BA3259HFP_11

Secondary LDO Regulators Secondary Dual-Output (Fixed/Variable) LDO Regulators BA3259HFP,BA30E00WHFP No.11026EBT02 ●Description The BA3259HFP and BA30E00WHFP are 2-output, low-saturation regulators. These units have both a 3.3 V fixed output as well as a variable output with a voltage accuracy of ±2%, and incorporate an overcurrent protection circuit to prevent IC destruction due to output shorting along with a TSD (Thermal Shut Down) circuit to protect the IC from thermal destruction caused by overloading. ●Features 1) Output voltage accuracy: ± 2%. 2) Reference voltage accuracy: ± 2% 3) Output current capacity: 1 A (BA3259HFP), 0.6 A (BA30E00WHFP) 4) Ceramic capacitor can be used to prevent output oscillation (BA3259HFP) 6) Low dissipation with two voltage input supported (BA30E00WHFP) 7) Built-in thermal shutdown circuit 8) Built-in overcurrent protection circuit ●Applications Available to all commercial devices, such as FPD, TV, and PC sets besides DSP power supplies for DVD and CD sets. ●Product Lineup Part Number BA3259HFP BA30E00WHFP Output voltage Vo1 Output voltage Vo2 Output Current Io1 Output Current Io2 3.3 V 3.3 V 0.8 V to 3.3 V 0.8 V to 3.3 V 1 A max 0.6 A max 1 A max 0.6 A max Package HRP5 HRP7 ●Absolute Maximum Ratings BA3259HFP Parameter Applied voltage Power dissipation Operating temperature range Ambient storage temperature range Maximum junction temperature Symbol Vcc Pd Topr Tstg Tjmax Ratings 15 *1 2300 *2 0 to 85 −55 to 150 150 Units V mW ℃ ℃ ℃ BA30E00WHFP Parameter Applied voltage Power dissipation Operating temperature range Ambient storage temperature range Maximum junction temperature Symbol Vcc Pd Topr Tstg Tjmax Ratings 18 *1 2300 *2 −25 to 105 −55 to 150 150 Units V mW ℃ ℃ ℃ *1 Must not exceed Pd. *2 Derated at 18.4 mW/℃ at Ta>25℃ when mounted on a glass epoxy board (70 mm  70 mm  1.6 mm). www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP ●Recommended Operating Conditions BA3259HFP Parameter Input power supply voltage 3.3 V output current Variable output current Symbol Vcc Io1 Io2 Ratings Min. 4.75 − − Typ. Max. − − − 14.0 1 1 Unit V A A Technical Note BA30E00WHFP Parameter Input power supply voltage 1 Input power supply voltage 2 3.3 V output current Variable output current Symbol Vcc1 Vcc2 Io1 Io2 Ratings Min. 4.1 2.8 − − Typ. Max. − − − − 16.0 Vcc1 0.6 0.6 Unit V V A A ●Electrical Characteristics ○BA3259HFP (Unless otherwise specified, Ta=25℃, Vcc=5 V, R1=R2=5 kΩ) Limits Parameter Symbol Unit Min. Typ. Max. Circuit current [3.3 V Output Block] Output voltage 1 Minimum I/O voltage difference 1 Current capability 1 Ripple rejection 1 Input stability 1 Load stability 1 Temperature coefficient of output voltage 1 *3 [Variable output] Reference voltage Minimum I/O voltage difference 2 Current capability 2 Ripple rejection 2 Input stability 2 Load stability 2 Temperature coefficient of *3 output voltage 2 Variable pin current VREF ∆Vd2 Io2 R.R.2 ∆VLINE2 ∆VLOAD2 Tcvo2 IADJ 0.784 − 1.0 46 − − − − 0.800 1.1 − 52 5 5 ±0.01 0.05 0.816 1.3 − − 15 20 − 1.0 V V A dB mV mV %/℃ µA Io2=50 mA Io2=1 A Vo1 ∆Vd1 Io1 R.R.1 ∆VLINE1 ∆VLOAD1 Tcvo1 3.234 − 1.0 46 − − − 3.300 1.1 − 52 5 5 ±0.01 3.366 1.3 − − 15 20 − V V A dB mV mV %/℃ Io1=50mA IB − 3 5 mA Conditions Io1=0 mA, Io2=0mA