin * The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane on the board, but it is possible to leave the tab floating. 5 RP605x No. EA-516-210611 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol VIN Item Input Voltage Rating Unit −0.3 to 6.5 V VBULX BULX Pin Voltage −0.3 to VIN + 0.3 V VBOLX BOLX Pin Voltage −0.3 to VOUT + 0.3 V VCE1 CE1 Pin Voltage −0.3 to 6.5 V VCE2 CE2 Pin Voltage −0.3 to 6.5 V VOUT VOUT Pin Voltage -0.3 to 6.5 V VFB VFB Pin Voltage −0.3 to 6.5 V VBM BM Pin Voltage −0.3 to VIN + 0.3 V PD Power Dissipation Refer to Appendix “POWER DISSIPATION” Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Item Rating RP605xxx3x 1.8 to 5.5 RP605xxx4x 2.4 to 5.5 VIN Input Voltage Ta Operating Temperature −40 to 85 Unit V °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. 6 RP605x No. EA-516-210611 ELECTRICAL CHARACTERISTICS The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C. RP605x Electrical Characteristics: DC/DC Section Symbol Parameter Conditions VOUT IQ ISTANDBY Output voltage Operating quiescent current VIN = VCE1 = 3.6 V VIN = VCE1 = VOUT = 3.6 V, VSET = 3.3V, at rest Standby current VIN = 5.5 V, VCE1 = 0 V ICE1H CE1 pin input current, high VIN = VCE1 = 5.5 V ICE1L CE1 pin input current, low IVFBH Min. Typ. x 0.985 (Ta = 25°C) Max. Unit x 1.015 0.3 V µA 0.01 1 µA −0.025 0 0.025 µA VIN = 5.5 V, VCE1 = 0 V −0.025 0 0.025 µA VFB pin input current, high VIN = VFB = 5.5 V, VCE1 = 0 V −0.025 0 0.025 µA IVFBL VFB pin input current, low VIN = 5.5 V, VCE1 = VFB = 0 V −0.025 0 0.025 µA VOVP Overvoltage Protection (OVP) Threshold RDISN VIN = 3.6 V , Rising (Detection) 6.0 V VIN = 3.6 V , Falling (Release) 5.5 V Auto-discharge NMOS on-resistance VIN = 3.6 V, VCE1 = 0 V RP605xxxxB only 100 Ω VCE1H CE1 pin input voltage, high VIN = 5.5 V VCE1L CE1 pin input voltage, low VIN = 1.8 V RONP RONN 1.0 V 0.4 V RP605Z VIN = 3.6 V, ILX = −100 mA 0.12 Ω RP605K VIN = 3.6 V, ILX = −100 mA 0.15 Ω RP605Z VIN = 3.6 V, ILX = −100 mA 0.12 Ω RP605K VIN = 3.6 V, ILX = −100 mA 0.15 Ω 140 100 20 °C °C ms mA PMOS on-resistance NMOS on-resistance TTSD TTSR Thermal Shutdown Threshold Temperature tSTART Soft-start time Tj, Rising (Detection) Tj, Falling (Release) VIN = VCE1 = 3.6 V ILXLIM BULX Limiting current VIN = VCE1 = 3.6 V 600 900 Undervoltage Lockout (UVLO) Threshold VIN = VCE1, Falling (Detection) 1.40 1.50 1.65 V VIN = VCE1, Rising (Release) 1.55 1.65 1.80 V VUVLOF VUVLOR All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C). Test circuit is operated under condition of “Open Loop Control” (GND = 0 V), unless otherwise specified. 7 RP605x No. EA-516-210611 ELECTRICAL CHARACTERISTICS (Continued) The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C. (Ta = 25°C) RP605x Electrical Characteristics: Battery Monitor Section Symbol Parameter Conditions Min. Typ. Max. RP605xxx3x VIN/3-30 VIN/3 VIN/3+30 RP605xxx4x VIN/4-30 VIN/4 VIN/4+30 VBM Output voltage VIN = 3.6 V, −10μA≤ IBM≤10μA IBM Output current VIN = 3.6 V ISSBM Supply current IBM = 0 μA VCE2H CE2 input voltage, high VIN = 5.5 V VCE2L CE2 input voltage, low VIN = 1.8 V RDISNBM Auto-discharge NMOS. on-resistance VIN = 4.0 V, VCE2 = 0 V −10 10 0.1 Unit mV µA µA 1.0 V 0.4 50 V Ω All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C) 8 RP605x No. EA-516-210611 Product-specific Electrical Characteristics Product Name RP605x16xx RP605x18xx RP605x20xx RP605x24xx RP605x25xx RP605x28xx RP605x30xx RP605x31xx RP605x33xx RP605x36xx RP605x40xx RP605x50xx RP605x52xx (Ta = 25°C) Min. 1.576 1.773 1.970 2.364 2.463 2.758 2.955 3.054 3.251 3.546 3.940 4.925 5.122 VOUT [V] Typ. 1.600 1.800 2.000 2.400 2.500 2.800 3.000 3.100 3.300 3.600 4.000 5.000 5.200 Max. 1.624 1.827 2.030 2.436 2.537 2.842 3.045 3.146 3.349 3.654 4.060 5.075 5.278 9 RP605x No. EA-516-210611 TYPICAL APPLICATION CIRCUIT RP605x Signal VIN CE1 BULX PVIN BOLX VFB Buck-Boost