Datasheet
Operational Amplifiers
Low Noise Operational Amplifier
BA15218F
General Description
Key Specifications
The BA15218F is low noise operational amplifier with
high voltage gain.
They have good performance of input referred noise
voltage(1.0μVrms), total harmonic distortion (0.0015%)
and operating supply voltage(±2.0V to ±16.0V).
These are suitable for audio applications and active
filter.
Operating Supply Voltage (split supply):
±2.0V to ±16.0V
Slew Rate:
3V/µs(Typ)
Input Referred Noise Voltage:
1.0μVrms(Typ)
0.0015%(Typ)
Total Harmonic Distortion:
Temperature Range:
-40°C to +85°C
Packages
Features
SOP8
High Voltage Gain
Low Input Referred Noise Voltage
Low Total Harmonic Distortion
Wide Operating Supply Voltage
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
Applications
Audio Application
Consumer Equipment
Active Filter
Simplified Schematic
VCC
-IN
OUT
+IN
VEE
Figure 1. Simplified Schematic
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BA15218F
Pin Configuration
BA15218F : SOP8
OUT1
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
8 VCC
1
CH1
- +
+
-IN1 2
7
CH2
+ -
+IN1 3
VEE 4
OUT2
6
-IN2
5
+IN2
Package
SOP8
BA15218F
Ordering Information
B
A
1
5
2
1
Part Number
BA15218F
8
F
-
E2
Package
F: SOP8
Packaging and Forming Specification
E2: Embossed tape and reel
(SOP8)
Line-Up
Topr
Operating
Supply Voltage
(split supply)
Supply
Current
(Typ)
Slew Rate
(Typ)
-40°C to +85°C
±2.0V to ±16.0V
5mA
3V/µs
Package
SOP8
Reel of 2500
Orderable
Part Number
BA15218F-E2
Absolute Maximum Ratings (TA=25°C)
Parameter
Supply Voltage
Power Dissipation
Differential Input Voltage
(Note 3)
Input Common-Mode Voltage Range
Input Current
Symbol
Rating
Unit
VCC-VEE
+36
V
PD
0.55
(Note 1,2)
W
VID
VCC - VEE
V
VICM
VEE - VCC
V
II
-10
(Note 4)
mA
Operating Supply Voltage
Vopr
±2 to ±16 (+4 to +32)
V
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +125
°C
Output Short Current (Note 5)
IOMAX
±50
mA
Maximum Junction Temperature
TJmax
+125
°C
(Note 1) To use at temperature above TA=25C reduce 5.5mW/C.
(Note 2) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 3) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 4) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
(Note 5) This current value is when the output is shorted to VCC or VEE. Please use within the PD range.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
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Datasheet
BA15218F
Electrical Characteristics
○BA15218F (Unless otherwise specified VCC=+15V, VEE=-15V, TA=25°C)
Parameter
Limit
Symbol
Unit
Min
Typ
Max
Conditions
Input Offset Voltage (Note 6)
VIO
-
0.5
5.0
mV
Input Offset Current (Note 6)
IIO
-
5
200
nA
-
Input Bias Current (Note 6,7)
IB
-
50
500
nA
-
Large Signal Voltage Gain
AV
86
110
-
dB
VICM
±12
±14
-
V
Common-Mode Rejection Ratio
CMRR
70
90
-
dB
RS≦10kΩ
Power Supply Rejection Ratio
PSRR
76
90
-
dB
RS≦10kΩ
ICC
-
5.0
8.0
mA
+IN=0V, RL=∞
±12
±14
-
V
RL≧10kΩ
±10
±13
-
V
RL≧2kΩ
SR
-
3.0
-
V/μs
AV=0dB, RL=2kΩ
GBW
-
10
-
MHz
f=10kHz
-
1.0
-
μVrms
RS=1kΩ
f=20Hz to 30kHz, RIAA
-
9.5
-
nV/ Hz
RS=100Ω, +IN=0V, f=1kHz
THD+N
-
0.0015
-
%
AV=20dB
RL=2kΩ, 80kHz-LPF
CS
-
120
-
dB
f=1kHz, OUT=0.5Vrms
Input Common-mode Voltage Range
Supply Current
Maximum Output Voltage
Slew Rate
Gain Bandwidth
Input Referred Noise Voltage
Total Harmonic Distortion + Noise
Channel Separation
RS≦10kΩ
RL≧2kΩ, OUT=±10V
-
VOM
VN
(Note 6) Absolute value
(Note 7) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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Datasheet
BA15218F
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC terminal and VEE terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics Items
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(5) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(6) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(7) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(8) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(9) Maximum Output Voltage (VOM)
Signifies the voltage range that can be output under specific output conditions.
