BA14741F-E2

Datasheet Operational Amplifier series Low Noise Operational Amplifiers BA14741F, BA14741FJ ●General Description General-purpose BA14741 integrates four independent Op-Amps on a single chip. Especially, this series is suitable for any audio applications due to low noise and low distortion characteristics and is usable for other many applications by wide operating supply voltage range. ●Packages SOP14 SOP-J14 W(Typ.) x D(Typ.) x H(Max.) 8.70mm x 6.20mm x 1.71mm 8.65mm x 6.00mm x 1.65mm ●Key Specification  Wide Operating Supply Voltage (split supply):  High Slew Rate:  Input Referred Noise Voltage:  Total Harmonic Distortion: ●Features  High voltage gain  Low input referred noise voltage  low distortion  Wide operating supply voltage ±2.0V to ±18.0V 1V/µs(Typ.) 2.0μVrms(Typ.) 0.003%(Typ.) ●Application  Audio application  Consumer electronics ●Block Diagrams VCC －IN OUT ＋IN VEE Figure 1. Simplified schematic ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･00 ○This product is not designed protection against radioactive rays. 1/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Pin Configuration(TOP VIEW) SOP14, SOP-J14 OUT1 1 -IN1 2 CH1 - + CH4 + - Pin No. Symbol 14 OUT4 1 OUT1 13 -IN4 2 -IN1 3 +IN1 +IN1 3 12 +IN4 4 VCC VCC 4 11 VEE 5 +IN2 5 10 +IN3 6 -IN2 7 OUT2 9 -IN3 8 OUT3 8 OUT3 9 -IN3 10 +IN3 11 VEE 12 +IN4 +IN2 + CH3 - + CH2 -IN2 6 OUT2 7 Package BA14741F SOP14 BA14741FJ SOP-J14 13 -IN4 14 OUT4 ●Ordering Information B A 1 4 7 4 Part Number BA14741 1 x x - E2 Packaging and forming specification E2: Embossed tape and reel (SOP14/ SOP-J14) Package F :SOP14 FJ :SOP-J14 ●Line-up Topr Operating Supply Voltage (split supply) Supply Current (Typ.) Slew Rate (Typ.) -40°C～+85°C ±2.0V～±18.0V 3mA 1V/µs www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 2/18 Package Orderable Part Number SOP14 Reel of 2500 BA14741F-E2 SOP-J14 Reel of 2500 BA14741FJ-E2 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Absolute Maximum Ratings (Ta=25℃) ○BA14741 Parameter Supply Voltage Power dissipation Symbol Ratings VCC-VEE +36 Pd Differential Input Voltage *4 Unit V *1*3 mW *2*3 mW SOP14 450 SOP-J14 820 Vid VCC - VEE V Input Common-mode Voltage Range Vicm VEE - VCC V Operating Supply Voltage Vopr 4 to 36 (±2 to ±18) V Operating Temperature Topr -40 to +85 ℃ Storage Temperature Tstg -55 to +125 ℃ Tjmax +125 unlimited (only 1CH short) ℃ Maximum Junction Temperature Output Short Time *5 Ts Sec Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 To use at temperature above Ta＝25℃ reduce 4.5mW/℃ *2 To use at temperature above Ta＝25℃ reduce 8.2mW/℃ *3 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *4 The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. *5 To short Output to VCC or VEE, Limited within Pd. ●Electrical Characteristics ○BA14741 (Unless otherwise specified VCC=+15V, VEE=-15V, Ta=25℃) Limits Parameter Symbol Unit Min. Typ. Max. Input Offset Voltage *6 Vio *6 Input Offset Current - 1.0 5.0 mV Condition RS≦10kΩ Iio - 10 50 nA - Input Bias Current *7 Ib - 60 300 nA - Large Signal Voltage Gain Av 20 100 - Common-mode Rejection Ratio V/mV RL≧2kΩ, OUT=±10V CMRR 80 100 - dB - Input Common-mode Voltage Range Vicm ±12 ±13.5 - V - Power Supply Rejection Ratio PSRR 80 100 - dB Supply Current ICC - 3.0 7.0 mA Maximum Output Voltage VOM ±10 ±12.5 - V Isource 10 20 - mA Vin+=1V, Vin-=0V, OUT=0V Isink 5 10 - mA Vin+=0V, Vin-=1V, OUT=0V SR - 1.0 - V/μs Av=1, RL=2kΩ MHz f=100kHz Output Source Current Output Sink Current Slew Rate Gain Bandwidth Product GBW - 2.2 - Unity Gain Frequency fT - 2.2 - - 2.0 4.0 Input Referred Noise Voltage Vn - 10 - THD+N - 0.003 - CS - 100 - Total Harmonic Distortion + Noise Channel Separation RL=∞,All Op-Amps RL=2kΩ MHz 0dB cross frequency RIAA, RS=2.2kΩ, 10Hz to μVrms 30kHz RIAA,RS=2.2kΩ, nV/ Hz f=1kHz Av=20dB,RL=2kΩ,OUT=1Vrms % f=1kHz,DIN-AUDIO dB f=1kHz, input referred *6 Absolute value. *7 Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 3/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet Description of electrical characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document. 