BA3472RFVM-TR

Datasheet Operational Amplifiers / Comparators High Speed with High Voltage Operational Amplifiers BA3472, BA3472R, BA3474, BA3474R ●General Description General-purpose BA3472,BA3472R,BA3474,BA3474R integrate two/four Independent Op-amps and phase compensation capacitors on a single chip and have some features of high-gain, and wide operating voltage range of +3[V] to +36[V](single power supply). Especially, characteristics are high slew rate (10[V/μs]) and high Maximum frequency (4[MHz]). ●Features  Operable with a single power supply  Wide operating supply voltage  Standard Op-Amp. Pin-assignments  Internal phase compensation  High open loop voltage gain  Internal ESD protection  Operable low input voltage around GND level  Wide output voltage range ●Packages MSOP8 SSOP-B8 SSOP-B14 SOP8 SOP14 (Typ.) (Typ.) (Max.) 2.90mm x 4.00mm x 0.90mm 3.00mm x 6.40mm x 1.35mm 5.00mm x 6.40mm x 1.35mm 5.00mm x 6.20mm x 1.71mm 8.70mm x 6.20mm x 1.71mm ●Key Specifications  Wide Operating Supply Voltage: Single supply +3.0[V] to +36.0[V] Dual supply ±1.5[V] to ±18.0[V]  Wide Temperature Range: BA3474F BA3472F BA3472FVM BA3472RFVM BA3474RFV BA3472FV BA3474FV -40[°C] to +75[°C] -40[°C] to +85[°C] -40[°C] to +105[°C]  Low Input Offset Current: 6[nA] (Typ.)  Low Input Bias Current: 100[nA] (Typ.)  Wide Output Voltage Range: VEE+0.3[V]-VCC-1.0[V](Typ.) with VCC-VEE=30[V]  High Slew Rate: 10[V/µs]  Maximum Frequency: 4[MHz]  Human Body Model (HBM): ±5000[V] (Typ.) ●Selection Guide Operation guaranteed Output Current Source/Sink High Speed Dual 30[mA]/ 30[mA] +75[°C] Slew Rate 10[V/µs] +85[°C] BA3472F BA3472FV BA3472FVM BA3474F BA3474FV +105[°C] BA3472RFVM Quad 30[mA]/ 30[mA] 10[V/µs] BA3474RFV ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Pin Configuration(TOP VIEW) OUT1 1 -IN1 2 CH1 -+ CH4 +- Datasheet 14 OUT4 13 -IN4 12 +IN4 11 VEE -+ CH2 +CH3 OUT1 1 -IN1 +IN1 VEE 8 VCC CH1 -+ CH2 +- +IN1 3 VCC 4 +IN2 5 2 3 4 7 OUT2 6 -IN2 5 +IN2 10 +IN3 9 8 -IN3 OUT3 -IN2 6 OUT2 7 SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14 BA3472F BA3472FV BA3472FVM BA3472RFVM BA3474F BA3474FV BA3474RFV ●Ordering Information B A 3 4 7 x F x x - xx Packaging and forming specification E2: Embossed tape and reel (SOP8/SOP14/SSOP-B8/SSOP-B14) Part Number Package F : SOP8 SOP14 FV : SSOP-B8 SSOP-B14 FVM : MSOP8 TR: Embossed tape and reel (MSOP8) ●Lineup Topr -40°C to +75°C Supply Current (Typ.) 8.0mA 4.0mA 10.0V/µs 8.0mA -40°C to +105°C 4.0mA 8.0mA Slew Rate (Typ.) SOP14 SOP8 -40°C to +85°C SSOP-B8 MSOP8 SSOP-B14 MSOP8 SSOP-B14 Package Reel of 2500 Reel of 2500 Reel of 2500 Reel of 3000 Reel of 2500 Reel of 3000 Reel of 2500 Orderable Part Number BA3474F-E2 BA3472F-E2 BA3472FV-E2 BA3472FVM-TR BA3474FV-E2 BA3472RFVM-TR BA3474RFV-E2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Absolute Maximum Ratings (Ta=25[℃]) Ratings Parameter Supply Voltage Differential Input Voltage (*1) Input Common-mode Voltage Range Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC-VEE Vid Vicm Topr Tstg Tjmax BA3472 BA3474 +36 36 (VEE - 0.3) to VEE + 36 -40 to +85(SOP14:+75) -55 to +150 +150 -40 to +105 BA3472R BA3474R Datasheet Unit V V V ℃ ℃ ℃ Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (*1) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VEE. ●Electrical Characteristics ○BA3472 (Unless otherwise specified Parameter Symbol VCC=+15[V], VEE=-15[V], Ta=25[℃]) Limits Temperature range BA3472F/FV/FVM Min. Typ. 1 1.5 6 100 4 4 14 0.1 -14.7 100 97 97 30 30 4 10 120 Max. 10 Unit Condition Vicm=0[V],VOUT=0[V] mV VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] RL=∞ VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] dB V dB dB mA mA MHz V/μs dB RL≧2[kΩ],VOUT=±10 [V] VCC=5[V],VEE=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] VCC=5[V],VIN+=1[V], VIN-=0[V],VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V],VOUT=5[V], Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[kΩ] - Input