(10) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(11) Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 20dB/decade.
(12) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(13) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(14) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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Datasheet
BA15218F
Typical Performance Curves
1.0
10
0.8
8
0.6
Supply Current [mA]
Power Dissipation [W]
○BA15218F
BA15218F
0.4
0.2
6
-40°C
25°C
4
2
85°C
0.0
0
0
25
50
75
100
Ambient Temperature [°C] .
125
±0
±4
±6
±8 ±10 ±12 ±14 ±16 ±18
Supply Voltage [V]
Figure 3.
Supply Current vs Supply Voltage
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
10
Maximum Output Voltage Swing [VP-P]
30
8
Supply Current [mA]
±2
6
±15V
±7.5 V
4
2
±2 V
25
20
15
10
5
0
0
-50
-25
0
25
50
75
0.1
100
Ambient Temperature [°C]
1
Load Resistance [kΩ]
10
Figure 5.
Maximum Output Voltage Swing vs Load Resistance
(VCC/VEE=+15V/-15V, TA=25°C)
Figure 4.
Supply Current vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA15218F
Typical Performance Curves - continued
20
20
15
15
Maximum Output Voltage [V]
Maximum Output Voltage [V]
○BA15218F
10
VOH
10
VOH
5
0
-5
VOL
-10
5
0
-5
-10
-15
VOL
-15
-20
-20
0.1
1
Load Resistance [kΩ]
10
±0
±4
±6 ±8 ±10 ±12 ±14 ±16 ±18
Supply Voltage [V]
Figure 7.
Maximum Output Voltage vs Supply Voltage
(RL=2kΩ, TA=25°C)
20
20
15
15
Maximum Output Voltage [V]
Maximum Output Voltage [V]
Figure 6.
Maximum Output Voltage vs Load Resistance
(VCC/VEE=+15V/-15V, TA=25°C)
±2
10
VOH
5
0
-5
VOL
-10
-15
10
VOH
5
0
-5
VOL
-10
-15
-20
-50
-20
-25
0
25
50
75
100
0
5
10
15
20
Ambient Temperature [°C]
Output Current [mA]
Figure 8.
Maximum Output Voltage vs Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 9.
Maximum Output Voltage vs Output Current
(VCC/VEE=+15V/-15V, TA=25°C)
25
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA15218F
Typical Performance Curves - continued
6
6
4
4
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
○BA15218F
-40°C
0
25°C
85°C
-2
-4
0
±15V
-2
-4
-6
-6
±0
±2
±4
±6
±8
±10 ±12 ±14 ±16 ±18
-50
-25
0
25
50
75
Supply Voltage [V]
Ambient Temperature [°C]
Figure 10.
Input Offset Voltage vs Supply Voltage
(VICM=0V, EK=0V)
Figure 11.
Input Offset Voltage vs Ambient Temperature
(VICM=0V, EK=0V)
60
60
50
50
Input Bias Current [nA]
Input Bias Current [nA]
±7.5V
±2V
2
40
-40°C
25°C
30
20
85°C
10
100
40
±15V
±7.5V
30
20
±2V
10
0
0
±0
±2
±4
±6
±8
±10
±12
±14
±16
-50
Supply Voltage [V]
-25
0
25
50
75
100
Ambient Temperature [°C]
Figure 13.
Input Bias Current vs Ambient Temperature
(VICM=0V, EK=0V)
Figure 12.
Input Bias Current vs Supply Voltage
(VICM=0V, EK=0V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA15218F
Typical Performance Curves - continued
30
30
20
20
10
25°C
Input Offset Current [nA]
Input Offset Current [nA]
○BA15218F
-40°C
0
85°C
-10
10
±2V
±7.5V
0
±15V
-10
-20
-20
-30
-30
±0
±2
±4
±6
±8 ±10 ±12
Supply Voltage [V]
±14
±16
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 15.
