BA3404FJ-GE2

Datasheet Operational Amplifiers Series Ground Sense Operational Amplifiers BA3404xxx ●General Description BA3404 is a dual operational amplifier with input and output ground sense. Especially, BA3404 have wide operating voltage range +4V to +36V (single supply). BA3404 have a good performance of slew rate and cross over distortion compare with BA2904. ●Packages SOP8 SOP-J8 MSOP8 W(Typ.)xD(Typ.) xH(Max.) 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm 2.90mm x 4.00mm x 0.90mm ●Key Specification  Wide Operating Supply Voltage (single supply): +4.0V to +36.0V (split supply): ±2.0V to ±18.0V  Slew Rate: 1.2V/µs(Typ.)  Wide Temperature Range: -40°C to +85°C  Input Offset Current: 5nA (Typ.)  Input Offset Voltage: 5mV (Max.) ●Features  Operable with a single power supply  Wide operating supply voltage  Input and output are operable GND sense  Low supply current  High open loop voltage gain  Internal ESD protection circuit ●Application  Current sense application  Buffer application amplifier  Active filter  Consumer electronics ●Block Diagrams VCC -IN OUT +IN VEE Figure 1. Simplified schematic ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Pin Configuration(TOP VIEW) OUT1 1 -IN1 3 VEE 4 Symbol 1 OUT1 2 -IN1 3 +IN1 8 VCC 2 +IN1 Pin No. 7 OUT2 CH1 - + 6 -IN2 CH2 + - 5 +IN2 4 VEE 5 +IN2 6 -IN2 7 OUT2 8 VCC SOP8 Package SOP-J8 MSOP8 BA3404F BA3404FJ BA3404FVM ●Ordering Information B A 3 4 0 Part Number. BA3404xxx 4 x x x Package F : SOP8 FJ : SOP-J8 FVM : MSOP8 - xx Packaging and forming specification E2: Embossed tape and reel (SOP8/SOP-J8) TR: Embossed tape and reel (MSOP8) ●Line-up Supply Current (Typ.) Topr -40°C to +85°C Slew Rate (Typ.) 2.0mA Orderable Part Number Package 1.2V/µs SOP8 Reel of 2500 SOP-J8 Reel of 2500 BA3404FJ-E2 MSOP8 Reel of 3000 BA3404FVM-TR BA3404F-E2 ●Absolute Maximum Ratings (Ta=25℃) Parameter Supply Voltage Symbol Ratings Unit VCC-VEE +36 V *1*4 SOP8 Power dissipation Differential Input Voltage Pd *5 780 SOP-J8 675*2*4 MSOP8 *3*4 mW 590 Vid +36 V Input Common-mode Voltage Range Vicm (VEE-0.3) to (VEE+36) V Operating Temperature Range Topr -40 to +85 ℃ Storage Temperature Range Tstg -55 to +150 ℃ Tjmax +150 ℃ Maximum Junction Temperature Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. *1 To use at temperature above Ta＝25℃ reduce 6.2mW/℃ *2 To use at temperature above Ta＝25℃ reduce 5.4mW/℃ *3 To use at temperature above Ta＝25℃ reduce 4.8mW/℃ *4 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *5 The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Electrical Characteristics ○BA3404 (Unless otherwise specified VCC=+15V, VEE=-15V, Ta=25℃) Limits Parameter Symbol Unit Min. Typ. Max. Condition Input Offset Voltage *6 Vio - 2 5 mV VOUT=0V, Vicm=0V Input Offset Current *6 Iio - 5 50 nA VOUT=0V, Vicm=0V Input Bias Current *6 Ib - 70 200 nA VOUT=0V, Vicm=0V Large Signal Voltage Gain Av 88 100 - dB RL≧2kΩ VOUT=±10V, Vicm=0V Maximum Output Voltage VOM ±13 ±14 - V RL≧2kΩ Input Common-mode Voltage Range Vicm -15 - 13 V VOUT=0V Common-mode Rejection Ratio CMRR 70 90 - dB Power Supply Rejection Ratio PSRR 80 94 - dB ICC - 2.0 3.5 mA Isource 20 30 - mA Isink 10 20 - mA SR - 1.2 - V/μs fT - 1.2 - MHz RL=2kΩ GBW - 1.2 - MHz f=100kHz THD+N - 0.1 - % VOUT=10VP-P, f=20kHz Av=0dB, RL=2kΩ CS - 100 - dB f=1kHz, input referred Supply Current Output Source Current Output Sink Current Slew rate Unity Gain Frequency Gain Band Width Total Harmonic Distortion Channel Separation *6 VOUT=0V Vicm=-15V to +13V Ri≦10kΩ VCC=+4V to +30V RL=∞, All Op-Amps VIN+=0V VIN+=1V, VIN-=0V VOUT=+12V Output of one channel only VIN+=0V, VIN-=1V VOUT= -12V Output of one channel only Av=0dB, RL=2kΩ CL=100pF Absolute value www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet Description of Electrical Characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document. 