BA12004DF-ZE2

Datasheet 7 Circuits Darlington Transistor Array General Description Packages Features ■ ■ ■ ■ ■ W(Typ) x D(Typ) x H(Max) 9.90mm x 6.00mm x 1.725mm Built-in 7 circuits High output break down voltage High DC output current gain Built-in input resistor to limit base current Built-in output surge absorption clamp diode Applications ■ ■ ■ ■ SOP-J16A e N co ew m m D es en ig de ns d f BA12003DF-Z, BA12004DF-Z are darlington transistor array consist of 7circuits, input resistor to limit base current and output surge absorption clamp diode. or BA12003DF-Z BA12004DF-Z SOP-J16A BA12003DF-Z / BA12004DF-Z Motor Drivers LED Drivers Solenoid Drivers Low Side Switch Key Specifications ■ ■ ■ ■ ■ ■ Output break down voltage： VCE=60V(max) Output current： Io=500mA/ch(max) Operating supply voltage range： -0.5V to +30V Operating temperature range： -40°C to +85°C DC current gain： hfe=1000(min) Input resistor： BA12003DF-Z Rin=2.7kΩ BA12004DF-Z Rin=10.5kΩ Typical Application Circuit VCC VCC 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 N ot R VCC μCOM ○Product structure: Silicon integrated circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has not designed protection against radioactive rays 1/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Pin Configuration Block Diagram SOP-J16A (TOP VIEW) 16 OUT OUT OUT OUT OUT OUT OUT COM 2 3 6 1 4 5 7 15 14 13 12 11 1 2 3 4 5 6 IN1 IN2 IN3 IN4 IN5 IN6 10 14 13 12 11 10 9 9 e N co ew m m D es en ig de ns d f or 16 15 7 1 8 2 3 4 5 6 7 8 IN7 GND Pin Description Pin No. 1 2 3 4 5 6 7 Function Pin No. Pin Name Function IN1 Input 1 9 COM Clamp diode cathode IN2 Input 2 10 OUT7 Output 7 IN3 Input 3 11 OUT6 Output 6 IN4 Input 4 12 OUT5 Output 5 IN5 Input 5 13 OUT4 Output 4 IN6 Input 6 14 OUT3 Output 3 IN7 Input 7 15 OUT2 Output 2 GND Ground 16 OUT1 Output 1 R 8 Pin Name I/O Equivalence Circuit N ot COM [Pin.9] COM [Pin.9] OUT 2.7kΩ [Pin.10 to 16] IN [Pin.1 to 7] OUT 10.5kΩ [Pin.10 to 16] IN [Pin.1 to 7] 7.2kΩ 3kΩ 7.2kΩ GND [Pin.8] 3kΩ GND [Pin.8] BA12004DF-Z BA12003DF-Z Note : The diode indicating the junction with a dotted line is a parasitic element. Note : The input and output parasitic diodes cannot be used as clamp diodes. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Symbol Rating Unit Output Voltage VCE -0.5 to +60 V Output Current IO 500 mA/circuit Input Voltage VI -0.5 to +30 V Diode Reverse Voltage VR 60 V Diode Forward Current IF 500 mA/ circuit GND Terminal Current IGND 2.3(Note 1) A e N co ew m m D es en ig de ns d f Parameter or Absolute Maximum Ratings (TA=25℃) Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C (Note 1) Pulse width≤20ms, Duty Cycle≤10%, 7 circuits flow the same current. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter SOP-J16A Symbol Junction to Ambient Junction to Top Characterization Parameter(Note 2) Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 169.7 115.4 °C/W ΨJT 21 20 °C/W (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Thickness 70μm R Copper Pattern Footprints and Traces (Note 4)Using a PCB board based on JESD51-7. ot Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Thickness Copper Pattern Thickness Copper Pattern Thickness 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm N Copper Pattern Footprints and Traces www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Electrical Characteristics (Unless otherwise specified, GND=0V TA=25°C) Limit Symbol Min Typ Max Unit Output Leakage Current IL - - 10 µA Output DC Current Gain hFE 1000 2400 - Output Saturation Voltage1 VCEsat1 - 0.94 Output Saturation Voltage2 VCEsat2 - Output Saturation Voltage3 VCEsat3 BA12003D Input Voltage1 Input Voltage3 1 - VCE=2.0V, IO=350mA 