Datasheet
Comparator series
Automotive
Ground Sense Comparators
BA2903Yxxx-C, BA2901Yxx-C
●General Description
BA2903Yxxx-C/BA2901Yxx-C, integrate two or four
independent high gain voltage comparator.
Some features are the wide operating voltage that is
2V to 36V and low supply current. BA2903Yxxx-C,
BA2901Yxx-C are manufactured for automotive
requirements of engine control unit, electric power
steering, antilock brake system, etc.
●Key Specifications
Operating supply voltage
single supply :
split supply :
Supply current
BA2903Yxxx-C
BA2901Yxx-C
Input bias current :
Input offset current :
Operating temperature range :
●Features
(Note 1)
AEC-Q100 Qualified
Single or dual supply operation
Wide operating supply voltage
Standard comparator Pin-assignments
Common-mode Input Voltage Range includes ground
level, allowing direct ground sensing
Internal ESD protection circuit
Wide temperature range
(Note1: Grade1)
+2.0V to +36V
±1.0V to ±18V
0.6mA(Typ.)
0.8mA(Typ.)
50nA(Typ.)
5nA(Typ.)
-40℃ to +125℃
●Special Characteristics
Input Offset Voltage
-40°C to 125°C:
●Packages
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
5mV (Max.)
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
●Application
Engine Control Unit
Electric Power Steering (EPS)
Anti-Lock Brake System (ABS)
Automotive electronics
●Selection Guide
Maximum Operating Temperature
+125℃
Supply Current
Dual
0.6mA
BA2903YF-C
BA2903YFV-C
BA2903YFVM-C
Quad
0.8mA
BA2901YF-C
BA2901YFV-C
Automotive
●Simplified schematic
VCC
OUT
+IN
-IN
VEE
Figure 1. Simplified schematic (one channel only)
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Pin Configuration
BA2903YF-C : SOP8
BA2903YFV-C : SSOP-B8
BA2903YFVM-C : MSOP8
OUT1
1
-IN1
2
+IN1
8
CH1
7
- +
3
6
CH2
Pin No.
Pin name
1
OUT1
2
-IN1
3
+IN1
VCC
OUT2
-IN2
+ 4
VEE
5
+IN2
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
Pin No.
Pin name
1
OUT2
2
OUT1
3
VCC
BA2901YF-C : SOP14
BA2901YFV-C : SSOP-B14
OUT2
1
14 OUT3
OUT1
2
13 OUT4
VCC
3
12 VEE
-IN1
4
+IN1
5
10
-IN4
-IN2
6
9
+IN3
8
-IN3
+IN2
CH1
- +
CH4
- +
CH2
CH3
- +
- +
7
11 +IN4
4
-IN1
5
+IN1
6
-IN2
7
+IN2
8
-IN3
9
+IN3
10
-IN4
11
+IN4
12
VEE
13
OUT4
14
OUT3
Package
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
BA2903YF-C
BA2903YFV-C
BA2903YFVM-C
BA2901YF-C
BA2901YFV-C
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Ordering Information
B
A
2
9
0
x
Y
x
x
x
-
C
Package
F
: SOP8
SOP14
FV : SSOP-B8
: SSOP-B14
FVM : MSOP8
Part Number
BA2903Yxxx
BA2901Yxx
x x
Packaging and forming specification
C: for Automotive
E2: Embossed tape and reel
(SOP8/SOP14/SSOP-B8/
SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
●Line-up
Operating
Supply Voltage
Topr
Dual/Quad
Dual
-40℃ to +125℃
+2.0V to +36V
Orderable
Part Number
Package
SOP8
Reel of 2500
BA2903YF-CE2
SSOP-B8
Reel of 2500
BA2903YFV-CE2
MSOP8
Reel of 3000
BA2903YFVM-CTR
SOP14
Reel of 2500
BA2901YF-CE2
SSOP-B14
Reel of 2500
BA2901YFV-CE2
Quad
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
VCC-VEE
Supply Voltage
Power Dissipation
Differential Input Voltage
Pd
*7
Input Common-mode Voltage Range
Input Current
*8
Ratings
Unit
+36
V
SOP8
770
*1*6
SSOP-B8
620
*2*6
MSOP8
580
*3*6
SOP14
560
*4*6
SSOP-B14
870
*5*6
mW
Vid
+36
V
Vicm
(VEE-0.3) to (VEE+36)
V
Ii
mA
Operating Supply Voltage
Vopr
Operating Temperature Range
Topr
-10
+2.0 to +36
(±1.0 to ±18)
-40 to +125
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Maximum junction Temperature
V
℃
Note : Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause
deterioration of characteristics.
