BA3259HFP-TR

Datasheet Dual-Output (Fixed/Variable) LDO Regulators BA3259HFP BA30E00WHFP ●General Description The BA3259HFP and BA30E00WHFP are 2-output, low-saturation regulators. These units have both a 3.3 V fixed output as well as a variable output with a voltage accuracy of ±2%, and incorporate an overcurrent protection circuit to prevent IC destruction due to output shorting along with a TSD (Thermal Shut Down) circuit to protect the IC from thermal destruction caused by overloading. ●Packages HRP5 HRP7 ●Features „ Output voltage accuracy: ± 2%. „ Reference voltage accuracy: ± 2% „ Ceramic capacitor can be used to prevent output oscillation (BA3259HFP) „ Low dissipation with two voltage input supported (BA30E00WHFP) „ Built-in thermal shutdown circuit „ Built-in overcurrent protection circuit ●Key Specifications ■ Input Power Supply Voltage: BA3259HFP BA30E00WHFP ■ Output Voltage type: VO1 VO2 ■ Output Current: BA3259HFP BA30E00WHFP ■ Operating temperature range: BA3259HFP BA30E00WHFP 14.0V(Max.) 16.0V(Max.) Fixed Variable W (Typ.) x D (Typ.) x H (Max.) 9.395mm x 10.54mm x 2.005mm 9.395mm x 10.54mm x 2.005mm HRP5 HRP7 1A (MAX) 0.6A (MAX) 0 to 85℃ −25 to 105℃ ●Applications Available to all commercial devices, such as FPD, TV, and PC sets besides DSP power supplies for DVD and CD sets. ●Ordering Information B A 3 x x x Part Number ●Lineup Maximum Output Current (Max.) H F P - TR Packaging and forming specification TR: Embossed tape and reel Package HFP:HRP5 HRP7 Output Voltage 1 (Typ.) Output Voltage 2 (Typ.) 1.0A 3.3V 0.8 to 3.3V HRP5 Reel of 2000 BA3259HFP-TR 0.6A 3.3V 0.8 to 3.3V HRP7 Reel of 2000 BA30E00WHFP-TR ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Package Orderable Part Number ○This product is not designed protection against radioactive rays. 1/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions VO1 GND(Fin) Vcc1 3.3V Current Limit CO1 Current Limit 1μF VO2 GND FIN 1.5V 4 Current Limit Sat. Prevention Vcc2 Vcc2 CO2 GND 3 Thermal Shutdown Vcc1 Reference Voltage 5 Thermal Shut Down 1μF Current Limit Sat. Prevention R2 ADJ 2 R1 Vcc 1 VREF VIN EN 1 CIN 3.3μF Vcc2 Fig.1 BA3259HFP Block Diagram Pin No. Pin name 2 Vcc1 3 1μF GND 4 1μF Vo1 5 47μF Vo2 6 47μF ADJ R2 7 R1 Fig.2 BA30E00WHFP Block Diagram Pin No. Function Pin name Function 1 VCC Power supply pin 1 EN 2 ADJ Variable output voltage detection pin 2 Vcc2 Power supply pin 2 3 GND GND pin 3 Vcc1 Power supply pin 1 Output on/off control pin: High active 4 Vo2 Variable output pin 4 GND GND pin 5 Vo1 3.3 V output pin 5 Vo1 Power supply pin for 3.3 V output FIN GND GND pin 6 Vo2 Variable output voltage detection pin (0.8 V to 3.3 V) 7 ADJ Variable output voltage detection pin FIN GND GND pin TOP VIEW Vcc (1Pin) External capacitor setting range Approximately 3.3µF Vo1 (5Pin) 1 µF to 1000 µF Vo2 (4Pin) 1 µF to 1000 µF PIN PIN 1 2 3 4 Vcc1 (3Pin) Vcc2 (2Pin) Vo1 (5Pin) Vo2 (6Pin) 5 TOP VIEW External capacitor setting range Approximately 1 µF Approximately 1 µF 47 µF to 1000 µF 47 µF to 1000 µF 1 HRP5 HRP7 ●Absolute Maximum Ratings BA3259HFP Parameter BA30E00WHFP Symbol Ratings Units Applied voltage Vcc 15 *1 V Power dissipation Pd 2300 *2 Topr Operating temperature range Ambient storage temperature range Maximum junction temperature 2 3 4 5 6 7 Parameter Symbol Ratings Units Applied voltage Vcc 18 *1 V mW Power dissipation Pd 2300 *2 mW 0 to 85 ℃ Topr −25 to 105 ℃ Tstg −55 to 150 ℃ Tstg −55 to 150 ℃ Tjmax 150 ℃ Operating temperature range Ambient storage temperature range Maximum junction temperature Tjmax 150 ℃ *1 Must not exceed Pd. *2 Derated at 18.4 mW/℃ at Ta>25℃ when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Recommended Operating Ratings BA3259HFP Parameter Symbol BA30E00WHFP Ratings Min. Unit Typ. Max. Input power supply voltage Vcc 4.75 − 14.0 V 3.3 V output current Io1 − − 1 A Variable output current Io2 − − 1 A Parameter Symbol Input power supply voltage 1 Input power supply voltage 2 Ratings Min. Typ. Max. Unit Vcc1 4.1 − 16.0 V Vcc2 2.8 − Vcc 1 V 3.3 V output current Io1 − − 0.6 A Variable output current Io2 − − 0.6 A ●Electrical Characteristics ○BA3259HFP (Unless otherwise specified, Ta=25℃, Vcc=5 V, R1=R2=5 kΩ) Parameter Symbol Limits Unit Conditions Min. Typ. Max. IB − 3 5 mA Vo1 3.234 3.300 3.366 V Io1=50mA ∆Vd1 − 1.1 1.3 V Io1=1 A, Vcc=3.8V Io1 1.0 − − A R.R.1 46 52 − dB f=120Hz, ein=0.5Vp-p, Io1=5mA Input stability 1 ∆VLINE1 − 5 15 mV Vcc=4.75→14V, Io1=5mA Load stability 1 ∆VLOAD1 − 5 20 mV Io1=5mA→1 A Tcvo1 − ±0.01 − %/℃ Reference voltage VREF 0.784 0.800 0.816 V Io2=50mA Minimum I/O voltage difference 2 ∆Vd2 − 1.1 1.3 V Io2=1 A Io2 1.0 − − A R.R.2 46 52 − dB f=120Hz, ein=0.5Vp-p, Io2=5mA Input stability 2 ∆VLINE2 − 5 15 mV Vcc=4.75→14V, Io2=5mA Load stability 2 ∆VLOAD2 − 5 20 mV Io2=5mA→1 A Tcvo2 − ±0.01 − %/℃ IADJ − 0.05 1.0 µA Circuit current Io1=0mA, Io2=0mA [3.3 V Output Block] Output voltage 1 Minimum I/O voltage difference 1 Current capability 1 Ripple rejection 1 Temperature coefficient of output voltage 1 *3 [Variable output] Current capability 2 Ripple rejection 2 Temperature coefficient of output voltage 2 *3 Variable pin current Io1=5mA, Tj=0℃ to 85℃ Io2=5mA, Tj=0℃ to 85℃ VADJ=0.85V *3 Not 100% tested www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Electrical Characteristics - continued ○BA30E00WHFP (Unless otherwise specified, Ta=25℃, Vcc1=Vcc2=VEN=5 V, R1=50kΩ, R2=62.5kΩ) Parameter Symbol Limits Min. Typ. Max. Unit Conditions Bias current Ib − 0.7 1.6 mA Io1=0mA, Io2=0mA Standby current IST − 0 10 µA VEN=GND EN pin on voltage VON 2.0 − − V Active mode EN pin off voltage VOFF − − 0.8 V Standby mode IEN − 50 100 µA VEN=3.3V Vo1 3.234 3.300 3.366 V Io1=50mA ∆Vd1 − 0.30 0.60 V Io1=300mA, Vcc=3.135V Io1 0.6 − − A Ripple rejection 1 R.R.1 − 68 − dB f=120Hz, ein=1Vp-p, Io1=100mA Input stability 1 Reg.I1 − 5 30 mV Vcc1=4.1→16V, Io1=50mA Load stability 1-1 Reg.L1-1 − 30 90 mV Io1=0mA→0.6A Load stability 1-2 Reg.L1-2 − 30 90 mV Vcc1=3.7V, Io1=0→0.4A Tcvo1 − ±0.01 − %/℃ Reference voltage VADJ 0.784 0.800 0.816 V Io2=50mA Minimum I/O voltage difference 2 ∆Vd2 − 0.30 0.60 V At Io2=3.3V Io2=300mA, Vcc1=Vcc2=3.135V Io2 0.6 − − A Ripple rejection 2 R.R.2 − 66 − dB f=120Hz, ein=1Vp-p, Io2=100mA Input stability 2 Reg.I2 − 5 30 mV Vcc1=Vcc2=4.1V→16V, Io2=50mA Load stability 2 Reg.L2 − 30 90 mV Io2=0mA→0.6A Tcvo2 − ±0.01 − %/℃ EN pin current [3.3 V output] Output voltage 1 Minimum I/O voltage difference 1 Output current capacity 1 Temperature coefficient of output voltage 1 *3 [Variable output] (at 1.8 V) Output current capacity 2 Temperature coefficient of output voltage 2 *3 Io1=5mA, Tj=0℃ to 125℃ Io2=5mA, Tj=0℃ to 125℃ *3 Not 100% tested www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves BA3259HFP (Unless otherwise specified, Ta=25℃, Vcc=5 V) Fig.4 Circuit Current vs Load Current Io Fig.3 Circuit Current (with no load) Fig.5 ADJ Pin Outflow Current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.6 Input Stability (3.3 V output with no load) 5/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves - continued Fig.7 Input Stability (Variable output with no load) Fig.8 Load Stability (3.3 V output) Fig.9 Load Stability (Variable output: 1.5 V) Fig.10 I/O Voltage Difference (3.3 V output) (3.3 V output, Io1=0 A → 1 A) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves - continued R.R.