1. Absolute maximum ratings Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Power supply voltage (VCC-VEE) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential input voltage (Vid) Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of IC. 1.3 Input common-mode voltage range (Vicm) Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures normal operation of IC. When normal operation of IC is desired, the input common-mode voltage of characteristics item must be followed. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package (maximum junction temperature)and thermal resistance of the package. 2. Electrical characteristics item 2.1 Input offset voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage difference required for setting the output voltage at 0 V . 2.2 Input offset current (Iio) Indicates the difference of input bias current between non-inverting terminal and inverting terminal. 2.3 Input bias current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 Large signal voltage gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and Inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage fluctuation) / (Input offset fluctuation) 2.5 Common-mode rejection ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage) / (Input offset fluctuation) 2.6 Input common-mode voltage range(Vicm) Indicates the input voltage range where IC operates normally. 2.7 Power supply rejection ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage) / (Input offset fluctuation) 2.8 Circuit current (ICC) Indicates the IC current that flows under specified conditions and no-load steady status. 2.9 Maximum Output Voltage(VOM) Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into maximum output voltage high and maximum output voltage low. maximum output voltage high indicates the upper limit of output voltage. maximum output voltage low indicates the lower limit. 2.10 Output source current/ output sink current (Isource/Isink) The maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. The output source current indicates the current flowing out of the IC, and the output sink current the current flowing into the IC. 2.11 Slew Rate (SR) SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage as unit time. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 4/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet 2.12 Gain Band Width (GBW) Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave. 2.13 Unity gain frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. 2.14 Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.15 Input referred noise voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. 2.16 Channel separation (CS) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 5/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Typical Performance Curves ○BA14741 8.0 SUPPLY CURRENT [mA] 　 . POWER DISSIPATION [mW] . 1000 800 BA14741FJ 600 BA14741F 400 200 6.0 25℃ -40℃ 4.0 2.0 85℃ 0 0.0 0 25 50 75 100 125 ±0 AMBIENT TEMPERATURE [℃] . MAXIMUM OUTPUT VOLTAGE SWING [VP-P] 8.0 SUPPLY CURRENT [mA] ±18V 6.0 ±15 V 4.0 2.0 ±2 V 0.0 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] ±20 Figure 3. Supply Current - Supply Voltage Figure 2. Derating Curve -50 ±5 ±10 ±15 SUPPLY VOLTAGE [V] 100 30 25 20 15 10 5 0 0.1 1 10 LOAD RESISTANCE [kΩ] Figure 5. Maximum Output Voltage Swing - Load Resistance (VCC/VEE=+15V/-15V,Ta=25℃) Figure 4. Supply Current - Ambient Temperature (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 6/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet 20 20 15 15 10 10 VOH OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] ○BA14741 VOH 5 0 -5 VOL -10 5 0 -5 -10 VOL -15 -15 -20 -20 0 1 SUPPLY VOLTAGE [V] 10 ±0 20 15 15 10 OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] 