2 1.1 V IO=100mA, II=250μA 2 1.14 1.3 V IO=200mA, II=350μA 2 - 1.46 1.6 V IO=350mA, II=500μA 2 2.0 - V VCE=2.0V, IO=100mA 3 5.0 - - e N co ew m m D es en ig de ns d f Input Voltage2 VCE=60V VI1 BA12004D BA12003D 2.4 - - 6.0 - - 3.4 - - 8.0 - - 0.90 1.35 VI2 BA12004D BA12003D VI3 BA12004D BA12003D Input Current Test Circuit Conditions or Parameter II - V VCE=2.0V, IO=200mA 3 V VCE=2.0V, IO=350mA 3 VI=3.85V mA BA12004D 0.39 0.5 4 VI=5.0V Diode Reverse Current IR - - 50 µA VR=60V 5 Diode Forward Voltage VF - 1.73 2.0 V IF=350mA 6 Input Capacity CI - 30 - pF VI=0V, f=1MHz 7 Test Circuit １. Output Leakage Current IL ２. DC Current Gain hFE=IO/II Output Saturation Voltage VCEsat OPEN OPEN OPEN IL OPEN IO II R VCE ot ４. Input Current II IO VCEsat ５. Diode Reverse Current IR VI VCE 6. Diode Forward Voltage VF OPEN II N ３. Input Voltage VI IR OPEN OPEN IF VR OPEN VI VF OPEN GND OPEN ７. Input Capacity CI OPEN Capacitance bridge HI OPEN VI TEST SIGNAL LEVEL 20mVrms www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Typical Performance Curve (Reference Data) 10000 1.0 0.8 or 85℃ hFE(IO÷II) 0.6 0.4 25℃ e N co ew m m D es en ig de ns d f IL[μA] 1000 100 0.2 -40℃ VOUT=60V 0.0 20 40 60 Ta[℃] 80 10 100 1 10 Figure 1 . Output Leakage Current vs Ambient Temperature Figure 2 . Output DC Current Gain vs Output Current 1.6 400 VCE[V] R -40℃ 25℃ 200 1.2 25℃ -40℃ ot Iout[mA] 85℃ N 1000 2.0 500 300 100 Iout[mA] 0.8 85℃ 0.4 100 50 100 150 100 200 Iin[μA] Figure 3 . Output Current vs Input Current www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 200 300 IOUT[mA] 400 500 Figure 4 . Output Saturation Voltage1 vs Output Current 5/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z 2.0 1.6 1.6 VCE[V] -40℃ 1.2 25℃ 0.8 -40℃ 1.2 25℃ or 2.0 e N co ew m m D es en ig de ns d f VCE[V] Typical Performance Curve (Reference Data) - continued 0.8 85℃ 0.4 100 200 85℃ 300 IOUT[mA] 400 0.4 500 100 Figure 5 . Output Saturation Voltage2 vs Output Current 200 300 IOUT[mA] 400 500 Figure 6 . Output Saturation Voltage3 vs Output Current 4 12 -40℃ 10 -40℃ 25℃ II[mA] 6 R II[mA] 8 3 2 85℃ 25℃ ot 4 85℃ 1 N 2 0 10 20 30 0 40 10 20 30 VI[V] VI[V] Figure 7 . Input Current vs Input Voltage (BA12003) Figure 8 . Input Current vs Input Voltage (BA12004) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/13 40 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Typical Performance Curve (Reference Data) - continued 100 800 80 Toff[ns] 40 400 e N co ew m m D es en ig de ns d f Ton[ns] 60 or 600 200 20 0 0 -50 0 50 100 -50 0 50 Ta[℃] Figure 9 . Turn-ON Time vs Ambient Temperature Figure 10 . Turn-OFF Time vs Ambient Temperature 500 500 TA=25℃ on PCB 400 383 1ch 350 328 R 300 250 200 2ch 3ch ot 150 100 N 50 4ch 5ch 6ch 7ch These limit is based on calculation (IGND÷the number of ON-channel). 400 383 350 328 300 250 10 20 30 40 50 60 70 80 90 150 Duty Cycle [%] 50 3ch 4ch 5ch 6ch 7ch These limit is based on calculation (IGND÷the number of ON-channel). 10 20 30 40 50 60 70 80 90 100 Duty Cycle [%] Figure 12. Output Current‐Duty Cycle Figure 11. Output Current‐Duty Cycle www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2ch 100 0 100 1ch 200 0 0 0 TA=85℃ on PCB 460 450 Maximum Output Current [mA] 460 450 Maximum Output Current [mA] 100 Ta[℃] 7/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Power Dissipation e N co ew m m D es en ig de ns d f or Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be estimated by this thermal resistance. Figure 13(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θJA = (TJMAX -TA) / Pd ［°C/W］ Derating curve in Figure 13(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 14 show a derating curve for an example of