BA2903YFV-MGE2

Datasheet Comparator Automotive Ground Sense Comparators BA2903Yxxx-M BA2901Yxx-M General Description Key Specifications  Operating Supply Voltage Range single supply : split supply :  Supply Current BA2903Yxxx-M(Dual) BA2901Yxx-M(Quad)  Input Bias Current :  Input Offset Current :  Operating Temperature Range : BA2903Yxxx-M and BA2901Yxx-M are manufactured for automotive. These products are open collector output comparators that can operate in single power supply. It features wide operating voltage range of 2V to 36V and with low supply current. Applications are Car Navigation System, Car Audio, Automotive Body and Exteriors. Features      AEC-Q100 Qualified Single or Dual Power Supply Operation Wide Operating Supply Voltage Standard Comparator Pin-assignments Common-mode Input Voltage Range includes ground level.  Wide Temperature Range Packages SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 +2.0V to +36V ±1.0V to ±18V 0.6mA(Typ) 0.8mA(Typ) 50nA(Typ) 5nA(Typ) -40°C to +125°C W(Typ) x D(Typ) x H(Max) 5.00mm x 6.20mm x 1.71mm 3.00mm x 6.40mm x 1.35mm 2.90mm x 4.00mm x 0.90mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm Application  Car Navigation System  Car Audio  Automotive Body and Exteriors Simplified schematic VCC OUT +IN -IN VEE Figure 1. Simplified schematic (one channel only) 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Pin Configuration BA2903YF-M : SOP8 BA2903YFV-M : SSOP-B8 BA2903YFVM-M : MSOP8 2 +IN1 Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VEE 5 +IN2 8 VCC OUT1 1 -IN1 Pin No. CH1 7 - + 3 6 CH2 OUT2 -IN2 + - VEE 6 -IN2 7 OUT2 8 VCC Pin No. Pin Name 1 OUT2 2 OUT1 3 VCC 5 +IN2 4 BA2901YF-M : SOP14 BA2901YFV-M : SSOP-B14 OUT2 1 14 OUT3 OUT1 2 13 OUT4 VCC 3 12 VEE 11 +IN4 -IN1 4 CH1 － ＋ CH4 － ＋ +IN1 5 10 -IN4 -IN2 6 9 +IN3 CH2 － ＋ +IN2 CH3 － ＋ 7 8 -IN3 4 -IN1 5 +IN1 6 -IN2 7 +IN2 8 -IN3 9 +IN3 10 -IN4 11 +IN4 12 VEE 13 OUT4 14 OUT3 Package SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 BA2903YF-M BA2903YFV-M BA2903YFVM-M BA2901YF-M BA2901YFV-M www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Ordering Information B A 2 9 0 x Y x x x - M Package F : SOP8 SOP14 FV : SSOP-B8 : SSOP-B14 FVM : MSOP8 Part Number BA2903Yxxx BA2901Yxx x x Packaging and forming specification M: Automotive E2: Embossed tape and reel (SOP8/SOP14/SSOP-B8/ SSOP-B14) TR: Embossed tape and reel (MSOP8) Line-up Operating Supply Voltage Topr Dual/Quad Dual -40°C to +125°C +2.0V to +36V Orderable Part Number Package SOP8 Reel of 2500 BA2903YF-ME2 SSOP-B8 Reel of 2500 BA2903YFV-ME2 MSOP8 Reel of 3000 BA2903YFVM-MTR SOP14 Reel of 2500 BA2901YF-ME2 SSOP-B14 Reel of 2500 BA2901YFV-ME2 Quad Absolute Maximum Ratings (TA=25°C) Parameter Symbol BA2903Yxxx-C VCC-VEE Supply Voltage Power dissipation Ratings PD +36 SOP8 0.77 (Note 1,6) SSOP-B8 0.62 (Note 2,6) 0.58 (Note 3,6) MSOP8 BA2901Yxx-C Unit V - W (Note 4,6) SOP14 - 0.56 SSOP-B14 - 0.87 (Note 5,6) Differential Input Voltage (Note 7) VID +36 Input Common-mode Voltage Range VICM (VEE-0.3) to (VEE+36) V II -10 mA Operating Supply Voltage Vopr +2.0 ~ +36 (±1.0 ~ ±18) V Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C TJmax +150 °C Input Current (Note 8) Maximum junction Temperature V (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) To use at temperature above TA=25°C reduce 6.2mW/°C. To use at temperature above TA=25°C reduce 5.0mW/°C. To use at temperature above TA=25°C reduce 4.7mW/°C. To use at temperature above TA=25°C reduce 4.5mW/°C. To use at temperature above TA=25°C reduce 7.0mW/°C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. (Note 8) An excessive input current will flow when input voltages of less than VEE-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Electrical Characteristics ○BA2903Yxxx-M (Unless otherwise specified