20 VOH 5 0 VOL -10 -15 -20 -50 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 SUPPLY VOLTAGE [V] Figure 7. Maximum Output Voltage - Supply Voltage (RL=2kΩ,Ta=25℃) Figure 6. Maximum Output Voltage - Load Resistance (VCC/VEE=+15V/-15V,Ta=25℃) -5 ±2 10 VOH 5 0 -5 VOL -10 -15 -20 -25 0 25 50 75 100 0 AMBIENT TEMPERATURE [℃] 5 10 15 20 OUTPUT CURRENT [mA] Figure 9. Maximum Output Voltage - Output Current (VCC/VEE=+15V/-15V,Ta=25℃) Figure 8. Maximum Output Voltage - Ambient Temperature (VCC/VEE=+15V/-15V, RL=2kΩ) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 7/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ○BA14741 6 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] 6 4 -40℃ 2 0 25℃ -2 85℃ -4 ±2V 2 ±15V 0 ±18V -2 -4 -6 -6 ±0 ±4 ±8 ±12 ±16 -50 ±20 -25 0 25 50 75 100 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] Figure 10. Input Offset Voltage - Supply Voltage (Vicm=0V, OUT=0V) Figure 11. Input Offset Voltage - Ambient Temperature (Vicm=0V, OUT=0V) 200 200 180 180 . 160 INPUT BIAS CURRENT [nA] INPUT BIAS CURRENT [nA] 4 -40℃ 140 120 100 85℃ 80 25℃ 60 40 20 160 ±2V ±15V 140 120 100 80 ±18V 60 40 20 0 0 ±0 ±4 ±8 ±12 ±16 ±20 -50 SUPPLY VOLTAGE [V] -25 0 25 50 75 100 AMBIENT TEMPERATURE [℃] Figure 13. Input Bias Current - Ambient Temperature (Vicm=0V, OUT=0V) Figure 12. Input Bias Current - Supply Voltage (Vicm=0V, OUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 8/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet 20 30 10 INPUT OFFSET CURRENT [nA] . 30 INPUT OFFSET CURRENT [nA] ○BA14741 -40℃ 25℃ 0 -10 85℃ -20 -30 20 10 0 -10 ±2V -20 -30 ±0 ±4 ±8 ±12 ±16 SUPPLY VOLTAGE [V] ±20 -50 Figure 14. Input Offset Current - Supply Voltage (Vicm=0V, OUT=0V) COMMON MODE REJECTION RATIO [dB] 4 85℃ 3 2 25℃ 1 -40℃ 0 -1 -2 -3 -4 -5 -40 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 15. Input Offset Current - Ambient Temperature (Vicm=0V, OUT=0V) 5 INPUT OFFSET VOLTAGE [mV] ±15V ±18V -22 04 26 48 COMMON MODE INPUT VOLTAGE [V] 150 125 100 75 50 25 0 -50 Figure 16. Input Offset Voltage - Common Mode Input Voltage (VCC/VEE=+4V/-4V, OUT=0V) -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 17. Common Mode Rejection Ratio - Ambient Temperature (VCC/VEE=+15V/-15V, Vicm=-12V to +12V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 9/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet 3.0 . 150 2.5 125 SLEW RATE [V/µs] POWER SUPPLY REJECTION RATIO [dB] ○BA14741 100 75 50 25 2.0 1.5 1.0 0.5 0 0.0 -50 -25 0 25 50 75 100 ±0 AMBIENT TEMPERATURE [℃] ±4 ±6 ±8 ±10 ±12 ±14 ±16 SUPPLY VOLTAGE [V] Figure 19. Slew Rate - Supply Voltage (CL=100pF, RL=2kΩ, Ta=25℃) Figure 18. Power Supply Rejection Ratio - Ambient Temperature (VCC/VEE=+2V/-2V to +15V/-15V) 1 TOTAL HARMONIC DISTORTION [%] 80 EQUIVALENT INPUT NOISE VOLTAGE [nV/√Hz] . ±2 60 40 20 10 100 1000 FREQUENCY [Hz] 1kHz 0.01 20Hz 0.001 0.0001 0.1 0 1 20kHz 0.1 10000 1 OUTPUT VOLTAGE [Vrms] 10 Figure 21. Total Harmonic Distortion - Output Voltage (VCC/VEE=+15V/-15V, Av=20dB, RL=2kΩ,80kHz-LPF,Ta=25℃) Figure 20. Equivalent Input Noise Voltage - Frequency (VCC/VEE=+15V/-15V, RS=100Ω,Ta=25℃) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 10/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet 30 60 25 50 -30 40 -60 0 20 15 30 -90 GAIN 20 -120 5 10 -150 0 0 -180 10 1 10 100 FREQUENCY [kHz] PHASE [deg] PHASE VOLTAGE GAIN [dB] MAXIMUM OUTPUT VOLTAGE SWING [VP-P] ○BA14741 1.E+00 1.E+01 1.E+02 2 1.E+03 3 1.E+04 4 1.E+05 5 1.E+06 6 1.E+07 7 1000 1 Figure 22. Maximum Output Voltage Swing - Frequency (VCC/VEE=+15V/-15V, RL=2kΩ,Ta=25℃) 10 10 10 10 10 FREQUENCY [Hz] 10 10 Figure 23. Voltage Gain・Phase - Frequency (VCC/VEE=+15V/-15V, Av=40dB,RL=2kΩ,Ta=25℃) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 11/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Application Information Test circuit1 NULL method VCC, VEE, EK, Vicm Unit: V Parameter VF S1 S2 BA14741 S3 calculation