(Variable output :1.5 V) R.R.(3.3 V output) Fig.12 Output Voltage vs Temperature (3.3 V output) Fig.11 R.R. Fig.13 Output Voltage vs Temperature (Variable output: 1.5 V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.14 Circuit Current vs Temperature 7/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves - continued BA30E00WHFP (Unless otherwise specified, Ta=25℃, Vcc1=Vcc2=5V) Fig.15 Circuit Current (with no load) Fig.16 Circuit Current vs Load Current Io (Io=0 → 600 mA) Fig.18 Input Stability (3.3 V output Io1=600 mA) Fig.17 ADJ Pin Source Current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves - continued Fig.20 Load Stability (3.3 V output) Fig.19 Input Stability (Variable output: 1.8 V) Fig.21 Load Stability (Variable output: 1.8 V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.22 I/O Voltage Difference (Vcc=3.135 V, 3.3 V output) 9/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Typical Performance Curves - continued Vo2(Variable output:1.8V) Vo1(3.3V output) Fig.24 Output Voltage vs Temperature (3.3 V output) Fig.23 R.R. (ein=1 Vp-p, Io=100 mA) Fig.25 Output Voltage vs Temperature (Variable output: 1.8 V) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.26 Circuit Current vs Temperature (Io=0 mA) 10/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP Application Information ●Setting the Output Voltage Vo2 The following output voltage setting method applies to the variable output pin. R2 ) - R2 × IADJ Vo2=VADJ × ( 1 + R1 VADJ: Output feedback reference voltage (0.8 V typ.) (0.05µA typ.: BA3259HFP) IADJ: ADJ pin source current (0.2µA typ.: BA30E00WHFP) Vo2 ADJ R2 VADJ IADJ R1 BA3259HFP: 1 kΩ to 10 kΩ BA30E00HFP: 1 kΩ to 5 kΩ The above is recommended. R1 Note:Connect R1 and R2 to make output voltage settings as shown in Fig.1and Fig.2. Keep in mind that the offset voltage caused by the current (IADJ) flowing out of the ADJ pin will become high if higher resistance is used. ●Function Explanation 1) Two-input power supply (BA30E00WHFP) The input voltages (Vcc1 and Vcc2) supply power to two outputs (Vo1 and Vo2, respectively). The power dissipation between the input and output pins can be suppressed for each output according to usage. Efficiency comparison: 5V single input vs. 5V/3V two inputs •Regulator with single input and two outputs •Regulator with two inputs and two outputs (Vo2=1.8V, Io1=Io2=0.3A) Conventional Vcc Vo1 5V 3.3 V/0.3 A REG1 Vo2 1.8 V/0.3 A REG2 Power loss between input and output (Vcc − Vo1) × Io1 + (Vcc − Vo2) × Io2 = (5 − 3.3) × 0.3 + (5 − 1.8) × 0.3 = 0.51W + 0.96W = 1.47W → Single 5V input results in decreased efficiency Current 5V Vcc 3.3 V/0.3 A Vo1 REG1 1.8 V/0.3 A Vo2 3V REG2 Power loss between input and output (Vcc1 − Vo1) × Io1 + (Vcc2 − Vo2) × Io2 = (5 − 3.3) × 0.3 + (5 − 1.8) × 0.3 = 0.51W + 0.36W = 0.87W Reduced power loss by 0.6W. → Additional 3V input improves efficiency 2) Standby function (BA30E00WHFP) The standby function is operated through the EN pin. Output is turned on at 2.0 V or higher and turned off at 0.8 V or lower. ●Power Dissipation If the IC is used under the conditions of excess of the power dissipation, the chip temperature will rise, which will have an adverse effect on the electrical characteristics of the IC, such as a reduction in current capability. Furthermore, if the temperature exceeds Tjmax, element deterioration or damage may occur. Implement proper thermal designs to ensure that the power dissipation is within the permissible range in order to prevent