DC/DC Converter MCU L 2.2µH VOUT VOUT VCC PGND COUT1 AVIN Signal CE2 AGND Battery Monitor BM CIN　　 22µF VBM ADC COUT2 ≥ 10µF 0.1µF to 0.22µF RP605x Typical Application Circuit 10 RP605x No. EA-516-210611 TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on the peripheral circuit. A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points. • Use carefully with the distance between the VFB pin and the wiring that causes noise. • Noise reduction is possible by adding a filter component such as a resistor to the VFB pin • Use ceramic capacitors with a low equivalent series resistance (ESR), considering the bias characteristics and input/output voltages. • When the built-in switches are turned off, the inductor may generate a spike-shaped high voltage. Use the high-breakdown voltage capacitor (COUT1) which output voltage is 1.5 times or more than the set output voltage. • Use an inductor that has a low DC resistance, has an enough tolerable current and is less likely to cause magnetic saturation. • The CE1 and CE2 pins are neither pulled up nor pulled down, therefore an operation is not stable at open. • The thermal shutdown function protects the IC from fuming and ignition but does not ensure the IC’s reliability or keep the IC below the absolute maximum ratings. The thermal shutdown function only works on the heat generated by normal IC operation such as latch-up and overvoltage application. • The thermal shutdown function operates in a state over the absolute maximum ratings, therefore the thermal shutdown function should not be used for a system design. 11 RP605x No. EA-516-210611 THEORY OF OPERATION DC/DC Section Soft-start Time Starting-up with CE1 Pin The IC starts to operate when the CE1 pin voltage (VCE1) exceeds the threshold voltage. The threshold voltage is preset between CE1 “High” input voltage (VCE1H) and CE1 “Low” input voltage (VCE1L). After the start-up of the IC, soft-start circuit starts to operate. Then, after a certain period, the reference voltage (VREF) in the IC gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises as VREF increases. Soft-start time (tSTART) indicates the period from the time soft-start circuit gets activated to the time VREF reaches the specified voltage. tSTART is not always equal to the turn-on speed of the DC/DC converter. Note that the turn-on speed could be affected by the power supply capacity, the output current (IOUT), the inductance and the output capacitor value (COUT1). VCE1H CE1 Pin Input Voltage (VCE1) Threshold Level VCE1L Soft-start Time IC Internal Reference Voltage (VREF) Lx Voltage (VLX) Soft-start Circuit operation starts. Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Timing Chart: Starting-up with CE1 Pin Starting-up with Power Supply After the power-on, when VIN exceeds the UVLO release voltage (VUVLOR), the IC starts to operate. Then, softstart circuit starts to operate and after a certain period, VREF gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage, and after that the output voltage rises as VREF increases. The turn-on speed of VOUT could be affected by following conditions: 1. The VIN turn-on speed determined by the power supply to the IC and the CIN 2. The output capacitor value (COUT1) and the output current (IOUT) Input Voltage (VIN) VSET VUVLOR VUVLOF Soft-start Time IC Internal Reference Voltage (VREF) Lx Voltage (VLX) VOUT Output Voltage (VOUT) Depending on Power Supply, Load Current, External Components Timing Chart: Starting-up with Power Supply 12 RP605x No. EA-516-210611 Undervoltage Lockout (UVLO) Circuit If the VIN becomes lower than the UVLO detector threshold (VUVLOF), the UVLO circuit starts to operate, VREF stops, and PMOS and NMOS built-in switch transistors turn “OFF”. To restart the operation, VIN needs to be higher than VUVLOR. Overvoltage Protection (OVP) Circuit If the VOUT becomes