*1 To use at temperature above Ta＝25℃ reduce 6.2mW/℃.
*2 To use at temperature above Ta＝25℃ reduce 5.0mW/℃.
*3 To use at temperature above Ta＝25℃ reduce 4.7mW/℃.
*4 To use at temperature above Ta＝25℃ reduce 4.5mW/℃.
*5 To use at temperature above Ta＝25℃ reduce 7.0mW/℃.
*6 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*7 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input pin voltage is set to more than VEE.
*8 An excessive input current will flow when input voltages of lesser than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Electrical Characteristics
○BA2903Yxxx-C (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Symbol
Parameter
range
Min.
Typ.
25℃
2
*9
Input Offset Voltage
Vio
Full range
25℃
5
*9
Input Offset Current
Iio
Full range
25℃
50
*9
Input Bias Current
Ib
Full range
25℃
0
Input Common-mode
Vicm
Voltage Range
Full range
0
25℃
88
100
Large Signal Voltage Gain
Av
Full range
74
25℃
0.6
Supply Current
ICC
Full range
*10
Output Sink Current
Isink
25℃
6
16
25℃
150
Output Saturation Voltage
VOL
(Low level output voltage)
Full range
25℃
0.1
Output Leakage Current
Ileak
(High level output current)
Full range
Response Time
Operable Frequency
Tre
Fopr
Max.
4
5
40
50
250
275
VCC-1.5
VCC-2.0
1
2.5
400
700
1
-
1.3
-
-
0.4
-
100
-
-
Conditions
mV
OUT=1.4V
VCC=5 to 36V, OUT=1.4V
nA
OUT=1.4V
nA
OUT=1.4V
V
dB
mA
mA
mV
nA
μA
μs
25℃
25℃
Unit
kHz
VCC=15V, OUT=1.4 to 11.4V
RL=15kΩ, VRL=15V
OUT=open
OUT=open, VCC=36V
+IN=0V, -IN=1V, VOL=1.5V
+IN=0V, -IN=1V,
Isink=4mA
+IN=1V, -IN=0V, VOH=5V
+IN=1V, -IN=0V, VOH=36V
RL=5.1kΩ, VRL=5V
IN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, IN=TTL
Logic Swing, VREF=1.4V
VCC=5V, RL=2kΩ, +IN=1.5V, -IN=5Vp-p
(Duty 50% Rectangular Pulse)
*9 Absolute value
*10 Please determine the output current value in consideration of the power dissipation of the IC under high temperature environment.
When the output terminal is continuously shorted, output current may be reduced by the temperature rise of the IC.
○BA2901Yxx-C
(Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
range
Min.
Typ.
25℃
2
*11
Input Offset Voltage
Vio
Full range
25℃
5
*11
Input Offset Current
Iio
Full range
25℃
50
*11
Input Bias Current
Ib
Full range
25℃
0
Input Common-mode
Vicm
Voltage Range
Full range
0
25℃
88
100
Large Signal Voltage Gain
Av
Full range
74
25℃
0.8
Supply Current
ICC
Full range
*12
Output Sink Current
Isink
25℃
6
16
25℃
150
Output Saturation Voltage
VOL
(Low level output voltage)
Full range
25℃
0.1
Output Leakage Current
Ileak
(High level output current)
Full range
Response Time
Operable Frequency
Tre
Fopr
Max.
4
5
40
50
250
275
VCC-1.5
VCC-2.0
2
2.5
400
700
1
-
1.3
-
-
0.4
-
100
-
-
Conditions
mV
OUT=1.4V
VCC=5 to 36V, OUT=1.4V
nA
OUT=1.4V
nA
OUT=1.4V
V
dB
mA
mA
mV
nA
μA
μs
25℃
25℃
Unit
kHz
VCC=15V, OUT=1.4 to 11.4V
RL=15kΩ, VRL=15V
OUT=open
OUT=open, VCC=36V
+IN=0V, -IN=1V, VOL=1.5V
+IN=0V, -IN=1V,
Isink=4mA
+IN=1V, -IN=0V, VOH=5V
+IN=1V, -IN=0V, VOH=36V
RL=5.1kΩ, VRL=5V
IN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, IN=TTL
Logic Swing, VREF=1.4V
VCC=5V, RL=2kΩ, +IN=1.5V, -IN=5Vp-p
(Duty 50% Rectangular Pulse)
*11 Absolute value
*12 Please determine the output current value in consideration of the power dissipation of the IC under high temperature environment.