Input Offset Current vs Ambient Temperature
(VICM=0V, EK=0V)
Figure 14.
Input Offset Current vs Supply Voltage
(VICM=0V, EK=0V)
5
150
85°C
Common Mode Rejection Ratio [dB]
4
25°C
Input Offset Voltage [mV]
3
-40°C
2
1
0
-1
-2
-3
125
100
75
50
25
-4
-5
0
0
2
4
6
Common Mode Input Voltage [V]
8
-50
Figure 16.
Input Offset Voltage vs Common Mode Input Voltage
(VCC=8V, EK=-4V)
-25
0
25
50
75
Ambient Temperature [°C]
100
Figure 17.
Common Mode Rejection Ratio vs Ambient Temperature
(VCC/VEE=+15V/-15V, VICM=-12V to +12V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA15218F
Typical Performance Curves - continued
○BA15218F
4
125
3
Slew Rate [V/µs]
Power Supply Rejection Ratio [dB]
150
100
75
2
50
1
25
0
0
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
±0
±4
±6
±8 ±10 ±12
Supply Voltage [V]
±14
±16
Figure 19.
Slew Rate vs Supply Voltage
(CL=100pF, RL=2kΩ, TA=25°C)
Figure 18.
Power Supply Rejection Ratio vs Ambient Temperature
(VCC/VEE=+2V/-2V to +15V/-15V)
1
Total Harmonic Distortion [%]
80
Input Reffered Noise Voltage [nV/√Hz]
±2
60
40
20
0.1
20kHz
0.01
1kHz
0.001
20Hz
0.0001
0
1
1
10
10
1002
10
Frequency
Frequency[Hz]
[Hz]
10003
10
4
10000
0.1
10
1
Output Voltage [Vrms]
10
Figure 21.
Total Harmonic Distortion vs Output Voltage
(VCC/VEE=+15V/-15V, Av=20dB,
RL=2kΩ, 80kHz-LPF, TA=25°C)
Figure 20.
Equivalent Input Noise Voltage vs Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, TA=25°C)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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BA15218F
Typical Performance Curves - continued
○BA15218F
100
200
PHASE
25
20
15
10
5
0
180
80
160
70
140
60
120
50
100
GAIN
40
80
30
60
20
40
10
20
0
1
10
100
Frequency [Hz]
1000
0
1.E+00
1
1.E+01
10
1.E+02
2
10
1.E+03
3
1.E+04
4
1.E+05
5
10
10
10
Frequency [kHz]
Frequency [Hz]
1.E+06
6
10
1.E+07
7
10
Figure 23.
Voltage Gain・Phase vs Frequency
(VCC/VEE=+15V/-15V, AV=40dB, RL=2kΩ, TA=25°C)
Figure 22.
Maximum Output Voltage Swing vs Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ, TA=25°C)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Phase [deg]
90
Voltage Gain [dB]
Maximum Output Voltage Swing [VP-P]
30
Datasheet
BA15218F
Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
S1
S2
S3
VCC
VEE
EK
VICM
calculation
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
0
2
VF3
OFF
ON
OFF
15
-15
0
0
3
VF4
ON
OFF
15
-15
-10
0
ON
ON
15
-15
10
0
3
-27
12
0
27
-3
-12
0
2
-2
0
0
15
-15
0
0
Input Bias Current
VF5
Large Signal Voltage Gain
ON
VF6
4
VF7
Common-Mode Rejection Ratio
(Input Common-Mode Voltage Range)
ON
ON
OFF
VF8
5
VF9
Power Supply Rejection Ratio
ON
ON
OFF
VF10
- Calculation 1. Input Offset Voltage (VIO)
|VF1|
VIO = 1 + R /R
F
S
2. Input Offset Current (IIO)
|VF2 - VF1|
IIO = RI x (1 + RF/RS)
3. Input Bias Current (IB)
|VF4 - VF3|
IB = 2 x RI x (1 + RF/RS)
6
[V]
[A]
[A]
EK × (1+RF/RS)
|VF6 - VF5|
[dB]
4. Large Signal Voltage Gain (AV)
Av = 20Log
5. Common-mode Rejection Ration (CMRR)
CMRR = 20Log
VICM × (1+RF/RS)
|VF8 - VF7|
6. Power supply rejection ratio (PSRR)
PSRR = 20Log
VCC × (1+ RF/RS)
|VF10 - VF9|
[dB]
[dB]
0.1μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
VCC
15V
EK
RI=10kΩ
0.1μF
Vo
500kΩ
DUT
SW3
RS=50Ω
1000pF
RI=10kΩ
NULL
RL
VICM
50kΩ
V VF
SW2
-15V
VEE
Figure 24. Test Circuit 1 (one channel only)
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BA15218F
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4
SW5
SW6
SW7
SW8
SW9 SW10 SW11 SW12
Supply Current
OFF
OFF OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
Maximum Output Voltage
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
ON
Slew Rate
OFF
OFF OFF
ON
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
Gain Bandwidth
OFF
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
ON
OFF
Input Referred Noise Voltage
ON
OFF OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
Input Voltage
SW4
VH
R2
SW5
VCC
VL
－
SW1
SW2
SW6
RS
SW7
Input Wave
Output Voltage
＋
SW3
SW8
SW9
SW10
SW11
t
SR＝ΔV/Δt