Offset Voltage (*2) Vio 25℃ 10 75 500 5.5 0.3 -14.3 -13.5 VCC-2.0 - Input Offset Current (*2) Input Bias Current (*2) Supply Current Iio Ib ICC 25℃ 25℃ 25℃ 3.7 nA nA mA High Level Output Voltage VOH 25℃ 13.7 13.5 - Low Level Output Voltage VOL 25℃ - Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Power Supply Rejection Ratio Output Source Current (*3) Output Sink Current (*3) Maximum Frequency Slew Rate Channel Separation (*2) (*3) AV Vicm CMRR PSRR IOH IOL ft SR CS 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 80 0 60 60 10 20 - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ○BA3472R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃]) Limits Parameter Symbol Temperature range Datasheet BA3472RFVM Min. Typ. 1 1.5 6 100 4 4 14 0.1 -14.7 100 97 97 30 30 4 10 120 Max. 10 Unit Condition Input Offset Voltage (*4) Vicm=0[V],VOUT=0[V] mV VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] RL=∞ VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] dB V dB dB mA mA MHz V/μs dB RL≧2[kΩ],VOUT=±10 [V] VCC=5[V],VEE=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] VCC=5[V],VIN+=1[V], VIN-=0[V], VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V], VOUT=5[V] Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[kΩ] - Vio 25℃ 10 75 500 5.5 0.3 -14.3 -13.5 VCC-2.0 - Input Offset Current (*4) Input Bias Current (*4) Supply Current Iio Ib ICC 25℃ 25℃ 25℃ 3.7 nA nA mA High Level Output Voltage VOH 25℃ 13.7 13.5 - Low Level Output Voltage VOL 25℃ - Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Power Supply Rejection Ratio Output Source Current (*5) Output Sink Current (*5) Maximum Frequency Slew Rate Channel Separation (*4) (*5) AV Vicm CMRR PSRR IOH IOL ft SR CS 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 80 0 60 60 10 20 - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ○BA3474 (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃]) Limits Parameter Symbol Temperature range Datasheet BA3474F/FV Min. Typ. 1 1.5 6 100 8 4 14 0.1 -14.7 100 97 97 30 30 4 10 120 Max. 10 Unit Condition Input Offset Voltage (*6) Vicm=0[V],VOUT=0[V] mV VCC=5[V],VEE=0[V], Vicm=0[V] VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] RL=∞ VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] dB V dB dB mA mA MHz V/μs dB RL≧2[kΩ], VOUT=±10 [V] VCC=5[V],VEE=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] VCC=5[V],VIN+=1[V], VIN-=0[V], VOUT=0[V] Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V], VOUT=5[V] Only 1ch is short circuit Av=1,Vin=-10 to +10[V], RL=2[kΩ] - Vio 25℃ 10 75 500 11 0.3 -14.3 -13.5 VCC-2.0 - Input Offset Current (*6) Input Bias Current (*6) Supply Current Iio Ib ICC 25℃ 25℃ 25℃ 3.7 nA nA mA High Level Output Voltage VOH 25℃ 13.7 13.5 - Low Level Output Voltage VOL 25℃ - Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Power Supply Rejection Ratio Output Source Current (*7) Output Sink Current (*7) Maximum Frequency Slew Rate Channel Separation (*6) (*7) AV Vicm CMRR PSRR IOH IOL ft SR CS 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 80 0 60 60 10 20 - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ○BA3474R (Unless otherwise specified VCC=+15[V], VEE=-15[V], Ta=25[℃]) Limits Parameter Symbol Temperature range Datasheet BA3474RFV Min. Typ. 1 1.5 6 100 8 4 14 0.1 -14.7 100 97 97 30 30 4 10 120 Max. 10 Unit Condition Input Offset Voltage (*8) Vio 25℃ 25℃ 25℃ 25℃ 3.7 Vicm=0[V],VOUT=0[V] mV VCC=5[V],VEE=0[V],Vicm=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] RL=∞ VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] VCC=5[V],RL=2[kΩ] V RL=10[kΩ] RL=2[kΩ] dB V dB dB mA mA MHz RL≧2[kΩ],VOUT=±10 [V] VCC=5[V],VEE=0[V], VOUT=VCC/2 Vicm=0[V],VOUT=0[V] Vicm=0[V],VOUT=0[V] VCC=5[V],VIN+=1[V], VIN-=0[V],VOUT=0[V], Only 1ch is short circuit VCC=5[V],VIN+=0[V], VIN-=1[V],VOUT=5[V], Only 1ch is short circuit - 10 75 500 11 0.3 -14.3 -13.5 VCC-2.0 nA nA mA Input Offset Current (*8) Input Bias Current (*8) Supply Current Iio Ib ICC High Level Output Voltage VOH 25℃ 13.7 13.5 80 0 60 60 10 20 - Low Level Output Voltage VOL 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ 25℃ Large Signal Voltage Gain Input Common-mode Voltage Range Common-mode Rejection Ratio Power Supply Rejection Ratio Output Source Current (*9) Output Sink Current (*9) Maximum Frequency Slew Rate Channel Separation (*8) (*9) AV Vicm CMRR PSRR IOH IOL ft SR CS V/μs Av=1,Vin=-10 to +10[V],RL=2[kΩ] dB - Absolute value Under high temperatures, please consider the power dissipation when selecting the output current. When the output terminal is continuously shorted the output current reduces the internal temperature by flushing. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents. 1. Absolute maximum ratings The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of electrical characteristics or damage to the part itself as well as peripheral components. 1.1 Power supply voltage (VCC-VEE) Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without causing deterioration of the electrical characteristics or destruction of the internal circuitry. 1.2 Differential input voltage (Vid) Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without damaging the IC. 1.3 Input common-mode voltage range (Vicm) Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the common-mode voltage range of the maximum ratings – use within the input common-mode voltage range of the electric characteristics instead. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For packaged products, Pd is determined by the maximum junction temperature and the thermal resistance. 2. Electrical characteristics 2.1 Input offset voltage (Vio) Signifies the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input voltage difference required for setting the output voltage to 0 V. 2.2 Input offset current (Iio) Indicates the difference of input bias current between the non-inverting and inverting terminals. 2.3 Input bias current (Ib) Denotes the current that flows into or out of the input terminal, it is defined by the average of the input bias current at the non-inverting terminal and the input bias current at the inverting terminal. 2.4 Circuit current (ICC) Indicates the current of the IC itself that flows under specified conditions and during no-load steady state. 2.5 maximum output voltage (VOM) Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into high-level output voltage and low-level output voltage. 2.6 Large signal voltage gain (AV) The amplifying rate (gain) of the output voltage against the voltage difference between non-inverting and inverting terminals, it is (normally) the amplifying rate (gain) with respect to DC voltage. AV = (output voltage fluctuation) / (input offset fluctuation) 2.7 Input common-mode voltage range (Vicm) Indicates the input voltage range under which the IC operates normally. 2.8 Common-mode rejection ratio (CMRR) Signifies the ratio of fluctuation of the input offset voltage when the in-phase input voltage is changed (DC fluctuation). CMRR = (change in input common-mode voltage) / (input offset fluctuation) 2.9 Power supply rejection ratio (PSRR) Denotes the ratio of fluctuation of the input offset voltage when supply voltage is changed (DC fluctuation). SVR = (change in power supply voltage) / (input offset fluctuation) 2.10 Channel separation (CS) Expresses the amount of fluctuation of the input offset voltage or output voltage with respect to the change in the output voltage of a driven channel. 2.11 Slew rate (SR) Indicates the time fluctuation ratio of the output voltage when an input step signal is supplied. 2.12 Maximum frequency (ft) Indicates a frequency where the voltage gain of Op-Amp is 1. 