VCC=+5V, VEE=0V) Parameter Symbol Input Offset Voltage (Note 9,10) VIO Input Offset Current (Note 9,10) IIO Input Bias Current (Note 10,11) IB Input Common-mode Voltage Range Typ Max 25°C - 2 7 Full range - - 15 25°C - 5 50 Full range - - 200 Unit mV EK=-1.4V 50 250 - 500 25°C 0 - VCC-1.5 25°C 88 100 - Full range 74 - - 25°C - 0.6 1 Full range - - 2.5 ISINK 25°C 6 16 - mA VOL 25°C Full range - 150 - 400 700 mV 25°C - 0.1 - Full range - - 1 - 1.3 - - 0.4 - ICC (Note 10) Output Saturation Voltage (Maximum Output Voltage Low) Response Time tRE V dB mA μA ILEAK μs 25°C VCC=5 to 36V, EK=-1.4V nA - Supply Current(Note 10) EK=-1.4V EK=-1.4V - AV Conditions nA 25°C Large Signal Voltage Gain Output Leakage Current(Note 10) (High level output current) Min Full range VICM Output Sink Current (Note 12) Limits Temperature range VCC=15V, EK=-1.4 to -11.4V RL=15kΩ, VRL=15V OUT=open OUT=open, VCC=36V +IN=0V, -IN=1V OUT=1.5V +IN=0V, -IN= 1V ISINK=4mA +IN=1V, -IN=0V OUT=5V +IN=1V, -IN=0V OUT=36V RL=5.1kΩ, VRL=5V VIN=100mVP-P, overdrive=5mV RL=5.1kΩ, VRL=5V, VIN=TTL Logic Swing, VREF=1.4V (Note 9) Absolute value (Note 10) Full range TA=-40°C to +125°C (Note 11) Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC. (Note 12) Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M ○BA2901Yxx-M (Unless otherwise specified VCC=+5V, VEE=0V) Parameter Symbol Input Offset Voltage (Note13,14) VIO Input Offset Current (Note13,14) IIO Input Bias Current (Note14,15) IB Input Common-mode Voltage Range VICM Large Signal Voltage Gain AV Supply Current(Note14) ICC Output Sink Current (Note16) ISINK Output Saturation Voltage(Note14) (Maximum Output Voltage Low) VOL Output Leakage Current(Note14) (High level output current) Temperature range Limits Min Typ Max 25°C - 2 7 Full range - - 15 25°C - 5 50 Full range - - 200 25°C - 50 250 Full range - - 500 25°C 0 - VCC-1.5 25°C 88 100 - Full range 74 - - 25°C - 0.8 2 Full range - - 2.5 25°C 6 16 - 25°C - 150 400 Full range - - 700 25°C - 0.1 - Full range - - 1 tRE - 1.3 - - 0.4 - Unit mV EK=-1.4V VCC=5 to 36V, EK=-1.4V EK=-1.4V nA EK=-1.4V V dB mA mA mV μs 25°C Conditions nA μA ILEAK Response Time (Note 13) (Note 14) (Note 15) (Note 16) Datasheet BA2901Yxx-M VCC=15V, EK=-1.4 to -11.4V RL=15kΩ, VRL=15V OUT=open OUT=open, VCC=36V +IN=0V, -IN=1V OUT=1.5V +IN=0V, -IN= 1V ISINK=4mA +IN=1V, -IN=0V OUT=5V +IN=1V, -IN=0V OUT=36V RL=5.1kΩ, VRL=5V VIN=100mVP-P, overdrive=5mV RL=5.1kΩ, VRL=5V, VIN=TTL Logic Swing, VREF=1.4V Absolute value Full range TA=-40°C to +125°C Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC. Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Description of electrical characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VCC/VEE) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Operating and Storage Temperature Ranges (Topr, Tstg) The operating temperature range indicates the temperature range within which the IC can operate. The higher the ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics. (5) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (5) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output voltage) / (Differential Input voltage) (6) Supply Current (ICC) Indicates the current that flows within the IC under specified no-load conditions. (7) Output Sink Current (ISINK) Denotes the maximum current that can be output under specific output conditions. (8) Output Saturation Voltage, Low Level Output Voltage (VOL) Signifies the voltage range that can be output under specific output conditions. (9) Output Leakage Current, High Level Output Current (ILEAK) Indicates the current that flows into the IC under specific input and output conditions. (10) Response Time (tRE) Response time indicates the delay time between the input and output signal is determined by the time difference from the