When the output terminal is continuously shorted, output current may be reduced by the temperature rise of the IC.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Supply Voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential Input Voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
1.3 Input Common-mode Voltage Range (Vicm)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
1.4 Operating and Storage Temperature Ranges (Topr,Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
1.5 Power Dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2.Electrical characteristics
2.1 Input Offset Voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input Offset Current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input Bias Current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
2.4 Input Common-mode Voltage Range (Vicm)
Indicates the input voltage range where IC normally operates.
2.5 Large Signal Voltage Gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential input voltage)
2.6 Supply current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
2.7 Output Sink Current (Isink)
Indicates the current flowing into the IC under specific output conditions.
2.8 Output Saturation Voltage ( Low level output voltage) (VOL)
Indicates the lower limit of output voltage under specific input and output conditions.
2.9 Output Leakage Current( High level output current) (Ileak)
Indicates the current that flows into the IC under specific input and output conditions.
2.11 Response Time (Tre)
Indicates the time interval between the application of input and output conditions.
2.10 Operable Frequency (Fopr)
Indicates minimum frequency that IC moves under specific conditions..
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Typical Performance Curves
○BA2903Yxxx-C
1.6
.
1000
800
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
BA2903YF-C
BA2903YFV-C
600
BA2903YFVM-C
400
200
0
1.4
1.2
1.0
-40℃
0.8
0.6
25℃
0.4
125℃
0.2
0.0
0
50
25
75
100
125
0
150
AMBIENT TEMPERATURE [℃]
MAXIMUM OUTPUT VOLTAGE [mV]
SUPPLY CURRENT [mA]
1.4
1.2
1.0
36V
2V
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
30
40
Figure 3.
Supply Current – Supply Voltage
1.6
5V
20
SUPPLY VOLTAGE [V]
Figure 2.
Derating Curve
0.8
10
100 125 150
200
150
125℃
100
25℃
50
-40℃
0
0
10
AMBIENT TEMPERATURE [℃]
20
30
40
SUPPLY VOLTAGE [V]
Figure 5.
Maximum Output Voltage – Supply Voltage
(Isink=4mA)
Figure 4.
Supply Current – Ambient
Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Typical Performance Curves -Continued
○BA2903Yxxx-C
MAXIMUM OUTPUT VOLTAGE [mV]
200
2
1.8
OUTPUT VOLTAGE [V]
2V
150
100
5V
36V
50
1.6
1.4
125℃
1.2
1
25℃
0.8
0.6
0.4
-40℃
0.2
0
0
-50 -25
0
25
50
75
0
100 125 150
AMBIENT TEMPERATURE [℃]
4
6
8
10
12
14
16
18
20
OUTPUT SINK CURRENT [mA]
Figure 7.
Output Voltage – Output Sink Current
(VCC=5V)
Figure 6.
Maximum Output Voltage – Ambient Temperature
(Isink=4mA)
8
INPUT OFFSET VOLTAGE [mV]
40
OUTPUT SINK CURRENT [mA]
2
30
5V
36V
20
2V
10
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
0
-50
-25
0
25
50
75
100 125 150
0
10
AMBIENT TEMPERATURE [℃]
20
30
40
SUPPLY VOLTAGE [V]
Figure 8.
Output Sink Current – Ambient Temperature
(OUT=1.5V)
Figure 9.
Input Offset Voltage – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
8
160
6
140
4
5V
36V
2
0
2V
-2
-4
-6
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
●Typical Performance Curves -Continued
○BA2903Yxxx-C
120
-40℃
100
80
60
25℃
40
125℃
20
0
-8
-50
-25
0
25
50
75
0
100 125 150
5
AMBIENT TEMPERATURE [℃]
140
40
INPUT OFFSET CURRENT[nA]
INPUT BIAS CURRENT [nA]
50
36V
80
60
40
5V
2V
20
20
25
30
35
Figure 11.
Input Bias Current – Supply Voltage
160
100
15
SUPPLY VOLTAGE [V]
Figure 10.