2.13 Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.14 Input referred noise voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Circuit Diagram VCC Datasheet VIN- VOUT VIN+ VEE Fig.1 Schematic diagram (one channel only) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Typical Performance Curves BA3472 Datasheet Fig.2 Derating Curve Fig.3 Supply Current - Supply Voltage Fig.4 Supply Current - Ambient Temperature Fig.5 High level Output Voltage - Supply Voltage (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.6 High level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.7 Low level Output Voltage - Supply Voltage (RL=10[kΩ]) Fig.8 Low level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.9 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.10 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.11 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.12 Input Offset Voltage - Supply voltage Fig.13 Input Offset Voltage - Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.14 Input Bias Current - Supply voltage Fig.15 Input Bias Current - Ambient Temperature Fig.16 Large Signal Voltage Gain -Supply Voltage Fig.17 Large Signal Voltage Gain -Ambient Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.18 Common Mode Rejection Ratio -Supply Voltage Fig.19 Common Mode Rejection Ratio -Ambient Temperature Fig.20 Slew Rate L-H - Supply Voltage (RL=10[kΩ]) Fig.21 Slew Rate L-H - Ambient Temperature (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.22 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.23 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.24 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ], CL=100[pF], Ta=25[℃]) (*)The data above is ability value of sample, it is not guaranteed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R BA3474 Datasheet Fig.25 Derating Curve Fig.26 Supply Current - Supply Voltage Fig.27 Supply Current - Ambient Temperature Fig.28 High level Output Voltage - Supply Voltage (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.29 High level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.30 Low level Output Voltage - Supply Voltage (RL=10[kΩ]) Fig.31 Low level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.32 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.33 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.34 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.35 Input Offset Voltage - Supply voltage Fig.36 Input Offset Voltage -Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.37 Input Bias Current - Supply voltage Fig.38 Input Bias Current - Ambient Temperature Fig.39 Large Signal Voltage Gain -Supply Voltage Fig.40 Large Signal Voltage Gain -Ambient Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.41 Common Mode Rejection Ratio -Supply Voltage Fig.42 Common Mode Rejection Ratio -Ambient Temperature Fig.43 Slew Rate L-H - Supply Voltage (RL=10[kΩ]) Fig.44 Slew Rate L-H - Ambient Temperature (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.45 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.46 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.47 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) (*)The data above is ability value of sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R BA3472R Datasheet Fig.48 Derating Curve Fig.49 Supply Current - Supply Voltage Fig.50 Supply Current - Ambient Temperature Fig.51 High level Output Voltage - Supply Voltage (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.52 High level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.53 Low level Output Voltage - Supply Voltage (RL=10[kΩ]) Fig.54 Low level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.55 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.56 Output Source Current (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.57 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.58 Input Offset Voltage - Supply voltage Fig.59 Input Offset Voltage - Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.60 Input Bias Current - Supply voltage Fig.61 Input Bias Current - Ambient Temperature Fig.62 Large Signal Voltage Gain -Supply Voltage Fig.63 Large Signal Voltage Gain -Ambient Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.64 Common Mode Rejection Ratio -Supply Voltage Fig.65 Common Mode Rejection Ratio -Ambient Temperature Fig.66 Slew Rate L-H - Supply Voltage (RL=10[kΩ]) Fig.67 Slew Rate L-H - Ambient Temperature (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.68 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.69 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.70 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) (*) The data above is ability value of sample, it is not guaranteed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R BA3474R Datasheet Fig.71 Derating Curve Fig.72 Supply Current - Supply Voltage Fig.73 Supply Current - Ambient Temperature Fig.74 High level Output Voltage - Supply Voltage (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.75 High level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.76 Low level Output Voltage - Supply Voltage (RL=10[kΩ]) Fig.77 Low level Output Voltage - Ambient Temperature (RL=10[kΩ]) Fig.78 Output Source Current - (VCC-VOUT) (VCC/VEE=5[V]/0[V]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.79 Output Source Current - (VOUT-VEE) (VCC/VEE=5[V]/0[V]) Fig.80 Input Offset Voltage - Common Model Input Voltage (VCC/VEE=15[V]/-15[V]) Fig.81 Input Offset Voltage - Supply voltage Fig.82 Input Offset Voltage -Ambient Temperature (*)The data above is ability value of sample, it is not guaranteed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.83 Input Bias Current - Supply voltage Fig.84 Input Bias Current - Ambient Temperature Fig.85 Large Signal Voltage Gain -Supply Voltage Fig.86 Large Signal Voltage Gain -Ambient Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.87 Common Mode Rejection Ratio -Supply Voltage Fig.88 Common Mode Rejection Ratio -Ambient Temperature Fig.89 Slew Rate L-H - Supply Voltage (RL=10[kΩ]) Fig.90 Slew Rate L-H - Ambient Temperature (RL=10[kΩ]) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Fig.91 Voltage Gain - Frequency (VCC=7.5[V]/-7.5[V], Av=40[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.92 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) Fig.93 Input / Output Voltage - Time (VCC/VEE=15[V]/-15[V], Av=0[dB], RL=2[kΩ],CL=100[pF],Ta=25[℃]) (*)The data above is ability value of sample, it is not guaranteed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 32/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Application Information Test circuit 1 NULL method Datasheet VCC, VEE, EK, Vicm Unit : [V] Parameter Input Offset Voltage Input Offset Current Input Bias Current Large Signal Voltage Gain Common-mode Rejection Ratio (Input Common-mode Voltage Range) Power Supply Rejection Ratio －Calculation－ 1. Input Offset Voltage (Vio) Vio = | VF1 | 1 + Rf / Rs [V] C2 0.1[µF] VF VF1 VF2 VF3 VF4 VF5 VF6 VF7 VF8 VF9 VF10 S1 ON OFF OFF ON ON ON ON S2 ON OFF ON OFF ON ON ON S3 OFF OFF OFF ON OFF OFF VCC 15 15 15 15 15 15 15 2 18 VEE -15 -15 -15 -15 -15 -15 -15 -2 -18 EK 0 0 0 +10 -10 0 0 0 0 Vicm Calculation 0 0 0 0 0 -15 13 0 0 1 2 3 4 5 6 2. Input Offset Current (Iio) Iio = | VF2－VF1 | Ri ×(1 + Rf / Rs) S1 VCC [A] Rf 50[kΩ] EK RK 500[kΩ] C1 0.1[µF] +15[V] 3. Input Bias Current (Ib) Ib = | VF4－VF3 | 2×Ri× (1 + Rf / Rs) ΔEK×(1+Rf /Rs) |VF5-VF6| [A] Rs Ri DUT S3 VEE C3 1000[pF] RK 500[kΩ] 50[Ω] 10[kΩ] 50[Ω] 10[kΩ] Rs Ri S2 4. Large Signal Voltage Gain (Av) Av = 20×Log [dB] Vicm NULL -15[V] RL V VF 5. Common-mode Rejection Ratio (CMRR) CMRR = 20×Log ΔVicm×(1+Rf /Rs) |VF8-VF7| ΔVcc×(1+Rf /Rs) |VF10-VF9| [dB] Fig.94 Test circuit 1 (one channel only) 6. Power Supply Rejection Ratio (PSRR) PSRR = 20×Log [dB] Test circuit2 switch condition SW No. Supply Current High Level