Io1=1 A, Vcc=3.8V f=120Hz, ein=0.5Vp-p, Io1=5mA Vcc=4.75→14V, Io1=5mA Io1=5mA→1 A Io1=5mA,Tj=0℃ to 85℃ f=120Hz, ein=0.5 Vp-p, Io2=5mA Vcc=4.75→14V, Io2=5mA Io2=5 mA→1 A Io2=5mA,Tj=0℃ to 85℃ VADJ=0.85V *3 Operation is guaranteed within these parameters www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP Technical Note ○BA30E00WHFP (Unless otherwise specified, Ta=25℃, Vcc1=Vcc2=VEN=5 V, R1=50 kΩ, R2=62.5 kΩ) Limits Parameter Symbol Unit Conditions Min. Typ. Max. Bias current Standby current EN pin on voltage EN pin off voltage EN pin current [3.3 V output] Output voltage 1 Minimum I/O voltage difference 1 Output current capacity 1 Ripple rejection 1 Input stability 1 Load stability 1-1 Load stability 1-2 Temperature coefficient of *3 output voltage 1 [Variable output] (at 1.8 V) Reference voltage Minimum I/O voltage difference 2 Output current capacity 2 Ripple rejection 2 Input stability 2 Load stability 2 Temperature coefficient of output voltage 2 *3 VADJ ∆Vd2 Io2 R.R.2 Reg.I2 Reg.L2 Tcvo2 0.784 − 0.6 − − − − 0.800 0.30 − 66 5 30 ±0.01 0.816 0.60 − − 30 90 − V V A dB mV mV %/℃ f=120 Hz,ein=1Vp-p,Io2=100mA Vcc1=Vcc2=4.1V→16V,Io2=50mA Io2=0mA→0.6A Io2=5mA,Tj=0℃ to 125℃ Io2=50 mA At Io2=3.3V Io2=300mA,Vcc1=Vcc2=3.135V Vo1 ∆Vd1 Io1 R.R.1 Reg.I1 Reg.L1-1 Reg.L1-2 Tcvo1 3.234 − 0.6 − − − − − 3.300 0.30 − 68 5 30 30 ±0.01 3.366 0.60 − − 30 90 90 − V V A dB mV mV mV %/℃ f=120Hz, ein=1Vp-p,Io1=100mA Vcc1=4.1→16V,Io1=50mA Io1=0 mA→0.6A Vcc1=3.7V,Io1=0→0.4A Io1=5mA,Tj=0℃ to 125℃ Io1=50mA Io1=300mA,Vcc=3.135V Ib IST VON VOFF IEN − − 2.0 − − 0.7 0 − − 50 1.6 10 − 0.8 100 mA µA V V µA Io1=0mA, Io2=0mA VEN=GND Active mode Standby mode VEN=3.3V *3 Operation is guaranteed within these parameters www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP ●BA3259HFP Electrical Characteristics Curves (Unless otherwise specified, Ta=25℃, Vcc=5 V) 4.0 CIRCUIT CURRENT： Icc［ mA ］ 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 SUPPLY VOLTAGE：Vcc［V］ Technical Note 5 ADJ PIN CURRENT：IADJ ［μA ］ 60 CIRCUIT CURRENT：IB［mA］ 4 50 3 40 2 30 1 20 0 0.0 0.2 0.4 0.6 0.8 1.0 OUTPUT CURRENT：Io1［A］ 10 5 6 7 8 9 10 11 12 13 14 SUPPLY VOLTAGE：Vcc［V ］ Fig.1 Circuit Current (with no load) Fig.2 Circuit Current vs Load Current Io Fig.3 ADJ Pin Outflow Current 4.0 3.5 ： OUTPUT VOLTAGE Vo1［V］ OUTPUT VOLTAGE：Vo2［V］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 SUPPLY VOLTAGE：Vcc［V］ 1.6 1.4 4.0 3.5 OUTPUT VOLTAGE：Vo1［V］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 1.2 1.0 0.8 0.6 0.4 0.2 0.0 SUPPLY VOLTAGE：Vcc［V］ 0.0 0.5 1.0 1.5 2.0 2.5 OUTPUT CURRENT：Io1［A］ Fig. 4 Input Stability (3.3 V output with no load) 1.6 1.4 OUTPUT VOLTAGE：Vo2［V］ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 OUTPUT CURRENT：Io2［A］ INPUT/OUTPUT VOLTAGE DIFFERENCE ： dVd［ V ］ 1.4 Fig. 5 Input Stability (Variable output with no load) 80 RIPPLE REJECTION：R.R.［dB］ 70 Fig. 6 Load Stability (3.3 V output) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 R.R.(Variable output :1.5 V) 60 50 40 30 20 10 0 10 100 1000 10000 R.R.