Input Offset Voltage – Ambient
Temperature
120
10
30
20
-40℃
10
0
-10
125℃
25℃
-20
-30
-40
-50
0
-50
-25
0
25
50
75
0
100 125 150
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 13.
Input Offset Current – Supply Voltage
Figure 12.
Input Bias Current – Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Typical Performance Curves -Continued
○BA2903Yxxx-C
LARGE SINGAL VOLTAGE GAIN [dB]
INPUT OFFSET CURRENT [nA]
50
40
30
20
2V
10
5V
0
-10
36V
-20
-30
-40
-50
-50
-25
0
25
50
75
140
130
125℃
25℃
120
110
100
-40℃
90
80
70
60
100 125 150
0
10
AMBIENT TEMPERATURE [℃]
36V
120
110
15V
100
5V
90
80
70
60
-50
-25
0
25
50
75
40
Figure 15.
Large Signal Voltage Gain
– Supply Voltage
COMMON MODE REJECTION RATIO [dB]
LARGE SINGAL VOLTAGE GAIN [dB]
130
30
SUPPLY VOLTAGE [V]
Figure 14.
Input Offset Current
– Ambient Temperature
140
20
160
140
120
125℃
100
80
-40℃
60
40
0
100 125 150
25℃
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Figure 16.
Large Signal Voltage Gain
– Ambient Temperature
Figure 17.
Common Mode Rejection Ratio
– Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
6
150
INPUT OFFSET VOLTAGE [mV]
COMMON MODE REJECTION RATIO [dB]
●Typical Performance Curves -Continued
○BA2903Yxxx-C
125
36V
100
75
5V
2V
50
25
-40℃
4
25℃
125℃
2
0
-2
-4
-6
0
-50
-25
0
25
50
75
-1
100 125 150
0
1
3
4
5
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 18.
Common Mode Rejection Ratio
– Ambient Temperature
Figure 19.
Input Offset Voltage – Input Voltage
(VCC=5V)
5
200
RESPONSE TIME (LOW TO HIGH)[μs]
POWER SUPPLY REJECTION RATIO [dB]
2
180
160
140
120
100
80
60
-50
-25
0
25
50
75
100 125 150
4
3
2
125℃
25℃
-40℃
1
0
-100
-80
-60
-40
-20
0
AMBIENT TEMPERATURE [℃]
OVER DRIVE VOLTAGE [mV]
Figure 20.
Power Supply Rejection Ratio
– Ambient Temperature
Figure 21.
Response Time (Low to High) – Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
10
5
RESPONSE TIME (HIGH TO LOW)[μs]
RRESPONSE TIME (LOW TO HIGH)[μs]
●Typical Performance Curves -Continued
○BA2903Yxxx-C
4
3
5mV
overdrive
20mV
overdrive
100mV
2
overdrive
1
0
-50
-25
0
25
50
75
100 125 150
8
6
4
125℃
25℃
-40℃
2
0
0
AMBIENT TEMPERATURE [℃]
20
40
60
80
100
OVER DRIVE VOLTAGE [mV]
Figure 22.
Response Time (Low to High)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 23.
Response Time (High to Low)
– Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
RESPONSE TIME (HIGH TO LOW)[μs]
10
8
6
5mV
overdrive
20mV
4
overdrive
100mV
overdrive
2
0
-50
-25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
Figure 24.
Response Time (High to Low)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Typical Performance Curves
○BA2901Yxx-C
2.0
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
1000
800
BA2901YFV-C
600
BA2901YF-C
400
200
0
0
25
50
75
100
125
-40℃
1.5
1.0
25℃
0.5
125℃
0.0
150
0
10
AMBIENT TEMPERATURE [℃]
36V
5V
2V
0.5
0.0
0
25
50
75
100 125 150
MAXIMUM OUTPUT VOLTAGE [mV]
SUPPLY CURRENT [mA]
1.5
-25
40
Figure 26.
Supply Current – Supply Voltage
2.0
-50
30
SUPPLY VOLTAGE [V]
Figure 25.
Derating Curve
1.0
20
200
150
125℃
100
25℃
50
-40℃
0
0
10
AMBIENT TEMPERATURE [℃]
20
30
40
SUPPLY VOLTAGE [V]
Figure 27.
Supply Current – Ambient Temperature
Figure 28.