Output Voltage Low Level Output Voltage Output Source Current Output Sink Current Slew Rate Gain Bandwidth Product Equivalent Input Noise Voltage SW 1 SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 SW 8 SW 9 SW 10 SW 11 SW 12 SW 13 SW 14 OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON OFF OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON ON OFF OFF OFF ON ON ON OFF OFF OFF OFF ON OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 33/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Voltage Datasheet SW4 VH R2 SW5 VCC VL A Input Voltage Waveform － SW1 SW2 SW3 SW6 SW7 SW8 VEE time Voltage 電圧 ＋ SW9 SW10 SW11 SW12 SW13 SW14 VH ΔV RS R1 ～ VIN- VIN+ A ～ RL CL V ～ V VOUT VL Δt Output Voltage Waveform 出力電圧波形 time 時間 Fig.95 Test circuit 2 (one channel only) Fig.96 Slew rate input output wave Test circuit 3 Channel separation VCC VCC R1//R2 R1//R2 OTHER CH VEE R1 VIN R2 V VOUT1 =0.5[Vrms] R1 R2 VEE VOUT2 V CS＝20 × log 100 × VOUT1 VOUT2 Fig.97 Test circuit 3 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 34/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R Datasheet Derating curves Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja[℃/W].The temperature of IC inside the package can be estimated by this thermal resistance. Fig.98 (a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below: θja = (Tj-Ta) / Pd [℃/W] ・・・・・ (Ⅰ) Derating curve in Fig.98 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.99(c) ~ (f) shows a derating curve for an example of BA3472, BA3474, BA3472R, BA3474R. LSI の 消 of LSI Power dissipation 費 電 力 [ W] θja = ( Tj ー Ta ) / Pd [℃/W] Ambient temperature P2 周囲温度 Ta [℃] Pd (max) θja2 < θja1 P1 θ' ja2 θ ja2 Tj ' (max) Tj (max) Chip surface temperature θ' ja1 0 25 50 θ ja1 75 100 125 150 Power dissipation Pd [W] 消費電力 P [W] チップ 表面温度 Tj [℃] Ambient temperature Ta [ ℃ ] 周囲温度 (a) Thermal resistance 1000 800 780mW(*10) 690mW(*11) 590mW(*12) (b) Derating curve Fig. 98 Thermal resistance and derating curve 1000 870mW(*13) BA3474FV 許容損失 Pd [mW] POWER DISSIPATION Pd [mW] BA3472FV 許容損失 Pd [mW] POWER DISSIPATION Pd [mW] BA3472F 800 610mW(*14) 600 600 400 BA3472FVM 400 BA3474F 200 200 0 0 25 50 75 85 100 125 0 0 25 50 75 85 100 125 Ambient Temperature: Ta [℃] 周囲温度 Ta [℃] 1000 Ambient Temperature: Ta [℃] 周囲温度 Ta [℃] (c)BA3472 937mW(*17) BA3472RFVM (d)BA3474 1800 1600 1689mW(*19) BA3474RFV 1187mW(*18) 許容損失 Pd [mW] POWER DISSIPATION Pd [mW] POWER DISSIPATION Pd [mW] 許容損失 Pd [mW] 800 713mW(*16) 625mW(*15) 1400 1200 1000 800 600 400 200 600 590mW(*12) 870mW(*13) 400 200 105 0 0 25 50 0 105 75 100 Ambient周囲温度 [℃] Ta [℃] Temperature: 125 0 25 50 75 100 125 Ambient Temperature: Ta [℃] 周囲温度 Ta [℃] (e)BA3472R (*10) 6.2 (*11) 5.5 (*12) 4.7 (*13) 7.0 (*14) 4.9 (*15) 5.0 (*16) 5.7 (*17) 7.5 (f)BA3474R (*18) 9.5 (*19) 13.5 Unit [mW/℃] When using the unit above Ta=25[℃], subtract the value above per degree[℃]. (*10) (*11) (*12) (*13) (*14) Mounted on a glass epoxy 1 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：below 3[%]). (*15) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：15mm×15mm). (*16) (*18) Mounted on a glass epoxy 2 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：70mm×70mm). (*17) (*19) Mounted on a glass epoxy 4 layers PCB 70[mm]×70[mm]×1.6[mm] (occupied copper area：70mm×70mm). Fig. 99 Derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 35/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Operational Notes 1) Unused circuits When there are unused circuits it is recommended that they are connected as in Fig.100, setting the non-inverting input terminal to a potential within input common-mode voltage range (Vicm). 2) Input terminal voltage Applying GND + 36V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) Power supply (single / dual) The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be used as dual supply op-amp as well. Please keep this potential in Vicm Datasheet VCC + VEE Fig.100 Unused circuit example 4) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 6) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 7) Radiation This IC is not designed to withstand radiation. 