(3.3 V output) OUT PUT CURRENT ： Io1［ A ］ FREQUENCY：f［Hz］ Fig. 7 Load Stability (Variable output: 1.5 V) 3.35 3.34 OUTPUT VOLTAGE：Vo1［V］ 3.33 3.32 3.31 3.30 3.29 3.28 3.27 3.26 3.25 -30 -15 0 15 30 45 60 75 TEMPERATURE：Ta［℃］ Fig. 8 I/O Voltage Difference (3.3 V output) (3.3 V output, Io1=0 A  1 A) 1.506 1.504 CIRCUIT CURRENT：IB［mA］ 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 Fig.9 R.R. OUTPUT VOLTAGE：Vo2［V］ 1.502 1.500 1.498 1.496 1.494 1.492 1.490 -30 -15 0 15 30 45 60 75 TEMPERATURE：Ta［℃］ -30 -15 0 15 30 45 60 75 TEMPERATURE：Ta［℃］ Fig. 10 Output Voltage vs Temperature (3.3 V output) Fig. 11 Output Voltage vs Temperature (Variable output: 1.5 V) Fig. 12 Circuit Current vs Temperature www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP ●BA30E00WHFP Electrical Characteristics Curves (Unless otherwise specified, Ta=25℃, Vcc1=Vcc2=5V) 1.8 1.6 CIRCUIT CURRENT：Ic c［ mA］ 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAG E：Vcc［V ］ Technical Note 40 ADJ PIN CURRENT：IADJ ［μA］ 35 CIRCUIT CURRENT：Icc［mA ］ 30 25 20 15 10 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 OUTPUT CURRENT：Io［A］ 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 ADJ PIN VOLTAGE：VADJ ［V］ Fig.13 Circuit Current (with no load) 4.0 3.5 OUTPUT VOLTAGE：Vo1［V］ 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAGE：Vcc［V］ Fig. 14 Circuit Current vs Load Current Io (Io=0  600 mA) 1.6 1.4 OUTPUT VOLTAGE：Vo2［V］ OUTPUT VOLTAGE：Vo1［V］ Fig. 15 ADJ Pin Source Current 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 18 SUPPLY VOLTAGE：Vcc［V］ 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 OUTPUT CURRENT：Io1［A］ Fig. 16 Input Stability (3.3 V output Io1=600 mA) INPUT/OUTPUT VOLTAGE DIFFERENCE： ΔVd［V］ 2.0 0.5 Fig. 17 Input Stability (Variable output: 1.8 V) 80 RIPPLE REJECTION：R.R.［dB］ 70 60 50 40 30 20 10 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Fig. 18 Load Stability (3.3 V output) Vo2(Variable output:1.8V) OUTPUT VOLTAGE：Vo2［V］ 1.5 0.4 0.3 Vo1(3.3V output) 1.0 0.2 0.5 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 OUTPUT CURRENT：Io2［A］ 0.0 OUTPUT CURRENT：Io［A］ 100 1000 FREQUENCY：f［Hz］ 10000 Fig. 19 Load Stability (Variable output: 1.8 V) 3.35 1.90 Fig. 20 I/O Voltage Difference (Vcc=3.135 V, 3.3 V output) 1.0 0.9 Fig.21 R.R. (ein=1 Vp-p, Io=100 mA) CIRCUIT CURRENT：Icc［mA］ OUTPUT VOLTAGE：Vo1［V］ OUTPUT VOLTAGE：Vo2［V］ 3.33 1.85 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 3.30 1.80 3.28 1.75 3.25 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ 1.70 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ 0.0 -25 -10 5 20 35 50 65 80 95 TEMPERATURE：Ta［℃］ Fig. 22 Output Voltage vs Temperature (3.3 V output) Fig. 23 Output Voltage vs Temperature (Variable output: 1.8 V) Fig. 24 Circuit Current vs Temperature (I 0 A) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP ●Block Diagrams / Standard Example Application Circuits Technical Note VO1 Current Limit 5 3.3V CO1 1μF GND(Fin) Vcc1 Reference Voltage Current Limit Sat. Prevention Vcc1 VO2 Current Limit Thermal Shutdown 4 GND 3 ADJ 2 Vcc 1 1.5V CO2 1μF R2 R1 Thermal Shut Down Vcc2 Vcc2 GND FIN Current Limit Sat. Prevention VREF VIN CIN 3.3μF EN 1 Vcc2 1μF 2 Vcc1 3 GND 1μF 4 Vo1 47μF 5 Vo2 47μF 6 ADJ R2 7 R1 Fig.25 BA3259HFP Block Diagram Pin No. 1 2 3 4 5 FIN Pin name Vcc ADJ GND Vo2 Vo1 GND Function Power supply pin Variable output voltage detection pin GND pin Variable output pin 3.3 V output pin GND pin Pin No. 1 2 3 4 5 6 7 FIN External capacitor setting range