Maximum Output Voltage – Supply Voltage
(Isink=4mA)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
200
2
1.8
2V
OUTPUT VOLTAGE [V]
MAXIMUM OUTPUT VOLTAGE [mV]
●Typical Performance Curves -Continued
○BA2901Yxx-C
150
100
5V
36V
50
1.6
1.4
125℃
1.2
1
25℃
0.8
0.6
0.4
-40℃
0.2
0
0
-50 -25
0
25
50
75
0
100 125 150
AMBIENT TEMPERATURE [℃]
4
6
8
10
12
14
16
18
20
OUTPUT SINK CURRENT [mA]
Figure 30.
Output Voltage – Output Sink Current
(VCC=5V)
Figure 29.
Maximum Output Voltage – Ambient Temperature
(Isink=4mA)
40
8
INPUT OFFSET VOLTAGE [mV]
OUTPUT SINK CURRENT [mA]
2
30
5V
36V
20
2V
10
0
6
4
-40℃
2
0
25℃
125℃
-2
-4
-6
-8
-50
-25
0
25
50
75
100 125 150
0
10
AMBIENT TEMPERATURE [℃]
20
30
40
SUPPLY VOLTAGE [V]
Figure 31.
Output Sink Current – Ambient Temperature
(OUT=1.5V)
Figure 32.
Input Offset Voltage – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
8
160
6
140
4
5V
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
●Typical Performance Curves -Continued
○BA2901Yxx-C
36V
2
0
2V
-2
-4
-6
120
-40℃
100
80
60
25℃
40
125℃
20
0
-8
-50
-25
0
25
50
75
0
100 125 150
5
AMBIENT TEMPERATURE [℃]
20
25
30
35
Figure 34.
Input Bias Current – Supply Voltage
160
50
140
40
INPUT OFFSET CURRENT[nA]
INPUT BIAS CURRENT [nA]
15
SUPPLY VOLTAGE [V]
Figure 33.
Input Offset Voltage – Ambient
Temperature
120
100
36V
80
60
40
5V
2V
20
10
30
20
-40℃
10
0
-10
125℃
25℃
-20
-30
-40
-50
0
-50
-25
0
25
50
75
100 125 150
0
10
20
30
40
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 35.
Input Bias Current – Ambient Temperature
Figure 36.
Input Offset Current – Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Typical Performance Curves -Continued
○BA2901Yxx-C
LARGE SINGAL VOLTAGE GAIN [dB]
INPUT OFFSET CURRENT [nA]
50
40
30
20
2V
10
5V
0
-10
36V
-20
-30
-40
-50
-50
-25
0
25
50
75
140
130
125℃
25℃
120
110
100
-40℃
90
80
70
60
100 125 150
0
10
AMBIENT TEMPERATURE [℃]
COMMON MODE REJECTION RATIO [dB]
LARGE SINGAL VOLTAGE GAIN [dB]
130
36V
110
15V
5V
90
80
70
60
-50
-25
0
25
50
75
40
Figure 38.
Large Signal Voltage Gain
– Supply Voltage
140
100
30
SUPPLY VOLTAGE [V]
Figure 37.
Input Offset Current
– Ambient Temperature
120
20
100 125 150
160
140
120
125℃
100
80
-40℃
25℃
60
40
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Figure 39.
Large Signal Voltage Gain
– Ambient Temperature
Figure 40.
Common Mode Rejection Ratio
– Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
6
150
INPUT OFFSET VOLTAGE [mV]
COMMON MODE REJECTION RATIO [dB]
●Typical Performance Curves -Continued
○BA2901Yxx-C
125
36V
100
75
5V
2V
50
25
-40℃
4
25℃
125℃
2
0
-2
-4
-6
0
-50
-25
0
25
50
75
-1
100 125 150
0
1
3
4
5
INPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 41.
Common Mode Rejection Ratio
– Ambient Temperature
Figure 42.
Input Offset Voltage – Input Voltage
(VCC=5V)
5
200
RESPONSE TIME (LOW TO HIGH)[μs]
POWER SUPPLY REJECTION RATIO [dB]
2
180
160
140
120
100
80
60
-50
-25
0
25
50
75
100 125 150
4
3
2
125℃
25℃
-40℃
1
0
-100
-80
-60
-40
-20
0
AMBIENT TEMPERATURE [℃]
OVER DRIVE VOLTAGE [mV]
Figure 43.