higher than the OVP detector threshold (VOVP), the OVP circuit starts to operate and turs off the built-in switch transistors. As a result, VOUT drops according to the COUT capacitance value and the load. Overcurrent Protection Circuit Overcurrent protection circuit supervises the inductor peak current (the peak current flowing through PMOS Tr (SW1) in each switching cycle, and if the current exceeds the BULX current limit (ILXLIM), it turns off PMOS Tr (SW1). ILXLIM of the RP605x is set to Typ. 0.9 A. BULX PVIN BOLX L SW1 SW2 SW4 VOUT SW3 PGND Simplified Diagram of Output Switches Thermal Shutdown Circuit When the junction temperature exceeds the thermal shutdown detector threshold TTSD (Typ.140°C), the output of the DC/DC section is shut off and self-heating is suppressed. The DC/DC restarts when the junction temperature falls below the thermal shutdown release threshold TTSR (Typ.100°C), and the soft-start function is operated like as CE1’s start-up. 13 RP605x No. EA-516-210611 VFM Mode The VFM (Variable Frequency Modulation) mode is adopted as a switching method to achieve a high efficiency under light load conditions. A switching frequency varies depending on values of input voltage (VIN), output voltage (VOUT), and output current (IOUT). Check the actual characteristics to avoid the switching noise. A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the upper-limit reference voltage (VREFH), a constant voltage is output by a hysteresis control which stops the switching. In order to operate within the rated characteristic of inductor and avoid the deteriorated band frequency of DC superimposed characteristics, when the inductor current (IL) exceeds LX current limit (ILXLIM), the operation shifts to off-cycle. And when IL drops below the valley current limit (ILXVAL), the operation shifts to on-cycle. VOUT　 VREFH　 VOUT　 VREFL　 ILXLIM　 VREFH　 VREFL　 ILXLIM　 I L　 I L　 0 0 No Load Light Load VREFH　 VREFH　 VOUT　 VOUT　 VREFL　 ILXLIM　 VREFL　 ILXLIM　 I L　 I L　 ILXVAL　 0 Medium Load ILXVAL　 0 Heavy Load 14 RP605x No. EA-516-210611 Battery Monitor Section Timing Chart of Typical Application Circuit VIN VCE2 VBM tW tW ADC Sampling RP605x Timing Chart of Typical Application Circuit The RP605x can monitor the battery voltage by connecting BM pin with ADC input pin in MCU. The RP605x allows the CE2 pin to control the battery monitor's start and stop according to the sampling cycle from the ADC, reducing the power consumption of the entire system. During the battery voltage monitoring, waiting time (tw) is needed, recommended tw ≥ 10ms, for the CE2 pin to gain stable VBM. 15 RP605x No. EA-516-210611 APPLICATION INFORMATION PCB Layout RP605Z (Package: WLCSP-20-P3) PCB Layout Top Layer Bottom Layer RP605K (Package: DFN(PLP)2730-12) PCB Layout Top Layer Bottom Layer 16 RP605x No. EA-516-210611 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. DC/DC Section 1) Efficiency vs. Output Current RP605x33xx, Ta = 25°C 2) Output Voltage vs. Output Current RP605x33xx, Ta = 25°C 3) Standby Current vs. Temperature RP605x33xx, VIN = 5.5V 17 RP605x No. EA-516-210611 4) Output Current vs. Input Voltage RP605x16xx, VIN = 1.8 to 3.6V, IOUT = (IIN = 300mA) RP605x33xx, VIN = 1.8 to 5.5V, IOUT = (IIN = 300mA) RP605x52xx, VIN = 2.3 to 5.5V, IOUT = (IIN = 300mA) 5) Output Ripple vs. Output Current RP605x33xx, Ta = 25°C 18 RP605x No. EA-516-210611 6) Output Voltage vs. Input Voltage RP605x33xx, IOUT = 1mA, Ta = 25°C RP605x33xx, IOUT = 100mA, Ta = 25°C 7) Starting-up/ Shutting-down Waveform with CE1 Pin RP605x33xB, VIN = 3.6V, CE1 = 0V ↔ 3.6V, IOUT = 0mA, Ta = 25°C (at Starting-up) 8) VOUT Pin Waveform RP605x33xx, VIN = 3.6V, IOUT = 10mA, Ta = 25°C (at Shutting-down) RP605x33xx, VIN = 3.6V, IOUT = 100mA, Ta = 25°C 19 RP605x No. EA-516-210611 9) Load Transient Response RP605x33xx, VIN = 3.6V, IOUT = 0.01mA ↔ 100mA, Ta = 