Approximately 3.3µF 1 µF to 1000 µF 1 µF to 1000 µF 1 2 3 4 5 Fig.26 BA30E00WHFP Block Diagram Pin name EN Vcc2 Vcc1 GND Vo1 Vo2 ADJ GND Function Output on/off control pin: High active Power supply pin 2 Power supply pin 1 GND pin Power supply pin for 3.3 V output Variable output voltage detection pin (0.8 V to 3.3 V) Variable output voltage detection pin GND pin External capacitor setting range Approximately 1 µF Approximately 1 µF 47 µF to 1000 µF 47 µF to 1000 µF TOP VIEW TOP VIEW PIN Vcc1 (3Pin) Vcc2 (2Pin) Vo1 (5Pin) Vo2 (6Pin) PIN Vcc (1Pin) Vo1 (5Pin) Vo2 (4Pin) 1 234567 HRP5 HRP7 ●Setting the Output Voltage Vo2 The following output voltage setting method applies to the variable output pin. R2 ) - R2  IADJ Vo2=VADJ  ( 1 + R1 VADJ: Output feedback reference voltage (0.8 V typ.) (0.05µA typ.: BA3259HFP) IADJ: ADJ pin source current (0.2µA typ.: BA30E00WHFP) Vo2 R2 VADJ R1 ADJ IADJ R1 BA3259HFP: 1 kΩ to 10 kΩ BA30E00HFP: 1 kΩ to 5 kΩ The above is recommended. Note:Connect R1 and R2 to make output voltage settings as shown in Fig.25 and Fig.26. Keep in mind that the offset voltage caused by the current (IADJ) flowing out of the ADJ pin will become high if higher resistance is used. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP Technical Note ●Function Explanation 1) Two-input power supply (BA30E00WHFP) The input voltages (Vcc1 and Vcc2) supply power to two outputs (Vo1 and Vo2, respectively). The power dissipation between the input and output pins can be suppressed for each output according to usage. Efficiency comparison: 5V single input vs. 5V/3V two inputs Regulator with single input and two outputs Regulator with two inputs and two outputs (Vo2=1.8V, Io1=Io2=0.3A) Conventional 5V Vcc REG1 Vo1 3.3 V/0.3 A Vo2 REG2 1.8 V/0.3 A Power loss between input and output (Vcc − Vo1)  Io1 + (Vcc − Vo2)  Io2 = (5 − 3.3)  0.3 + (5 − 1.8)  0.3 = 0.51W + 0.96W = 1.47W  Single 5V input results in decreased efficiency Current 5V Vcc REG1 Vo1 3.3 V/0.3 A 3V REG2 Vo2 1.8 V/0.3 A Power loss between input and output (Vcc1 − Vo1)  Io1 + (Vcc2 − Vo2)  Io2 = (5 − 3.3)  0.3 + (5 − 1.8)  0.3 = 0.51W + 0.36W = 0.87W Reduced power loss by 0.6W.  Additional 3V input improves efficiency 2) Standby function (BA30E00WHFP) The standby function is operated through the EN pin. Output is turned on at 2.0 V or higher and turned off at 0.8 V or lower. ●Thermal Design If the IC is used under the conditions of excess of the power dissipation, the chip temperature will rise, which will have an adverse effect on the electrical characteristics of the IC, such as a reduction in current capability. Furthermore, if the temperature exceeds Tjmax, element deterioration or damage may occur. Implement proper thermal designs to ensure that the power dissipation is within the permissible range in order to prevent instantaneous IC damage resulting from heat and maintain the reliability of the IC for long-term operation. Refer to the power derating characteristics curves in Fig. 27. ・Power Consumption Pc (W) Calculation Method: ○BA3259HFP Vcc IP Vcc Power Tr Controller Vcc Power Tr Icc GND  Power consumption of 3.3 V power transistor Pc1=(Vcc − 3.3)  Io1  Power consumption of Vo2 power transistor 3.3 V Pc2=(Vcc − Vo2)  Io2 output Vo1  Power