1. Absolute maximum ratings Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Power supply voltage (VCC-VEE) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential input voltage (Vid) Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without damaging the IC. 1.3 Input common-mode voltage range (Vicm) Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics item must be followed. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package (maximum junction temperature) and thermal resistance of the package. 2. Electrical characteristics 2.1 Input offset voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage difference required for setting the output voltage at 0 V. 2.2 Input offset current (Iio) Indicates the difference of input bias current between the non-inverting and inverting terminals. 2.3 Input bias current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 Large signal voltage gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage fluctuation) / (Input offset fluctuation) 2.5 Maximum Output Voltage (VOM) Signifies the voltage range that can be output under specific output conditions. 2.6 Input common-mode voltage range (Vicm) Indicates the input voltage range under which the IC operates normally. 2.7 Common-mode rejection ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.8 Power supply rejection ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) 2.9 Circuit current (ICC) Indicates the IC current that flows under specified conditions and no-load steady status. 2.10 Output source current/ output sink current (Isource/Isink) The maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. The output source current indicates the current flowing out of the IC, and the output sink current the current flowing into the IC. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet 2.11 Slew Rate (SR) SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage as unit time. 2.12 Unity gain frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. 2.13 Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.14 Gain Band Width (GBW) Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Typical Performance Curves ○BA3404 1000 POWER DISSIPATION [mW] 800 BA3404F BA3404FJ 600 BA3404FVM 400 200 0 0 85 25 50 75 100 AMBIENT TEMPERATURE [℃] 125 Figure 3. Supply Current - Supply Voltage Figure 2. Derating Curve Figure 5. Maximum Output Voltage - Load Resistance (VCC/VEE=+15V/-15V, Ta=25℃) Figure 4. Supply Current - Ambient Temperature (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ○BA3404 Figure 7. Output Voltage - Output Current (VCC/VEE=+15V/-15V, Ta=25℃) Figure 6. Maximum Output Voltage – Supply Voltage Figure 9. Input Offset Voltage - Ambient Temperature (Vicm=0V, VOUT=0V) Figure 8. Input Offset Voltage - Supply voltage (Vicm=0V, VOUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ○BA3404 Figure 11. Input Bias Current - Ambient Temperature (Vicm=0V, VOUT=0V) Figure 10. Input Bias Current - Supply Voltage (Vicm=0V, VOUT=0V) Figure 12. Input Offset Current - Supply Voltage (Vicm=0V, VOUT=0V) Figure 13. Input Offset Current - Ambient Temperature (Vicm=0V, VOUT=0V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ○BA3404 Figure 15. Common Mode Rejection Ratio - Ambient Temperature (VCC/VEE=+15V/-15V) Figure 14. Input Offset Voltage - Common Mode Input Voltage (VCC/VEE=+2.5V/-2.5V) Figure 17. Large Signal Voltage Gain - Supply Voltage (RL=2kΩ) Figure 16. Common Mode Rejection Ratio - Ambient Temperature (VCC/VEE=+15V/-15V) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ○BA3404 2 10 Figure 18. Large Signal Voltage Gain - Ambient Temperature (RL=2kΩ) 103 104 105 106 107 