fifty percent of input signal swing to the fifty percent of output signal swing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves ○BA2903Yxxx-M 1.0 1.6 1.4 BA2903YF-M 1.2 Supply Current [mA] Power Dissipation [W] 0.8 BA2903YFV-M 0.6 BA2903YFVM-M 0.4 1.0 -40℃ 0.8 25℃ 0.6 0.4 0.2 125℃ 0.2 0.0 0.0 0 25 50 75 100 125 Ambient Temperature [°C] 150 0 Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 10 20 30 Supply Voltage [V] 40 Figure 3. Supply Current vs Supply Voltage 1.6 200 Output Saturation Voltage [mV] 1.4 Supply Current [mA] 1.2 1.0 0.8 36V 0.6 5V 0.4 150 125℃ 100 25℃ 50 -40℃ 2V 0.2 0 0.0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 5. Output Saturation Voltage vs Supply Voltage (ISINK=4mA) Figure 4. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2903Yxxx-M 200 2.0 Output Saturation Voltage [V] Output Saturation Voltage [mV] 1.8 150 2V 100 5V 36V 50 1.6 1.4 125℃ 1.2 25℃ 1.0 0.8 0.6 -40℃ 0.4 0.2 0.0 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 2 4 6 8 10 12 14 16 Output Sink Current [mA] 18 20 Figure 7. Output Saturation Voltage vs Output Sink Current (VCC=5V) Figure 6. Output Saturation Voltage vs Ambient Temperature (ISINK=4mA) 40 8 30 5V 36V 20 2V 10 Input Offset Voltage [mV] Output Sink Current [mA] 6 4 -40℃ 2 0 25℃ 125℃ -2 -4 -6 -8 0 -50 -25 0 0 25 50 75 100 125 150 Ambient Temperature [°C] 10 20 30 Supply Voltage [V] 40 Figure 9. Input Offset Voltage vs Supply Voltage Figure 8. Output Sink Current vs Ambient Temperature (OUT=1.5V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued 8 160 6 140 4 120 Input Bias Current [nA] Input Offset Voltage [mV] ○BA2903Yxxx-M 2V 2 0 5V 36V -2 -4 100 -40℃ 80 25℃ 60 40 125℃ -6 20 -8 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 Figure 10. Input Offset Voltage vs Ambient Temperature 10 20 30 Supply Voltage [V] 40 Figure 11. Input Bias Current vs Supply Voltage 50 160 40 140 30 Input Offset Current [nA] Input Bias Current [nA] 120 100 36V 80 60 40 5V 20 10 -40℃ 25℃ 0 125℃ -10 -20 -30 2V 20 -40 -50 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 0 150 Figure 12. Input Bias Current vs Ambient Temperature 10 20 30 Supply Voltage [V] 40 Figure 13. Input Offset Current vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2903Yxxx-M 140 50 40 130 Large Signal Voltage Gain [dB] Input Offset Current [nA] 30 20 10 2V 0 36V 5V -10 -20 -30 125℃ 120 110 25℃ 100 90 80 70 -40 -50 60 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 10 20 30 Supply Voltage [V] 40 Figure 15. Large Signal Voltage Gain vs Supply Voltage Figure 14. Input Offset Current vs Ambient Temperature 140 160 Common Mode Rejection Ratio [dB] 130 Large Signal Voltage Gain [dB] -40℃ 36V 120 110 15V 100 5V 90 80 70 140 120 125℃ 25℃ 100 60 -40℃ 80 60 40 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 10 20 30 Supply Voltage [V] 40 Figure 17. Common Mode Rejection Ratio vs Supply Voltage Figure 16. Large Signal Voltage Gain vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued 150 6 125 4 36V Input Offset Voltage [mV] Common Mode Rejection Ratio [dB] ○BA2903Yxxx-M 100 75 5V 2V 50 125℃ 0 -2 -4 0 -6 -25 0 25 50 75 100 Ambient Temperature [°C] 125 -40℃ 2 25 -50 25℃ 150 -1 Figure 18. Common Mode Rejection Ratio vs Ambient Temperature 1 2 3 Input Voltage [V] 4 5 Figure 19. Input Offset Voltage - Input Voltage (VCC=5V) 200 5 180 Response Time (Low to High) [μs] Power Supply Rejection Ratio [dB] 0 160 140 120 100 4 3 2 125℃ 1 25℃ -40℃ 80 0 -100 60 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 -80 -60 -40 -20 Over Drive Voltage [mV] 0 Figure 21. Response Time (Low to High) vs Over Drive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ) Figure 20. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2903Yxxx-M 5 Response Time (High to Low) [μs] Response Time (Low to High) [μs] 5 4 3 2 5mV overdrive 20mV overdrive 100mV overdrive 1 0 4 3 125℃ 2 25℃ -40℃ 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 20 40 60 80 Over Drive Voltage [mV] 100 Figure 23. Response Time (High to Low) vs Over Drive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ) Figure 22. Response Time (Low to High) vs Ambient Temperature (VCC=5V, VRL=5V, RL=5.1kΩ) Response Time (High to Low) [μs] 5 4 3 5mV overdrive 2 20mV overdrive 100mV overdrive 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 Figure 24. Response Time (High to Low) vs Ambient Temperature (VCC=5V, VRL=5V, RL=5.1kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2901Yxx-M 1.0 2.0 1.8 0.8 1.6 0.6 Supply Current [mA] Power Dissipation [W] -40℃ BA2901YF-M BA2901YFV-M 0.4 0.2 25℃ 1.4 1.2 1.0 0.8 0.6 125℃ 0.4 0.2 0.0 0.0 0 25 50 75 100 125 Ambient Temperature [°C] 150 0 Figure 25. Power Dissipation vs Ambient Temperature (Derating Curve) 10 20 30 Supply Voltage [V] 40 Figure 26. Supply Current vs Supply Voltage 200 2.0 1.8 1.4 Output Saturation Voltage [mV] Supply Current [mA] 1.6 36V 1.2 1.0 5V 0.8 0.6 2V 0.4 150 125℃ 100 25℃ 50 -40℃ 0.2 0 0.0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 28. Output Saturation Voltage vs Supply Voltage (ISINK=4mA) Figure 27. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2901Yxx-M 2.0 200 Output Saturation Voltage [V] Output Saturation Voltage [mV] 1.8 150 2V 100 5V 36V 50 1.6 1.4 125℃ 1.2 25℃ 1.0 0.8 0.6 -40℃ 0.4 0.2 0.0 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 0 150 2 4 6 8 10 12 14 16 Output Sink Current [mA] 18 20 Figure 30. Output Saturation Voltage vs Output Sink Current (VCC=5V) Figure 29. Output Saturation Voltage vs Ambient Temperature (ISINK=4mA) 8 40 30 5V 36V 20 2V 10 Input Offset Voltage [mV] Output Sink Current [mA] 6 4 -40℃ 2 0 25℃ 125℃ -2 -4 -6 -8 0 -50 -25 0 0 25 50 75 100 125 150 Ambient Temperature [°C] 10 20 30 Supply Voltage [V] 40 Figure 32. Input Offset Voltage vs Supply Voltage Figure 31. Output Sink Current vs Ambient Temperature (OUT=1.5V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued 8 160 6 140 4 120 Input Bias Current [nA] Input Offset Voltage [mV] ○BA2901Yxx-M 2V 2 0 5V 36V -2 -4 100 -40℃ 80 25℃ 60 40 125℃ -6 20 -8 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 Figure 33. Input Offset Voltage vs Ambient Temperature 10 20 30 Supply Voltage [V] 40 Figure 34. Input Bias Current vs Supply Voltage 160 50 40 140 30 Input Offset Current [nA] Input Bias Current [nA] 120 100 36V 80 60 40 5V 20 10 -40℃ 25℃ 0 125℃ -10 -20 -30 2V 20 -40 -50 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 0 150 10 20 30 Supply Voltage [V] 40 Figure 36. Input Offset Current vs Supply Voltage Figure 35. Input Bias Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2901Yxx-M 140 50 40 130 Large Signal Voltage Gain [dB] Input Offset Current [nA] 30 20 10 2V 0 5V -10 36V -20 -30 125℃ 120 110 25℃ 100 90 80 70 -40 -50 60 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 Figure 37. Input Offset Current vs Ambient Temperature 10 20 30 Supply Voltage [V] 40 Figure 38. Large Signal Voltage Gain vs Supply Voltage 140 160 Common Mode Rejection Ratio [dB] 130 Large Signal Voltage Gain [dB] -40℃ 36V 120 110 15V 100 5V 90 80 70 140 120 125℃ 25℃ 100 60 -40℃ 80 60 40 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 10 20 30 Supply Voltage [V] 40 Figure 40. Common Mode Rejection Ratio vs Supply Voltage Figure 39. Large Signal Voltage Gain vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued 150 6 125 4 36V Input Offset Voltage [mV] Common Mode Rejection Ratio [dB] ○BA2901Yxx-M 100 75 5V 2V 50 25 25℃ -40℃ 2 125℃ 0 -2 -4 0 -6 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 -1 Figure 41. Common Mode Rejection Ratio vs Ambient Temperature 1 2 3 Input Voltage [V] 4 5 Figure 42. Input Offset Voltage - Input Voltage (VCC=5V) 5 200 180 Response Time (Low to High) [μs] Power Supply Rejection Ratio [dB] 0 160 140 120 100 4 3 2 125℃ 1 25℃ -40℃ 80 0 -100 60 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 -80 -60 -40 -20 Over Drive Voltage [mV] 0 Figure 44. Response Time (Low to High) vs Over Drive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ) Figure 43. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Typical Performance Curves - continued ○BA2901Yxx-M 5 Response Time (High to Low) [μs] Response Time (Low to High) [μs] 5 4 3 2 5mV overdrive 20mV overdrive 100mV overdrive 1 0 4 3 125℃ 2 25℃ -40℃ 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 0 20 40 60 80 Over Drive Voltage [mV] 100 Figure 46. Response Time (High to Low) vs Over Drive Voltage (VCC=5V, VRL=5V, RL=5.1kΩ) Figure 45. Response Time (Low to High) vs Ambient Temperature (VCC=5V, VRL=5V, RL=5.1kΩ) Response Time (High to Low) [μs] 5 4 3 5mV overdrive 2 20mV overdrive 100mV overdrive 1 0 -50 -25 0 25 50 75 100 Ambient Temperature [°C] 125 150 Figure 47. Response Time (High to Low) vs Ambient Temperature (VCC=5V, VRL=5V, RL=5.1kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 48(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax-TA) / PD °C/W The Derating curve in Figure 48(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 48(c) and (d) shows an example of the derating curve for BA2903Yxxx-M, BA2901Yxx-M. LSIの Power dissipation LSI 消of 費電 力 [W] LSI の消費電力 PPd D(max) D(max) (max) θJA=(TJmax-TA)/PD °C /W θθja2 < θθja1 JA2 < JA1 P2 Ambient temperature TA [ °C ] θ’ θ'JA2 ja2 P1 Chip surface temperature TJ [ °C ] 0 25 TJ(max) J’(max) Tj (max) Tj ' T (max) θ’θ'JA1 ja1 θθJA1 ja1 50 75 100 125 150 TA [℃ ] ] [ °C 周 囲 温 度 Ta 周囲温度 Ambient temperature (a) Thermal resistance (b) Derating curve 1.0 1.0 BA2903YF-M 0.8 BA2903YFV-M 0.6 (Note 20) BA2901YFV-M (Note 17) Power Dissipation [W] Power Dissipation [W] θJA2 θ ja2 (Note 18) (Note 19) BA2903YFVM-M 0.4 0.2 0.0 0.8 0.6 (Note 21) BA2901YF-M 0.4 0.2 0.0 0 25 50 75 100 125 Ambient Temperature [°C] 150 0 25 50 75 100 125 150 Ambient Temperature [°C] (c) BA2903Y (d) BA2901Y (Note17) (Note18) (Note19) (Note20) (Note21) UNIT 6.2 5.0 4.7 7.0 4.5 mW/°C When using the unit above TA=25°C, subtract the value above per Celsius degree. Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted. Figure 48. Thermal resistance and derating www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Application Information NULL method condition for Test circuit1 VCC,VEE,EK,VICM Unit：V Parameter VF S1 S2 S3 VCC VEE EK VICM Calculation Input Offset Voltage VF1 ON ON ON 5 to 36 0 -1.4 0 1 Input Offset Current VF2 OFF OFF ON 5 0 -1.4 0 2 VF3 OFF ON VF4 ON OFF ON ON Input Bias Current VF5 Large Signal Voltage Gain VF6 - Calculation 1. Input Offset Voltage (VIO) VIO = |VF1| 5 0 -1.4 0 5 0 -1.4 0 15 0 -1.4 0 15 0 -11.4 0 ON ON 3 4 [V] 1+RF/RS |VF2-VF1| 2. Input Offset Current (IIO) IIO = 3. Input Bias Current (IB) IB = 4. Large Signal Voltage Gain (AV) AV = 20Log ΔEK × (1+RF/RS) |VF5-VF6| RI ×(1+RF/RS) [A] |VF4-VF3| [A] 2 × RI ×(1+RF/RS) [dB] RF=50kΩ 0.1µF 500kΩ SW1 VCC EK RS=50Ω 15V Vo RI=10kΩ 500kΩ 0.1µF 0.1µF DUT NULL SW3 RS=50Ω 1000pF RI=10kΩ VF RL VICM SW2 50kΩ VEE VRL -15V Figure 49. Test circuit1 (one channel only) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Switch Condition for Test Circuit 2 SW No. Supply Current Output Sink Current SW 1 SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 OFF OFF OFF OFF OFF OFF OFF OUT=1.5V OFF ON ON OFF OFF OFF ON Output Saturation Voltage ISINK=4mA OFF ON ON OFF ON ON OFF Output Leakage Current OUT=36V OFF ON ON OFF OFF OFF ON Response Time RL=5.1kΩ, VRL=5V ON OFF ON ON OFF OFF OFF VCC A － ＋ SW1 SW2 SW3 SW4 SW5 SW6 SW7 VEE RL V -IN VRL +IN A OUT Figure 50. Test Circuit 2 (one channel