25°C 10) Input Transient Response RP605x33xx, VIN = 2.5V ↔ 4.5V, IOUT = 1mA, Ta = 25°C RP605x33xx, VIN = 2.5V ↔ 4.5V, IOUT = 100mA, Ta = 25°C 11) Supply Current vs. Temperature RP605x33xx 20 RP605x No. EA-516-210611 Battery Monitor Section 12) Output Voltage vs. Temperature RP605xxx3x, VIN = 3.6V RP605xxx4x, VIN = 3.6V 13) Output Voltage vs. Input Voltage RP605xxx3x, VIN = 5.5V to Minimum Voltage, Ta = 25°C RP605xxx4x, VIN = 5.5V to Minimum Voltage, Ta = 25°C 14) Supply Current vs. Temperature RP605xxx3x, VIN = 3.6V RP605xxx4x, VIN = 3.6V 21 RP605x No. EA-516-210611 15) Supply Current vs. Input Voltage RP605xxx3x, VIN = 5.5V to Minimum Voltage, Ta = 25°C RP605xxx4x, VIN = 5.5V to Minimum Voltage, Ta = 25°C 16) Starting-up/ Shutting-down Waveform with CE2 Pin RP605xxx3x, VIN = 3.6V, Ta = 25°C RP605xxx4x, VIN = 3.6V, Ta = 25°C RP605xxx3x, VIN = 5.5V, Ta = 25°C RP605xxx4x, VIN = 5.5V, Ta = 25°C 22 RP605x No. EA-516-210611 Test Circuit RP605x Signal VIN CE1 BULX PVIN BOLX Buck-Boost DC/DC Converter VFB MCU L 2.2µH VOUT VOUT VCC PGND COUT1 AVIN Battery Monitor CE2 Signal 22µF AGND BM VBM CIN　　 ADC COUT2 ≥ 10µF 0.1µF ～ 0.22µF Test Circuit for Typical Characteristics Measurement Components Symbol Capacitance Manufacture Parts number CIN COUT1 COUT2 10μF 22μF 0.1μF Murata Taiyo Yuden Murata GRM155R60J106M JMK107BBJ226MA GRM155R61A104K L 2.2μH TDK MLP2520H2R2ST0S1 Measurement Components for Typical Characteristics 23 POWER DISSIPATION WLCSP-20-P3 PD-WLCSP-20-P3-(85125)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm Copper Ratio Outer Layer (First Layer): 10% Inner Layers (Second and Third Layers): 99.5 x 99.5mm 100% Outer Layer (Fourth Layer): 10% Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 1210 mW Thermal Resistance (ja) ja = 82°C/W ja: Junction-to-Ambient Thermal Resistance 1400 1210 Power Dissipation (mW) 1200 1000 800 600 400 200 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS WLCSP-20-P3 DM-WLCSP-20-P3-JE-A WLCSP-20-P3 Package Dimensions i Visual Inspection Criteria WLCSP VI-160823 No. 1 Inspection Items Package chipping 2 Si surface chipping 3 No bump Marking miss 4 Inspection Criteria Figure A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected And, Package chipping to Si surface and to bump is rejected. A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected But, even if A≥0.2mm, B≤0.1mm is acceptable. No bump is rejected. To reject incorrect marking, such as another product name marking or 5 6 7 No marking Reverse direction of marking Defective marking 8 Scratch 9 Stain and Foreign material another lot No. marking. To reject no marking on the package. To reject reverse direction of marking character. To reject unreadable marking. (Microscope: X15/ White LED/ Viewed from vertical direction) To reject unreadable marking character by scratch. (Microscope: X15/ White LED/ Viewed from vertical direction) To reject unreadable marking character by stain and foreign material. (Microscope: X15/ White LED/ Viewed from vertical direction) i POWER DISSIPATION DFN(PLP)2730-12 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 23 pcs (Ta = 25°C, Tjmax = 125°C) Measurement Result Item Measurement Result Power Dissipation 3100 mW Thermal Resistance (ja) ja = 32°C/W Thermal Characterization Parameter (ψjt) ψjt = 8°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern i PACKAGE DIMENSIONS DFN(PLP)2730-12 DM-DFN(PNP)2730-12-JE-B DFN(PLP)2730-12 Package Dimensions (Unit: mm) i 1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of our company. 3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein. 4. The technical information described in this document shows typical characteristics of and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our company's or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI. 11. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/