Power Supply Rejection Ratio
– Ambient Temperature
Figure 44.
Response Time (Low to High) – Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
10
5
RESPONSE TIME (HIGH TO LOW)[μs]
RRESPONSE TIME (LOW TO HIGH)[μs]
●Typical Performance Curves -Continued
○BA2901Yxx-C
4
3
5mV
overdrive
20mV
overdrive
100mV
2
overdrive
1
0
-50
-25
0
25
50
75
100 125 150
8
6
4
125℃
25℃
-40℃
2
0
0
20
40
60
80
AMBIENT TEMPERATURE [℃]
OVER DRIVE VOLTAGE [mV]
Figure 45.
Response Time (Low to High)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
Figure 46.
Response Time (High to Low)
– Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
100
RESPONSE TIME (HIGH TO LOW)[μs]
10
8
6
5mV
overdrive
20mV
4
overdrive
100mV
overdrive
2
0
-50
-25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
Figure 47.
Response Time (High to Low)
– Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 50. (a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), junction temperature (Tj), and power dissipation (Pd).
θja = (Tjmax-Ta) / Pd
℃/W
・・・・・
(Ⅰ)
The Derating curve in Figure 48. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 49. (c),(d) shows an example of the derating curve for
BA2903Yxxx-C, BA2901Yxx-C.
LSIの 消 費
力 [W]
Power dissipation
of 電
LSI
Pd (max)
θja=(Tjmax-Ta)/Pd
℃/W
θja2 < θja1
P2
Ambient temperature
周囲温度 Ta [℃]
θ' ja2
P1
θ ja2
Tj ' (max)
θ' ja1
Tj (max)
θ ja1
Chip surfaceチップ
temperature
表面温度 Tj [℃]
0
消費電力Pd
P [W]
Power dissipation
[W]
25
50
75
100
125
150
Ambient temperature
周 囲 温 度 Ta [℃ ]
(a) Thermal resistance
(b) Derating curve
Figure 48. Thermal resistance and derating
1000
BA2903YF-C(*13)
800
POWER DISSIPATION [mW]
POWER DISSIPATION [mW]
1000
BA2903YFV-C(*14)
600
BA2903YFVM-C(*15)
400
200
0
0
25
50
75
100
125
BA2901YFV-C(*16)
800
600
BA2901YF-C(*17)
400
200
0
150
0
AMBIENT TEMPERATURE [℃]
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
(c) BA2903Y
(d) BA2901Y
(*13)
(*14)
(*15)
(*16)
(*17)
UNIT
6.2
5.0
4.7
7.0
4.5
mW/℃
When using the unit above Ta=25℃, subtract the value above per degree℃.
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.
Figure 49. Derating curve
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Application Information
NULL method condition for Test circuit 1
VCC,VEE,EK,Vicm Unit：V
Parameter
VF
S1
S2
S3
VCC
VEE
EK
Vicm
Calculation
Input Offset Voltage
VF1
ON
ON
ON
5～36
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
ON
5
0
-1.4
0
2
VF3
OFF
ON
5
0
-1.4
0
VF4
ON
OFF
5
0
-1.4
0
ON
ON
15
0
-1.4
0
15
0
-11.4
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
ON
ON
3
4
- Calculation 1. Input Offset Voltage (Vio)
Vio =
VF1
1 + RF / RS
[V]
2. Input Offset Current (Iio)
Iio =
VF2 - VF1
Ri × (1 + RF / RS)
[A]
3. Input Bias Current (Ib)
Ib =
VF4 - VF3
2 × Ri × (1 + RF / RS)
[A]
4. Large Signal Voltage Gain (Av)
Av = 20 × Log
ΔEK × (1+ RF/RS)
[dB]
VF5 - VF6
Rf=50kΩ
500kΩ
SW1
0.1μF
EK
VCC
+15V
Rs=50Ω
500kΩ
Ri=10kΩ
Ri=10kΩ
DUT
NULL
SW3
Rs=50Ω
1000pF
Vicm
V
VF
RL
SW2
VEE
50kΩ
VRL
-15V
Figure 50. Test circuit 1 (one channel only)
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BA2903Yxxx-C, BA2901Yxx-C
Switch Condition for Test Circuit 2
SW No.