only) IN IN Input wave Input wave VREF overdrive voltage overdrive voltage VREF OUT OUT Output wave Output wave VCC VCC VCC/2 VCC/2 0V 0V tRE (Low to High) tRE (High to Low) Figure 51. Response Time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Example of circuit ○Reference voltage is -IN VCC VRL IN + IN - Reference Voltage VREF OUT Vref VEE Time OUT High While the input voltage is higher that the reference voltage, the output voltage remains high. In case the input voltage becomes lower than the reference voltage, the output voltage will turn low. Low Time ○Reference voltage is +IN IN VCC RL + Reference Voltage Vref IN VRL VREF Time VEE OUT High While the input voltage is smaller that the reference voltage, the output voltage remains high. In case the input voltage becomes higher than the reference voltage, the output voltage will turn low. Low Time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Operational Notes – continued 11. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ N P N P+ N Pin B B N Parasitic Element P+ N P N P+ B N C E Parasitic Element P Substrate P Substrate GND GND Parasitic Element GND GND Parasitic Element Parasitic element or Transistor Figure 52. Example of Monolithic IC Structure 12. Unused Circuits When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting input terminal to a potential within the in-phase input voltage range (VICR). VCC keep this potential in VICM VICM + - OPEN VEE Figure 53. Disable Circuit Example 13. Input Terminal Voltage Applying VEE + 36V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. Power Supply (signal / dual) The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be used as a dual supply op-amp as well. 15. Terminal short-circuits When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 16. IC Handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Physical Dimensions Tape and Reel Information Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 25/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Physical Dimension Tape and Reel Information - continued Package Name SSOP-B8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 26/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Physical Dimension Tape and Reel Information - continued Package Name MSOP8 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ∗ Order quantity needs to be multiple of the minimum quantity. 27/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Physical Dimension Tape and Reel Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 28/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Physical Dimension Tape and Reel Information - continued Package Name SSOP-B14 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 29/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Marking Diagrams SOP8(TOP VIEW) SSOP-B8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK MSOP8(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SSOP-B14(TOP VIEW) Part Number Marking Product Name Package Type LOT Number BA2903Y BA2901Y Marking F-M SOP8 03YM FV-M SSOP-B8 MSOP8 03YM FVM-M F-M SOP14 FV-M SSOP-B14 03YM BA2901YFM 01YM 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 BA2903Yxxx-M Datasheet BA2901Yxx-M Land pattern data SOP8, SSOP-B8, MSOP8, SOP14, SSOP-B14 b2 e MIE ℓ2 PKG SOP8 SOP14 SSOP-B8 SSOP-B14 MSOP8 All dimensions in mm Land length Land width ≧ℓ 2 b2 Land pitch e Land space MIE 1.27 4.60 1.10 0.76 0.65 4.60 1.20 0.35 0.65 2.62 0.99 0.35 Revision History Date Revision 11.Apr.2012 001 New Release 002 Land pattern data inserted. SOP8, SSOP-B8, MSOP8 Power dissipation corrected. SSOP-B8, SSOP-B14 corrected. 13.Sep.2013 Changes www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 31/31 TSZ02201-0RFR1G200550-1-2 13.Sep.2013 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001