instantaneous IC damage resulting from heat and maintain the reliability of the IC for long-term operation. Refer to the power derating characteristics curves in Fig.27. ・Power Consumption Pc (W) Calculation Method: ○BA3259HFP Vcc Vcc IP Power Tr Controller Vcc Power Tr Icc GND • Power consumption of 3.3 V power transistor Pc1=(Vcc − 3.3) × Io1 • Power consumption of Vo2 power transistor 3.3 V Pc2=(Vcc − Vo2) × Io2 output Vo1 • Power consumption by circuit current Io1 Pc3=Vcc × Icc ¶ 0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V output * Vcc: Applied voltage Vo2 Io1: Load current on Vo1 side Io2 Io2: Load current on Vo2 side Icc: Circuit current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ○BA30E00WHFP Vcc1 Vcc1 IB1 Controller Vcc2 IB2 Vcc2 11/16 Power Tr Power Tr Icc1+Icc2 GND • Power consumption of power transistor on Vo1 (3.3 V output) Pc1=(Vcc1 − Vo1) × Io1 • Power consumption of power transistor on Vo2 (variable output ) 3.3 V Pc2=(Vcc2 − Vo2) × Io2 output Io1 • Power consumption by circuit current Io1 Pc3=Vcc1 × Icc1 + Vcc2 × Icc2 ¶ 0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V output * Vcc1, Vcc2: Applied voltage Io2 Io1: Load current on 3.3 V output side Io2 Io2: Load current on variable output side Icc1, Icc2: Circuit currents TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP The Icc (circuit current) varies with the load. Refer to the above and implement proper thermal designs so that the IC will not be used under conditions of Unstable region 2.0 1.0 0.5 0.2 Stable region 0.1 0.05 0.02 0.01 0 200 Fig.27 Ambient Temperature vs. Power Dissipation 400 600 Io [mA] 10.0 5.0 2.0 1.0 0.7 0.5 0.2 0.1 0.05 0.02 0.01 0 800 1000 Fig.28 BA3259HFP ESR Characteristics ●I/O equivalence circuit BA3259HFP Unstable region ESR [Ω] 10.0 5.0 ESR [Ω] POWER DISSIPATION: Pd [W] excess power dissipation Pd under all operating temperatures. 10 Board size: 70 mm × 70 mm × 1.6 mm 9 (with a thermal via incorporated by the board) Board surface area: 10.5 mm × 10.5 mm 8 (3) 7.3W (1) 2-layer board (Backside copper foil area: 15 mm × 15 mm) (2) 2-layer board (Backside copper foil area: 70 mm × 70 mm) 7 (3) 4-layer board (Backside copper foil area: 70 mm × 70 mm) 6 (2) 5.5W 5 4 3 (1) 2.3W 2 1 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [°C] Stable region Unstable region 200 400 600 Io [mA] 800 1000 Fig.29 BA30E00WHFP ESR Characteristics BA30E00WHFP Vcc Vcc1 Vcc1 Vcc2 Vcc Vo1 Vo1 Fig.30 BA3259HFP I/O equivalence circuit Vo2 Vo2 ADJ ADJ Fig.31 BA30E00WHFP I/O equivalence circuit ●Explanation of External Components ○BA3259HFP 1) Vcc (Pin 1) It is recommended that a ceramic capacitor with a capacitance of approximately 3.3µF is placed between Vcc and GND at a position closest to the pins as possible. 2) Vo (Pins 4 and 5) Insert a capacitor between Vo and GND in order to prevent output oscillation. The capacitor may oscillate if the capacitance changes as a result of temperature fluctuations. Therefore, it is recommended that a ceramic capacitor with a temperature coefficient of X5R or above and a maximum capacitance change (resulting from temperature fluctuations) of ±10% be used. The capacitance should be between 1µF and 1,000µF. (Refer to Fig.28.) ○BA33E00HFP 1) Vcc1 (Pin 3) and Vcc2 (Pin 2) Insert capacitors with a capacitance of 1µF between Vcc1 and GND and Vcc2 and GND. The capacitance value will vary depending on the application. Be sure to implement designs with sufficient margins. 2) Vo1 (Pin 5) and Vo2 (Pin 6) Insert a capacitor between Vo and GND in order to prevent oscillation. The capacitance of the capacitor may greatly vary with temperature changes, making it impossible to completely prevent oscillation. Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance) that ensures good performance characteristics at low temperatures. The output oscillates if the ESR is too high or too low. Refer to the ESR characteristics in Fig.29 and operate the IC within the stable operating region. If there is a sudden load change, use a capacitor with a higher capacitance. A capacitance between 47µF and 1,000µF is recommended. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Operational Notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > PIN A and GND > PIN B, the P-N junction operates as a parasitic diode. When GND > PIN B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 8)Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 9) Thermal Shutdown Circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for protection against thermal destruction. Should the junction temperature (Tj) reach the thermal shutdown ON temperature threshold, the TSD will be activated, turning off all output power elements. The circuit will automatically reset once the chip's temperature Tj drops below the threshold temperature. Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. 10) Overcurrent protection circuit An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents. Continued use of the protection circuits should be avoided. Please note that current increases negatively impact the temperature. 11) Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other pins in applications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance of 1000 mF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass diodes between Vcc and each pin is recommended. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 Datasheet BA30E00WHFP 抵抗 Resistor (PIN B） B) （端子 C ～ ～ ( PIN A)A） （端子 C B ～ ～ B Diode for preventing back current flow (PINB) Transistor (NP N) トランジスタ(NPN) Bypass diode ～ ～ BA3259HFP E E GND GND N P P＋ Output pin P＋ PＰ P＋ P＋ N Ｎ N N substr ate PP基板 Other adjacent elements N N Ｎ N 寄生素子 Parasitic element (PINA) ～ ～ VCC Parasitic element P substrate P 基板 GND G ND GND Parasitic element Fig.32 Bypass diode Fig.33 Example of Simple Bipolar IC Architecture Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Physical Dimension Tape and Reel Information HRP5 8.82 ± 0.1 (6.5) 0.08±0.05 1.2575 1 2 3 4 0.835±0.2 1.523±0.15 8.0±0.13 (7.49) 1.905±0.1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed 10.54±0.13 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) TR direction is the 1pin of product is at the upper right when you hold ( The ) reel on the left hand and you pull out the tape on the right hand 1pin 5 +5.5° 4.5°−4.5° +0.1 0.27 −0.05 0.73±0.1 0.08 S 1.72 S Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. HRP7 1.905±0.1 0.8875 1 2 3 4 0.835±0.2 8.0±0.13 (7.49) 8.82±0.1 (6.5) 5 6 7 Tape Embossed carrier tape Quantity 2000pcs Direction of feed 1.523±0.15 10.54±0.13 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin +5.5° 4.5° −4.5° 0.08±0.05 +0.1 0.27 -0.05 0.73±0.1 1.27 S Direction of feed 0.08 S Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagrams HRP5 (TOP VIEW) HRP7 (TOP VIEW) Part Number Marking B A 3 2 5 9 LOT Number BA30E00W 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Part Number Marking LOT Number 1PIN MARK 15/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 BA3259HFP Datasheet BA30E00WHFP ●Revision History Date Revision 26.Jun.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/16 TSZ02201-0R6R0A600100-1-2 26.Jun.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001