VCC VEE EK Vicm Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1 Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2 VF3 OFF ON VF4 ON OFF OFF 15 -15 0 0 3 ON ON ON 15 -15 -10 0 15 -15 10 0 ON ON OFF 3 -27 12 0 27 -3 -12 0 ON ON OFF 2 -2 0 0 15 -15 0 0 Input Bias Current VF5 Large Signal Voltage Gain VF6 Common-mode Rejection Ratio (Input common-mode Voltage Range) VF7 Power Supply Rejection Ratio VF9 VF8 VF10 -Calculation1. Input Offset Voltage (Vio) VF1 Vio  [V] 1 + RF / RS 4 5 6 0.1μF RF=50kΩ 2. Input Offset Current (Iio) VF2 - VF1 Iio  [A] Ri × (1 + RF / RS) SW1 500kΩ VCC EK RS＝50Ω 0.1μF 15V Ri=10kΩ 500kΩ 3. Input Bias Current (Ib) VF4 - VF3 Ib  [A] 2 × Ri × (1 + RF / RS) DUT SW3 RS＝50Ω Ri=10kΩ NULL 1000pF V RL Vicm VF SW2 50kΩ 4. Large Signal Voltage Gain (Av) ΔEK × (1+ RF/RS) Av  20 × Log [dB] VF5 - VF6 -15V VEE Figure 24. Test circuit1 (one channel only) 5. Common-mode Rejection Ration (CMRR) ΔVicm × (1+ RF/RS) CMRR  20 × Log [dB] VF8 - VF7 6. Power supply rejection ratio (PSRR) ΔVcc × (1+ RF/RS) PSRR  20 × Log [dB] VF10 - VF9 Test Circuit 2 Switch Condition SW No. Supply Current SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14 OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage High OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF ON OFF Maximum Output Voltage Low OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON ON OFF Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Slew Rate OFF OFF OFF ON ON ON OFF OFF OFF OFF Gain Bandwidth Product OFF ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF Equivalent Input Noise Voltage ON OFF OFF OFF ON ON OFF OFF OFF OFF www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 ON OFF OFF OFF 12/18 ON OFF OFF OFF TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet Input voltage VH VL t Input wave Output voltage 90% SR=ΔV/Δt VH C ΔV 10% VL Δt t Output wave Figure 26. Slew Rate Input Waveform Figure 25. Test Circuit 2 (each Op-Amp) VCC VCC R1//R2 R1//R2 OTHER CH VEE R1 VIN R2 VEE OUT1 V VOUT1 R1 R2 V =0.5Vrms =0.5[Vrms] CS＝ 20 CS 20×log log OUT2 VOUT2 100 100×VOUT1 OUT1 VOUT2 OUT2 Figure 27. Test Circuit 3 (Channel Separation) (VCC=+15V, VEE=-15V, R1=1kΩ, R2=100kΩ) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 13/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 28. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θja = (Tjmax-Ta) / Pd ℃/W ・・・・・ (Ⅰ) Derating curve in Figure 28. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 29. (c) show a derating curve for an example of BA 14741. Power dissipation of LSI [W] LSIの 消 費 電 力 [W] Pd (max) θja=(Tjmax-Ta)/Pd ℃/W θja2 < θja1 P2 Ta [℃] Ta [℃] 周囲温度 Ambient temperature θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surface temperature Tj [℃] チップ 表面温度 Tj [℃] Power dissipation Pd [W] 0 25 50 θ ja1 75 100 125 150 ] [℃] 囲 温 度 Ta [℃Ta Ambient 周 temperature 消費電力 P [W] (a) Thermal resistance (b) Derating curve Figure 28. Thermal resistance and derating curve 1000 POWER DISSIPATION [mW] 820mW (*8) 800 BA14741FJ 600 BA14741F 490mW (*9) 400 200 0 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] (*8) 8.2 (*9) 4.5 Unit mW/℃ (c)BA14741 When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value. Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. Figure 29. Derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 14/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet Application examples ○Voltage follower Voltage gain is 0 dB. This circuit controls output voltage (OUT) equal input voltage (Vin), and keeps OUT with stable because of high input impedance and low output impedance. OUT is shown next formula. OUT=Vin VCC OUT Vin VEE Figure 30. Voltage follower circuit ○Inverting amplifier R2 For inverting amplifier, Vin is amplified by voltage gain decided R1 and R2, and phase reversed voltage is outputted. OUT is shown next formula. OUT=-(R2/R1)・Vin Input impedance is R1. VCC Vin R1 OUT R1//R2 VEE Figure 31. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 VCC OUT For non-inverting amplifier, Vin is amplified by voltage gain decided R1 and R2, and phase is same with Vin. OUT is shown next formula. OUT=(1 + R2/R1)・Vin This circuit realizes high input impedance because Input impedance is operational amplifier’s input Impedance. Vin VEE Figure 32. Non-inverting amplifier circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 15/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Operational Notes 1) Processing of unused circuit It is recommended to apply connection (see the Figure 33.) and set the non-inverting input terminal at the potential within input common-mode voltage range (Vicm), for any unused circuit. VCC + - Vicm 2) Input voltage Applying VEE to VCC to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. Connect to Vicm VEE Figure 33. The example of application circuit for unused op-amp 3) Maximum output voltage Because the output voltage range becomes narrow as the output current Increases, design the application with margin by considering changes in electrical characteristics and temperature characteristics. VCC protection resistor + - 4) Short-circuit of output terminal When output terminal and VCC or VEE terminal are shorted, excessive Output current may flow under some conditions, and heating may destroy IC. It is necessary to connect a resistor as shown in Figure 34, thereby protecting against load shorting. VEE 5) Power supply (split supply / single supply) in used Op-amp operates when specified voltage is applied between VCC and VEE. Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well. Figure 34. The example of output short protection 6) Power dissipation (Pd) Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 7) Short-circuit between pins and wrong mounting Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other components on the circuits, can damage the IC. 8) Use in strong electromagnetic field Using the ICs in strong electromagnetic field can cause operation malfunction. 9) Radiation This IC is not designed to be radiation-resistant. 10) IC handling When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezo resistance effects. 11) Inspection on set board During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage. 12) Output capacitor When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor, connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a voltage comparator. Set the capacitor connected to output terminal below 0.1μF in order to prevent damage to IC. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 16/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Physical Dimensions Tape and Reel Information SOP14 8.7 ± 0.2 (MAX 9.05 include BURR) 8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed 0.3MIN 4.4±0.2 6.2±0.3 14 1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 7 1.5±0.1 0.15 ± 0.1 0.4 ± 0.1 0.11 1.27 0.1 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. SOP-J14 8.65 ± 0.1 (Max 9.0 include BURR) 0.65±0.15 1 1PIN MARK Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 7 S + 0.05 0.22 −0.03 0.175±0.075 1.65MAX 1.375±0.075 0.515 1.05±0.2 8 6.0±0.2 3.9±0.1 14 4° +6° −4° 1.27 +0.05 0.42 −0.04 0.08 S 0.08 M 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagrams SOP14, SOP-J14 (TOP) Part Number Marking LOT Number 1PIN MARK Product Name BA14741 F FJ Package Type SOP14 SOP-J14 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 Marking BA14741F BA14741 17/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 BA14741xx Datasheet ●Land pattern data all dimensions in mm Land length Land width ≧ℓ 2 b2 Land pitch e Land space MIE SOP14 1.27 4.60 1.10 0.76 SOP-J14 1.27 3.90 1.35 0.35 PKG b2 e MIE ℓ2 ●Revision History Date 2012.11.9 Revision 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･00 18/18 TSZ02201-0RAR1G200060-1-2 9.NOV.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001