BA12003DF-Z, BA12004DF-Z. 0.6 (°C/W) POWER DISSIPATION Power Dissipation[W] [W] θja=(Tjmax-Ta)/Pd 周囲温度 Ta [℃] TA (℃) Ambient temperature Chip surface temperature Tj (℃) チップ 表面温度 Tj [℃] 消費電力 P [W] 0.5 0.4 0.3 0.2 0.1 0.0 95 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 125 Ambient Temperature [°C] (a) Thermal resistance (b) Derating curve Figure 13. Thermal resistance and derating curve N ot R BA12003DF-Z, BA12004DF-Z (SOP-J16A) Figure 14. Derating curve Part Number Slope of Derating Curve Unit BA12003DF-Z, BA12004DF-Z 5.9 mW/℃ www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Operational Notes Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. ot R e N co ew m m D es en ig de ns d f or 1. N 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. or Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin B C E Pin A N Pin B B e N co ew m m D es en ig de ns d f Pin A P+ P N N P+ N N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 15. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Output Pins Connecting zener diode should be enable to prevent degradation of current time.Pease use zener diode satisfy with VCC+VZ≤VCE(SUS). N ot R 16. Output clamp diode Figure 16 is a construction of the clamp diode part in this IC. When the clamp diode works, PNP transistor works. Therefore, a consumption power increases. When a consecutive surge current (or backward current of motor) flows in this clamp diode, we recommend the diode with a low forward voltage etc.( schottky diode) connection between OUT and COM for bypass pathway of surge current. OUT COM P+ N+ N+ Isolation P Isolation Epi(N-) Buried Layer N+ P P-sub Figure 16. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Construction of output clamp diode 10/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Ordering Information A 1 2 0 0 Part Number BA12003D BA12004D X D F - Package F-Z: SOP-J16A Z E2 Packaging and forming specification E2: Embossed tape and reel or B e N co ew m m D es en ig de ns d f Marking Diagrams SOP-J16A (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Lineup Part Number Marking A12003DF Orderable Part Number SOP-J16A BA12003DF-ZE2 SOP-J16A BA12004DF-ZE2 N ot R A12004DF Package www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Physical Dimension, Tape and Reel Information SOP-J16A N ot R e N co ew m m D es en ig de ns d f or Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 BA12003DF-Z BA12004DF–Z Revision History Revision Changes 13.Jun.2016 001 New Release 6.Jul.2016 002 Update Lineup 29.Nov.2016 003 Update Physical Dimension and Package Name 20.Dec.2016 004 Update Lineup 10.Feb.2017 005 Update Lineup 02.Jun.2017 006 Update Lineup 09.Aug.2017 007 Update Marking Diagrams and Lineup 26.Sep.2017 008 Update Lineup 24.Aug.2018 009 Update Lineup 27.Aug.2020 010 Physical Dimension, Tape and Reel Information (P.12) Change dimension to JEDEC standard values. N ot R e N co ew m m D es en ig de ns d f or Date www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/13 TSZ02201-0GPG0GZ00010-1-2 27.Aug.2020 Rev.010 Notice Precaution on using ROHM Products Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. or 1. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. ot R 2. N e N co ew m m D es en ig de ns d f (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic or 1. e N co ew m m D es en ig de ns d f This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. 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No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. N 2. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. N ot R e N co ew m m D es en ig de ns d f or 3. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001