SW12
R1
90%
VH
VEE
ΔV
RL
-IN
CL
+IN
VL
10%
Δt
Output Wave
Figure 26. Slew Rate Input Waveform
Figure 25. Test Circuit 2 (each channel)
R2=100kΩ
R2=100kΩ
VCC
R1=1kΩ
VCC
R1=1kΩ
－
－
＋
VIN
R1//R2
t
VEE
OUT1
=0.5Vrms
＋
R1//R2
OUT2
VEE
CS = 20Log
100 × OUT1
OUT2
Figure 27. Test Circuit 3 (Channel Separation)
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BA15218F
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 28(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), junction temperature (TJmax), and power dissipation (PD).
θJA = (TJmax－TA) / PD
°C/W
The derating curve in Figure 28(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 28(c) shows an example of the derating curve for BA15218F.
Power Dissipation of LSI [W]
PDmax
θJA=(TJmax-TA)/ PD °C/W
P2
Power Dissipation of IC
Ambient temperature TA [ °C ]
Chip surface temperature TJ [ °C ]
θJA2 < θJA1
P1
(a) Thermal resistance
θJA2
TJmax
θJA1
0
50
25
75
100
125
Ambient temperature TA[C]
(b) Derating curve
1.0
Power Dissipation [W]
0.8
0.6
BA15218F
0.4
0.2
0.0
0
25
50
75
100
Ambient Temperature [°C]
125
(c)BA15218F
5.5
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree. Permissible dissipation is the value
when FR4 glass epoxy board 70mm ×70mm ×1.6mm (copper foil area less than 3%) is mounted.
Figure 28. Thermal Resistance and Derating Curve
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BA15218F
Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
VCC
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT
IN
OUT=IN
VEE
Figure 29. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VCC
IN
R1
OUT
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
R1//R2
VEE
Figure 30. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the next expression.
VCC
OUT
IN
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
VEE
Figure 31. Non-inverting Amplifier Circuit
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BA15218F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure 32):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
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BA15218F
Operational Notes – continued
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 32. Example of monolithic IC structure
12.
Unused circuits
When there are unused op-amps, it is recommended that they are
connected as in Figure 33, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (VICM).
VDD
Keep this potential
in VICM
VICM
13.
Input Voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless
of the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the
electric characteristics.
+
VSS
Figure 33. Example of Application Circuit
for Unused Op-amp
14.
Power supply(single/dual)
The op-amp operates when the voltage supplied is between VCC and
VEE. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
15.
Output capacitor
If a large capacitor is connected between the output pin and VEE pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1uF between output pin and VEE pin.
16.
Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
17.
Short-circuit of Output Terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output current may flow under some
conditions, and heating may destroy IC. It is necessary to connect a resistor as shown in Figure 34, thereby
protecting against load shorting.
VCC
protection
resistor
VEE
Figure 34. The Example of Output Short Protection
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Datasheet
BA15218F
Physical Dimensions Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Datasheet
BA15218F
Marking Diagrams
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Product Name
Package Type
Marking
BA15218F
SOP8
15218
Land Pattern Data
PKG
Land pitch
e
Land space
MIE
SOP8
1.27
4.60
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
1.10
0.76
SOP8
b2
e
MIE
ℓ2
Revision History
Date
Revision
10.SEP.2013
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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