Supply Current
Output Sink Current
VOL=1.5V
SW
1
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
Output Saturation Voltage
Isink=4mA
OFF
ON
ON
OFF
ON
ON
OFF
Output Leakage Current
VOH=36V
OFF
ON
ON
OFF
OFF
OFF
ON
Response Time
RL=5.1kΩ, VRL=5V
ON
OFF
ON
ON
OFF
OFF
OFF
VCC
A
－
＋
SW1
SW2
SW3
SW4
VEE
VIN-
SW5
SW6
RL
SW7
A
V
VRL
VIN+
VOL/VOH
Figure 51. Test Circuit 2 (one channel only)
Input wave
VIN
Input wave
入力電圧波形
VIN
入力電圧波形
+100mV
0V
overdrive voltage
overdrive voltage
0V
VOUT
-100mV
Output wave
出力電圧波形
VOUT
VCC
Output wave
出力電圧波形
VCC
VCC/2
VCC/2
0V
0V
Tre (LOW to HIGH)
Tre (HIGH to LOW)
Figure 52. Response Time
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Application example
○Reference voltage is -IN
VCC
RL
+
Vin
電圧
Vin
VRL
Reference voltage
-
OUT
Vref
VEE
Input
voltage wave
入力電圧波形
Reference Voltage
Time
電圧
OUT
High
While the input voltage(Vin) is higher that the
reference voltage, the output voltage remains high.
In case the input voltage becomes lower than the
reference voltage, the output voltage will turn low.
Low
Time
Output voltage wave
出力電圧波形
○Reference voltage is +IN
電圧
Vin
VCC
RL
+
Reference voltage
-
Vref
VRL
OUT
Vin
Reference Voltage
VEE
入力電圧波形
Input voltage wave
Time
OUT
High
While the input voltage(Vin) is smaller that the
reference voltage, the output voltage remains high.
In case the input voltage becomes higher than the
reference voltage, the output voltage will turn low.
Low
Output voltage wave
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BA2903Yxxx-C, BA2901Yxx-C
Datasheet
●Operational Notes –Continued
11. Unused circuits
When there are unused comparators, it is recommended that they are
connected as in Figure 53. ,setting the non-inverting input terminal to
a potential within the in-phase input voltage range (Vicm).
VCC
OPEN
Vicm
Please keep this potential in Vicm
VCC-1.5V＞Vicm＞VEE
VEE
Figure 53. Example of application
circuit for unused comparator
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 54. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Input voltage
Applying VEE +36V to the input terminal is possible without causing deterioration of the electrical characteristics or
destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note
that the circuit operates normally only when the input voltage is within the common mode input voltage range of the
electric characteristics.
15. Power supply (single / split)
The comparator operates when the voltage supplied is between VCC and VEE. Therefore, the single supply
comparator can be used as a split supply comparator as well.
16. Terminal short-circuits
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat
generation and, subsequently, destruction.
17. IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Physical Dimension, Tape and Reel Information
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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29.Sep.2015 Rev.005
Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Physical Dimension, Tape and Reel Information
Package Name
SSOP-B8
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Physical Dimension, Tape and Reel Information
Package Name
SSOP-B14
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Physical Dimension, Tape and Reel Information
Package Name
MSOP8
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Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Marking Diagrams
SOP8(TOP VIEW)
SSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Product Name
BA2903Y
BA2901Y
Package Type
Marking
F-C
SOP8
2903Y
FV-C
03Y
FVM-C
SSOP-B8
MSOP8
F-C
SOP14
BA2901YF
FV-C
SSOP-B14
2901Y
2903Y
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29.Sep.2015 Rev.005
Datasheet
BA2903Yxxx-C, BA2901Yxx-C
●Land pattern data
SOP8, SSOP-B8, MSOP8
SOP14, SSOP-B14
b2
e
MIE
l2
Package
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
Land pitch
e
Land space
MIE
1.27
4.60
1.10
0.76
0.65
4.60
1.20
0.35
0.65
2.62
0.99
0.35
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
●Revision History
Date
Revision
Changes
11.APR.2012
001
New Release
21.JAN.2013
002
Land pattern data inserted.
11.MAR.2013
003
8.MAY.2013
004
29.SEP.2015
005
Input offset voltage, Input offset current limit (Temp=25℃) changed.
Description of Physical Dimension, Tape and Reel Information changed.
SOP8, SSOP-B8, MSOP8 Power dissipation corrected.
SSOP-B8, SSOP-B14 corrected.
Corrections, Postscript(Operational Notes),Changing the notation
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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