consumption by circuit current Io1 Pc3=Vcc  Icc  0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V output * Vcc: Applied voltage Vo2 Io1: Load current on Vo1 side Io2 Io2: Load current on Vo2 side Icc: Circuit current ○BA30E00WHFP Vcc1 Vcc1 Controller Vcc2 IB1 IB2 Power Tr Vcc2 Power Tr Icc1+Icc2 GND  Power consumption of power transistor on Vol1 (3.3 V output) Pc1=(Vcc1 − Vo1)  Io1  Power consumption of power transistor on Vo2 (variable output ) 3.3 V Pc2=(Vcc2 − Vo2)  Io2 output Io1  Power consumption by circuit current Io1 Pc3=Vcc1  Icc1 + Vcc2  Icc2  0.8 V to Pc=Pc1 + Pc2 + Pc3 3.3 V Io2 output * Vcc1, Vcc2: Applied voltage Io1: Load current on 3.3 V output side Io2 Io2: Load current on variable output side Icc1, Icc2: Circuit currents The Icc (circuit current) varies with the load. Refer to the above and implement proper thermal designs so that the IC will not be used under conditions of excess power dissipation Pd under all operating temperatures. 10 Board size: 70 mm  70 mm  1.6 mm 9 (with a thermal via incorporated by the board) Board surface area: 10.5 mm  10.5 mm 8 (3) 7.3W (1) 2-layer board (Backside copper foil area: 15 mm  15 mm) (2) 2-layer board (Backside copper foil area: 70 mm  70 mm) 7 (3) 4-layer board (Backside copper foil area: 70 mm  70 mm) 6 (2) 5.5W 5 4 3 (1) 2.3W 2 1 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [°C] POWER DISSIPATION: Pd [W] 10.0 5.0 ESR [Ω] 2.0 1.0 0.5 0.2 Unstable region 0.1 0.05 0.02 0.01 0 Stable region 200 400 600 Io [mA] 10.0 5.0 2.0 1.0 0.7 0.5 0.2 0.1 0.05 0.02 0.01 0 800 1000 ESR [Ω] Unstable region Stable region Unstable region 200 400 600 Io [mA] 800 1000 Fig. 27 Ambient Temperature vs. Power Dissipation Fig.28 BA3259HFP ESR Fig.29 BA30E00WHFP ESR www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP ●Input / Output Equivalent Circuits BA3259HFP Technical Note BA30E00WHFP Vcc Vcc Vcc1 Vcc1 Vcc2 Vo1 Vo2 ADJ Vo1 Vo2 ADJ Fig.30 BA3259HFP I/O Equivalent Circuits Fig.31 BA30E00WHFP I/O Equivalent Circuit ●Explanation of external components ○BA3259HFP 1) Vcc (Pin 1) It is recommended that a ceramic capacitor with a capacitance of approximately 3.3µF is placed between Vcc and GND at a position closest to the pins as possible. 2) Vo (Pins 4 and 5) Insert a capacitor between Vo and GND in order to prevent output oscillation. The capacitor may oscillate if the capacitance changes as a result of temperature fluctuations. Therefore, it is recommended that a ceramic capacitor with a temperature coefficient of X5R or above and a maximum capacitance change (resulting from temperature fluctuations) of ±10% be used. The capacitance should be between 1µF and 1,000µF. (Refer to Fig. 28.) ○BA33E00HFP 1) Vcc1 (Pin 3) and Vcc2 (Pin 2) Insert capacitors with a capacitance of 1µF between Vcc1 and GND and Vcc2 and GND. The capacitance value will vary depending on the application. Be sure to implement designs with sufficient margins. 2) Vo1 (Pin 5) and Vo2 (Pin 6) Insert a capacitor between Vo and GND in order to prevent oscillation. The capacitance of the capacitor may greatly vary with temperature changes, making it impossible to completely prevent oscillation. Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance) that ensures good performance characteristics at low temperatures. The output oscillates if the ESR is too high or too low. Refer to the ESR characteristics in Fig. 29 and operate the IC within the stable operating region. If there is a sudden load change, use a capacitor with a higher capacitance. A capacitance between 47µF and 1,000µF is recommended. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/10 2011.03 - Rev.B BA3259HFP,BA30E00WHFP Technical Note ●Notes for use 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all operating conditions. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 8) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 9) Thermal Shutdown Circuit (TSD) This IC incorporates a built-in thermal shutdown circuit for protection against thermal destruction. Should the junction temperature (Tj) reach the thermal shutdown ON temperature threshold, the TSD will be activated, turning off all output power elements. The circuit will automatically reset once the chip's temperature Tj drops below the threshold temperature. Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. 10) Overcurrent protection circuit An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents. Continued use of the protection circuits should be avoided. Please note that current increases negatively impact the temperature. 11) Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other pins inapplications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance of 1000 mF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass diodes between Vcc and each pin is recommended. 抵抗 R esistor Bypass diode T ransistor (NP(NPN) トランジスタ N) (PIN B) （端子 B ） C (PINB) C Diode for preventing back current flow ～ ～ E ～ ～ GND P＋ N Ｎ ( PIN A) （端子 A ） ～ ～ B B E GND Other adjacent elements VCC N P＋ O utput pin P N P＋ N N P＋ N Ｎ P Ｐ N P substr P 基板 ate 寄生素子 Parasitic element GND P substrate P 基板 G ND GND Parasitic element Parasitic element Fig. 32 Bypass diode Fig. 33 Example of Simple Bipolar IC Architecture www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/10 2011.03 - Rev.B ～ ～ (PINA) BA3259HFP,BA30E00WHFP ●Ordering part number Technical Note B A 3 2 5 9 H F P - T R Part No. Part No. 3259 30E00W Package HFP: HRP5 HRP7 Packaging and forming specification TR: Embossed tape and reel HRP5 9.395±0.125 (MAX 9.745 include BURR) 1.017±0.2 Tape 1.905±0.1 Embossed carrier tape 2000pcs TR direction the at right when you ( The on the leftishand1pin of product is thethe upperthe right hand hold ) reel and you pull out tape on 8.82 ± 0.1 (6.5) Quantity Direction of feed 0.835±0.2 1.523±0.15 10.54±0.13 8.0±0.13 (7.49) 1pin 1.2575 1 2 3 4 5 5.5° 4.5°+4.5° − +0.1 0.27 −0.05 1.72 0.73±0.1 0.08 S S 0.08±0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. HRP7 9.395±0.125 (MAX 9.745 include BURR) 1.017±0.2 Tape 1.905±0.1 Embossed carrier tape 2000pcs TR The direction is the 1pin of product is at the upper right when you hold 8.82±0.1 (6.5) Quantity Direction of feed (7.49) 1.523±0.15 10.54±0.13 8.0±0.13 0.835±0.2 ( reel on the left hand and you pull out the tape on the right hand 1pin ) 0.8875 12 34 567 +5.5° 4.5° −4.5° +0.1 0.27 -0.05 0.73±0.1 0.08±0.05 S 1.27 0.08 S Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/10 2011.03 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A