8) IC handing Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezoelectric (piezo) effects. 9) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 10) Output capacitor Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE, causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1µF. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 36/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Physical Dimensions Tape and Reel Information Datasheet SOP8 5.0±0.2 (MAX 5.35 include BURR) 8 7 6 5 +6° 4° −4° 0.9±0.15 0.3MIN Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.2±0.3 4.4±0.2 ( reel on the left hand and you pull out the tape on the right hand ) 12 3 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S 0.1 0.11 S 1.27 0.42±0.1 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. SOP14 8.7 ± 0.2 (MAX 9.05 include BURR) 14 8 Tape Quantity Direction of feed 0.3MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.2 ± 0.3 4.4 ± 0.2 ( reel on the left hand and you pull out the tape on the right hand ) 1 7 0.15 ± 0.1 1.5 ± 0.1 0.11 1.27 0.4 ± 0.1 0.1 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. SSOP-B8 3.0 ± 0.2 (MAX 3.35 include BURR) 876 5 Tape Quantity 0.3MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.4 ± 0.3 4.4 ± 0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1234 1.15 ± 0.1 0.15 ± 0.1 S 0.1 0.22± 0.10 0.08 M 0.1 (0.52) 0.65 1pin Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 37/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R SSOP-B14 5.0 ± 0.2 14 8 Datasheet Tape Quantity 0.3Min. Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.4 ± 0.3 4.4 ± 0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 7 0.15 ± 0.1 1.15 ± 0.1 0.10 0.65 0.1 0.22 ± 0.1 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. MSOP8 2.9±0.1 (MAX 3.25 include BURR) 8765 Tape 0.29±0.15 0.6±0.2 Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +6 ° 4 ° −4 ° Quantity Direction of feed 4.0±0.2 2.8±0.1 ( reel on the left hand and you pull out the tape on the right hand 1pin ) 1 234 1PIN MARK 0.475 0.9MAX +0.05 0.145 −0.03 S 0.75±0.05 0.08±0.05 +0.05 0.22 −0.04 0.08 S 0.65 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 38/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 BA3472, BA3472R, BA3474, BA3474R ●Marking Diagrams Datasheet SOP8(TOP VIEW) Part Number Marking LOT Number SOP14(TOP VIEW) Part Number Marking LOT Number 1PIN MARK 1PIN MARK SSOP-B8(TOP VIEW) Part Number Marking LOT Number SSOP-B14(TOP VIEW) Part Number Marking LOT Number 1PIN MARK 1PIN MARK MSOP8(TOP VIEW) Part Number Marking LOT Number Product Name F FV FVM RFVM F FV RFV Package Type SOP8S SSOP-B8 MSOP8 MSOP8 SOP14 SSOP-B14 SSOP-B14 Marking BA3472 1PIN MARK 3472 3472R 3474F 3474 3474R BA3474 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 39/39 TSZ02201-0RAR0G200100-1-2 27.FEB.2012 Rev.001 Datasheet Datasheet Notice ●Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation The products are not radiation resistant. Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. Confirm that operation temperature is within the specified range described in product specification. Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. 3) 4) 5) 6) 7) 8) ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Datasheet ●Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. Use products within the specified time after opening a dry bag. 3) 4) ●Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. ●Precaution for disposition When disposing products please dispose them properly with a industry waste company. ●Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. ●Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001