Figure 19. Voltage Gain・Phase - Frequency (VCC=±15V) Figure 20. Slew Rate L-H - Supply Voltage Figure 21. Slew Rate H-L - Ambient Temperature (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ○BA3404 Figure 22. Total Harmonic Distoration - Output Voltage (VCC/VEE=+4V/-4V, Av=0dB, RL=2kΩ, 80kHz-LPF, Ta=25℃) Figure 23. Equivalent Input Noise Voltage - Frequency (VCC/VEE=+15V/-15V, RS=100Ω, Ta=25℃) (*)The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Application Information NULL method condition for Test Circuit 1 VCC,VEE,EK,Vicm Unit: V Parameter VF S1 S2 S3 VCC VEE EK Vicm calculation Input Offset Voltage VF1 ON ON OFF 15 -15 0 0 1 Input Offset Current VF2 OFF OFF OFF 15 -15 0 0 2 VF3 OFF ON VF4 ON OFF OFF 15 -15 0 0 3 ON ON ON 15 -15 10 0 15 -15 -10 0 ON ON OFF 15 -15 0 -15 15 -15 0 13 ON ON OFF Input Bias Current VF5 Large Signal Voltage Gain VF6 Common-mode Rejection Ratio VF7 (Input common-mode Voltage Range) VF8 Power Supply VF9 Rejection Ratio VF10 2 -2 0 0 15 -15 0 0 -Calculation1. Input Offset Voltage (Vio) VF1 Vio  [V] 1 + Rf / Rs 5 6 0.1μF Rf=50kΩ 2. Input Offset Current (Iio) VF2 - VF1 Iio  [A] Ri × (1 + Rf / Rs) 3. Input Bias Current (Ib) VF4 - VF3 Ib  2 × Ri × (1 + Rf / Rs) 4 500kΩ SW1 VCC EK +15V Rs=50Ω Ri=10kΩ Ri=10kΩ [A] 500kΩ DUT NULL SW3 Rs=50Ω 4. Large Signal Voltage Gain (Av) ΔEK × (1+ Rf/Rs) Av  20 × Log VF5 - VF6 0.1μF Vicm 1000pF V RL SW2 50kΩ [dB] VF VEE -15V Figure 24. Test circuit 1 (one channel only) 5. Common-mode Rejection Ration (CMRR) ΔVicm × (1+ Rf/Rs) CMRR  20 × Log [dB] VF8 - VF7 6. Power supply rejection ratio (PSRR) ΔVcc × (1+ Rf/Rs) PSRR  20 × Log [dB] VF10 - VF9 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet Switch Condition for Test Circuit 2 SW 1 SW No. SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 SW 8 SW 9 SW 10 SW 11 SW 12 SW 13 SW 14 Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF High Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF Low Level Output Voltage OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Slew Rate OFF OFF OFF ON OFF OFF OFF ON Gain Bandwidth Product Equivalent Input Noise Voltage ON ON OFF OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF Input voltage SW4 R2 SW5 VH VCC A VL － SW1 SW2 SW6 RS SW7 t Time ＋ SW3 Output voltage SW8 SW9 SW10 SW11 SW12 SW13 SW14 R1 VEE 90% SR=ΔV/Δt VH C A ～ VIN- ～ VIN+ RL CL V ～ ΔV V 10% VOUT VL Δt Figure 25. Test Circuit 2 (each Op-Amp) Figure 26. Slew Rate Input Waveform VCC VCC R1//R2 R1//R2 OTHER CH VEE R1 VIN R2 t Time VEE V VOUT1 R1 R2 V =0.5[Vrms] CS＝20×log VOUT2 100×VOUT1 VOUT2 Figure 27. Test Circuit 3 (Channel Separation) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet Application example ○Voltage follower Voltage gain is 0 dB. This circuit controls output voltage (Vout) equal input voltage (Vin), and keeps Vout with stable because of high input impedance and low output impedance. Vout is shown next formula. Vout=Vin VCC Vout Vin VEE Figure 28. Voltage follower circuit ○Inverting amplifier R2 VCC R1 Vin Vout R1//R2 For inverting amplifier, Vin is amplified by voltage gain decided R1 and R2, and phase reversed voltage is output. Vout is shown next expression. Vout=-(R2/R1)・Vin Input impedance is R1. VEE Figure 29. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 VCC Vout For non-inverting amplifier, Vin is amplified by voltage gain decided R1 and R2, and phase is same with Vin. Vout is shown next expression. Vout= (1+R2/R1)・Vin This circuit performes high input impedance because Input impedance is operational amplifier’s input Impedance. Vin VEE Figure 30. Non-inverting amplifier circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this thermal resistance. Figure 31. (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θja = (Tjmax-Ta) / Pd ℃/W ・・・・・ (Ⅰ) Derating curve in Figure 31. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 32. (c) show a derating curve for an example of BA3404. LSIの 消 費 力 [W] Power dissipation of 電 LSI Pd (max) θja=(Tjmax-Ta)/Pd ℃/W θja2 < θja1 P2 Ambient temperature 周囲温度 Ta [℃] θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surface temperature θ ja1 チップ 表面温度 Tj [℃] Power dissipation Pd[W] 0 消費電力 P [W] 25 50 75 100 125 150 Ambient temperature 周 囲 温 度 Ta [℃ ] (a)Thermal resistance (b) Derating curve Figure 31. Thermal resistance and derating [mW] 容量損失　Pd POWER DISSIPATION Pd [mW] 1000 * 800 780mW( 7) BA3404F * 675mW( 8) BA3404FJ * BA3404FVM 590mW( 9) 600 400 200 0 0 25 50 75 100 125 周囲温度　Ta Ambient temperature[℃] Ta [℃] (c)BA3404 (*7) (*8) (*9) Unit 6.2 5.4 4.8 mW/℃ When using the unit above Ta=25℃, subtract the value above per degree ℃. Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. Figure 32. Derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Operational Notes 1) Unused circuits When there are unused circuits, it is recommended that they be connected as in Figure 33. setting the non-inverting input terminal to a potential within the in-phase input voltage range (Vicm). 2) Input voltage Applying VEE+36V(BA3404 ) to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VCC + Connect to Vicm Vicm VEE Figure 33. The example of application circuit for unused op-amp 3) Power supply (single / dual) The op-amp operates when the voltage supplied is between VCC and VEE Therefore, the single supply op-mp can be used as a dual supply op-amp as well. 4) Power dissipation (Pd) Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 6) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 7) Radiation This IC is not designed to withstand radiation. 8) IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical characteristics due to piezo resistance effects. 9) IC operation The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias current for Class A operation will suppress crossover distortion. 10) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 11) Output capacitor Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE, causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1μF. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Physical Dimensions Tape and Reel Information SOP8 5.0±0.2 (MAX 5.35 include BURR) 6 +6° 4° −4° 5 4.4±0.2 6.2±0.3 0.9±0.15 7 0.3MIN 8 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 0.11 S 1.27 0.42±0.1 Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 6 5 0.45MIN 7 3.9±0.2 6.0±0.3 8 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.545 0.2±0.1 0.175 1.375±0.1 S 1.27 0.42±0.1 0.1 S Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. MSOP8 2.8±0.1 4.0±0.2 8 7 6 5 0.6±0.2 +6° 4° −4° 0.29±0.15 2.9±0.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 –0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 –0.04 0.08 S Direction of feed 0.65 Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/19 ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Marking Diagrams SOP8(TOP VIEW) SOP-J8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK MSOP8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK Product Name BA3404 Package Type F SOP8 FJ SOP-J8 FVM MSOP8 Marking 3404 ●Land pattern data all dimensions in mm Land length Land width ≧ℓ 2 b2 PKG Land pitch e Land space MIE SOP8 1.27 4.60 1.10 0.76 SOP-J8 1.27 3.90 1.35 0.76 MSOP8 0.65 2.62 0.99 0.35 b2 e MIE ℓ2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 BA3404xxx Datasheet ●Revision History Date 2012.10.22 Revision 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/19 TSZ02201-0RAR1G200140-1-2 26.OCT.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001